MP7523/XRD7523
Rev. 3.00
1996 EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 (510) 668-7000 (510) 668-7010
FEATURES
•Full Four-Quadrant Multiplying
•Low Feedthrough: 1/2 LSB @ 200 kHz
•Fast Settling: 100 ns (typ.)
•Low Power Dissipation
•Low Cost
•5 V/15 V Operation
•Buffered Version: MP7524/XRD7524
15 V CMOS
Multiplying 8-Bit
Digital-to-Analog Converter
APPLICATIONS
•Battery Operated Equipment
•Low Power, Ratiometric A/D Converters
•Digitally Controlled Gain Circuits
•Digitally Controlled Attenuators
•CRT Character Generation
•Low Noise Audio Gain Control
...the analog plus companyTM
January 1996-2
GENERAL DESCRIPTION
The MP7523/XRD7523 is a low cost multiplying Digital-to-
Analog Converter. The device uses an advanced thin-film-on-
CMOS technology to provide 8-bit resolution with accuracy to
10-bits and very low power dissipation.
The MP7523/XRD7523’s excellent multiplying characteris-
tics and low cost allow it to be used in a wide ranging field of ap-
plications such as: low noise audio gain control, CRT character
generation, motor speed control, digitally controlled attenuators,
etc.
SIMPLIFIED BLOCK DIAGRAM
4R R
2R
2 to 3 Decoder
MSB LSB
4R 4R 4R 4R 4R 4R
2R2R
Switch Drivers & Switches
3 Segment D/A Converter with Termination to DGND
Logical “1” at Digital Input Steers Current to IOUT1
BIT 8
R = 10k
BIT 1
RFB
IOUT1
IOUT2
VREF
VDD
MP7523/XRD7523
2
Rev. 3.00
ORDERING INFORMATION
Package
Type Temperature
Range Part No.
1/2
1/4
1/2
1/4
1.8
1.8
1.8
1.8
–40 to +85°C
–40 to +85°C
–40 to +85°C
–40 to +85°C
1
1
1
1
INL
(LSB) Gain Error
(% FSR)
DNL
(LSB)
SOP (EIAJ) XRD7523AIK-J
SOP (EIAJ) XRD7523AIK-K
SOIC (Jedec, 0.150”) XRD7523AID-J
XRD7523AID-K
SOIC (Jedec, 0.300”) MP7523JS
MP7523KS
1/2
1/4
1.8
1.8
–40 to +85°C
–40 to +85°C
1
1
Plastic Dip MP7523JN
Plastic Dip MP7523KN
1/2
1/4
1.8
1.8
–40 to +85°C
–40 to +85°C
1
1
SOIC (Jedec, 0.300”)
SOIC (Jedec, 0.150”)
PIN CONFIGURATIONS
16 pin SOIC (Jedec, 0.300”)
16 pin SOIC (Jedec, 0.150”)
16 pin SOP (EIAJ, 5.5 mm)
N/C
N/C
BIT 8 (LSB)
BIT 7
BIT 6
RFB
VREF
VDD
GND
(MSB) BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
IOUT1
IOUT2
16
1
98
2
3
4
5
6
7
15
14
13
12
11
10
GND
(MSB) BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
N/C
N/C
BIT 8 (LSB)
BIT 7
BIT 6
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
16 Pin PDIP (0.300”)
RFB
VREF
VDD
IOUT1
IOUT2
PIN OUT DEFINITIONS
1I
OUT1 Current Output 1
2I
OUT2 Current Output 2
3 GND Ground
4 BIT 1 Bit 1 (MSB)
5 BIT 2 Bit 2
6 BIT 3 Bit 3
7 BIT 4 Bit 4
8 BIT 5 Bit 5
PIN NO. NAME DESCRIPTION
9 BIT 6 Bit 6
10 BIT 7 Bit 7
11 BIT 8 Bit 8
12 N/C No Connection
13 N/C No Connection
14 VDD Positive Power Supply
15 VREF Reference Input Voltage
16 RFB Internal Feedback Resistor
PIN NO. NAME DESCRIPTION
MP7523/XRD7523
3
Rev. 3.00
ELECTRICAL CHARACTERISTICS
(VDD = + 15 V, VREF = +10 V unless otherwise noted)
25°CTmin to Tmax
Parameter Symbol Min Typ Max Min Max Units Test Conditions/Comments
STATIC PERFORMANCE1
Resolution (All Grades) N 8 8 Bits
Integral Non-Linearity INL LSB Best Fit Straight Line
(Relative Accuracy) (Max INL – Min INL) / 2
J+
1/2 +1/2
K+
1/4 +1/4
Monotonicity Guaranteed over temp
Differential Non-Linearity DNL LSB All grades monotonic over full
J+
1+1 temperature range.
K+
1+1
Gain Error GE +1.5 +1.8 % Using Internal RFB
JDigital Inputs = VINH
K
Power Supply Rejection Ratio PSRR +200 +300 ppm/% |∆Gain/∆VDD| ∆VDD = + 5%
JDigital Inputs = VINH
K
Output Leakage Current (Pin 1) IOUT1 +50nA +200nA nA Digital Inputs = VINL
J
K
Output Leakage Current (Pin 2) IOUT2 +50nA +200nA nA Digital Inputs = VINH
J
K
REFERENCE INPUT
Input Resistance RIN 5 20 5 20 kΩVOUT1 = VOUT2 = 0 V
DIGITAL INPUTS
Logical “1” Voltage VIH 14.5 14.5 V
Logical “0” Voltage VIL 0.5 0.5 V
Input Leakage Current ILKG +1+1µA
ANALOG OUTPUTS
Output Capacitance2COUT1 100 100 pF DAC Inputs all 1’s
COUT1 30 30 pF DAC Inputs all 0’s
COUT2 30 30 pF DAC Inputs all 1’s
COUT2 100 100 pF DAC Inputs all 0’s
MP7523/XRD7523
4
Rev. 3.00
25°C
NOTES:
Specifications are subject to change without notice
ELECTRICAL CHARACTERISTICS (CON’T)
Tmin to Tmax
Parameter Symbol Min Typ Max Min Max Units Test Conditions/Comments
POWER SUPPLY
Functional Voltage Range2VDD 5 16 5 16 V
Supply Current IDD 1.6 1.6 mA All digital inputs = 0 V or all = 15 V
1Full Scale Range (FSR) is 10V.
2Guaranteed but not production tested.
3Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur.
4Specified values guarantee functionality. Refer to other parameters for accuracy.
ABSOLUTE MAXIMUM RATINGS (TA = +25°C unless otherwise noted)1, 2
VDD to GND +17 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital Input Voltage to GND GND –0.5 to VDD +0.5 V
IOUT1, IOUT2 to GND –0.5 to 6.5 V. . . . . . . . . . . . . . . . .
VREF to GND +25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VRFB to GND +25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature –65°C to +150°C. . . . . . . . . . . .
Lead Temperature (Soldering, 10 seconds) +300°C.
Package Power Dissipation Rating to 75°C
CDIP, PDIP, SOIC 800mW. . . . . . . . . . . . . . . . . . . .
Derates above 75°C 11mW/°C. . . . . . . . . . . . . . . . .
NOTES:
1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps
(HP5082-2835) from input pin to the supplies.
APPLICATION NOTES
Refer to Section 8 in the 1995 Data Acquisition Products databook for Applications Information
MP7523/XRD7523
5
Rev. 3.00
16 LEAD PLASTIC DUAL-IN-LINE
(300 MIL PDIP)
16
1
9
8
D
eB1
A1
E1
E
A
L
B
Seating
Plane
SYMBOL MIN MAX MIN MAX
INCHES
A 0.145 0.210 3.68 5.33
A10.015 0.070 0.38 1.78
A20.115 0.195 2.92 4.95
B 0.014 0.024 0.36 0.56
B10.030 0.070 0.76 1.78
C 0.008 0.014 0.20 0.38
D 0.745 0.840 18.92 21.34
E 0.300 0.325 7.62 8.26
E10.240 0.280 6.10 7.11
e 0.100 BSC 2.54 BSC
eB0.310 0.430 7.87 10.92
L 0.115 0.160 2.92 4.06
α0°15°0°15°
MILLIMETERS
α
eB
A2
C
MP7523/XRD7523
6
Rev. 3.00
SYMBOL MIN MAX MIN MAX
A 0.053 0.069 1.35 1.75
A10.004 0.010 0.10 0.25
B 0.013 0.020 0.33 0.51
C 0.007 0.010 0.19 0.25
D 0.386 0.394 9.80 10.00
E 0.150 0.157 3.80 4.00
e 0.050 BSC 1.27 BSC
H 0.228 0.244 5.80 6.20
L 0.016 0.050 0.40 1.27
α0°8°0°8°
INCHES MILLIMETERS
16 LEAD SMALL OUTLINE
(150 MIL JEDEC SOIC)
e
16 9
8
D
EH
B
A
L
C
A1
Seating
Plane α
MP7523/XRD7523
7
Rev. 3.00
SYMBOL MIN MAX MIN MAX
A 0.093 0.104 2.35 2.65
A10.004 0.012 0.10 0.30
B 0.013 0.020 0.33 0.51
C 0.009 0.013 0.23 0.32
D 0.398 0.413 10.10 10.50
E 0.291 0.299 7.40 7.60
e 0.050 BSC 1.27 BSC
H 0.394 0.419 10.00 10.65
L 0.016 0.050 0.40 1.27
α0°8°0°8°
INCHES MILLIMETERS
16 LEAD SMALL OUTLINE
(300 MIL JEDEC SOIC)
e
16 9
8
D
E H
B
A
L
C
A1
Seating
Plane α
MP7523/XRD7523
8
Rev. 3.00
16 LEAD EIAJ SMALL OUTLINE
(5.5 mm EIAJ SOP)
e
16 9
8
D
E H
B
A
L
C
A1
Seating
Plane α
A2
SYMBOL MIN MAX MIN MAX
A 1.80 2.40 0.071 0.095
A10.02 0.20 0.001 0.008
A21.80 2.20 0.079 0.087
B 0.30 0.50 0.012 0.020
C 0.13 0.20 0.005 0.008
D 9.9 10.5 0.390 0.414
E 5.30 5.70 0.209 0.224
e 1.27 BSC 0.050 BSC
H 7.80 8.20 0.307 0.323
L 0.30 0.90 0.012 0.035
α0°15°0°15°
INCHESMILLIMETERS
1
Pin 1 Indexer
MP7523/XRD7523
9
Rev. 3.00
Notes
MP7523/XRD7523
10
Rev. 3.00
Notes
MP7523/XRD7523
11
Rev. 3.00
Notes
MP7523/XRD7523
12
Rev. 3.00
NOTICE
EXAR Corporation reserves the right to make changes to the products contained in this publication in order to im-
prove design, performance or reliability . EXAR Corporation assumes no responsibility for the use of any circuits de-
scribed herein, conveys no license under any patent or other right, and makes no representation that the circuits are
free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary
depending upon a user’ s specific application. While the information in this publication has been carefully checked;
no responsibility, however, is assumed for inaccuracies.
EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly
affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation
receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the
user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circum-
stances.
Copyright EXAR Corporation
Datasheet December 1996
Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.
