PE35400 Document Category: Product Specification UltraCMOS(R) Divide-by-4 Prescaler, 3-13.5 GHz Features Figure 1 * PE35400 Functional Diagram * High frequency support up to 13.5 GHz * Low SSB phase noise of -135 dBc/Hz @ 3.025 GHz output frequency * Low supply current of 16 mA D Q D Q * Bare die Q Q Applications * Wireless communication * Test and measurement * Phased array radar Product Description The PE35400 is a high-performance UltraCMOS(R) prescaler with a fixed divide ratio of 4. It supports an operating frequency range from 3-13.5 GHz. It operates on a single voltage supply with a frequency-selecting bias resistor and draws a low current of 16 mA. The PE35400 is available in bare die. The PE35400 is manufactured on Peregrine's UltraCMOS process, a patented variation of silicon-on-insulator (SOI) technology on a sapphire substrate, offering the performance of GaAs with the economy and integration of conventional CMOS. (c)2015, Peregrine Semiconductor Corporation. All rights reserved. * Headquarters: 9380 Carroll Park Drive, San Diego, CA, 92121 Product Specification DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Absolute Maximum Ratings Exceeding absolute maximum ratings listed in Table 1 may cause permanent damage. Operation should be restricted to the limits in Table 2. Operation between operating range maximum and absolute maximum for extended periods may reduce reliability. ESD Precautions When handling this UltraCMOS device, observe the same precautions as with any other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the rating specified in Table 1. Latch-up Immunity Unlike conventional CMOS devices, UltraCMOS devices are immune to latch-up. Table 1 * Absolute Maximum Ratings for PE35400 Parameter/Condition Min Max Unit Supply voltage, VDD -0.3 3.3 V +14 dBm +150 C 250 V Input power, 50 Storage temperature range -65 ESD voltage HBM, all pins(*) Note: * Human body model (MIL-STD 883 Method 3015). Recommended Operating Conditions Table 2 lists the recommending operating conditions for the PE35400. Devices should not be operated outside the recommended operating conditions listed below. Table 2 * Recommended Operating Conditions for PE35400 Parameter Min Typ Max Unit Supply voltage, VDD 2.65 2.8 2.95 V +7 dBm +85 C Input power, 50, based on optimal RBIAS (see Figure 3), PIN Operating temperature range -40 Page 2 DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Electrical Specifications Table 3 provides the PE35400 key electrical specifications @ +25 C, VDD = 2.8V (ZS = ZL = 50), unless otherwise specified. Table 3 * PE35400 Electrical Specifications(*) Parameter Condition Operating frequency, FIN Min Typ 3.0 GHz Max Unit 13.5 GHz As shown FIN = 3-4.5 GHz -5 > -7 dBm FIN = >4.5-11.5 GHz -15 > -20 dBm FIN = >11.5-13.5 GHz -1 > -7 dBm Output power 0.75-3.375 GHz output frequency range 0 5 dBm Reverse leakage FIN = 3-13.5 GHz, PIN = 0 dBm -45 dBm SSB phase noise 3.025 GHz output frequency @ 100 kHz offset, PIN = 0 dBm -135 dBc/Hz Supply current, IDD FIN = 8 GHz 16 mA Input power sensitivity Note: * All values in Min/Max columns are guaranteed by design characterization. DOC-64872-2 - (10/2015) Page 3 www.psemi.com PE35400 Divide-by-4 Prescaler Device Functional Considerations The PE35400 divides a 3.0-13.5 GHz input signal by four, producing a 750 MHz to 3.375 GHz output signal. In order for the prescaler to work properly, several conditions need to be adhered to. It is crucial that VBYPS and VDD are supplied with bypass capacitors to ground. In addition, the output signal RFOUT needs to be AC coupled via an external capacitor, as shown in Figure 2. The input frequency range is selected by the value of RBIAS according to Figure 3. The ground pattern on the board should be made as wide as possible to minimize ground impedance. Figure 2 * Circuit Block Diagram for PE35400(*) 10 pF GND 0.01 F 10 pF VBYPS VDD VBYPS 50 RFIN Transmission Line RBIAS RBIAS RFOUT VDD 10 pF 0.01 F 6.8 pF 50 GND Die ID Transmission Line Note: * For optimal performance, the following bond wire configuration is recommended. VBYPS: 2 bond wires per pad. RFIN: 1 bond wire. GND: 3 bond wires per pad. RFOUT: 2 bond wires. VDD: 2 bond wires. RBIAS: 1 bond wire. Page 4 DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Typical Performance Data Figure 3 through Figure 11 show the typical performance data @ +25 C, VDD = 2.8V (ZS = ZL = 50), based on optimal RBIAS as shown in Figure 3, unless otherwise specified. Figure 3 * Frequency vs RBIAS Lower Freq Limit (PIN = 0 dBm) Optimal Level Upper Freq Limit (PIN = -7 dBm) Upper Freq Limit (PIN = 0 dBm) Lower Freq Limit (PIN = -7 dBm) Input Frequency (GHz) 16 14 12 10 8 6 4 2 0 5.6 8.2 12 18 27 39 56 RBIAS (k) DOC-64872-2 - (10/2015) Page 5 www.psemi.com PE35400 Divide-by-4 Prescaler Figure 4 * Input Power Sensitivity Min PIN Max PIN 10 Input Power (dBm) 5 0 Recommended input power operating region -5 -10 -15 -20 RBIAS = 56 k RBIAS = 5.6 k -25 1 2 3 4 5 6 7 8 9 10 Input Frequency (GHz) 4.5 GHz 11 12 13 14 15 14 15 11.5 GHz Figure 5 * Input Power Sensitivity vs Temperature Min PIN -40 C Min PIN +25 C Min PIN +85 C Max PIN -40 C Max PIN +25 C Max PIN +85 C 10 Input Power (dBm) 5 RBIAS = 56 k RBIAS = 5.6 k 0 -5 -10 -15 -20 -25 1 2 3 4 5 4.5 GHz 6 7 8 9 10 Input Frequency (GHz) Page 6 11 12 13 11.5 GHz DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Figure 6 * Output Power vs VDD Output power @ 2.65V Output power @ 2.8V Output power @ 2.95V 10 9 Ouput Power (dBm) 8 7 6 5 4 3 2 1 0 2 3 4 5 6 RBIAS Max = 56 k 7 8 9 10 11 12 14 13 RBIAS Min = 5.6 k Input Frequency (GHz) Figure 7 * Output Power vs Temperature Output power @ -40 C Output power @ +25 C Output power @ +85 C Output Power (dBm) 10 9 8 7 6 5 4 3 2 1 0 2 RBIAS Max = 56 k 3 4 6 7 8 9 10 Input Frequency (GHz) DOC-64872-2 - (10/2015) 11 12 13 14 RBIAS Min = 5.6 k Page 7 www.psemi.com PE35400 Divide-by-4 Prescaler Figure 8 * SSB Phase Noise @ 3.025 GHz Output Frequency, PIN = 0 dBm SSB Phase Noise @ 3.025 GHz Output Frequency -125 Phase Noise (dBc/Hz) -130 -135 -140 -145 -150 -155 -160 1.E+05 1.E+06 1.E+07 Offset Frequency (Hz) Figure 9 * Output Harmonics, PIN = 0 dBm 2nd Harmonic 3rd Harmonic Feedthru 0 Output Power (dBm) -5 -10 -15 -20 -25 -30 -35 -40 2 4 6 8 10 12 14 Input Frequency (GHz) Page 8 DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Figure 10 * IDD vs RBIAS Supply Current 20 19 18 IDD (mA) 17 16 15 14 13 12 11 10 5.6 8.2 12 18 27 39 56 RBIAS (k) Figure 11 * Reverse Leakage, PIN = 0 dBm Reverse Leakage -20 Power Level (dBm) -30 -40 -50 -60 -70 2 3 4 5 6 7 8 9 10 11 12 13 14 Input Frequency (GHz) DOC-64872-2 - (10/2015) Page 9 www.psemi.com PE35400 Divide-by-4 Prescaler Pad Configuration This section provides pad information for the PE35400. Figure 12 shows the pad configuration of this device. Table 4 provides a description for each pad. Table 4 * Pad Descriptions for PE35400 Pad No. Pad Name 1 VBYPS Prescaler supply bypass 2 VBYPS Prescaler supply bypass 7 3 RFIN RF input RBIAS 4 GND Ground 5 RFOUT 6 VDD 7 RBIAS Frequency selecting bias resistor 8 GND Ground Figure 12 * Pad Configuration (Top View) 1 8 GND VBYPS 6 2 VDD VBYPS Description RF output Supply voltage 5 3 RFIN Die ID 4 GND RFOUT Page 10 DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Die Mechanical Specifications This section provides the die mechanical specifications for the PE35400. Table 5 * Mechanical Specifications for PE35400 Die size, singulated (x,y) Min Typ Max Unit Condition 866 x 716 886 x 736 916 x 766 m Including excess sapphire, max tolerance = -20/+30 m 180 200 220 m Wafer thickness Wafer size 150 Table 6 * Pad Coordinates for PE35400(*) Pad Pad No. Name Pad Center (m) mm Figure 13 * Pad Layout for PE35400(1)(2) Pad Opening Size (m) X Y X Y 1 8 GND 7 RBIAS VBYPS 1 VBYPS -303 198 160 180 2 VBPYS -303 -3 160 180 2 3 RFIN -303 -208 100 100 VBYPS 4 GND 68 -243 290 130 5 RFOUT 333 -193 100 190 6 VDD 318 40 130 190 7 RBIAS 318 243 130 130 8 GND 14 243 290 130 Note: * All pad locations originate from the die center and refer to the center of the pad. 6 VDD 736 m (-20 / +30 m) Parameter 5 3 RFIN Die ID 4 GND RFOUT 886 m (-20 / +30 m) Notes: 1) Drawings are not drawn to scale. 2) Singulated die size shown, pad side up. DOC-64872-2 - (10/2015) Page 11 www.psemi.com PE35400 Divide-by-4 Prescaler Waffle Pack Information Figure 14 provides the waffle pack information for the PE35400. Figure 14 * 2 x 2 Inch Waffle Pack for PE35400(1)(2)(3) Notch Pocket Closeup Pad 1 Die ID Notes: 1) Drawings are not drawn to scale. 2) Die in pocket shown pad side up. 3) Die will be oriented in the same direction in and within all waffle packs. Unless otherwise stated, die will be oriented such that the top left corner of die will be in-line with the "notched" corner of the die plate base and corner. The die base cover label will be affixed on the die base cover such that the top of the label indicates the top of the die within the waffle pack. Page 12 DOC-64872-2 - (10/2015) www.psemi.com PE35400 Divide-by-4 Prescaler Ordering Information Table 7 lists the available ordering code for the PE35400 as well as available shipping method. Table 7 * Order Code for PE35400 Order Codes PE35400A-G Description Packaging Shipping Method PE35400 die Die in 2 x 2 inch waffle pack 100 die/waffle pack Document Categories Advance Information Product Brief The product is in a formative or design stage. The datasheet contains design target specifications for product development. Specifications and features may change in any manner without notice. This document contains a shortened version of the datasheet. For the full datasheet, contact sales@psemi.com. Preliminary Specification Not Recommended for New Designs (NRND) This product is in production but is not recommended for new designs. The datasheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The datasheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer Notification Form). End of Life (EOL) This product is currently going through the EOL process. It has a specific last-time buy date. Obsolete This product is discontinued. Orders are no longer accepted for this product. Sales Contact For additional information, contact Sales at sales@psemi.com. Disclaimers The information in this document is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user's own risk. No patent rights or licenses to any circuits described in this document are implied or granted to any third party. Peregrine's products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. Patent Statement Peregrine products are protected under one or more of the following U.S. patents: patents.psemi.com Copyright and Trademark (c)2015, Peregrine Semiconductor Corporation. All rights reserved. The Peregrine name, logo, UTSi and UltraCMOS are registered trademarks and HaRP, MultiSwitch and DuNE are trademarks of Peregrine Semiconductor Corp. Product Specification www.psemi.com DOC-64872-2 - (10/2015)