2016-04-01 1
2016-0 4-01
Silicon PIN Photodiode
Version 1.5
SFH 2400 FA
Ordering Information
Features:
•Especially suitable for applications from 750 nm to 1100 nm
•Short switching time (typ. 5 ns)
•The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification
for Automotive Grade Discrete Semiconductors.
Applications
•Photointerrupters
•Industrial electronics
•For control and drive circuits
Type: Photocurrent Ordering Code
IP [µA]
VR = 5 V, λ = 870 nm, Ee = 1
mW/cm2
SFH 2400 FA 6.2 (≥ 3.6) Q65110A2638
2016-04-01 2
Version 1.5 SFH 2400 FA
Maximum Ratings (TA = 25 °C)
Characteristics (TA = 25 °C, λ = 870 nm)
Parameter Symbol Values Unit
Operating and storage temperature range Top; Tstg -40 ... 100 °C
Reverse voltage VR20 V
Reverse voltage
(t < 2 min)
VR50 V
Total Power dissipation Ptot 120 mW
ESD withstand voltage
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
VESD 2000 V
Thermal resistance for mounting on pcb RthJA 450 K/W
Parameter Symbol Values Unit
Photocurrent
(VR = 5 V, λ = 870 nm, Ee = 1 mW/cm2)
(typ (min)) IP6.2 (≥ 3.6) µA
Wavelength of max. sensitivity (typ) λS max 900 nm
Spectral range of sensitivity (typ) λ10% (typ) 750
... 1100
nm
Radiant sensitive area (typ) A 1.00 mm2
Dimensions of radiant sensitive area (typ) L x W 1 x 1 mm x
mm
Half angle (typ) ϕ ± 60 °
Dark current
(VR = 20 V)
(typ (max)) IR1 (≤ 5) nA
Spectral sensitivity of the chip
(λ = 870 nm)
(typ) Sλ typ 0.65 A / W
Quantum yield of the chip
(λ = 870 nm)
(typ) η 0.93 Electro
ns
/Photon
Open-circuit voltage
(Ee = 1 mW/cm2, λ = 870 nm)
(typ (min)) VO320 mV
Short-circuit current
(Ee = 1 mW/cm2, λ = 870 nm)
(typ) ISC 6 µA
Rise and fall time
(VR = 20 V, RL = 50 Ω, λ = 850 nm)
(typ) tr, tf0.005 µs
Forward voltage
(IF = 80 mA, E = 0)
(typ) VF1.3 V
Capacitance
(VR = 0 V, f = 1 MHz, E = 0)
(typ) C011 pF
Version 1.5 SFH 2400 FA
2016-04-01 3
Temperature coefficient of VO(typ) TCV-2.6 mV / K
Temperature coefficient of ISC
(λ = 870 nm)
(typ) TCI0.1 % / K
Noise equivalent power
(VR = 20 V, λ = 870 nm)
(typ) NEP 0.028 pW /
Hz½
Detection limit
(VR = 20 V, λ = 870 nm)
(typ) D*3.6e12 cm x
Hz½ / W
Relative Spectral Sensitivity 1) page 12
Srel = f(λ)
Photocurrent / Open-Circuit Voltage 1) page 12
IP (VR = 5 V) / VO = f(Ee)
Parameter Symbol Values Unit
λ
OHF01773
0
rel
S
400 600 800 1000 1200
20
40
60
80
%
100
nm
E
OHF01765
e
0
10
P
Ι
-2
10 10 110 210 4
10 -1
10 0
10 1
10 2 4
10
3
10
2
10
1
10
10 0
VO
µA mV
Ι
P
VO
2
W/cmµ
2016-04-01 4
Version 1.5 SFH 2400 FA
Power Consumption
Ptot = f(TA)
Dark Current 1) page 12
IR = f(VR), E = 0
Capacitance 1) page 12
C = f(VR), f = 1 MHz, E = 0
Dark Current 1) page 12
IR = f(TA), VR = 10 V, E = 0
T
OHFD0228
A
0
tot
P
020 40 60 80 C 100
mW
20
40
60
80
100
120
140
V
OHF01026
R
R
Ι
0
4
10
3
10
2
10
10 1
pA
20 V 3010
OHF05718
A
T
10-6 ˚C-50
R
I
µA
0 50 100
-5
10
10-4
-3
10
10-2
-1
10
0
10
Version 1.5 SFH 2400 FA
2016-04-01 5
Directional Characteristics 1) page 12
Srel = f(ϕ)
Package Outline
Dimensions in mm (inch).
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
2016-04-01 6
Version 1.5 SFH 2400 FA
Pinning
Pin Description
1 cathode
2 n.c.
3 anode
Package
Smart DIL
Approximate Weight:
12 mg
Recommended Solder Pad
Version 1.5 SFH 2400 FA
2016-04-01 7
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*)
25 °C to 150 °C
2 3 K/s
Time tS
TSmin to TSmax
tS
tL
tP
TL
TP
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to TP
Time within 5 °C of the specified peak
temperature TP - 5 K
Ramp-down rate*
TP to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480
2016-04-01 8
Version 1.5 SFH 2400 FA
Taping
Dimensions in mm (inch).
Tape and Reel
12 mm tape with 2000 pcs. on ∅ 180 mm reel
D0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.5 SFH 2400 FA
2016-04-01 9
Tape dimensions [mm]
Tape dim ensions in m m
Reel dimensions [mm]
Reel dim ensions in m m
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.
WP0P1P2D0E F
12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1
or
8 ± 0.1
2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05
A W Nmin W1W2max
180 12 60 12.4 + 2 18.4
OHA04563
(G) GROUP:
1234567890(1T) LOT NO: (9D) D/C: 1234
(X) PROD NO: 123456789
(6P) BATCH NO: 1234567890
LX XXXX
RoHS Compliant
BIN1: XX-XX-X-XXX-X
ML
XTemp ST
XXX °C X
Pack: RXX
DEMY XXX
X_X123_1234.1234 X
9999(Q)QTY:
Semiconductors
OSRAM Opto
XX-XX-X-X
EXAMPLE
X_X123_1234.1234 XX_X123_1234.1234 X
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
XXXXXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-XXX-XX-X-X
EXAMPLE
Pack: RXX
XXX
X_X123_1234.1234 XX_X123_1234.1234 X
XX-XX-X-X
EXAMPLE
Pack: RXXPack: RXX
DEMY DEMY
EXAMPLE
1234
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
12341234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
12341234
EXAMPLE
Pack: RXXPack: RXX
DEMY
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
1234
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(9D) D/C:
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
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EXAMPLE
12345678901234567890
EXAMPLE
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EXAMPLE
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EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
SemiconductorsSemiconductors
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
EXAMPLE
(6P) BATCH NO:(6P) BATCH NO:
12345678901234567890
EXAMPLE
SemiconductorsSemiconductors
OSRAM OptoOSRAM Opto
EXAMPLE
EXAMPLE
1234567890
X_X123_1234.1234 X
Pack: RXX
DEMY
X_X123_1234.1234 X
(9D) D/C:
1234
(9D) D/C:
1234567890
(6P) BATCH NO:
1234567890
OSRAM Opto
XXX
X_X123_1234.1234 X
XX-XX-X-X
Pack: RXX
DEMY
Semiconductors
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10% bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
2016-04-01 10
Version 1.5 SFH 2400 FA
Transportation Packing and Materials
Dimensions of transportation box in mm
Width Length Height
195 ± 5 195 ± 5 30 ± 5
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Version 1.5 SFH 2400 FA
2016-04-01 11
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.
*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.
2016-04-01 12
Version 1.5 SFH 2400 FA
Glossary
1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.
2016-04-01 13
Version 1.5 SFH 2400 FA
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.