1C3D04060E Rev. F, 08-2016
C3D04060E
Silicon Carbide Schottky Diode
Z-Rec® 
Features
• 600-VoltSchottkyRectier
• OptimizedforPFCBoostDiodeApplication
• ZeroReverseRecoveryCurrent
• ZeroForwardRecoveryVoltage
• High-FrequencyOperation
• Temperature-IndependentSwitchingBehavior
• ExtremelyFastSwitching
• PositiveTemperatureCoefcientonVF
Benets
• ReplaceBipolarwithUnipolarRectiers
• EssentiallyNoSwitchingLosses
• HigherEfciency
• ReductionofHeatSinkRequirements
• ParallelDevicesWithoutThermalRunaway
Applications
• SwitchModePowerSupplies(SMPS)
• BoostdiodesinPFCorDC/DCstages
• FreeWheelingDiodesinInverterstages
• AC/DCconverters
Package
TO-252-2 
Part Number Package Marking
C3D04060E TO-252-2 C3D04060
PIN1
PIN2 CASE
VRRM = 600 V
IF (TC=135˚C) = 6 A
Qc
Maximum Ratings (TC=25˚Cunlessotherwisespecied)
Symbol Parameter Value Unit Test Conditions Note
VRRM RepetitivePeakReverseVoltage 600 V
VRSM SurgePeakReverseVoltage 600 V
VDC DCBlockingVoltage 600 V
IFContinuousForwardCurrent
13.5
6
4
A
TC=25˚C
TC=135˚C
TC=155˚C
Fig.3
IFRM RepetitivePeakForwardSurgeCurrent 17
12 ATC=25˚C,tP=10ms,HalfSineWave
TC=110˚C,tP=10ms,HalfSineWave
IFSM Non-RepetitivePeakForwardSurgeCurrent 25
19 ATC=25˚C,tp=10ms,HalfSineWave
TC=110˚C,tp=10ms,HalfSineWave Fig.8
IF,Max Non-RepetitivePeakForwardSurgeCurrent 220
160 ATC=25˚C,tP=10µs,Pulse
TC=110˚C,tP=10µs,Pulse Fig.8
Ptot PowerDissipation 52
22.5 WTC=25˚C
TC=110˚C Fig.4
dV/dt DiodedV/dtruggedness 200 V/ns VR=0-600V
∫i2dt i2tvalue 3.1
1.8 A2sTC=25˚C,tP=10ms
TC=110˚C,tP=10ms
T
J , Tstg  
 
2C3D04060E Rev. F, 08-2016
40
60
80
100
Reverse Leakage Current, I
RR
(uA)
TJ= 175 °C
TJ= 125 °C
TJ= 75 °C
0
20
0 200 400 600 800 1000 1200
Reverse Leakage Current, I
Reverse Voltage, V
R
(V)
TJ= -55 °C
TJ= 25 °C
Electrical Characteristics
Symbol Parameter Typ. Max. Unit Test Conditions Note
VFForwardVoltage 1.4
1.7
1.7
2.4 VIF=4ATJ=25°C
IF=4ATJ=175°C Fig.1
IRReverseCurrent 5
10
25
100 μA VR=600VTJ=25°C
VR=600VTJ=175°C Fig.2
QCTotalCapacitiveCharge 10 nC
VR=400V,IF=4A
di/dt=500A/μs
TJ=25°C
Fig.5
C TotalCapacitance
231
18.5
15
pF
VR=0V,TJ=25°C,f=1MHz
VR=200V,TJ=25˚C,f=1MHz
VR=400V,TJ=25˚C,f=1MHz
Fig.6
ECCapacitanceStoredEnergy 1.4 μJ VR=400V Fig.7

Thermal Characteristics
Symbol Parameter Typ. Unit Note
RθJC ThermalResistancefromJunctiontoCase 2.9 °C/W Fig.9
Typical Performance
Figure1.ForwardCharacteristics Figure2.ReverseCharacteristics
4
6
8
10
12
Foward Current, I
F
(A)
TJ= -55 °C
TJ= 25 °C
TJ= 75 °C
TJ= 175 °C
TJ= 125 °C
0
2
4
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Foward Current, I
Foward Voltage, V
F
(V)
IF (A)
VF (V) VR (V)
IR (mA)
3C3D04060E Rev. F, 08-2016
20
25
30
35
40
45
50
IF
(A)
10% Duty
20% Duty
30% Duty
50% Duty
70% Duty
DC
0
5
10
15
25 50 75 100 125 150 175
TC(°C)
Figure3.CurrentDerating Figure4.PowerDerating
20
30
40
50
60
P
TOT
(W)
0
10
20
25 50 75 100 125 150 175
TCC)
Typical Performance
Capacitive Charge, Q
Capacitive Charge, Q
100
150
200
250
Capacitance (pF)
Conditions:
T
J
= 25 °C
F
test
= 1 MHz
V
test
= 25 mV
0
50
0 1 10 100 1000
Capacitance (pF)
Reverse Voltage, V
R
(V)
IF(peak) (A)
TC ˚C TC ˚C
PTot (W)
C (pF)
VR (V)
QC (nC)
VR (V)
Figure5.TotalCapacitanceChargevs.ReverseVoltage Figure6.Capacitancevs.ReverseVoltage
4C3D04060E Rev. F, 08-2016
1.5
2
2.5
3
3.5
4
Capacitance Stored Energy, E
C
(µ
µ
µ
µJ)
0
0.5
1
0 100 200 300 400 500 600 700
Capacitance Stored Energy, E
Reverse Voltage, V
R
(V)
Typical Performance
100
1,000
I
FSM
(A)
T
J_initial
= 25 °C
T
J_initial
= 110 °C
10
10E-6 100E-6 1E-3 10E-3
Time, tp(s)
Figure7.CapacitanceStoredEnergy Figure8.Non-repetitivepeakforwardsurgecurrent
versuspulseduration(sinusoidalwaveform)
tp (s)
IFSM (A)
VR (V)
EC(mJ)
Figure9.TransientThermalImpedance
100E-3
1
Thermal Resistance (oC/W)
0.5
0.3
0.1
0.05
10E-3
1E-6 10E-6 100E-6 1E-3 10E-3 100E-3 1
Time, t
p
(s)
0.02
0.01
SinglePulse
Thermal Resistance (˚C/W)
T (Sec)
5C3D04060E Rev. F, 08-2016
Recommended Solder Pad Layout
Part Number Package Marking
C3D04060E TO-252-2 C3D04060
 TO-252-2

Note: Recommended soldering proles can be found in the applications note here:
http://www.wolfspeed.com/power_app_notes/soldering
SYMBOL
MILLIMETERS
MIN
MAX
A
2.159
2.413
A1
0
0.13
b
0.64
0.89
b2
0.653
1.143
b3
5.004
5.6
c
0.457
0.61
c2
0.457
0.864
D
5.867
6.248
D1
5.21
-
E
6.35
7.341
E1
4.32
-
e
4.58 BSC
H
9.65
10.414
L
1.106
1.78
L2
0.51 BSC
L3
0.889
1.27
L4
0.64
1.01
θ
Tjb June 2015
MX+DI+PSI
Tjb June 2015
MX+DI+PSI
PackageTO-252-2
Package Dimensions
66 C3D04060E Rev. F, 08-2016
Copyright © 2016 Cree, Inc. All rights reserved.
The information in this document is subject to change without notice.
Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5451
www.cree.com/power
• RoHSCompliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred
to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance
with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can
be obtained from your Wolfpseed representative or from the Product Ecology section of our website at http://
www.wolfspeed.com/Power/Tools-and-Support/Product-Ecology.
• REAChCompliance
REACh substances of high concern (SVHCs) information is available for this product. Since the European Chemi-
cal Agency (ECHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable
future,please contact a Cree representative to insure you get the most up-to-date REACh SVHC Declaration.
REACh banned substance information (REACh Article 67) is also available upon request.
• This product has not been designed or tested for use in, and is not intended for use in, applications implanted into
the human body nor in applications in which failure of the product could lead to death, personal injury or property
damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines,
cardiacdebrillatorsorsimilaremergencymedicalequipment,aircraftnavigationorcommunicationorcontrol
systems,orairtrafccontrolsystems.
Notes
• Cree SiC Schottky diode portfolio: http://www.wolfspeed.com/Power/Products#SiCSchottkyDiodes
• Schottky diode Spice models: http://www.wolfspeed.com/power/tools-and-support/DIODE-model-request2
• SiC MOSFET and diode reference designs: http://go.pardot.com/l/101562/2015-07-31/349i
RelatedLinks
Diode Model
VT
RT
Diode Model CSD04060
Vf T = VT + If*RT
VT= 0.965 + (Tj * -1.3*10-3)
RT= 0.096 + (Tj * 1.06*10-3)
Note: Tj = Diode Junction Temperature In Degrees Celsius,
valid from 25°C to 175°C
VfT=VT+If*RT
VT=1.00+(TJ*-1.1*10-3)
RT=0.069+(TJ*8.3*10-4)