NJL6502R
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1
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1
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10 April 2015 Rev.1.0
Ambient Light Sensor
GENERAL DESCRIPTION
The NJL6502R-1 is the ambient light sensor with optical filter to solve the interference problem by the infrared.
Also, the spectral response is close to human eye.
FEATURES
1. Peak wavelength 580 nm
2. Photo current 420nA±15%
3. Illuminance linearity 0.1 to 100,000 Lux Condition : VR=0V, Ta=25C
4. COBP Package size : 1.7 x 1.2 x 0.8 mm
APPLICATIONS
1. Cellular phone, TV, Car navigation system, PND, HUD, PDA, etc.
to adjust the luminance of display.
2. Lighting equipment, Clock, Toy, etc.
to control ON/OFF.
3. Diaphragm control of camera.
ABSOLUTE MAXIMUM RATINGS (Ta=25C)
PARAMETER SYMBOL
RATINGS UNIT
Reverse Voltage VR 6 V
Operating Temperature Topr -30～+85 ℃
Storage Temperature Tstg -40～+100 ℃
Soldering Temperature Tsol 260 ℃
ELECTRO-OPTICAL CHARACTERISTICS (Ta=25C)
PARAMETER SYMBOL
TEST CONDITION MIN TYP MAX UNIT
Forward Current VF IF=1mA, Ev=0Lux － － 1 V
Dark Current ID VR=5V, Ev=0Lux － － 0.5 nA
Photo Current 1 IL1 Ev=1,000Lux, White LED 357 420 483 nA
Photo Current 2 IL2 Ev=1,000Lux, Light source A － 500 － nA
Light source A/White LED
Light Current Ratio － IL2／IL1 － 1.2 － －
Peak Wavelength p － － 580 － nm
Capacitance Ct FREQ=10kHz, VR=0V － 35 － pF
NJL6502R
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10 April 2015 Rev.1.0
OUT LINE
UNIT: mm
0.8±0.15
(0.2)(0.2)
1.2
1.7
(0.28)
0.450.45
0.42
1
0.32 0.32
0.56 0.56
1.16
0.56
CATHODE
ANODE
PCB Pattern
GENERAL TOLERANCE: ±0.1
ACTIVE AREA
0.57×0.57
RESIST
ACTIVE AREA
NJL6502R
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10 April 2015 Rev.1.0
TYPICAL CHARACTERISTCS
NJL6502R-1
Mask plate
(Window: 0.9mm□)
Light
Measurement image
(Recommended condition)
0.01
0.1
1
10
100
1000
10000
100000
0.1 1 10 100 1000 10000 100000
Photocurrent (nA)
Illuminance (Lux)
Photocurrent vs. Illuminance (Ta=25℃)
White LED Incandescent lamp
0
20
40
60
80
100
120
300 400 500 600 700 800 900 1000 1100
Relative Response (%)
Wavelength(nm)
Spectral Response (Ta=25°C)
NJL6502R-1 Human eye
80
85
90
95
100
105
110
115
120
-40 -20 0 20 40 60 80 100
Relative Photocurrent (%)
Ambient Temperature Ta (°C)
Photocurrent vs. Temperature
VR=0V
Incandescient lamp
White LED
1.0E-13
1.0E-12
1.0E-11
1.0E-10
1.0E-09
1.0E-08
-40 -20 0 20 40 60 80 100
Dark Current ID (A)
Ambient Tempetrature Ta(°C)
Dark Current vs. Temperature
VR=5V
NJL6502R
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10 April 2015 Rev.1.0
MOUNTING METHOD
NOTE
Mounting was evaluated with the following profiles in our company, so there was no problem.
However, confirm mounting by the condition of your company beforehand.
The exposure of device under higher temperature many affect to the reliability of the products, it is
recommended to complete soldering in the shortest time possible.
Mounting: Twice soldering is allowed.
INFRARED REFLOW SOLDERING METHOD
Recommended reflow soldering procedure
(NOTE1) Using reflow furnace with short wave infrared radiation heater such as halogen lamp
Regarding temperature profile, please refer to those fo reflow furnace.
In this case the resin surface temperature may become higher than lead terminals due to endothermic ally of black
colored mold resin. Therefore, please avoid from direct exposure to mold resin.
(NOTE2) Other method
Such other methods of soldering as dipping the device into melted solder and vapor phase method (VPS) are not
appropriate because the body of device will be heated rapidly. Therefore, these are not recommended to apply.
(NOTE3) The resin gets softened right after soldering, so, the following care has to be taken
Not to contact the lens surface to anything.
Not to dip the device into water or any solvents.
FLOE SOLDERING METHOD
Flow soldering is not possible.
IRON SOLDERING METHOD
Iron soldering is not possible.
a b c g
e
150
C
260
C
Room
Temp.
f
180
C
230
C
220
C
d
a : Temperature ramping rate : 1 to 4C/s
b : Pre-heating temperature
time
: 150 to 180C
: 60 to 120s
c : Temperature ramping rate : 1 to 4
C /s
d : 220C or higher time : Shorter than 60s
e : 230C or higher time : Shorter than 40s
f : Peak temperature : Lower than 260C
g : Temperature ramping rate : 1 to 6C /s
The temperature indicates at the surface of mold
package
NJL6502R
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10 April 2015 Rev.1.0
CLEANING
Avid washing the device after soldering by reflow method.
IC STORAGE CONDITIONS AND ITS DURATION
(1) Temperature and humidity ranges
Pack Sealing Temperature: 5 to 40 [C]
Humidity: 40 to 80 []
Pack Opening Temperature: 5 to 30 [C]
Humidity: 40 to 70 []
After opening the bag, solder products within 48 hours.
Avoid a dry environment below 40% because the products are is easily damageable by the electrical discharge.
Store the products in the place where it does not create dew with the products due to a sudden change in temperature.
(2) When baking, place the reel vertically to avoid load to the side.
(3) Do not store the devices in corrosive-gas atmosphere.
(4) Do not store the devices in a dusty place.
(5) Do not expose the devices to direct rays of the sun.
(6) Do not allow external forces or loads to be applied to IC’s.
(7) Be careful because affixed label on the reel might be peeled off when baking.
(8) The product is recommended to do the baking before using for the stability of the quality.
BAKING
In case of keeping expect above condition be sure to apply baking. (Heat-resistant tape)
Baking method: Ta=60C, 48 to 72h, Three times baking is allowed
Ta=100C, 2 to 6h, Three times baking is allowed
STORAGE DURATION
Within a year after delivering this device.
For the products stored longer than a year, confirm their terminals and solderability before they are used.
Moisture Sensitivity Levels
JEDEC : Level 5
NJL6502R
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10 April 2015 Rev.1.0
A
P1 D1
D0
P0P2 T0
T1
W1
F E
W0
B
PACKING SPECIFICATION
PACKING DIMENTIONS UNIT : mm
Drawing direction
Insert direction
(TE1)
* Carrier tape material : Polycarbonate(antistatic)
Cover tape material : Polyester(antistatic)
Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15 , and the peeling-off
strength is to be within the power of 20 to 40g.
Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
2-1) Start rolling : Carrier tape open space more than 20 Pieces.
2-2) End of rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity : 2,000 Pieces
4) Seal off after putting each reels in a damp proof bag with silica gel.
* Reel material : PPE(antistatic)
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
C
D
E
W0
W1
A
B
SIMBOL REMARKS
A1.40 ±0.10 BOTOM DIMENSION
B2.00 ±0.10 BOTOM DIMENSION
+0.10
-0.0
D1 1.10 ±0.10
E1.75 ±0.10
F3.50 ±0.05
P0 4.00 ±0.10
P1 4.00 ±0.10
P2 2.00 ±0.05
T0 0.25 ±0.05
T1 1.05 ±0.10
W0 8.00 ±0.30
W1 5.40 ±0.10 THICKNESS 0.1MAX
D0 1.50
DIMENSION
SIMBOL DIMENSION
A φ180.0±1.0
B φ60.0±1.0
C φ13.0±0.2
D φ21.0±0.8
E 2.0±0.5
W0 9.5±1.0
W1 13.1±1.0
