FM25V02
256-Kbit (32 K × 8) Serial (SPI) F-RAM
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 001-84494 Rev. *E Revised June 5, 2015
256-Kbit (32 K × 8) Serial (SPI) F-RAM
Features
■256-Kbit ferroelectric random access memory (F-RAM)
logically organized as 32 K × 8
❐High-endurance 100 trillion (1014) read/writes
❐151-year data retention (See the Data Retention and
Endurance table )
❐NoDelay™ writes
❐Advanced high-reliability ferroelectric process
■Very fast serial peripheral interface (SPI)
❐Up to 40-MHz frequency
❐Direct hardware replacement for serial flash and EEPROM
❐Supports SPI mode 0 (0, 0) and mode 3 (1, 1)
■Sophistica te d w r ite protec ti on s cheme
❐Hardware protection using the Write Protect (WP) pin
❐Software protection using Write Disable instruction
❐Software block protection for 1/4, 1/2, or entire array
■Device ID
❐Manufacturer ID and Product ID
■Low power consumption
❐220 A active current at 1 MHz
❐90 A (typ) standby current
❐5 A sleep mode curren t
■Low-voltage operation: VDD = 2.0 V to 3.6 V
■Industrial temperature: –40 C to +85 C
■Packages
❐8-pin small outline integrated circuit (SOIC) package
❐8-pin thin dual flat no leads (DFN) package
■Restriction of hazardous substances (RoHS) compliant
Functional Description
The FM25V02 is a 256-Kbit nonvolatile memory employing an
advanced ferroelectric process. A ferroelectric random access
memory or F-RAM is nonvolatile and performs reads and writes
similar to a RAM. It provides reliable data retention for 151 years
while eliminating the complexities, overhead, and system-level
reliability problems caused by seri al flash, EEPROM, and othe r
nonvolatile memories.
Unlike serial flash and EEPROM, the FM25V02 performs write
operations at bus speed. No write delays are incurred. Data is
written to the memory array immediately after each byte is
successfully transferred to the device. The next bus cycle can
commence without the need for data polling. In addition, the
product offers substantial write endura nce compared with other
nonvolatile memories. The FM25V02 is capable of supporting
1014 read/write cycles, or 100 million times more write cycles
than EEPROM.
These capabilities make the FM25V02 ideal for nonvolatile
memory applications, requiring frequent or rapid writes.
Examples range from data collection, where the number of write
cycles may be critical, to demanding industrial controls where the
long write time of serial flash or EEPROM can cause data loss.
The FM25V02 provides substantial benefits to users of serial
EEPROM or flash as a hardware drop-in replacement. The
FM25V02 uses the high-speed SPI bus, which enhances the
high-speed write capability of F-RAM technology. The device
incorporates a read-only Device ID that allows the host to
determine the manufacturer, product density, and product
revision. The device specifications are guaranteed over an
industrial temperature range of –40 C to +85 C.
For a complete list of related documentation, click here.
Instruction Decoder
Clock Generator
Control Logic
Write Protect
Instruction Register
Address Register
Counter
32 K x 8
F-RAM Array
15
Data I/ O Register
8
Nonvolatile Status
Register
3
WP
CS
HOLD
SCK
SOSI
Logic Block Diagram
FM25V02
Document Number: 001-84494 Rev. *E Page 2 of 23
Contents
Pinouts ..............................................................................3
Pin Definitions ..................................................................3
Functional Overview ................ ... .............. ... .............. ... ...4
Memory Architecture ...................................................4
Serial Peripheral Interface – SPI Bus ..........................4
SPI Overview ............ ... .............. ... .............. ... ..............4
SPI Modes ................ ... .............. ... .............. ... ..............5
Power Up to First Access ............................................6
Command Structure ....................................................6
WREN - Set Write Enable Latch .................................6
WRDI - Reset Write Enable Latch ...............................6
Status Register and Write Protection .............................7
RDSR - Read Status Register .....................................8
WRSR - Write Status Register ....................................8
Memory Operation ....................... ... .............. ... .............. ...8
Write Operation ................... .............. ... .............. ... ......8
Read Operation ...........................................................9
Fast Read Operation .............. ... .............. ... ... ..............9
HOLD Pin Operation .................................................10
Sleep Mode ...............................................................11
Device ID ...................................................................11
Endurance ................................................................. 12
Maximum Ratings ...........................................................13
Operating Range .............................................................13
DC Electrical Characteristics ............ ... ................. ........13
Data Retention and Endurance .....................................14
Capacitance ....................................................................14
Thermal Resistance ........................................................14
AC Test Conditions .................... .. ............... .. .............. ...14
AC Switching Characteristi cs ...................... .................15
Power Cycle Timing .......................................................17
Ordering Information ......................................................18
Ordering Code Definitions .........................................18
Package Diagrams ..........................................................19
Acronyms ........................................................................ 21
Document Conventions .................. .............. ... ..............21
Units of Measure ..... .............. .. ............... .. ... ..............21
Document History Page ........................ ... .............. ... .. ...22
Sales, Solutions, and Legal Information ......................23
Worldwide Sales and Design Support .......................23
Products .................................................................... 23
PSoC® Solutions ......................................................23
Cypress Developer Community ...................... ... ........23
Technical Support .....................................................23
FM25V02
Document Number: 001-84494 Rev. *E Page 3 of 23
Pinouts Figure 1. 8-pin SOIC pinout
Figure 2. 8-pin DFN pinout
HOLD
SCK
1
2
3
4 5
CS 8
7
6
VDD
SI
SO
Top View
not to scale
V
SS
WP
SO
CS
V
SS
WP
SI
VDD
SCK
HOLD
1
2
45
6
7
8
3
O
PAD
EXPOSED
Top View
not to scale
Pin Definitions
Pin Name I/O Type Description
CS Input Chip Select. This active LOW input activates the device. When HIGH, the device enters low-power
standby mode, ignores other inputs, and the output is tristated. When LOW, the device internally
activates the SCK signal. A falling edge on CS must occur before every opcode.
SCK Input Serial Clock. All I/O activity is synchronized to the serial clock. Inputs are latched on the rising edge
and outputs occur on the falling edge. Because th e device is synchronous, th e cl ock freq uency may
be any value between 0 and 40 MHz and may be interrupted at any time.
SI [1] Input Serial Input. All data is input to the device on this pin. The pin is sampled on the rising edge of SCK
and is ignored at other times. It should always be driven to a valid logic level to meet IDD specifications.
SO [1] Output Serial Output. This is the data output pin. It is driven during a read and remains tristated at all other
times including when HOLD is LOW. Data transitions are driven on the falling edge of the serial clock.
WP Input Write Protect. This Active LOW pin prevents write operation to the Status Register when WPEN is
set to ‘1’. This is critical because other write protection features are controlled through the Status
Register. A complete explanation of write protection is provided in Status Register and Write Protection
on page 7. This pin must be tied to VDD if not use d .
HOLD Input HOLD Pin. The HOLD pin is used when the host CPU must interrupt a memory operation for another
task. When HOLD is LOW, the current operation is suspended. The device ignores any transition on
SCK or CS. All transitions on HOLD must occur while SCK is LOW. This pin has a weak internal pull-up
(Refer DC Electrical Characteristics table for RIN spec). However, if it is not used, the HOLD pin should
be tied to VDD.
VSS Power supply Ground for the device. Must be connected to the gro und of the system.
VDD Power supply Power supply input to the device.
EXPOSED
PAD No connect The EXPOSED P AD on the bottom of 8-pin DFN package is not connected to the die. The EXPOSED
PAD should not be soldered on the PCB.
Note
1. SI may be connected to SO for a single pin data interface.
FM25V02
Document Number: 001-84494 Rev. *E Page 4 of 23
Functional Overview
The FM25V02 is a serial F-RAM memory. The memory array is
logically organize d a s 32,76 8 × 8 bits and is accessed using an
industry-standard serial peripheral interface (SPI) bus. The
functional operation of the F-RAM is similar to serial flash and
serial EEPROMs. The major difference between the FM25V02
and a serial flash or EEPROM with the same pinout is the
F-RAM's superior write performance, high endurance, and low
power consumption.
Memory Architecture
When accessing the FM25V02, the user addresses 32K
locations of eight data bits each. These eight data bits are shifted
in or out serially. The addresses are accessed using the SPI
protocol, which includes a chip select (to permit multiple devices
on the bus), an opcode, and a two-byte add ress. The upper bit
of the address range is a 'don't care' value. The complete
address of 15 bits specifies each byte address uniquely.
Most functions of the FM25V02 are either controlled by the SPI
interface or handled by on-board circuitry. The access time for
the memory operation is essentially zero, beyond the time
needed for the serial protocol. That is, the memory is read or
written at the speed of the SPI bus. Unlike a serial flash or
EEPROM, it is not necessary to poll the device for a ready
condition beca us e wr it es oc cur at b us sp eed . B y the time a n ew
bus transaction can be shifted into the device , a write operation
is complete. This is explained in more detail in the interface
section.
Serial Peripheral Interface – SPI Bus
The FM25V02 is a SPI slave device and operates at spe eds up
to 40 MHz. This high-speed serial bus provides
high-performance serial communication to a SPI master. Many
common microcontrollers have hardware SPI ports allowing a
direct interface. It is quite simple to emulate the port using
ordinary port pins for microcontrollers that do not. The FM25V02
operates in SPI Mode 0 and 3.
SPI Overview
The SPI is a four-pin interface with Chip Select (CS), Serial Input
(SI), Serial Output (SO), and Serial Clock (SCK) pins.
The SPI is a synchronous serial interface, which uses clock and
data pins for memory access and su pports multiple devices on
the data bus. A device on the SPI bus is activated using the CS
pin.
The relationship between chip select, clock, and data is dictated
by the SPI mode. This device supports SPI modes 0 and 3. In
both of these modes, data is clocked into the F-RAM on the rising
edge of SCK starting from the first rising edge after CS goes
active.
The SPI protocol is controlled by opcodes. These opcodes
specify the commands from the bus master to the slave devi ce.
After CS is activated, the first byte transferred from the bus
master is the opcode. Following the opcode, any addresses and
data are then transferred. The CS must go inactive after an
operation is comple te and befo re a new opcod e can be issue d.
The commonly used terms in the SPI protocol are as follows:
SPI Master
The SPI master device controls the operations on a SPI bus. An
SPI bus may have only one master with one or more slave
devices. All the slaves share the same SPI bus lines and the
master may select any of the slave devices using the CS pin. All
of the operations must be initiated by the master activating a
slave device by pulling the CS pin of the slave LOW . The master
also generates the SCK and all the data transmission on SI and
SO lines are synchronized with this clock.
SPI Slave
The SPI slave device is activated by the master through the Chip
Select line. A slave device gets the SCK as an input from the SPI
master and all the communication is synchronized with this
clock. An SPI slave never initiates a communication on the SPI
bus and acts only on the instruction from the master.
The FM25V02 operates as an SPI slave and may share the SPI
bus with other SPI slave devices.
Chip Select (CS)
To select any slave device, the master needs to pull down the
corresponding CS pin. Any instruction can be issued to a slave
device only while the CS pin is LOW. When the device is not
selected, data through the SI pin is ignored and the serial output
pin (SO) remains in a high-impedan ce state.
Note A new instruction must begin with the falling edge of CS.
Therefore, only one opcode can be issued fo r each active Chip
Select cycle.
Serial Clock (SCK)
The Serial Clock is generated by the SPI master and the
communication is synchronized with this clock after CS goes
LOW.
The FM25V02 enables SPI modes 0 and 3 for data
communication. In both of these modes, the inputs are latched
by the slave device on the rising edge of SCK and ou tputs are
issued on the falling edge. Therefore, the first rising edge of SCK
signifies the arrival of the first bit (MSB) of a SPI instruction on
the SI pin. Further, all data inputs and outputs are synchronized
with SCK.
Data Transmission (SI/SO)
The SPI data bus consists of two lines, SI and SO, for serial dat a
communication. SI is also referred to as Master Out Slave In
(MOSI) and SO is referred to as Master In Slave Out (MISO). The
master issues instructions to the slave through the SI pin, while
the slave responds through the SO pin. Multiple slave devices
may share the SI and SO line s as de scri b ed ea rl i er.
FM25V02
Document Number: 001-84494 Rev. *E Page 5 of 23
The FM25V02 has two separate pins for SI and SO, which can
be connected with the master as shown in Figure 3.
For a microcontroller that has no dedicated SPI bus, a
general-purpose port may be used. To reduce hardware
resources on the controller , it is possible to connect the two data
pins (SI, SO) together and tie off (HIGH) the HOLD and WP pins.
Figure 4 shows such a configuration, which uses only three pins.
Most Significant Bit (MSB)
The SPI protocol requires that the first bit to be transmitted is the
Most Significant Bit (MSB). This is valid for both address and
data tran s missi on .
The 256-Kbit serial F-RAM requires a 2-byte address for any
read or write operation. Because the address is only 15 bits, the
upper bit which is fed in is ignored by the device. Althoug h this
bit is ‘don’t care’, Cypress recommends that this bit be set to ‘0’
to enable seamless transition to higher memory de nsities.
Serial Opcode
After the slave device is selected with CS going LOW, the first
byte received is treated as the opcode for the intended operation.
FM25V02 uses the standard opcodes for memory accesses.
Invalid Opcode
If an invalid opcode i s received, the opcode is ignored and the
device ignores any additio nal serial data on the SI pin until the
next falling edge of CS, and the SO pin remains tristated.
Status Register
FM25V02 has an 8-bit Status Register. The bits in the Status
Register are used to configure the device. These bits are
described in Table 3 on page 7 .
SPI Modes
FM25V02 may be driven by a microcontroller with its SPI
peripheral running in either of the following two modes:
■SPI Mode 0 (CPOL = 0, CPHA = 0)
■SPI Mode 3 (CPOL = 1, CPHA = 1)
For both these modes, the i nput data is latched in on the rising
edge of SCK starting from the first rising edge after CS goes
active. If the clock starts from a HIGH state (in mode 3), the first
rising edge after the clock toggles is considered. The output data
is available on the falling edge of SCK.
Figure 3. System Configuration with SPI Port
CS1
CS2
HOLD1
HOLD2
FM25V02 FM25V02
WP1
WP2
SCK SI SO SCK SI SO
CS HOLD WP CS HOLD WP
SCK
MOSI
MISO
SPI
Microcontroller
Figure 4. System Configuration without SPI Port
FM25V02
Microcontroller
SCK SI SO
CS HOLD WP
P1.2
P1.1
P1.0
FM25V02
Document Number: 001-84494 Rev. *E Page 6 of 23
The two SPI modes are shown in Figure 5 on page 6 and Figure
6 on page 6. The status of the clock when the bus master is not
transferring data is:
■SCK remains at 0 for Mode 0
■SCK remains at 1 for Mode 3
The device detects the SPI mode from the status of the SCK pin
when the device is selected by bringi ng the CS pin LOW. If the
SCK pin is LOW when the device is selected, SPI Mode 0 is
assumed and if the SCK pin is HIGH, it works in SPI Mode 3.
Power Up to First Access
The FM25V02 is not accessible for a tPU time after power-up.
Users must comply with the timing parameter, tPU, which is the
minimum time from VDD (min) to the first CS LOW.
Command Structure
There are nine commands, called opco des, that can be issued
by the bus master to the FM25V02. They are listed in Table 1.
These opcodes control the functions performed by the memory.
WREN - Set Write Enable Latch
The FM25V02 will power up with writes disabled. The WREN
command must be issued before any write operation. Sending
the WREN opcode allows the user to issue subsequent opcodes
for write operations. These include writing the Status Register
(WRSR) and writing the memory (WRITE).
Sending the WREN opcode causes the internal Write Enable
Latch to be set. A flag bit in the Status Register, called WEL,
indicates the state of the latch. WEL = ’1’ indicates that writes are
permitted. Attempting to write the WEL bit in the Status R egist er
has no effect on the state of this bit – only the WREN opcode can
set this bit. The WEL bit will be automatically cleared on the rising
edge of CS following a W RDI, a WRSR, or a WRIT E opera tion.
This preve nt s f ur ther wr it es to the Status Register or the F-RAM
array without another WREN command. Figure 7 illustrates the
WREN command bus configuration.
WRDI - Reset Write Enable Latch
The WRDI command disables all write activity by clearing the
Write Enable Latch. The user can verify that writes are disabled
by reading the WEL bit in the Status Register and verifying that
WEL is equal to ‘0’. Figure 8 illustrates the WRDI command bus
configuration.
Figure 5. SPI Mode 0
Figure 6. SPI Mode 3
Table 1. Opcode Commands
Name Description Opcode
WREN Set write enable latch 0000 0110b
WRDI Reset write enable latch 0000 0100b
RDSR Read Status Register 0000 0101b
WRSR Write Status Register 0000 0001b
READ Read memory data 0000 0011b
FSTRD Fast read memory data 0000 1011b
WRITE Write memory data 0000 0010b
SLEEP Enter sleep mode 1011 1001b
RDID Read device ID 1001 1111b
LSB
MSB
76543210
CS
SCK
SI
012 3 4 567
CS
SCK
SI 76543210
LSB
MSB
012 3 4 567
Figure 7. WREN Bus Configuration
Figure 8. WRDI Bus Configuration
0 0 0 0 0 1 1 0
CS
SCK
SI
SO
HI-Z
0 1 2 3 4 5 6 7
0 0 0
CS
SCK
SI
SO
HI-Z
0 1 2 3 4 5 6 7
00
001
FM25V02
Document Number: 001-84494 Rev. *E Page 7 of 23
Status Register and Write Protection
The write protection features of the FM25V02 are multi-tiered
and are enabled through the status register. The S t atus Register
is organized as follows. (The default value shipped from the
factory for bits in the Status Register is ‘0’).
Bits 0 and 4-6 are fixed at ‘0’; none of these bits can be modified.
Note that bit 0 (“Ready or Write in progress” bit in serial flash and
EEPROM) is unnecessary, as the F-RAM writes in real-time and
is never busy , so it reads out as a ‘0’. An exception to this is when
the device is waking up from sleep mode, which is descri bed in
Sleep Mode on page 11. The BP1 and BP0 control the software
write-protecti on features and are non volatile bits. The WEL flag
indicates the state of the Write Enable Latch. Attempting to
directly write the WEL bit in the Status Register has no effect on
its state. This bit is internally set and cleared via the WREN and
WRDI commands, respectively.
BP1 and BP0 are memory block write protection bits. They
specify portions of memory that are write-protected as shown in
Table 4.
The BP1 and BP0 bits and the Write Enable L atch are the onl y
mechanisms that protect the memory from writes. The remaining
write protection features protect inadvertent changes to the block
protect bits.
The write protect enable bit (WPEN) in the Status Register
controls the effect of the hardware write protect (WP) pin. When
the WPEN bit is set to '0', the status of the WP pin is ignored.
When the WPEN bit is set to '1', a LOW on the WP pin inhibits a
write to the Status Register. Thus the Status Register is
write-protected only when WPEN = '1' and WP = '0 '.
Table 5 summarizes the write protection conditions.
Table 2. Status Register
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
WPEN (0) X (0) X (0) X (0) BP1 (0) BP0 (0) WEL (0) X (0)
Table 3. Status Register Bit Definition
Bit Definition Description
Bit 0 Don’t care This bit is non-writable and always returns ‘0’ upon read.
Bit 1 (WEL) Write Enable WEL indicates if the device is write enabled. This bit defaults to ‘0’ (disabled) on power-up.
WEL = '1' --> Write enabled
WEL = '0' --> Write disabled
Bit 2 (BP0) Block Protect bit ‘0’ Used for block protection. For details, see Table 4 on page 7.
Bit 3 (BP1) Block Protect bit ‘1’ Used for block protection. For details, see Table 4 on page 7.
Bit 4-6 Don’t care These bits are non-writable and always return ‘0’ upon read.
Bit 7 (WPEN) Write Protect Enable bi t Used to enable the function of Write Protect Pin (WP). For details, see Table 5 on page 7.
Table 4. Block Memory Write Protection
BP1 BP0 Protected Addres s Ran ge
0 0 None
0 1 6000h to 7FFFh (upp er 1/4)
1 0 4000h to 7FFFh (upp er 1/2)
1 1 0000h to 7FFFh (all)
Table 5. Write Protection
WEL WPEN WP Protected
Blocks Unprotected
Blocks Status
Register
0 X X Protected Protected Protected
1 0 X Protected Unprotected Unprotected
1 1 0 Protected Unprotected Protected
1 1 1 Protected Unprotected Unprotected
FM25V02
Document Number: 001-84494 Rev. *E Page 8 of 23
RDSR - Read Status Register
The RDSR command allows the bus master to verify the
contents of the Status Register. Reading the status register
provides information about the current state of the
write-protection features. Following the RDSR opcode, the
FM25V02 will return one byte with the contents of the Status
Register.
WRSR - Write Status Register
The WRSR command allows the SPI bus master to write into the
Status Register and change the write protect configuration by
setting the WPEN, BP0 and BP1 bits as required. Before issuing
a WRSR command, the WP pin must be HIGH or inactive. Note
that on the FM25V02, WP only prevents writing to the Status
Register, not the memory array. Before sending the WRSR
command, the user must send a WREN command to enable
writes. Executing a WRSR command is a write operation and
therefore, clears the Write Enable Latch.
Memory Operation
The SPI interface, which is capable of a high clock frequency,
highlights the fast write capability of the F-RAM technology.
Unlike serial flash and EEPROMs, the FM25V02 can perform
sequential writes at b us speed. No page register is needed and
any number of sequential writes may be performed.
Write Operation
All writes to the memory begin with a WREN opcode with CS
being asserted and deasserted. The next opcode is WRITE. The
WRITE opcode is followed by a two-byte address containing the
15-bit address (A14-A0) of the first data byte to be written into
the memory. The upper bit of the two-byte address is ignored.
Subsequent bytes are data bytes, which are written sequentially .
Addresses are incremented internally as long as the bus master
continues to issue clocks and keep s CS LOW . If the last address
of 7FFFh is reached, the coun ter will roll over to 000 0h. Data is
written MSB first. The rising edge of CS terminates a write
operation. A write operati on is shown in Figure 11.
Note When a burst write reaches a protected block address, the
automatic address increment stops and all the subsequent data
bytes received fo r write will be ignored by the device.
EEPROMs use page buffers to increase their write throughput.
This compensates for the technology's inherently slow write
operations. F-RAM memories do not have page buffers because
each byte is written to the F-RAM array immediately after it is
clocked in (after the eighth clock). This allows any number of
bytes to be written without page buffer delays.
Note If the power is lost in the middle of the write operation, only
the last completed byte will be written.
Figure 9. RDSR Bus Configuration
Figure 10. WRSR Bus Configuration (WREN not shown)
CS
SCK
SO
01234567
SI
000001 0 0
1
HI-Z
012345 67
LSB
D0D1D2D3D4D5D6
MSB
D7
Opcode
Data
CS
SCK
SO
01 23 4567
SI
00000001
MSB LSB
D2D3D7
HI-Z
012345 67
Opcode Data
XX
XX
X
FM25V02
Document Number: 001-84494 Rev. *E Page 9 of 23
Read Operation
After the falling edge of CS, the bus master can issue a READ
opcode. Following the READ command is a two-byte address
containing the 15-bit address (A14-A0) of the first byte of the
read operation. The upper bit of the address is ignored. After the
opcode and address are issued, the device drives out th e read
data on the next eight clocks. The SI input is ignored during read
data bytes. Subsequent bytes are data bytes, which are read out
sequentially. Addresses are incremented internally as long as
the bus master continues to issue clocks and CS is LOW. If the
last address of 7FFFh is reached, the counter will roll over to
0000h. Data is read MSB first. The rising edge of CS terminates
a read operation and tristates the SO pin. A read operation is
shown in Figure 12.
Fast Read Operation
The FM25V02 supports a FAST READ opcode (0Bh) that is
provided for code compatibility with serial flash devices. The
FAST READ opcode is followed by a two-byte address
containing the 15-bit address (A14-A0) of the first byte of the
read operation and then a dummy byte. The dummy byte inserts
a read latency of 8-clock cycle. The fast read operation is
otherwise the same as an ordinary read operation excep t that it
requires an additional dummy byte. After receiving opcode,
address, and a dummy byte, the FM25V02 starts driving its SO
line with data bytes, with MSB first, and continues transmitting
as long as the device is selected and the clock is available. In
case of bulk read, the internal address counter is incremented
automatically, and after the last address 7FFF h is reached, the
counter rolls over to 0000h. When the device is drivi ng data on
its SO line, any transition on its SI line is ignored. The rising edge
of CS terminates a fast read operation and tristates the SO pin.
A Fast Read operation is shown in Figure 13.
Figure 11. Memory Write (WREN not shown) Operation
Figure 12. Memory Read Operation
~
~
CS
SCK
SO
01234 5 6 70 7654321 1213141501234567
MSB LSB
Data
D0D1D2D3D4D5D6D7
SI
~
~
Opcode
0000001
X A14 A13 A12 A11 A9
0
A10
A8 A3 A1A2 A0
15-bit Address
MSB LSB
HI-Z
~
~
CS
SCK
SO
01 23456 70 7654321 12131415012345 6 7
MSB LSB
Data
SI
~
~
Opcode
0000001
X A14 A13 A12 A11 A9
1
A10
A8 A3 A1A2 A0
15-bit Address
MSB LSB
D0D1D2D3D4D5D6D7
HI-Z
FM25V02
Document Number: 001-84494 Rev. *E Page 10 of 23
HOLD Pin Operation
The HOLD pin can be used to interrupt a serial operation without
aborting it. If the bus master pulls the HOLD pin LOW wh ile SCK
is LOW, the current operati on will pause. Taking the HOLD pin
HIGH while SCK is LOW will resume an operation. The
transitions of HOLD must occur while SCK is LOW , but the SCK
and CS pin can toggle duri ng a hold state.
Figure 13. Fast Read Operation
~
~
CS
SCK
SO
012345670 7654321 121314151617181920 212223
Data
SI
~
~
Opcode
0000101
X A14 A13 A11 A9
1
A10
A8 A3 A1A2 A0
15-bit Address
MSB LSB
MSB LSB
D0D1D2D3D4D5D6D7
012345 67
XXXXXXXX
Dummy Byte
HI-Z
A12
Figure 14. HOLD Operation [2]
Note
2. F igure shows HOLD operation for input mode and output mode.
CS
SCK
HOLD
SO
~
~
~
~
SI VALID IN VALID IN
~
~
~
~
~
~
FM25V02
Document Number: 001-84494 Rev. *E Page 11 of 23
Sleep Mode
A low-power sleep mode is implemented on the FM25V02
device. The device will enter the low-power state when the
SLEEP opcode B9h is clocked in and a rising edge of CS is
applied. When in sleep mode, the SCK and SI pins are ignored
and SO will be HI-Z, but the device continues to monitor the CS
pin. On the next falling edge of CS, the device will return to
normal operation within tREC time. The SO pin remains in a HI-Z
state during the wakeup period. The device does not necessarily
respond to an opcode within the wakeup period. To start the
wakeup procedure, the controller may send a “dummy” read, for
example, and wait the remaining tREC time.
Device ID
The FM25V02 device can be interrogated for its manufacturer,
product identification, and die revision. The RDID opcode 9Fh
allows the user to read the manufacturer ID and product ID, both
of which are read-only bytes. The JEDEC-assigned
manufacturer ID places the Cypress (Ramtron) identifier in bank
7; therefore, there are six bytes of the continuation code 7Fh
followed by the si ngle byte C2h. The re are tw o byte s of product
ID, which includes a family code, a density code, a sub code, and
the product revi si o n co de .
Figure 15. Sleep Mode Operation
CS
SCK
SI
SO
HI-Z
0
Enters Sleep Mode
VALID IN
tSU
tREC Recovers from Sleep Mode
1011 1 00 1
1 2 3 4 5 6 7
Table 6. Device ID
Device ID
(9 bytes)
Device ID Description
71–16
(56 bits) 15–13
(3 bits) 12–8
(5 bits) 7–6
(2 bits) 5–3
(3 bits) 2–0
(3 bits)
Manufacturer ID Product ID
Family Density Sub Rev Rsvd
7F7F7F7F7F7FC22200h 0111111101111111011111110111
1111011111110111111111000010 001 00010 00 000 000
Figure 16. Read Device ID
CS
SCK
SO
SI
Opcode
~
~
01 2 3 456 70 7654321 444546 5556575859606162636465666768697071
10011111
LSBMSB
HI-Z
~
~
47 48 49 50 51 52 53 54
9-Byte Device ID
D7 D6 D5 D4 D3 D2 D1 D0 D3 D1 D7D2 D0 D5 D3 D1D4 D2 D7 D5 D3D6 D4D6 D0 D1 D7 D5D0 D6 D3 D1D2 D0D2 D4
FM25V02
Document Number: 001-84494 Rev. *E Page 12 of 23
Endurance
The FM25V02 devices are capable of being accessed at least
1014 times, reads or writes. An F-RAM memory operates with a
read and restore mechan ism. Therefor e, an endurance cycl e is
applied on a row basis for each access (read or write) to the
memory array. The F-RAM architecture is b ased on a n array of
rows and columns of 4K ro ws of 64-bits each. The entire row i s
internally accessed once, whether a single byte or all eight bytes
are read or written. Each byte in the row is counted only once in
an endurance calculation. Table 7 shows endurance calculations
for a 64-byte repeating loop, which includes an opcode, a starting
address, and a sequential 64-byte data stream. This causes
each byte to experience one enduran ce cycl e through th e loop.
F-RAM read and write endurance is virtually unlimited even at a
40-MHz clock rate.
Table 7. Time to Reach Endurance Limit for Repeating
64-byte Loop
SCK Freq
(MHz) Endurance
Cycles/sec Endurance
Cycles/year Years to Reach
Limit
40 74,620 2.35 × 1012 42.6
25 37,310 1.18 × 1012 85.1
10 18,660 5.88 × 1011 170.2
5 9,330 2.94 × 1011 340.3
FM25V02
Document Number: 001-84494 Rev. *E Page 13 of 23
Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –55 C to +125 C
Maximum junction temperature ................................... 95 C
Supply voltage on VDD relative to VSS .........–1.0 V to +4.5 V
Input voltage ........... –1.0 V to +4.5 V and VIN < VDD + 1.0 V
DC voltage applied to outputs
in High-Z state .................... ................–0.5 V to VDD + 0.5 V
Transient voltage (< 20 ns) on
any pin to ground potential .................–2.0 V to VDD + 2.0 V
Package power dissipation
capability (TA = 25 °C) ................... ... ... .............. ... .......1.0 W
Surface mount lead soldering
temperature (3 seconds) ......................................... +260 C
DC output curr en t
(1 output at a time, 1s duration) ..................................15 mA
Electrostatic Discharge Voltage
Human Body Model (AEC-Q100-002 Rev. E) ......................... 1k
Charged Device Model (AEC-Q100-011 Rev. B) .............1.25 kV
Machine Model (AEC-Q100-003 Rev. E) ............................200 V
Latch-up current ....................................................> 140 mA
Operating Range
Range Ambient Temperature (TA) VDD
Industrial –40 C to +85 C 2.0 V to 3.6 V
DC Electrical Characteristics
Over the Operating Range
Parameter Description Test Conditions Min Typ [3] Max Unit
VDD Power supply 2.0 3.3 3.6 V
IDD VDD supply current SCK toggling
between VDD – 0.2 V
and VSS, other inputs
VSS or VDD – 0.2 V.
SO = Open
fSCK = 1 MHz – – 0.22 mA
fSCK = 40 MHz – 1.5 2.5 mA
ISB VDD standby current CS = VDD. All other inputs VSS or VDD.– 90 150A
IZZ Sleep mode current CS = VDD.
All other inputs VSS or VDD.–58A
ILI Input leakage current
(except HOLD pin) VSS < VIN < VDD ––±1A
ILO Output leakage current VSS < VOUT < VDD ––±1A
VIH Input HIGH vol tage 0.7 × VDD –V
DD + 0.3 V
VIL Input LOW voltage – 0.3 – 0.3 × VDD V
VOH1 Output HIGH voltage IOH = –1 mA, VDD = 2.7 V. 2.4 – – V
VOH2 Output HIGH voltage IOH = –100 AV
DD – 0.2 – – V
VOL1 Output LOW voltage IOL = 2 mA, VDD = 2.7 V – – 0.4 V
VOL2 Output LOW voltage IOL = 150 A––0.2V
RIN[4] Input resistance (HOLD pin) For VIN = VIH(min) 40 – – k
For VIN = VIL(max) 1 – – M
Notes
3. Typical values are at 25 °C, VDD = VDD(typ). Not 100% tested.
4. The input pull-up circuit is strong (> 40 k) when the input voltage is above VIH and weak (>1 M) when the input voltage is below VIL.
FM25V02
Document Number: 001-84494 Rev. *E Page 14 of 23
AC Test Conditions
Input pulse levels .................................10% and 90% of VDD
Input rise and fall times ...................................................3 ns
Input and output timing reference levels ................0.5 × VDD
Output load capacitance ..............................................30 pF
Data Retention and Endurance
Parameter Description Test condition Min Max Unit
TDR Data retention TA = 85 C 10 – Years
TA = 75 C38–
TA = 65 C151–
NVCEndurance Over operating temperature 1014 – Cycles
Capacitance
Parameter [5] Description Test Conditions Max Unit
COOutput pin capacitance (SO) TA = 25 C, f = 1 MHz, VDD = VDD(typ) 8 pF
CIInput pin capacitance 6pF
Thermal Resist ance
Parameter Description Test Conditions 8- pin SOIC 8-pin DFN Unit
JA Thermal resistance
(junction to ambient) Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA / JESD51.
146 21 C/W
JC Thermal resistance
(junction to case) 48 35 C/W
Note
5. This parameter is characterized and not 100% tested.
FM25V02
Document Number: 001-84494 Rev. *E Page 15 of 23
AC Switching Characteristics
Over the Operating Range
Parameters [6]
Description VDD = 2.0 V to 2.7 V VDD = 2.7 V to 3.6 V Unit
Cypress
Parameter Alt. Parameter Min Max Min Max
fSCK –SCK clock frequency 025 040 MHz
tCH –Clock HIGH time 20 –11 –ns
tCL –Clock LOW time 20 –11 –ns
tCSU tCSS Chip select setup 12 –10 –ns
tCSH tCSH Chip select hold 12 –10 –ns
tOD[7, 8] tHZCS Output disable time –20 –12 ns
tODV tCO Output data valid time –18 – 9 ns
tOH –Output hold time 0 – 0 – ns
tD–Deselect time 60 –40 –ns
tR[9, 10] –Data in rise time –50 –50 ns
tF[9, 10] –Data in fa ll time –50 –50 ns
tSU tSD Data setup time 8 – 5 – ns
tHtHD Data hold time 8 – 5 – ns
tHS tSH HOLD setup time 12 –10 –ns
tHH tHH HOLD hold time 12 –10 –ns
tHZ[7, 8] tHHZ HOLD LOW to HI-Z –25 –20 ns
tLZ[8] tHLZ HOLD HIGH to data active –25 –20 ns
Notes
6. Test conditions assume a signal transition time of 3 ns or less, timing reference levels of 0.5 × VDD, input pulse levels of 10% to 90% of VDD, and output loading of
the specified IOL/IOH and 30 pF load capacitance shown in AC Test Conditions on page 14.
7. tOD and tHZ are specified with a load capacitance of 5 pF. Transition is measured when the outputs enter a high impedance st ate
8. This parameter is characterized and not 100% tested.
9. Rise and fall times measured between 10% and 90% of waveform.
FM25V02
Document Number: 001-84494 Rev. *E Page 16 of 23
Figure 17. Synchronous Data Timing (Mode 0)
Figure 18. HOLD Timing
HI-Z
VALID IN
HI-Z
CS
SCK
SI
SO
tCL
tCH
tCSU
tSU tH
tODV tOH
t
D
tCSH
tOD
VALID IN VALID IN
CS
SCK
HOLD
SO
tHS
tHZ tLZ
tHH
tHS
tHH
~
~
~
~
SI
tSU
VALID IN VALID IN
~
~
~
~
~
~
FM25V02
Document Number: 001-84494 Rev. *E Page 17 of 23
Power Cycle Timing
Over the Operating Range
Parameter Description Min Max Unit
tPU Power-up VDD(min) to first access (CS LOW) 250 –µs
tPD Last access (CS HIGH) to power-down (VDD(min)) 0 – µs
tVR [11, 12] VDD power-up ramp rate 50 –µs/V
tVF [11, 12] VDD power-down ramp rate 100 –µs/V
tREC [13] Recovery time from sleep mode –400 µs
Figure 19. Power Cycle Timing
CS
~
~
~
~
tPU
tVR tVF
VDD
VDD(min)
tPD
VDD(min)
Notes
11. Slope measured at any point on the VDD waveform.
12.This parameter is ch aracterized and not 100% tested
13.Gua r a nteed by des i gn . R e fe r to Figure 15 for sleep mode recovery timing.
FM25V02
Document Number: 001-84494 Rev. *E Page 18 of 23
Ordering Code Definitions
Ordering Information
Ordering Code Package
Diagram Package Type Operating
Range
FM25V02-G 51-85066 8- pin SOIC Industrial
FM25V02-GTR 51-85066 8-pin SOIC
FM25V02-DG 001-85260 8-pin DFN
FM25V02-DGTR 001-85260 8-pin DFN
All these part s are Pb-free. Contact your local Cypress sa les representative for availability of these parts.
Option:
blank = Standard; TR = Tape and Reel
Package Type:
G = 8-pin SOIC; DG = 8-pin DFN
Density: 02 = 256-Kbit
Voltage: V = 2.0 V to 3.6 V
SPI F-RAM
Cypress
25FM V 02 G TR-
FM25V02
Document Number: 001-84494 Rev. *E Page 19 of 23
Package Diagrams Figure 20. 8-pin SOIC (150 Mils) Package Outline, 51-85066
51-85066 *G
FM25V02
Document Number: 001-84494 Rev. *E Page 20 of 23
Figure 21. 8-pin DFN (4.0 × 4.5 × 0.8 mm) Package Outline, 001-85260
Package Diagrams (continued)
001-85260 *B
FM25V02
Document Number: 001-84494 Rev. *E Page 21 of 23
Acronyms Document Conventions
Units of Measure
Acronym Description
CPHA Clock Phase
CPOL Clock Polarity
DFN Dual Flat No-lead
EEPROM Electrically Erasable Programmable Read-Only
Memory
EIA Electronic Industries Alliance
F-RAM Ferroelectric Random Access Memory
I/O Input/Output
JEDEC Joint Electron Devi ces Engineering Council
JESD JEDEC Standards
LSB Least Significant Bit
MSB Most Significant Bit
RoHS Restriction of Hazardous Substances
SPI Serial Peripheral Interface
SOIC Small Outline Integrated Circuit
Symbol Unit of Measure
°C degree Celsius
Hz hertz
kHz kilohertz
kkilohm
Mbit megabit
MHz megahertz
Amicroampere
Fmicrofarad
smicrosecond
mA milliampere
ms millisecond
ns nanosecond
ohm
%percent
pF picofarad
Vvolt
Wwatt
FM25V02
Document Number: 001-84494 Rev. *E Page 22 of 23
Document History Page
Document Title: FM25V02, 256-Kbit (32 K × 8) Serial (SPI) F-RAM
Document Number: 001-84494
Rev. ECN No. Orig. of
Change Submission
Date Description of Change
** 3912930 GVCH 02/25/2013 New spec
*A 3994285 GVCH 05/14/2013 Removed FM25VN02 part related information
Added Appendix A - Errata for FM25V02
*B 4045438 GVCH 06/30/2013 All errata items are fixed and the errata is removed.
*C 4227729 GVCH 01/23/2014 Converted to Cypress standard format
Updated Pinouts
- Updated Figure 2 (Added EXPOSED PAD details)
Updated Pin Defini tions
- Added EXPOSED PAD details.
Updated Maximum Ratings table
- Removed Moisture Sensitivity Level (MSL)
- Added junction temperature and latch up current
Updated Data Retention and Endura nce table
- Added data retention value at 65 C and 75 C temperature
Added Thermal Resistance table
Removed Package Marking Scheme (top mark)
Removed Ramtron revision history
Completing Sunset Review
*D 4563141 GVCH 11/06/2014 Updated Functional Description:
Added “For a complete list of related documentation, click here.” at the end.
*E 4788116 GVCH 06/05/2015 Replaced “T DFN” with “DFN” in all instances across the document.
Updated Pin Defini tions:
Updated details in “Description” column of “EXPOSED PAD” pi n.
Updated Package Diagrams:
spec 51-85066 – Changed revision from *F to *G.
spec 001-85260 – Changed revision fro m *A to *B .
Updated to new te mplate.
Document Number: 001-84494 Rev. *E Revised June 5, 2015 Page 23 of 23
All products and company names mentioned in this document may be the trademarks of their respective holders.
FM25V02
© Cypress Semicondu ctor Corpor ation, 2014-2015. The informatio n contai ned herei n is subject to chan ge without no tice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypre ss prod uc ts are n ot war r ant ed no r inte nd ed to be used fo r
medical, life supp or t, l if e savin g, cr it ical control or saf ety ap pl ic at io ns, unless pursuant to a n express written ag re em en t with Cypress. Furthermor e, Cyp ress doe s not author iz e its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress pr oducts in life -support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protec tion (Unit ed States and fore ign),
United S t ates copyright laws and international treaty provis ions. Cyp ress he reby gr ant s to l icense e a pers onal, no n-excl usive , non-tr ansfer able license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product t o be used only in conju nction with a Cypress
integrated circui t as specified in the applicab le agreement. Any r eproduction, mod ification, translati on, compilatio n, or represent ation of this Sour ce Code except as specified above is prohibited wi thout
the express written permis sion of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials describ ed herein. Cyp ress does not
assume any liabil ity ar ising ou t of the a pplic ation or use o f any pr oduct or circ uit descri bed herein . Cypr ess does n ot author ize its p roducts fo r use as critical componen ts in life-su pport systems whe re
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
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