AXJ31142T - Panasonic Electric Works

Interface connectors

AXJ3

ORDERING INFORMATION

PRODUCT TYPES

COMPATIBLE WITH

HDMI STANDARD HDMI

CONNECTORS

Number of terminals Inlet direction Part No. Packing quantity

Inner carton (tray) Outer carton

19 terminals Horizontal type AXJ31142T 100 1,000

Ver tical type AXJ31242T

FEATURES

1. High-level impedance matching

performance based on HDMI

Standards

2. Space-saving size

Horizontal type: 9.8 mm in depth

Ver tical type: 9.0 mm in height

Vertical type Horizontal type

3. Horizontal and vertical type

receptacles are usable on the same

foot pattern.

Either the horizontal or vertical type can

be used on the same printed circuit

board, reducing the design cost and the

number of components to be controlled in

the target equipment.

4. Shell having a GND structure for

EMI prevention

The screw ﬂange and the metal clips

have enhanced grounding performance.

5. Structure with high resistance to

the excessive press-in force of a plug

6. Structure with high resistance to

twisting forces

The resistance has been increased by

adopting a structure with a screw ﬂange

and DIP terminal metal clips ﬁxed to the

housing and circuit board, crimping the

shell bottom, and holding it with the

molded part.

Receptacle:

Horizontal type

Receptacle:

Ver tical type

Compliance with RoHS Directive

Inlet

9.8mm

9.0mm

Screw flange

DIP terminal metal clips

Stopper

Crimped section at

the shell bottom

The shell bottom is

inserted and engaged

in the concave section

of the molded part.

2: Center flange

T: Tray packaging

3: HDMI connectors

1: Receptacle

1: 19/Horizontal

2: 19/Vertical

AXJ 3 1 42T

4: DIP metal clips/Without positioning projections

http://www.mew.co.jp/ac/e/Matsushita Electric Works, Ltd.

Interface connectors

AXJ3

SPECIFICATIONS

1. Characteristics

Item Speciﬁcations Test conditions

Electrical

characteristics

Rated current 0.5 A/terminal

Rated voltage 40V AC (rms.)

Contact resistance Contact: Max. 50mΩ

Shell: Max. 50mΩ

EIA-364-23 (Except wire conductor resistance)

EIA-364-06A-83

Dielectric withstanding

voltage

Unmated: Apply 500V AC for 1minute between adjacent

terminal or ground. No breakdown.

Mated: Apply 300V AC for 1minute between adjacent

terminal or ground. No breakdown.

EIA-364-20 Detection current: 1mA

Insulation resistance Unmated: Min. 100MΩ between adjacent terminal or ground.

Mated: Min. 10MΩ between adjacent terminal or ground.

EIA-364-21

Unmated: Using 500V DC megger

Mated: Using 150V DC megger

Electrostatic discharge No evidence of discharge to contacts at 8 kV IEC-801-2 Test unmated connector from 1 kV to 8 kV in 1 kV

steps using 8 mm probe.

T.M.D.S Impedance 100Ω ±15%

EIA-364-108 Draft Proposal

Rise time: 200 p sec. (10% to 90%)

Differential measurement specimen environment impedance:

100Ω differential

Source-side receptacle connector mounted on a controlled

impedance PCB ﬁxture.

T.M.D.S Cross talk

FEXT Max. 5 % (Max. –26 dB)

EIA-364-90 Draft Proposal

Rise time: 200 p sec. (10% to 90%)

Differential measurement specimen environment impedance:

100Ω differential

Source-side receptacle connector mounted on a controlled

impedance PCB ﬁxture.

Driven pair and victim pair.

Mechanical

characteristics

Insertion force (initial) Max. 44.1N {4.5kg} EIA-364-13 Mate and un-mate connector at maximum rate of

25mm per minute

Removal force (initial) Min. 9.8N {1.0kg}, Max. 39.2N {4.0kg} EIA-364-13 Mate and un-mate connector at maximum rate of

25mm per minute

Screw tightening

torque

Use M3 screw

Recommended torque: 0.294N-m {3.0kgf-cm}

Max. permissible torque: 0.343N-m {3.5kgf-cm}

Put the connector to PC board, then tighten the screw at

following torque.

Durability

After 10,000 cycles

Contact resistance: Change from initial requirement

Contact: Max. 30mΩ

Shell: Max. 50mΩ

100±50 cycles per hour

Environmental

characteristics

Ambient temperature 0°C to +50°C No freezing or condensation

Storage condition –20°C to +60°C (–20°C to +50°C for packaging materials) No freezing or condensation

Vibration

Appearance: No breakdown

Contact resistance: Change from initial requirement

Contact: Max. 30mΩ

Shell: Max. 50mΩ

Discontinuity: Max. 1µsec

EIA-364-28 Method 5A

Amplitude: 1.52 mm P-P or 147 m/s2 (15G)

Sweep time: 50-2000-50 Hz in 20 minutes

Duration: 12 times in each (total of 36 times) X, Y, Z axes.

Electrical load: 100 mA DC current shall be ﬂowed during the

test.

Physical shock

Appearance: No breakdown

Contact resistance: Change from initial requirement

Contact: Max. 30mΩ

Shell: Max. 50mΩ

Discontinuity: Max. 1µsec

EIA-364-27 Condition A

Pulse width: 11msec

Wave form: half sine 490 m/s2 (50 G)

Direction: 6 sides (X, Y, Z direction)

Number of impacts: 3 times each (total 18 times)

Thermal shock

(mating)

After 10 cycles

Appearance: No breakdown

Contact resistance: Change from initial requirement

Contact: Max. 30mΩ

Shell: Max. 50mΩ

EIA-364-32 Condition I

Order Temperature Time (min.)

1 –55±3°C 30

2 ~ Max. 5

3 85±2°C 30

4 ~ Max. 5

Humidity resistance A

(mating)

After 4 cycles (96 hours)

Appearance: No breakdown

Contact resistance: Change from initial requirement

Contact: Max. 30mΩ

Shell: Max. 50mΩ

EIA-364-31

Mate connectors and expose to humidity at ﬁgure1.

Temperature: +25°C to +85°C

Relative humidity: 80 to 95%

Upon completion of the test specimens shall be conditioned at

ambient room conditions for 24 hours, after which the speciﬁed

measurements shall be performed.

Humidity resistance B

(unmating)

After 4 cycles (96 hours)

Appearance: No breakdown

Dielectric withstanding voltage: Must meet dielectric

withstanding voltage of electrical characteristics

Insulation resistance: Must meet contact resistance of

electrical characteristics

EIA-364-31

Unmate connectors and expose to humidity at ﬁgure1.

Temperature: +25°C to +85°C

Relative humidity: 80 to 95%

Upon completion of the test specimens shall be conditioned at

ambient room conditions for 24 hours, after which the speciﬁed

measurements shall be performed.

Heat resistance

(mating)

After 250 hours

Appearance: No breakdown

Contact resistance: Change from initial requirement

Contact: Max. 30mΩ

Shell: Max. 50mΩ

EIA-364-17

Under mating condition

Temperature: 105°C±2°C

Upon completion of the test specimens shall be conditioned at

ambient room conditions for 1 to 2 hours, after which the

speciﬁed measurements shall be performed.

Soldering

temperature

resistance

Reﬂow soldering Peak temperature: Max. 260°C

Manual soldering 300±10°C: Max. 5 s

350±10°C: Max. 3 s

http://www.mew.co.jp/ac/e/Matsushita Electric Works, Ltd.

Interface connectors

AXJ3

2. Material and surface treatment

DIMENSIONS (Unit: mm)

Part name Material Surface treatment

Receptacle

Molded portion LCP resin (UL94V-0), Color: Black —

Post Copper alloy Contact portion: Au ﬂash plating on PdNi over Ni

Te r minal portion: Au ﬂash plating over Ni (except for top of the terminal)

Shell Copper alloy Sn plating over Ni

• Receptacle: Horizontal type

AXJ31142T Recommended board pattern (Reference)

Amount of shell projection by

bending of the shell contact spring

General tolerance: ±0.3

Te r m i nal No.18 Te r m i nal No.2

Te r minal No.1

Te r minal No.19

14.5±0.05

2.00±0.1

0.80±0.05

This pattern should be

both side of PC board.

4.40±0.1

1.40±0.05

Through hole

MIN.3.00

5.10±0.05

4.45±0.05

9.0±0.05

1.55±0.05

0.50±0.03

0.25±0.03

MAX.0.40

Plug mating condition:

Amount of shell projection by

bending of the shell contact spring.

(15.00)

9.80±0.2

0.22±0.03

9.00±0.20

0.50±0.1

3.00 dia.

R 3.00

8.45

6.00

5.70±0.15

14.50±0.15 0.50±0.05 1.00±0.1

4.20±0.1 5.10±0.2

1.00±0.1

Te rminal No.18 Terminal No.2

Te rminal No.1

Te rminal No.19

1.70

1.55

• Receptacle: Vertical type

AXJ31242T Recommended board pattern (Reference)

Amount of shell projection by

bending of the shell contact spring

General tolerance: ±0.3

1.55±0.05

2.00±0.1

0.50±0.03

1.40±0.05

0.80±0.05

4.40±0.1

4.45±0.05

5.10±0.05

14.5±0.05

9.0±0.05

0.25±0.03

Te r m i nal No.1

Te r m i nal No.18

Te r m i nal No.19

Te r m i nal No.2

Through hole

This pattern should be

both side of PC board.

MAX.0.40

Plug mating condition:

Amount of shell projection by

bending of the shell contact spring.

R 3.00

9.45

(15.00)

0.22±0.03

1.55

0.50±0.05

14.50±0.15

9.0±0.2

1.70

1.40±0.2

1.00±0.1

5.10±0.2

5.70±0.15 5.55

8.45 7.00

9.00±0.2

0.50±0.1

M3×0.5

Te r minal No.18

Te r minal No.19 Te r minal No.1

Te r minal No.2

http://www.mew.co.jp/ac/e/Matsushita Electric Works, Ltd.

Interface connectors

AXJ3

NOTES

1. A cover for receptacle is

recommended to prevent dusts.

2. Regarding PC board design

Refer the recommended PC board

pattern for keeping the strength of

soldering.

3. Regarding soldering

1) Manual soldering

• Please use the soldering iron under

speciﬁcation’s temperature and times.

• In case of exercise care not to

contaminate the contacts with solder ﬂux

from the soldering iron tip. And make

sure that the contacts are not

contaminated to dispersed solder ﬂux

with a magnifying glass and so on.

Please pay attentions. Not to deform

terminals when apply an excessive force

to terminals, or the posts.

• Please soldering iron is cleaning.

2) Reﬂow soldering

• Please use screen soldering regarding

cream solder printing.

• A screen thickness of 0.15 mm is

recommended during cream solder

printing.

• When applying the different thickness of

a screen, please consult us.

• There may be a case of difﬁcult self-

alignment depending on the connector

size. In that case, please pay attentions

to align terminals and solder pads.

• The following diagram shows the

recommended reﬂow soldering

temperature proﬁle.

The recommended conditions for the

reﬂow temperature proﬁle

• The temperature measured on the PC

board surface near connector terminals.

• After reﬂow soldering, in case of PC

board surface the reverse side using

reﬂow soldering, for example an adhesive

and so on connector of ﬁxed disposition.

• After soldering, we recommend the

solder of the addition to the terminal dip

of the shell for the strength securing.

4. Rework of soldering portion

1) Rework is one time.

2) In case of soldering rework of bridges.

Please use a ﬂat-head soldering iron and

don’t use supplementary solder ﬂux.

3) Please use the soldering iron under

speciﬁcation’s temperature.

5. Since excessive force on the

terminals will cause deformation and

the integrity of the soldering will be

lost during reﬂow soldering, avoid

dropping or rough handling of the

product.

6. PC board warpage should be

controlled to 0.03 mm max. after

soldering to a PC board.

7. Repeated bending of terminals and

holding parts can result in terminals

breaking.

8. Please do the screw tightening of

the ﬂange by the tightening torque

below recommended torque.

Please note that tightening more than

the permissible limit torque has

danger of causing the transformation

of the shell.

9. Regarding after soldering

connectors on PC boards

1) After mounting connectors on PC

boards, do not apply excessive loads to

the connector by piling up the boards.

2) Please do not add the force to the

connector during assembled connector

on PC board.

10. This connector has metal shell for

preventing EMI, when designing an

enclosure the followings should be

considered. Guide for plug entrance

should be arranged in order to prevent

distorted insertions. Provide a cover

to reinforce the metal shell portions of

the receptacle.

11. Other notes

After soldering is no coating. In case of

using coating, please do not stick to the

terminal.

60 to 120 second

Pre-heating

Time

Te mperature

Maximum temperature

200°C

150 to 175°C

Max. 260°C

Max. 70 sec

For other details, please verify with

the product speciﬁcation sheets.

http://www.mew.co.jp/ac/e/Matsushita Electric Works, Ltd.