Supertex inc.
Supertex inc.
www.supertex.com
TN5335
Doc.# DSFP-TN5335
B081213
DRAIN
SOURCE
GATE
Features
Low threshold
High input impedance
Low input capacitance
Fast switching speeds
Low on-resistance
Free from secondary breakdown
Low input and output leakage
Complementary N- and P-channel devices
Applications
Logic level interfaces - ideal for TTL and CMOS
Solid state relays
Battery operated systems
Photo voltaic drives
Analog switches
General purpose line drivers
Telecom switches
General Description
This low threshold, enhancement-mode (normally-off)
transistor utilizes a vertical DMOS structure and Supertex’s
well-proven, silicon-gate manufacturing process. This
combination produces a device with the power handling
capabilities of bipolar transistors and the high input impedance
and positive temperature coefcient inherent in MOS devices.
Characteristic of all MOS structures, this device is free
from thermal runaway and thermally-induced secondary
breakdown.
Supertex’s vertical DMOS FETs are ideally suited to a wide
range of switching and amplifying applications where very
low threshold voltage, high breakdown voltage, high input
impedance, low input capacitance, and fast switching speeds
are desired.
N-Channel Enhancement-Mode
Vertical DMOS FET
Absolute Maximum Ratings
Parameter Value
Drain-to-source voltage BVDSS
Drain-to-gate voltage BVDGS
Gate-to-source voltage ±20V
Operating and storage temperature -55OC to +150OC
Absolute Maximum Ratings are those values beyond which damage to the device
may occur. Functional operation under these conditions is not implied. Continuous
operation of the device at the absolute rating level may affect device reliability. All
voltages are referenced to device ground.
Pin Conguration
TO-243AA (SOT-89)
Product Marking
TO-243AA (SOT-89)
TN3SW W = Code for week sealed
= “Green” Packaging
TO-236AB (SOT-23)
TO-236AB (SOT-23)
N3SW W = Code for week sealed
= “Green” Packaging
Package may or may not include the following marks: Si or
Package may or may not include the following marks: Si or
GATE
SOURCE
DRAIN
DRAIN
Ordering Information
Part Number Package Option Packing
TN5335K1-G TO-236AB (SOT-23) 3000/Reel
TN5335N8-G TO-243AA (SOT-89) 2000/Reel
Product Summary
BVDSS/BVDGS
RDS(ON)
(max)
ID(ON)
(min)
VGS(th)
(max)
350V 15Ω750mA 2.0V
Typical Thermal Resistance
Package θja
TO-236AB (SOT-23) 203OC/W
TO-243AA (SOT-89) 173OC/W
-G denotes a lead (Pb)-free / RoHS compliant package.
Contact factory for Wafer / Die availablity.
Devices in Wafer / Die form are lead (Pb)-free / RoHS compliant.
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TN5335
Supertex inc.
www.supertex.com
Doc.# DSFP-TN5335
B081213
Electrical Characteristics (TA = 25OC unless otherwise specied)
Sym Parameter Min Typ Max Units Conditions
BVDSS Drain-to-source breakdown voltage 350 - - V VGS = 0V, ID = 100µA
VGS(th) Gate threshold voltage 0.6 - 2.0 V VGS = VDS, ID= 1.0mA
ΔVGS(th) Change in VGS(th) with temperature - - -4.5 mV/OC VGS = VDS, ID= 1.0mA
IGSS Gate body leakage - - 100 nA VGS = ± 20V, VDS = 0V
IDSS Zero gate voltage drain current
- - 1.0 µA VGS = 0V, VDS = 100V
- - 10 VGS = 0V, VDS = Max Rating
- - 1.0 mA VDS = 0.8 Max Rating,
VGS = 0V, TA = 125°C
ID(ON) On-state drain current 300 - - mA VGS = 4.5V, VDS = 25V
750 - - VGS = 10V, VDS = 25V
RDS(ON) Static drain-to-source on-state resistance
- - 15
Ω
VGS = 3.0V, ID = 20mA
- - 15 VGS = 4.5V, ID = 150mA
- - 15 VGS = 10V, ID = 200mA
ΔRDS(ON) Change in RDS(ON) with temperature - - 1.0 %/OC VGS = 4.5V, ID = 150mA
GFS Forward transductance 125 - - mmho VDS = 25V, ID = 200mA
CISS Input capacitance - - 110
pF
VGS = 0V,
VDS = 25V,
f = 1.0MHz
COSS Common source output capacitance - - 60
CRSS Reverse transfer capacitance - - 22
td(ON) Turn-on delay time - - 20
ns
VDD = 25V,
ID = 150mA,
RGEN = 25Ω
trRise time - - 15
td(OFF) Turn-off delay time - - 25
tfFall time - - 25
VSD Diode forward voltage drop - - 1.8 V VGS = 0V, ISD = 200mA
trr Reverse recovery time - 800 - ns VGS = 0V, ISD = 200mA
Notes:
1. All D.C. parameters 100% tested at 25OC unless otherwise stated. (Pulse test: 300µs pulse, 2% duty cycle.)
2. All A.C. parameters sample tested.
Notes:
† ID (continuous) is limited by max rated Tj .
‡ Mounted on FR5 Board, 25mm x 25mm x 1.57mm.
Thermal Characteristics
Package ID
(continuous)
ID
(pulsed)
Power Dissipation
@TA = 25OCIDR
IDRM
TO-236AB (SOT-23) 110mA 0.8A 0.36W 110mA 0.8A
TO-243AA (SOT-89) 230mA 1.3A 1.6W230mA 1.3A
3
TN5335
Supertex inc.
www.supertex.com
Doc.# DSFP-TN5335
B081213
Switching Waveforms and Test Circuit
90%
10%
90% 90%
10%
10%
Pulse
Generator
VDD
R
L
OUTPUT
D.U.T.
t
(ON)
t
d(ON)
t
(OFF)
t
d(OFF)
t
r
INPUT
INPUT
OUTPUT
10V
VDD
R
GEN
0V
0V
t
f
4
TN5335
Supertex inc.
www.supertex.com
Doc.# DSFP-TN5335
B081213
3-Lead TO-236AB (SOT-23) Package Outline (K1)
2.90x1.30mm body, 1.12mm height (max), 1.90mm pitch
Symbol A A1 A2 b D E E1 e e1 L L1 θ
Dimension
(mm)
MIN 0.89 0.01 0.88 0.30 2.80 2.10 1.20 0.95
BSC
1.90
BSC
0.20
0.54
REF
0O
NOM - - 0.95 - 2.90 - 1.30 0.50 -
MAX 1.12 0.10 1.02 0.50 3.04 2.64 1.40 0.60 8O
JEDEC Registration TO-236, Variation AB, Issue H, Jan. 1999.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
Supertex Doc.#: DSPD-3TO236ABK1, Version C041309.
View B
View A - A
Side View
Top View
View B
Gauge
Plane
Seating
Plane
0.25
L1
L
E1 E
D
3
12
e
e1
b
A
A
Seating
Plane
AA2
A1
Supertex inc. does not recommend the use of its products in life support applications, and will not knowingly sell them for use in such applications unless it receives
an adequate “product liability indemnification insurance agreement.” Supertex inc. does not assume responsibility for use of devices described, and limits its liability
to the replacement of the devices determined defective due to workmanship. No responsibility is assumed for possible omissions and inaccuracies. Circuitry and
specifications are subject to change without notice. For the latest product specifications refer to the Supertex inc. (website: http//www.supertex.com)
©2013 Supertex inc. All rights reserved. Unauthorized use or reproduction is prohibited. Supertex inc.
1235 Bordeaux Drive, Sunnyvale, CA 94089
Tel: 408-222-8888
www.supertex.com
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TN5335
(The package drawing(s) in this data sheet may not reect the most current specications. For the latest package outline
information go to http://www.supertex.com/packaging.html.)
Doc.# DSFP-TN5335
B081213
3-Lead TO-243AA (SOT-89) Package Outline (N8)
Symbol A b b1 C D D1 E E1 e e1 H L
Dimensions
(mm)
MIN 1.40 0.44 0.36 0.35 4.40 1.62 2.29 2.00
1.50
BSC
3.00
BSC
3.94 0.73
NOM-------- --
MAX 1.60 0.56 0.48 0.44 4.60 1.83 2.60 2.29 4.25 1.20
JEDEC Registration TO-243, Variation AA, Issue C, July 1986.
† This dimension differs from the JEDEC drawing
Drawings not to scale.
Supertex Doc. #: DSPD-3TO243AAN8, Version F111010.
b b1
D
D1
E H E1
C
A
1 2 3
e
e1
Top View Side View
L