www.fairchildsemi.com
Features
• Devices are available in military (-55°C to +125°C)
temperature range
• Standard PROMs are offered in power-switched SPROM
versions
• Typically, 75% power savings achieved by deselected
SPROMs
• Reliable nichrome fuses
• Three-state outputs
• Devices programmed on standard PROM programmers
• High immunity or resistance to space levels of radiation
• Device pinouts comply with JEDEC standards
• Available in surface mount and through-hole packaging
• PROMs and SPROMs are offered in 24-pin, 0.3" wide
DIPs
Applications
• Microprogram control store
• Microprocessor program store
• Programmable logic
• Custom look-up tables
• Security encoding/decoding
• Code converter
• Character generator
• Use in redundant systems
Description
Fairchild Semiconductor Electronics Semiconductor Divi-
sion’s Bipolar Field Programmable Read-Only Memories
include both standard and power-switched versions. CS/PS
inputs provide logic flexibility and ease of memory expan-
sion decoding. SPROM power-switch circuitry is activated
by the PS input.
Fairchild Semiconductor PROMs and SPROMs are manu-
factured with nichrome fuses and low power Schottky tech-
nology. The devices are shipped with all bits in the HIGH
(logical ONE) state. To achieve a LOW state in a given bit
location the nichrome link is fused open by passing a short,
high current pulse through the link. All devices are pro-
grammed using the same programming technique.
Standard PROMs are enabled by a single active LOW CS or
by both active LOW CS and HIGH CS inputs. Power-
switched PROMs (SPROMs) are enabled by a single active
LOW PS or by both active LOW PS and HIGH PS inputs.
See the individual block diagrams for the enable scheme.
R296XX/R297XX
Standard PROMs and Power-Switched SPROMs
Rev. 1.0.1
R296XX/R297XX PRODUCT SPECIFICATION
2
Absolute Maximum Ratings (above which the useful life may be impaired)
Operating Conditions
Note:
1. Tests shall be conducted at input test conditions as follows: VIH = VIH(min) +20%, –0%; VIL = VIL(max) +0%, –50%. Devices
may be tested using any input voltage within this input voltage range but shall be guaranteed to VIH(min) and VIL(max).
CAUTION: To avoid test correlation problems, the test system noise (e.g., testers, handlers, etc.) should be verified to assure
that VIH(min) and VIL(max) requirements are not violated at the device terminals.
2. VIL = 0.6V for Chip Select Pins on all 29600 series devices.
Supply Voltage to Ground Potential (continuous), VCC –0.5V to +7.0V
DC Input Current –30 mA to +5.0 mA
DC Input Voltage (address inputs) –0.5V to +5.5V
DC Input Voltage (chip/power select input pin)
R296XX –0.5V to +33V
R297XX –0.5V to +28V
DC Voltage Applied to Outputs (except during programming) –0.5V to +VCC max.
Output Current into Outputs During Programming 240 mA
DC Voltage Applied to Outputs During Programming
R296XX 26V
R297XX 24V
Junction Temperature +175°C
Storage Temperature –65°C to +150°C
Programming Temperature 25 ±5°C
Lead Temperature (soldering, 10 seconds) 300°C
Current Density (metallization) <5 x 105A/cm2
Thermal Resistance, Junction-to-Case qJC
Dual-ln-Line £11°C/W
Leadless Chip Carrier £10°C/W
Flat Pack £10°C/W
Military
Parameter Description Min. Max. Unit
VCC Supply Voltage 4.5 5.5 V
TCCase Operating Temperature –55 +125 °C
VIL11, 2 DC Low Level Input Voltage 0.8 V
VIH1DC High Level Input Voltage 2.0 V
VIL AC/Functional Low Level Input Voltage 0 V
VIH AC/Functional High Level Input Voltage 3.0 V
PRODUCT SPECIFICATION R296XX/R297XX
3
Electrical Characteristics (Over Operating Range)
Devices conform to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
Notes:
1. This characteristic cannot be tested prior to programming; it is guaranteed by factory testing.
2. Not more than one output should be shorted at a time. Duration of the short circuit should not exceed 1 second.
3. VOUT = 0.0V for R29791/R29793.
Pin Definitions
Parameter Description Conditions Min. Max. Units
VOH Output High Voltage VCC = Min, IOH = -1.6 mA 2.4 V
VIN = VIH or VIL
VOL1Output Low Voltage VCC = Min, IOL = 8 mA 0.4 V
VIN = VIH or VIL IOL = 16 mA 0.5
IIL Input Low Current VCC = Max, VIN = 0.4V R296XX -250 mA
R297XX -100
IIH Input High Current VCC = Max, VIN = 2.7V 10 mA
VCC = Max, VIN = 5.5V 40
IOS2Output Short Circuit
Current VCC = Max, VOUT = 0.2V3-15 -85 mA
VIC Input Clamp Voltage VCC = Min, IIN = -18 mA -1.2 V
ICEX Output Leakage
Current VCC = Max, VOUT = 5.5V +40 mA
Chip Disabled VOUT = 0.4V -40
Symbol Description
A0—AnAddress Inputs
CS Chip Select Active Low (PROM)
CS Chip Select Active High (PROM)
PS Chip Select Active Low (SPROM)
PS Chip Select Active High (SPROM)
O1—OnData Outputs
R296XX/R297XX PRODUCT SPECIFICATION
4
A01
1 of 64
Decoder
64 x 64
Memory
Matrix
1 of 8
Multiplexers
(8)
Output
Drivers (8)
2
16
3
4
5
6
15
CS
7 8 911121314
17
18
19
A1
A5
A2
A3
A4
A6
A7
A8
O1
O2
O3
O4
O5
O6
O7
O8
20 19 18 17 16 15 14 13 12 11
VCC A8A7A6A5
A0A1A2A3A4
CS O8
O1O2O3O4Gnd
O7O6O5
12345678910
Pin 15 is also the programming pin (pp)
512 x 8 PROM—R29621/R29621A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 20 Lead Ceramic DIP
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
Units29621AM R29621M
ICC Power Supply Current VCC = Max 155 155 mA
All Inputs GND
tAA2Address Access Time CL = 30 pF175 95 ns
tEA2Enable Access Time R1 = 300W to VCC 50 50 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 ns
PDPower Dissipation 853 853 mW
Part Type Package Operating Temperature
Range
R29621DM D -55°C to +125°C
R29621DM/883B D -55°C to+125°C
R29621DMS D -55°C to +125°C
R29621ADM D -55°C to +125°C
R29621ADM/883B D -55°C to +125°C
R29621ADMS D -55°C to +125°C
20 Lead Ceramic DIP
PRODUCT SPECIFICATION R296XX/R297XX
5
512 x 8 SPROM—R29623/R29623A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 20 Lead Ceramic DIP
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
Units29623AM R29623M
ICCD Power Down, Supply
Current (disabled) VCC = Max
PS = VIH, All other inputs = GND 45 45 mA
ICC Supply Current
(enabled) VCC = Max
All Inputs = GND 155 155 mA
tAA2Address Access Time CL = 30 pF175 100 ns
tEA2Enable Access Time R1 = 300W to VCC 80 100 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 ns
PDPower Dissipation
(Disabled) 248 248 mW
PDPower Dissipation
(Enabled) 853 853 mW
Part Type Package Operating Temperature
Range
R29623DM D -55°C to +125°C
R29623DM/883B D -55°C to +125°C
R29623DMS D -55°C to +125°C
R29623ADM D -55°C to +125°C
R29623ADM/883B D -55°C to +125°C
R29623ADMS D -55°C to +125°C
A01
1 of 64
Decoder
64 x 64
Memory
Matrix
1 of 8
Multiplexers
(8)
Output
Drivers (8)
2
16
3
4
5
6
15
PS
7 8 911121314
17
18
19
A1
A5
A2
A3
A4
A6
A7
A8
O1
O2
O3
O4
O5
O6
O7
O8
20 19 18 17 16 15 14 13 12 11
VCC
Pin 15 is also the programming pin (pp)
A8A7A6A5
A0A1A2A3A4
PS O8
O1O2O3O4Gnd
O7O6O5
12345678910
20 Lead Ceramic DIP
R296XX/R297XX PRODUCT SPECIFICATION
6
1024 x 8 PROM—R29631/R29631A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
F = 24 Lead CERPACK
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
Units29631AM R29631M
ICC Power Supply Current VCC = Max 170 170 mA
All Inputs GND
tAA2Address Access Time CL = 30 pF175 105 ns
tEA2Enable Access Time R1 = 300W to VCC 50 50 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 ns
PDPower Dissipation 935 935 mW
Part Type Package Operating Temperature
Range
R29631DM D -55°C to +125°C
R29631DM/883B D -55°C to +125°C
R29631DMS D -55°C to +125°C
R29631FM F -55°C to +125°C
R29631FM/883B F -55°C to +125°C
R29631FMS F -55°C to +125°C
R29631ADM D -55°C to +125°C
R29631ADM/883B D -55°C to +125°C
R29631AFMS D -55°C to +125°C
R29631ADM F -55°C to +125°C
R29631AFM/883B F -55°C to +125°C
R29631AFMS F -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 20 is also the programming pin (pp)
A8A9
A5
A7A6A4A3A2A1
O7
O8
CS4
CS3
CS2
CS1
A0O1O2O3Gnd
O6O5O4
1 2 3 4 5 6 7 8 9 10 11 12
24 Lead Ceramic DIP/24 Lead CERPACK
A44
1 of 64
Decoder
64 x 128
Memory
Matrix
1 of 16
Multiplexers
(8)
Output
Drivers (8)
3
2
8
7
6
9
21
20
19
18
CS1
10111314151617
1
23
22
A5
A6
A0
A1
A25
A3
A7
A8
A9
O1
O2
O3
O4
O5
O6
O7
O8
CS2
CS3
CS4
PRODUCT SPECIFICATION R296XX/R297XX
7
1024 x 8 SPROM—R29633/R29633A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Pin Assignments
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
F = 24 Lead CERPACK
Parameter Description Test Conditions
Maximum Limits
Units29633AM R29633M
ICCD Power Down, Supply
Current (disabled) VCC = Max, PS = VIH,
All other inputs = GND 45 45 mA
ICC Supply Current
(Enabled) VCC = Max
All Inputs = GND 170 170 mA
tAA2Address Access Time CL = 30 pF185 105 ns
tEA2Enable Access Time R1 = 300W to VCC 85 130 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 40 40 ns
PDPower Dissipation
(Disabled) 248 248 mW
PDPower Dissipation
(Enabled) 935 935 mW
Part Type Package Operating Temperature
Range
R29633DM D -55°C to +125°C
R29633DM/883B D -55°C to +125°C
R29633DMS D -55°C to +125°C
R29633FM F -55°C to +125°C
R29633FM/883B F -55°C to +125°C
R29633FMS F -55°C to +125°C
R29633ADM D -55°C to +125°C
R29633ADM/883B D -55°C to +125°C
R29633ADMS D -55°C to +125°C
R29633AFM F -55°C to +125°C
R29633AFM/883B F -55°C to +125°C
R29633AFMS F -55°C to +125°C
A44
1 of 64
Decoder
64 x 128
Memory
Matrix
1 of 16
Multiplexers
(8)
Output
Drivers (8)
3
2
8
7
6
21
20
19
18
PS1
1
23
22
A5
A6
A0
A1
A25
A3
A7
A8
A9
O1
O2
O3
O4
O5
O6
O7
O8
PS2
PS3
PS4
910111314151617
Block Diagram
24 Lead Ceramic DIP/24 Lead CERPACK
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 20 is also the programming pin (pp)
A8A9
A5
A7A6A4A3A2A1
O7
O8
PS4
PS3
PS2
PS1
A0O1O2O3Gnd
O6O5O4
1 2 3 4 5 6 7 8 9 10 11 12
R296XX/R297XX PRODUCT SPECIFICATION
8
2048 x 4 PROM—R29651/R29651A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 18 Lead Ceramic DIP
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
Units29651AM R29651M
ICC Power Supply Current VCC = Max 170 170 mA
All Inputs GND
tAA2Address Access Time CL = 30 pF185 105 ns
tEA2Enable Access Time R1 = 300W to VCC 50 55 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 45 45 ns
PDPower Dissipation 935 935 mW
Part Type Package Operating Temperature
Range
R29651DM D -55°C to +125°C
R29651DM/883B D -55°C to +125°C
R29651DMS D -55°C to +125°C
R29651ADM D -55°C to +125°C
R29651ADM/883B D -55°C to +125°C
R29651ADMS D -55°C to +125°C
14 13 12 1118 17 16 15 10
VCC
Pin 10 is also the programming pin (pp)
A7A8
A4
A6A5A3A0A1A2
CSO4
O3
O2
O1
A9
A10 Gnd
123456789
18 Lead Ceramic DIP
A52
1 of 64
Decoder
64 x 128
Memory
Matrix
1 of 32
Multiplexers
(4)
Output
Drivers (4)
1
17
5
6
7
CS
16
15
3
A6
A7
A0
A1
A24
A38
A10
A8
A9
A4
O1
O2
O3
O4
14 13 12 11
10
PRODUCT SPECIFICATION R296XX/R297XX
9
2048 x 4 SPROM—R29653/R29653A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 18 Lead Ceramic DIP
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
Units29653AM R29653M
ICCD Power Down, Supply
Current (disabled) VCC = Max, PS = VIH,
All other inputs = GND 45 45 mA
ICC Supply Current
(Enabled) VCC = Max
All Inputs = GND 170 170 mA
tAA2Address Access Time CL = 30 pF190 105 ns
tEA2Enable Access Time R1 = 300W to VCC 95 110 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 45 45 ns
PDPower Dissipation
(Disabled) 248 248 mW
PDPower Dissipation
(Enabled) 935 935 mW
Part Type Package Operating Temperature
Range
R29653DM D -55°C to +125°C
R29653DM/883B D -55°C to +125°C
R29653DMS D -55°C to +125°C
R29653ADM D -55°C to +125°C
R29653ADM/883B D -55°C to +125°C
R29653ADMS D -55°C to +125°C
14 13 12 1118 17 16 15 10
VCC
Pin 10 is also the programming pin (pp)
A7A8
A4
A6A5A3A0A1A2
PSO4
O3
O2
O1
A9
A10 Gnd
123456789
18 Lead Ceramic DIP
A52
1 of 64
Decoder
64 x 128
Memory
Matrix
1 of 32
Multiplexers
(4)
Output
Drivers (4)
1
17
5
6
7
PS
16
15
3
A6
A7
A0
A1
A24
A38
A10
A8
A9
A4
O1
O2
O3
O4
14 13 12 11
10
R296XX/R297XX PRODUCT SPECIFICATION
10
2048 x 8 PROM—R29681/R29681A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Parameter Description Test Conditions
Maximum Limits
Units29681AM R29681M
ICC Power Supply Current VCC = Max 180 180 mA
All Inputs GND
tAA2Address Access Time CL = 30 pF185 120 ns
tEA2Enable Access Time R1 = 300W to VCC 50 55 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 35 45 ns
PDPower Dissipation 990 990 mW
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being
programmed.
3. TER is guaranteed by design but not performed.
Ordering Information
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
L = 28 Terminal Leadless Chip Carrier
S = 24 Lead Sidebrazed — .300" Body Width
Contact factory regarding flat pack package
Pin Assignments
Block Diagram
Part Type Package Operating
Temperature Range
R29681DM D -55°C to +125°C
R29681DM/883B D -55°C to +125°C
R29681DMS D -55°C to +125°C
R29681LM L -55°C to +125°C
R29681LM/883B L -55°C to +125°C
R29681LMS L -55°C to +125°C
R29681SM S -55°C to +125°C
R29681SM/883B S -55°C to +125°C
R29681SMS S -55°C to +125°C
R29681ADM D -55°C to +125°C
R29681ADM/883B D -55°C to +125°C
R29681ADMS D -55°C to +125°C
R29681ALM L -55°C to +125°C
R29681ALM/883B L -55°C to +125°C
R29681ALMS L -55°C to +125°C
R29681ASM S -55°C to +125°C
R29681ASM/883B S -55°C to +125°C
R29681ASMS S -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 24 is also the programming pin (pp)
Pin 20 is also the programming pin (pp)
A8A9A10
A5
A7A6A4A3A2A1
O7
O8
CS3
CS2
CS1
A0O1O2O3Gnd
O6O5O4
1
123
28 Terminal Leadless Chip Carrier
24 Lead Ceramic DIP/24 Lead Sidebrazed
4 282726
NC
A7
A6
A5
V
CC
A8A9
15141312 16 17 18
NC
Gnd
O
3
O
2
O
4
O
5
O
6
5
6
7
8
9
10
11
A4
A3
A2
A1
A0
NC
O1
25
24
23
22
21
20
19
A16
CS1
CS2
CS3
NC
O8
O7
2 3 4 5 6 7 8 9 10 11 12
A44
1 of 128
Decoder
128 x 128
Memory
Matrix
1 of 16
Multiplexers
(8)
Output
Drivers (8)
3
2
8
7
6
20
19
18
1
23
22
A5
A6
A0
A1
A25
A3
A7
A8
A921
A10
O1
O2
O3
O4
O5
O6
O7
O8
CS1
CS2
CS3
910111314151617
PRODUCT SPECIFICATION R296XX/R297XX
11
2048 x 8 SPROM—R29683/R29683A
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Parameter Description Test Conditions
Maximum Limits
Units29683AM R29683M
ICCD Power Down, Supply
Current (Disabled) VCC = Max, PS = VIH,
All other inputs = GND 50 50 mA
ICC Supply Current
(Enabled) VCC = Max
All Inputs = GND 180 180 mA
tAA2Address Access Time CL = 30 pF185 120 ns
tEA2Enable Access Time R1 = 300W to VCC 100 125 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 45 50 ns
PDPower Dissipation
(Disabled) 275 275 mW
PDPower Dissipation
(Enabled) 990 990 mW
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being
programmed.
3. TER is guaranteed by design but not performed.
Ordering Information
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
L = 28 Terminal Leadless Chip Carrier
S = 24 Lead Sidebrazed — .300" Body Width
Contact factory regarding flat pack package
Pin Assignments
Block Diagram
Part Type Package Operating
Temperature Range
R29683DM D -55°C to +125°C
R29683DM/883B D -55°C to +125°C
R29683DMS D -55°C to +125°C
R29683LM L -55°C to +125°C
R29683LM/883B L -55°C to +125°C
R29683LMS L -55°C to +125°C
R29683SM S -55°C to +125°C
R29683SM/883B S -55°C to +125°C
R29683SMS S -55°C to +125°C
R29683ADM D -55°C to +125°C
R29683ADM/883B D -55°C to +125°C
R29683ADMS D -55°C to +125°C
R29683ALM L -55°C to +125°C
R29683ALM/883B L -55°C to +125°C
R29683ALMS L -55°C to +125°C
R29683ASM S -55°C to +125°C
R29683ASM/883B S -55°C to +125°C
R29683ASMS S -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
V
CC
Pin 24 is also the programming pin (pp)
Pin 20 is also the programming pin (pp)
A
8
A
9
A
10
A
5
A
7
A
6
A
4
A
3
A
2
A
1
O
7
O
8
PS
3
PS
2
PS
1
A
0
O
1
O
2
O
3
Gnd
O
6
O
5
O
4
1
123
28 Terminal Leadless Chip Carrier
24 Lead Ceramic DIP/24 Lead Sidebrazed
4 282726
NC
A
7
A
6
A
5
V
CC
A
8
A
9
15141312 16 17 18
NC
Gnd
O
3
O
2
O
4
O
5
O
6
5
6
7
8
9
10
11
A
4
A
3
A
2
A
1
A
0
NC
O
1
25
24
23
22
21
20
19
A
16
PS
1
PS
2
PS
3
NC
O
8
O
7
2 3 4 5 6 7 8 9 10 11 12
A44
1 of 128
Decoder
128 x 128
Memory
Matrix
1 of 16
Multiplexers
(8)
Output
Drivers (8)
3
2
8
7
6
20
19
18
1
23
22
A5
A6
A0
A1
A25
A3
A7
A8
A921
A10
O1
O2
O3
O4
O5
O6
O7
O8
PS1
PS2
PS3
910111314151617
R296XX/R297XX PRODUCT SPECIFICATION
12
4096 x 8 PROM—R29771
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Parameter Description Test Conditions
Maximum Limits
UnitsR29771M
ICC Power Supply Current VCC = Max 190 mA
All Inputs GND
tAA2Address Access Time CL = 30 pF185 ns
tEA2Enable Access Time R1 = 300W to VCC 50 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 35 ns
PDPower Dissipation 1.05 mW
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being
programmed.
3. TER is guaranteed by design but not performed.
Ordering Information
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
F = 24 Lead Leadless Chip Carrier
L = 28 Terminal Leadless Chip Carrier
S = 24 Lead Sidebrazed — .300" Body Width
Pin Assignments
Block Diagram
Part Type Package Operating
Temperature Range
R29771DM D -55°C to +125°C
R29771DM/883B D -55°C to +125°C
R29771DMS D -55°C to +125°C
R29771FM F -55°C to +125°C
R29771FM/883B F -55°C to +125°C
R29771FMS F -55°C to +125°C
R29771LM L -55°C to +125°C
R29771LM/883B L -55°C to +125°C
R29771LMS L -55°C to +125°C
R29771SM S -55°C to +125°C
R29771SM/883B S -55°C to +125°C
R29771SMS S -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 24 is also the programming pin (pp)
Pin 20 is also the programming pin (pp)
A8A9A10
A5
A7A6A4A3A2A1
O7
O8
CS2
A11
CS1
A0O1O2O3Gnd
O6O5O4
1
123
28 Terminal Leadless Chip Carrier
24 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/24 Lead Sidebrazed
4 282726
NC
A7
A6
A5
V
CC
A8A9
15141312 16 17 18
NC
Gnd
O
3
O
2
O
4
O
5
O
6
5
6
7
8
9
10
11
A4
A3
A2
A1
A0
NC
O1
25
24
23
22
21
20
19
A16
CS1
A11
CS2
NC
O8
O7
2 3 4 5 6 7 8 9 10 11 12
A53
1 of 128
Decoder
128 x 256
Memory
Matrix
1 of 32
Multiplexers
(8)
Output
Drivers (8)
2
1
8
7
6
20
18
23
22
21
A6
A7
A0
A1
A25
A34
A4
A8
A9
A10 19
A11
O1
O2
O3
O4
O5
O6
O7
O8
CS1
CS2
910111314151617
PRODUCT SPECIFICATION R296XX/R297XX
13
4096 x 8 SPROM—R29773
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Parameter Description Test Conditions
Maximum Limits
UnitsR29773M
ICCD Power Down, Supply
Current (disabled) VCC = Max, PS = VIH,
All other inputs = GND 55 mA
ICC Supply Current
(Enabled) VCC = Max
All Inputs = GND 190 mA
tAA2Address Access Time CL = 30 pF185 ns
tEA2Enable Access Time R1 = 300W to VCC 135 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 35 ns
PDPower Dissipation
(Disabled) 303 mW
PDPower Dissipation
(Enabled) 1.05 W
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being
programmed.
3. TER is guaranteed by design but not performed.
Ordering Information
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
F = 24 Lead Leaded Chip Carrier
L = 28 Terminal Leadless Chip Carrier
S = 24 Lead Sidebrazed — .300" Body Width
Pin Assignments
Block Diagram
Part Type Package Operating
Temperature Range
R29773DM D -55°C to +125°C
R29773DM/883B D -55°C to +125°C
R29773DMS D -55°C to +125°C
R29773FM F -55°C to +125°C
R29773FM/883B F -55°C to +125°C
R29773FMS F -55°C to +125°C
R29773LM L -55°C to +125°C
R29773LM/883B L -55°C to +125°C
R29773LMS L -55°C to +125°C
R29773SM S -55°C to +125°C
R29773SM/883B S -55°C to +125°C
R29773SMS S -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 24 is also the programming pin (pp)
Pin 20 is also the programming pin (pp)
A8A9A10
A5
A7A6A4A3A2A1
O7
O8
PS2
A11
PS1
A0O1O2O3Gnd
O6O5O4
1
123
28 Terminal Leadless Chip Carrier
24 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/
24 Lead Sidebrazed
4 282726
NC
A7
A6
A5
V
CC
A8A9
15141312 16 17 18
NC
Gnd
O
3
O
2
O
4
O
5
O
6
5
6
7
8
9
10
11
A4
A3
A2
A1
A0
NC
O1
25
24
23
22
21
20
19
A16
PS1
A11
PS2
NC
O8
O7
2 3 4 5 6 7 8 9 10 11 12
A
5
3
1 of 128
Decoder
128 x 256
Memory
Matrix
1 of 32
Multiplexers
(8)
Output
Drivers (8)
2
1
8
7
6
20
18
23
22
21
A
6
A
7
A
0
A
1
A
2
5
A
3
4
A
4
A
8
A
9
A
10
19
A
11
O
1
O
2
O
3
O
4
O
5
O
6
O
7
O
8
PS
1
PS
2
910111314151617
R296XX/R297XX PRODUCT SPECIFICATION
14
8192 x 8 PROM—R29791
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
F = 24 Lead Leaded Chip Carrier
S = 24 Lead Sidebrazed — .300" Body Width
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
UnitsR29791M
ICC Power Supply Current VCC = Max, All Inputs GND 190 mA
tAA2Address Access Time CL = 30 pF195 ns
tEA2Enable Access Time R1 = 300W to VCC 50 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 30 ns
PDPower Dissipation 1.05 W
Part Type Package Operating
Temperature Range
R29791DM D -55°C to +125°C
R29791DM/883B D -55°C to +125°C
R29791DMS D -55°C to +125°C
R29791FM F -55°C to +125°C
R29791FM/883B F -55°C to +125°C
R29791FMS F -55°C to +125°C
R29791SM S -55°C to +125°C
R29791SM/883B S -55°C to +125°C
R29791SMS S -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 20 is also the programming pin (pp)
A8A9A10
A5
A7A6A4A3A2A1
O7
O8
A12
A11
CS
A0O1O2O3Gnd
O6O5O4
1
24 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/
24 Lead Sidebrazed
2 3 4 5 6 7 8 9 10 11 12
A53
1 of 256
Decoder 256 x 256
Memory
Matrix
1 of 32
Multiplexers
(8)
Output
Drivers (8)
2
1
8
7
6
20
23
22
21
A6
A7
A0
A1
A25
A34
A4
A8
A9
A10 19
A11 18
A12
O1
O2
O3
O4
O5
O6
O7
O8
CS
910111314151617
PRODUCT SPECIFICATION R296XX/R297XX
15
8192 x 8 SPROM—R29793
Power and AC Characteristics Over Operating Range
ICC conforms to MIL-STD-883, Group A, Subgroups 1, 2 and 3.
AC parameters conform to MIL-STD-883, Group A, Subgroups 9, 10 and 11.
Notes:
1. See AC Test Load Circuit and Switching Waveforms.
2. Speeds are based on a minimum of 50% of the array being programmed.
3. TER is guaranteed by design but not performed.
Ordering Information Block Diagram
Notes:
/883B suffix denotes MIL-STD-883, Level B processing
S suffix denotes Level S processing
D = 24 Lead Ceramic DIP — .600" Body Width
F = 24 Lead Leaded Chip Carrier
S = 24 Lead Sidebrazed — .300" Body Width
Pin Assignments
Parameter Description Test Conditions
Maximum Limits
UnitsR29793M
ICCD Power Down, Supply
Current (disabled) VCC = Max, PS = VIH,
All other inputs = GND 50 mA
ICC Supply Current
(Enabled) VCC = Max
All Inputs = GND 190 mA
tAA2Address Access Time CL = 30 pF195 ns
tEA2Enable Access Time R1 = 300W to VCC 145 ns
tER3Enable Recovery Time R2 = 600W to GND, 16 mA Load 30 ns
PDPower Dissipation (Disabled) 275 mW
PDPower Dissipation (Enabled) 1.05 W
Part Type Package Operating
Temperature Range
R29793DM D -55°C to +125°C
R29793DM/883B D -55°C to +125°C
R29793DMS D -55°C to +125°C
R29793FM F -55°C to +125°C
R29793FM/883B F -55°C to +125°C
R29793FMS F -55°C to +125°C
R29793SM S -55°C to +125°C
R29793SM/883B S -55°C to +125°C
R29793SMS S -55°C to +125°C
20 19 18 1724 23 22 21 16 15 14 13
VCC
Pin 20 is also the programming pin (pp)
A8A9A10
A5
A7A6A4A3A2A1
O7
O8
A12
A11
PS
A0O1O2O3Gnd
O6O5O4
1
24 Lead Ceramic DIP/24 Lead Leaded Chip Carrier/
24 Lead Sidebrazed
2 3 4 5 6 7 8 9 10 11 12
A53
1 of 256
Decoder 256 x 256
Memory
Matrix
1 of 32
Multiplexers
(8)
Output
Drivers (8)
2
1
8
7
6
20
23
22
21
A6
A7
A0
A1
A25
A34
A4
A8
A9
A10 19
A11 18
A12
O1
O2
O3
O4
O5
O6
O7
O8
PS
910111314151617
R296XX/R297XX PRODUCT SPECIFICATION
16
AC Test Load Circuit
Notes:
1. tAA is tested with switch S1 closed and CL = 30 pF.
2. tEA is tested with CL = 30 pF; S1 is open for high impedance to “1” test and closed for high impedance to “0” test.
3. tER, is tested with CL = 5 pF; S1 is open for “1” to high impedance test and measured at VOH-0.5V output level and is closed
for “0” to high impedance test and measured at VOL+0.5V output level.
Switching Waveforms
VCC
CL
Output
S1 R1
300½
R2
600½
A0–An3.0V
1.5V
0V
3.0V
1.5V
0V
Keys to Timing Diagram
VOH
1.5V
VOL
tAA tER tEA
CS–PS
Waveforms Inputs
Must be
Steady Will be
Steady
Don’t Care.
Any Change
Permitted
Changing State
Unknown
Does Not
Apply Center Line is
High Impedance
Off State
Outputs
O1–On
PRODUCT SPECIFICATION R296XX/R297XX
17
1
2
3
4
5
6
7
8
9
10
F0
F1
F2
F3
F4
F8
F7
F6
VCC
VBB ² VCC
VBB ² VCC
F5
F9
20
19
18
17
16
15
14
13
12
11
Dynamic Burn-In
R29621/621A
R29623/623A
1
2
3
4
5
6
7
8
9
10
11
12
F7
F6
F5
F4
F3
F2
F1
F0
F8
F9
F10
F13
F11
F12
VCC
VBB ² VCC
VBB ² VCC
24
23
22
21
20
19
18
17
16
15
14
13
Dynamic Burn-In
R29631/631A
R29633/633A
R29681/681A
R29683/683A
R29771
R29773
R29791
R29793
1
2
3
4
5
6
7
8
9
F6
F5
F4
F3
F0
F1
F2
F10
F9
F7
F8
F11
VCC
VBB ² VCC
18
17
16
15
14
13
12
11
10
Dynamic Burn-In
R29651/651A
R29653/653A
Dynamic Life Test/Burn-In Circuits
In accordance with MIL-STD-883, Methods
1005/1015, Condition D:
TA = 125+10 °C minimum
VCC = 5.25 ±0.25V
Square Wave Pulses on F0 to Fn are:
• 50% ±10% duty cycle
• Frequency of each address is to be
1/2 of each preceding input,
with F0 beginning at 100 kHz
(e.g., F0 = 100 kHz ±10%,
F1 = 50 kHz ±10%,
F2 = 25 kHz ±10%,
Fn = 1/2 Fn-1 ±10%, etc.)
Resistors are optional on input pins
(R = 300 ±10%)
–0
R296XX/R297XX PRODUCT SPECIFICATION
18
1
2
3
4
5
6
7
8
9
VCC
18
17
16
15
14
13
12
11
10
Static Burn-In
R29651/651A
R29653/653A
1
2
3
4
5
6
7
8
9
10
VCC
20
19
18
17
16
15
14
13
12
11
Static Burn-In
R29621/621A
R29623/623A
1
2
3
4
5
6
7
8
9
10
11
12
VCC
24
23
22
21
20
19
18
17
16
15
14
13
Static Burn-In
R29631/631A
R29633/633A
R29681/681A
R29683/683A
R29771
R29773
R29791
R29793
Static Life Test/Burn-In Circuits
In accordance with MIL-STD-883, Methods
1005/1015, Condition C:
TA = 125+10 °C minimum
VCC = 5.25 ±0.25V
Resistors are optional on input pins
(R = 300W ±10%)
–0
PRODUCT SPECIFICATION R296XX/R297XX
19
Programming Characteristics
Programming Timing
Address R296XX Series R297XX Series
Strobe
VPP
VOUT
VCC
TPP
TP
TR
TD2
TD1
TR = 0.34V/µS Min. — 1.25V/µS Max.
TPP = 80 µS Min. — 110 µS Max.
TP = 1 µS Min. — 40 µS Max.
TD1 = 70 µS Min. — 90 µS Max.
TD2 = 100 nS Min.
VPP = 27V Min. — 33V Max.
VOUT = 20V Min. — 26V Max.
TR = 0.34V/µS Min. — 1.25V/µS Max.
TPP = 70 µS Min. — 120 µS Max.
TP = 20 µS Min. — 40 µS Max.
TD1 = 60 µS Min. — 100 µS Max.
TD2 = 100 nS Min.
VPP = 26V Min. — 28V Max.
VOUT = 22V Min. — 24V Max.
Notes:
Output Load = 0.2 mA During 6.0V Check
Output Load = 12 mA During 4.2V Check
6.0V
4.2V
5.5V
TR
90%
10%
90%
10%
Check Check
VPP
TTL High
TTL Low
TTL High
TTL Low
TTL Low
TTL Low
Device Programming Inputs
If you would like to have Fairchild Semiconductor program
your devices, please submit one of the following:
• Two masters and truth table
• Two masters and checksum
In either case, we require customer approval prior to pro-
gramming the devices.
If you need blank devices in order to supply programming
masters, please do not hesitate to contact Fairchild Semicon-
ductor Electronics Semiconductor Division for unpro-
grammed samples.
Commercial Programmers
(subject to change)
Equipment must be calibrated at regular intervals. Each time
a new board or a new programming module is inserted, the
whole system should be checked. Both timing and voltages
must meet published specifications for the device.
Please contact the following manufacturers for equipment
information:
Data I/O Corp.
10525 Willows Road, N.E.
P.O. Box 97046
Redmond, WA 98073-9746
(800) 247-5700
Stag Microsystems Inc. (R296XX Series)
1600 Wyatt Drive, Suite 3
Santa Clara, CA 95054
(408) 988-1118
Commercial Surface Mount Socket
Adapter Manufacturer (subject to change)
Please contact the following manufacturer for equipment
information:
Emulation Technology, Inc.
2344 Walsh Avenue, Bldg. F
Santa Clara, CA 95051
(408) 982-0660
The companies listed abov e are not intended to be a complete
guide of manufacturers of programmers or adapters, nor does
Fairchild Semiconductor endorse any specific company.
R296XX/R297XX PRODUCT SPECIFICATION
20
Mechanical Dimensions
24 Lead CERPACK
L E
Q
c1
A
e
b1
s1
D
E1
Notes:
1. Index area: a notch or pin one identification mark shall be
shall not be used as a pin one identification mark.
3. This dimension allows for off-center lid, meniscus and glass overrun.
4. All leads - Increase maximum limit by .003 (.08mm) measured at the
center of the flat, when lead finish is applied.
5. Dimension s1 may be .000 (.00mm) minimum if leads number 1, 12,
13 and 24 bend toward the cavity of the package within one lead's
width from the point of entry of the lead into the body.
located adjacent to pin one. The manufacturer's identification
2. Dimension Q shall be measured at the point of exit of the lead from
the body.
Note 1
A .045 .090 1.14 2.29
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .015 .019 .38 .48
c1 .004 .006 .10 .15
E .300 .420 7.62 10.67
e.050 BSC 1.27 BSC
L .250 .370 6.35 9.40
.026 .045 .66 1.14
.005 — .13 — 5
2
4
3
4
E1 — .440 — 11.18 3
Q
s1
D — .640 — 16.26
PRODUCT SPECIFICATION R296XX/R297XX
21
Mechanical Dimensions (continued)
24 Lead Leaded Chip Carrier
Notes:
1. Index area: a notch or a pin one identification mark shall be located adjacent to pin one.
The manufacturer's identification mark shall not be used as a pin one identification mark.
2. This dimension allows for off-center lid, meniscus and glass overrun.
3. The basic pin spacing is .050 (1.27mm) between centerlines. Each pin centerline shall
be located within ±.005 (.13mm) of its exact longitudinal position relative to pins 1 and 24.
4. All leads - Increase maximum limit by .003 (0.08mm) measured at the center of the flat,
when finish "A" is applied.
5. Twenty-two spaces.
6. Applies to all four corners (leads number 1, 12, 13, and 24).
D
b1
e
S1
E
E1
L
2 PL
E3
2 PL
c1
E2
Q
AE
K
Alternatively, a tab (dim. K) may be used to identify pin one.
Note 1
A .045 .115 1.14 2.92
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .015 .019 .38 .48
c1 .004 .006 .10 .15
E .350 .420 8.89 10.67
e.050 BSC 1.27 BSC
L .250 .370 6.35 9.40
.026 .045 .66 1.14
.000 — .00 — 6
4
2
4
E1 — .450 — 11.43 2
E2 .180 — 4.57 —
E3 .030 — .76 — 3, 5
Q
s1
D — .640 — 16.26
R296XX/R297XX PRODUCT SPECIFICATION
22
Mechanical Dimensions (continued)
28 Terminal Leadless Chip Carrier
Notes:
1. The index feature for terminal 1 identification, optical orientation or
handling purposes, shall be within the shaded index areas shown on
planes 1 and 2. Plane 1, terminal 1 identification may be an extension
of the length of the metalized terminal which shall not be wider than
the B1 dimension.
2. Unless otherwise specified, a minimum clearance of .015 inch
(0.38mm) shall be maintained between all metallized features (e.g.,
lid, castellations, terminals, thermal pads, etc.).
3. Dimension “A” controls the overall package thickness. The maximum
“A” dimension is the package height before being solder dipped.
The corner shape (square, notch, radius, etc.) may vary at the
manufacturer’s option, from that shown on the drawing. The index
corner shall be clearly unique.
5. Dimension “B3” minimum and “L3” minimum and the appropriately
derived castellation length define an unobstructed three dimensional
space traversing all of the ceramic layers in which a castellation was
designed. Dimensions “B3” and “L3” maximum define the maximum
width and depth of the castellation at any point on its surface.
Measurement of these dimensions may be made prior to solder
dripping.
6. Chip carriers shall be constructed of a minimum of two ceramic
layers.
7. Symbol “N” is the maximum number of terminals. Symbol “ND” and
“NE” are the number of terminals along the sides of Length “D” and
“E” respectively.
E
E3
D
4
D3
A1
LID
A
L2
e
D2
DETAIL“A”
DETAIL“A”
D1
PLANE 1
PLANE 2
B3
B1
L3
E2
E1
L1
(h) X 45¡
3 PLCS
j X 45¡
A .060 .100 1.52 2.54
A1 .050 .088 1.27 2.24 3, 6
3, 6
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
B1 .022 .028 .56 .71
B3 .006 .022 .15 .56
D1/E1
e.050 BSC 1.27 BSC
h.040 REF 1.02 REF
.300 BSC 7.62 BSC
.150 BSC 3.81 BSC
j.020 REF .51 REF 4
4
5
L1 .045 .055 1.14 1.40
L2 .075 .095 1.91 2.41
L3 .003 .015 .08 .38
77
28 28 7
7
2, 5
2
D2/E2
D3/E3 — .460 — 11.68
ND/NE
N
D/E .442 .460 11.23 11.68
4
PRODUCT SPECIFICATION R296XX/R297XX
23
Mechanical Dimensions (continued)
24 Lead Sidebrazed — .300" Body Width
D
E
A
Q
b2 b1
L
e
S1
S2 eA
c1
Note 1
7. All leads - Increase maximum limit by .003 (.08mm) measured
at the center of the flat when lead finish is applied.
5. Applies to all four corners (leads number 1, 12, 13, and 24).
4. The basic pin spacing is .100 (2.54mm) between centerlines.
Each pin centerline shall be located within ±.010 (.25mm) of its
exact longitudinal position relative to pins 1 and 24.
3. Dimension "Q" shall be measured from the seating plane to the
base plane.
1. Index area: a notch or a pin one identification mark shall be
located adjacent to pin one. The manufacturer's identification
shall not be used as pin one identification mark.
2. The minimum limit for dimension "b2" may be .023 (.58mm)
for leads number 1, 12, 13, and 24 only.
8. Twenty-two spaces.
6. "eA" shall be measured at the centerline of the leads.
A — .200 — 5.08
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .014 .023 .36 .58
c1 .008 .015 .20 .38
D — 1.280 — 32.51
.220 .310 5.59 7.87
E
e .100 BSC 2.54 BSC
.300 BSC 7.62 BSC 4, 8
6
eA .125 .200 3.18 5.08
.015 .060 .38 1.52
L
Q
S1 .005 .13——
3
5
S2 .005 .13——
b2 .045 .065 1.14 1.65 7
7
2
Notes:
R296XX/R297XX PRODUCT SPECIFICATION
24
Mechanical Dimensions (continued)
18 Lead Ceramic Dual Inline Package (CerDIP)
8. All leads - Increase maximum limit by .003(.08mm) measured at the center of the flat,
when " " is 90¡.
7. "eA" shall be measured at the center of the lead bends or at the centerline of the leads
6. Applies to all four corner's (leads number 1, 8, 9, and 18).
pins 1 and 18.
shall be located within ±.010 (.25mm) of its exact longitudinal position relative to
5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline
4. This dimension allows for off-center lid, meniscus and glass overrun.
3. Dimension "Q" shall be measured from the seating plane to the base plane.
one. The manufacturer's identification shall not be used as pin one identification mark.
1. Index area: a notch or a pin one identification mark shall be located adjacent to pin
a
Notes:
2. The minimum limit for dimension "b2" may be .023(.58mm) for leads number 1, 8, 9
and 18 only.
9. Sixteen spaces.
when lead finish is applied.
D
b2
e
b1
E
Q
A
L
s1
c1
eA
a
Note 1
A — .200 — 5.08
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .014 .023 .36 .58
.065 1.65
b2 .045 1.14
c1 .008 .015 .20 .38
E .220 .310 5.59 7.87
e.100 BSC 2.54 BSC
L .125 .200 3.18 5.08
.015 .070 .38 1.78
.005 — .13 — 3
6
8
4
8
2, 8
4
5, 9
eA .300 BSC 7.62 BSC 7
Q
s1 90¡105¡90¡105¡
a
D — .960 — 24.38
PRODUCT SPECIFICATION R296XX/R297XX
25
Mechanical Dimensions (continued)
20 Lead Ceramic Dual Inline Package (CerDIP)
8. All leads - Increase maximum limit by .003(.08mm) measured at the center of the flat,
when " " is 90¡.
7. "eA" shall be measured at the center of the lead bends or at the centerline of the leads
6. Applies to all four corner's (leads number 1, 10, 11, and 20).
pins 1 and 20.
shall be located within ±.010 (.25mm) of its exact longitudinal position relative to
5. The basic pin spacing is .100 (2.54mm) between centerlines. Each pin centerline
4. This dimension allows for off-center lid, meniscus and glass overrun.
3. Dimension "Q" shall be measured from the seating plane to the base plane.
one. The manufacturer's identification shall not be used as pin one identification mark.
1. Index area: a notch or a pin one identification mark shall be located adjacent to pin
a
Notes:
2. The minimum limit for dimension "b2" may be .023(.58mm) for leads number 1, 10, 11
and 20 only.
9. Eighteen spaces.
when lead finish is applied.
D
b2
e
b1
E
Q
A
L
s1
c1
eA
a
Note 1
A — .200 — 5.08
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .014 .023 .36 .58
.065 1.65
b2 .045 1.14
c1 .008 .015 .20 .38
E .220 .310 5.59 7.87
e.100 BSC 2.54 BSC
L .125 .200 3.18 5.08
.015 .060 .38 1.52
.005 — .13 — 3
6
8
4
8
2, 8
4
5, 9
eA .300 BSC 7.62 BSC 7
Q
s1 90¡105¡90¡105¡
a
D — 1.060 — 25.92
R296XX/R297XX PRODUCT SPECIFICATION
26
Mechanical Dimensions (continued)
24 Lead Ceramic Dual Inline Package (CerDIP) — .600" Body Width
NOTE 1
D
s1
b2
e
b1
E
Q
A
L
eA
c1
a
A — .225 — 5.72
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .014 .023 .36 .58
.065 1.65
b2 .045 1.14
c1 .008 .015 .20 .38
E .500 .610 12.70 15.49
e.100 BSC 2.54 BSC
L .120 .200 3.05 5.08
.015 .075 .38 1.91
.005 — .13 — 3
6
8
4
8
2, 8
4
5, 9
eA .600 BSC 15.24 BSC 7
Q
s1 90¡105¡90¡105¡
a
D — 1.290 — 32.77
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Index area: a notch or a pin one identification mark shall be located
adjacent to pin one. The manufacturer's identification shall not be
used as pin one identification mark.
The minimum limit for dimension "b2" may be .023 (.58mm) for leads
number 1, 12, 13 and 24 only.
Dimension "Q" shall be measured from the seating plane to the base
plane.
This dimension allows for off-center lid, meniscus and glass overrun.
The basic pin spacing is .100 (2.54mm) between centerlines. Each
pin centerline shall be located within ±.010 (.25mm) of its exact
longitudinal position relative to pins 1 and 24.
Applies to all four corners (leads number 1, 12, 13, and 24).
"eA" shall be measured at the center of the lead bends or at the
centerline of the leads when "a" is 90¡.
All leads – Increase maximum limit by .003 (.08mm) measured at the
center of the flat, when lead finish applied.
Twenty-two spaces.
PRODUCT SPECIFICATION R296XX/R297XX
27
Mechanical Dimensions (continued)
24 Lead Ceramic Dual Inline Package (CerDIP) — .300" Body Width
A — .200 — 5.08
Symbol Inches
Min. Max. Min. Max.
Millimeters Notes
b1 .014 .023 .36 .58
.065 1.65
b2 .045 1.14
c1 .008 .015 .20 .38
E .220 .310 5.59 7.87
e.100 BSC 2.54 BSC
L .125 .200 3.18 5.08
.015 .060 .38 1.52
.005 — .13 — 3
6
8
4
8
2, 8
4
5, 9
eA .300 BSC 7.62 BSC 7
Q
s1 90¡105¡90¡105¡
a
D — 1.280 — 32.51
Notes:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Index area: a notch or a pin one identification mark shall be located
adjacent to pin one. The manufacturer's identification shall not be
used as pin one identification mark.
The minimum limit for dimension "b2" may be .023 (.58mm) for leads
number 1, 12, 13 and 24 only.
Dimension "Q" shall be measured from the seating plane to the base
plane.
This dimension allows for off-center lid, meniscus and glass overrun.
The basic pin spacing is .100 (2.54mm) between centerlines. Each
pin centerline shall be located within ±.010 (.25mm) of its exact
longitudinal position relative to pins 1 and 24.
Applies to all four corners (leads number 1, 12, 13, and 24).
"eA" shall be measured at the center of the lead bends or at the
centerline of the leads when "a" is 90¡.
All leads – Increase maximum limit by .003 (.08mm) measured at the
center of the flat, when lead finish applied.
Twenty-two spaces.
NOTE 1
D
s1
b2
e
b1
E
Q
A
L
eA
c1
a
R296XX/R297XX PRODUCT SPECIFICATION
5/20/98 0.0m 001
Stock#DS3000296XX
Ó 1998 Fairchild Semiconductor Corporation
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1.Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2.A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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