1
ASMC-QxB2-Txxxx
EnvisiumTM 0.5W Power PLCC-4
Surface Mount LED Indicator
Data Sheet
EnvisiumTM
EnvisiumTM is the premier class of mid-Power LEDs using
TS AlInGaP chip technology. EnvisiumTM LEDs offer unpar-
alleled performance, engineering and design flexibility.
Description
The EnvisiumTM 0.5W Power PLCC-4 SMT LED is an
extension of EnvisiumTM Power PLCC-4 SMT LEDs. The
package can be driven at high current due to its superior
package design. The product is able to dissipate the heat
more efficiently compared to the EnvisiumTM Power PLCC-
4 SMT LEDs. These LEDs produce higher light output with
better flux performance compared to the EnvisiumTM
Power PLCC-4 SMT LED.
The EnvisiumTM 0.5W Power PLCC-4 SMT LEDs are
designed for higher reliability, better performance, and
operate under a wide range of environmental conditions.
The performance characteristics of these new mid-power
LEDs make them uniquely suitable for use in harsh condi-
tions such as in automotive applications, and in electron-
ics signs and signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin (except for red),
to provide close uniformity. These LEDs are compatible
with the IR solder reflow process.
EnvisiumTM 0.5W Power PLCC-4 SMT LED is available in
red orange & amber colors.
Features
x Industry Standard PLCC 4 platform (3.2 x 2.8 x 1.9mm)
x High reliability LED package
x Mid-Power intensity brightness with optimum flux
performance using TS AllnGaP chip technologies
x Available in Red Orange and Amber colors
x High optical efficiency
x Available in 8mm carrier tape and 7 inch reel
x Low Thermal Resistance
x Super wide viewing angle at 120q
x Longer life time with minimum degradation due to
enhanced silicone resin material
x JEDEC MSL 2a
Applications
1. Exterior automotive
- Turn signals
- Side repeaters
- CHSML
- Rear combination lamp
- Side markers
- Truck clearance lamp
2. Electronic signs and signals
- Channel lettering
- Contour lighting
- Indoor variable message sign
3. Office automation, home appliances, industrial
equipment
- Front panel backlighting
- Push button backlighting
- Display backlighting
2
Note:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 12.
3. Terminal Finish: Ag plating
4. Encapsulation material: Silicone resin
Figure 1. Package Drawing
Table 1. Device Selection Guide (TJ = 25 °C)
Color Part Number
Luminous Flux, IV [1] (lm)
Dice TechnologyMin. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA)
Amber ASMC-QAB2-TAC0E 4.30 6.60 9.00 150 AlInGaP
Red Orange ASMC-QHB2-TCD0E 7.00 9.30 11.50 150 AlInGaP
Notes:
1. IV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
Part Numbering System
Component Dimensions
A S M C - Q X1 B 2 - T X2 X3 X4 X5
Packaging Option
Color Bin Selection
Max. Flux Bin
Min. Flux Bin
Color
A - Amber
H - Red Orange
3.6 ± 0.2
0.7
3.2 ± 0.2
2.8 ± 0.2
2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3
CC
AA
0.79 ± 0.3
CATHODE
MARKING
I 2.4
1.15 ± 0.2
0.41 (TYP.)
0.56 (TYP.)
0.97
3
Table 2. Absolute Maximum Ratings (TA = 25 qC)
Parameters ASMC-QxB2-Txxxx
DC Forward Current [1] 150 mA
Peak Forward Current [2] 300 mA
Power Dissipation 470 mW
Reverse Voltage 5 V
Junction Temperature 125 °C
Operating Temperature -40 °C to +100 °C
Storage Temperature -40 °C to +100 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TJ = 25 qC)
Color
Part
Number
Dice
Technology
Dominant
Wavelength
OD [1] (nm)
Viewing Angle
2T½ [2]
(Degrees)
Luminous
Efficiency
Ke (lm/W)
Total Flux /
Luminous Intensity
FV (lm) / IV (cd)
Typ. Typ. Typ. Typ.
Amber ASMC-QAB2-Txxxx AlInGaP 593.5 120 17 6.5
Red Orange ASMC-QHB2-Txxxx AlInGaP 619.3 120 24 5.0
Notes:
1. The dominant wavelength, OD, is derived from the CIE Chromaticity diagram and represents the color of the device.
2. T½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (TJ = 25 qC)
Part Number
Forward Voltage
VF (Volts) @ IF = 150 mA
Reverse Voltage
VR @ 100PAThermal Resistance
RTJ-P (°C/W)Typ. Max. Min.
ASMC-QxB2-Txxxx 2.64 3.10 5 60
4
Figure 3. Forward Current Vs. Forward Voltage
Figure 4. Relative Intensity Vs. Forward Current Figure 5. Relative Intensity Vs. Temperature
Figure 2. Relative Intensity Vs. Wavelength
0
50
100
150
200
250
300
350
012345
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
AlInGaP Amber
AlInGaP Red Orange
0
0.2
0.4
0.6
0.8
1.0
1.2
020406080100 120 140160
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZATION AT 150 mA)
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
-50-250255075100 125
JUNCTION TEMPERATURE - °C
RELATIVE LUMINOUS INTENSITY
(NORMALIZATION AT 25°C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430480 530580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
AlInGaP Amber
AlInGaP Red Orange
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on TJMAX = 125°C, RTJ-A=130 °C/W, 110°C/W and 100°C/W
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RTJP = 60°C/W
MAXIMUM FORWARD CURRENT - mA
0
20
40
60
80
100
120
140
160
020406080100 120
AMBIENT TEMPERATURE (°C)
RθJA = 100°C/W
RθJA = 110°C/W
RθJA = 130°C/W
MAXIMUM FORWARD CURRENT - mA
0
20
40
60
80
100
120
140
160
020406080100 120
SOLDER POINT TEMPERATURE (°C)
RθJP = 60°C/W
5
Figure 8. Forward Voltage Shift Vs. Temperature
Figure 9. Radiation Pattern
Figure 7. Dominant Wavelength Vs. Forward Current - AlInGaP Devices
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
-50-250255075100
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90 -60 -300 306090
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
570
580
590
600
610
620
630
125102050100 150
CURRENT - mA
DOMINANT WAVELENGTH - nm
RED ORANGE
AMBER
6
Figure 12. Recommended Soldering Pad Pattern
Figure 10. Recommended Pick and Place Nozzle Size Figure 11. Recommended Pb-free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components
Note: Diameter "D" should be smaller than 2.2mm
D217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
3°C/SEC. MAX.
CATHODE
MARKING
CATHODE
MARKING
A
C
A A
C C
C C
SOLDER MASK
ANODE
CATHODE
0.4
0.3
MINIMUM 55 mm2 OF CATHODE PAD
FOR IMPROVED HEAT DISSIPATION
2.4
0.6
0.9 X 6
4.6
1.1
1.3 x 6
AA
CC
7
Figure 14. Tape Dimensions
Figure 15. Reeling Orientation
Figure 13. Tape Leader and Trailer Dimensions
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILER COMPONENTLEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.1 4 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5+0.1
–0
8°
Ø1+0.1
–0
AA
CC
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
8
Color Bin Select (X4)
Individual reel will contain parts from one full bin only.
X4
0 Full Distribution
A 1 and 2 only
B 2 and 3 only
C 3 and 4 only
D 4 and 5 only
E 5 and 6 only
G 1, 2 and 3 only
H 2, 3 and 4 only
J 3, 4 and 5 only
K 4, 5 and 6 only
M 1, 2, 3 and 4 only
N 2, 3, 4 and 5 only
P 3, 4, 5 and 6 only
R 1, 2, 3, 4 and 5 only
S 2, 3, 4, 5 and 6 only
Z Special Color Bin
Color Bin Limits
Amber/Yellow Min. (nm) Max. (nm)
2 583.0 586.0
3 586.0 589.0
4 589.0 592.0
5 592.0 595.0
6 595.0 598.0
Red Orange Min. (nm) Max. (nm)
1 611.0 616.0
2 616.0 620.0
3 620.0 625.0
Tolerance of each bin limit = ±1nm
Device Color (X1)
A Amber
H Red Orange
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only
X2Min Flux Bin
X3Max Flux Bin
Flux Bin Limits
Bin ID Min. (lm) Max. (lm)
A 4.30 5.50
B 5.50 7.00
C 7.00 9.00
D 9.00 11.50
E 11.50 15.00
F 15.00 19.50
G 19.50 25.50
H 25.50 33.00
J 33.00 43.00
K 43.00 56.00
L 56.00 73.00
Tolerance of each bin limit = ± 12%
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-0397EN - September 29, 2009
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reflow the LEDs per the
original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their floor
life of 672 hours.
E. Baking is required if:
- “10%” is Not blue and “5%” HIC indicator turns pink.
- The LEDs are exposed to condition of >30°C / 60% RH
at any time.
- The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60±5°C for 20 hours.
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly
of handling, the unit should b e held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Packaging Option (X5)
Option Test Current Package Type Reel Size
E 150mA Top Mount 7 Inch
VF Binning
Bin Min. Max.
2D 2.35 2.50
2E 2.50 2.65
2F 2.65 2.80
2G 2.80 2.95
2H 2.95 3.10
2J 3.10 3.25
Tolerance of each bin = ±0.1V
