5V, SUPER MINIMOLD UPC2710TB MEDIUM POWER SI MMIC AMPLIFIER GAIN vs. FREQUENCY and TEMPERATURE FEATURES 35 * HIGH DENSITY SURFACE MOUNTING: 6 Pin Super Minimold or SOT-363 package VCC = 5.0 V * SATURATED OUTPUT POWER: +13.5 dBm * SUPPLY VOLTAGE: VCC = 4.5 to 5.5 V Gain, GS (dB) * HIGH GAIN: 33 dB TYP TA = -40C TA = +25C TA = +85C 30 DESCRIPTION NEC's UPC2710TB is a Silicon RFIC manufactured using the NESAT III process. This device is suitable as a PA driver amplifier for cellular radio and other communication receivers. The UPC2710TB is pin compatible and has comparable performance to the larger UPC2710T, so it is suitable for use as a replacement to help reduce system size. The IC is housed in a 6 pin super minimold or SOT-363 package. 25 0.1 0.3 1.0 2.0 Frequency, f (GHz) NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. ELECTRICAL CHARACTERISTICS (TA = 25 C, VCC = 5 V, f = 0.5 GHz) PART NUMBER PACKAGE OUTLINE SYMBOLS PARAMETERS AND CONDITIONS UPC2710TB S06 UNITS MIN TYP MAX ICC Circuit Current (no signal) mA 16 22 29 GS Small Signal Gain dB 30 33 36.5 fU Upper Limit Operating Frequency (The gain at fU is 3 dB down from the gain at 0.1 GHz) GHz 0.7 1.0 GS Gain Flatness, f = 0.1 ~ 0.6 GHz f = 0.1 ~ 0.8 GHz dB PSAT Saturated Output Power dBm P1dB Output Power at 1dB Compression Point dBm +7.5 NF Noise Figure dB 3.5 RLIN Input Return Loss dB 3 6 RLOUT Output Return Loss dB 9 12 ISOL Isolation dB 34 39 GT Gain -Temperature Coefficient dB/C RTH Thermal Resistance (Junction to Ambient) C/W 0.8 +11 +13.5 5 -0.006 325 California Eastern Laboratories UPC2710TB ABSOLUTE MAXIMUM RATINGS1 (TA = 25C) SYMBOLS PARAMETERS UNITS RATINGS VCC Supply Voltage V 6 PIN Input Power dBm +10 PT Power Dissipation2 mW 200 TOP Operating Temperature C -40 to +85 TSTG Storage Temperature C -55 to +150 RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER UNITS MIN TYP MAX V 4.5 5.0 Supply Voltage VCC 5.5 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. Mounted on 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85C). PIN DESCRIPTIONS Pin No. Symbol 1 Applied Pin Voltage (V) Voltage (V) Input 4 - Output 6 0.9 - VCC Internal Equivalent Circuit Description Signal input pin. An internal matching circuit, configured with resistors, enables 50 connection over a wide bandwidth. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to the signal source with a blocking capacitor. - Signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. 4.5 to 5.5 IN 1 Power supply pin. This pin should be externally equipped with a bypass capacitor to minimize ground impedance. 3 2 GND 2 3 5 GND 0 - Ground pins. These pins should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to minimize impedance difference. TYPICAL PERFORMANCE CURVES (TA = 25C) CIRCUIT CURRENT vs. TEMPERATURE CIRCUIT CURRENT vs. VOLTAGE 40 35 1.4 30 1.2 25 1.0 20 0.8 15 0.6 UPC2710T 35 Circuit Current, ICC (mA) Circuit Current, ICC (mA) 40 30 UPC2710T 25 20 15 10 0.4 5 0.2 5 0 0 0 0 1 2 3 4 Supply Voltage, VCC (V) 5 6 10 -60 -40 -20 0 20 40 60 5 GND 80 Operating Temperature, TOP (C) 100 6 VCC 4 OUT UPC2710TB TYPICAL PERFORMANCE CURVES (TA = 25 C) NOISE FIGURE AND INSERTION GAIN vs. FREQUENCY RETURN LOSS vs. FREQUENCY 35 0 6 VCC = 5.0 V VCC = 4.5 V 5 30 VCC = 5.5 V NF 4 VCC = 4.5 V VCC = 5.0 V Input Return Loss, RLIN (dB) Output Return Loss, RLOUT (dB) Gp Noise Figure, NF (dB) Insertion Power Gain, GP (dB) VCC = 5.0 V VCC = 5.5 V 3 25 0.1 0.3 1.0 RLIN -10 RLOUT -20 -30 -40 -50 0.1 2.0 0.3 Frequency, f (GHz) ISOLATION vs. FREQUENCY POWER vs. FREQUENCY 0 2.0 1.0 Frequency, f (GHz) 20 VCC = 5.0V x 15 PSAT Power (dBm) Isolation, ISOL (dB) -10 -20 -30 -40 10 P1dB 5 0 -5 -50 0.1 0.3 1.0 2.0 0 1.0 1.5 2.0 Frequency, f (GHz) X: Typical SSB Third Order Intercept Point OUTPUT POWER vs. INPUT POWER AND VOLTAGE OUTPUT POWER vs. INPUT POWER AND TEMPERATURE 20 20 VCC = 5.0 V f = 0.5 GHZ VCC = 5.5 V f = 0.5 GHz TA = 85 C 15 Output Power, POUT (dBm) 15 Output Power, POUT (dBm) 0.5 Frequency, f (GHz) 10 VCC = 5.0 V 5 VCC = 4.5 V 0 -5 10 TA = -45 C TA = 25 C 5 0 -5 -10 -10 -15 -15 -40 -35 -30 -25 -20 -15 -10 -5 Input Power, PIN (dBm) 0 5 10 -40 -35 -30 -25 -20 -15 -10 -5 Input Power, PIN (dBm) 0 5 10 UPC2710TB TYPICAL PERFORMANCE CURVES (TA = 25C) OUTPUT POWER vs. INPUT POWER AND VOLTAGE NOISE FIGURE vs. FREQUENCY 6 +20 f = 1.0 GHz Output Power, POUT (dBm) Noise Figure, NF (dB) +15 5 UPC2710T 4 3 VCC = 5.0 V VCC = 5.5 V +10 +5 0 VCC = 4.5 V -5 -10 2 -15 0 0.5 1.0 +5 +10 OUTPUT POWER vs. INPUT POWER AND FREQUENCY SATURATED OUTPUT POWER vs. FREQUENCY AND VOLTAGE Saturated Output Power, POUT (sat) (dBm) +15 Output Power, POUT (dBm) 0 Input Power, PIN (dBm) VCC = 5.0 V f = 0.5 GHz +10 +5 f = 1.0 GHz 0 -5 -10 -15 -40 -35 -30 -25 -20 -15 -10 -5 0 +5 +10 Input Power, PIN (dBm) Third Order Intermodulation Distortion, IM3 (dBc) -5 Frequency, f (GHz) +20 -10 VCC = 4.5 V -20 -30 VCC = 5.5 V -40 VCC = 5.0 V -50 f1 = 0.500 GHz f2 = 0.502 GHz -60 -8 -6 -4 -2 0 +2 +4 +6 Output Power, POUT (dBm) +20 PIN = -8 dBm +18 VCC = 5.5 V +16 VCC = 5.0 V +14 +12 VCC = 4.5 V +10 +8 +6 0.1 0.2 0.5 Frequency, f (GHz) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE and VOLTAGE -10 -40 -35 -30 -25 -20 -15 -10 1.5 +8 +10 1.0 2.0 UPC2710TB SYSTEM APPLICATION EXAMPLE Example of 900 MHz Band Digital Cellular Telephone RX DEMO SW PLL I Q PLL I Driver TX 0 PA UPC2710TB 90 Q UPC2710TB TYPICAL SCATTERING PARAMETERS (TA = 25C) 3.0 GHz 0.1 GHz 0.1 GHz 3.0 GHz 2.0 GHz 2.0 GHz 1.0 GHz 1.0 GHz S22 S11 UPC2710TB VCC = VOUT = 5 V, ICC = 22 mA FREQUENCY S11 S21 GHz MAG ANG 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 0.306 0.324 0.356 0.400 0.439 0.469 0.481 0.488 0.479 0.465 0.448 0.417 0.387 0.350 0.316 0.292 0.256 0.245 0.215 0.201 0.177 0.161 0.145 0.124 0.113 0.107 0.091 0.081 0.067 0.055 0.039 2.5 5.2 5.3 2.5 -3.3 -10.2 -17.9 -26.7 -34.5 -41.2 -49.3 -54.9 -61.2 -65.2 -70.8 -74.0 -76.9 -80.5 -82.9 -85.6 -84.4 -88.8 -88.7 -90.3 -89.8 -91.9 -92.2 -94.9 -97.4 -103.8 -95.6 S12 S22 MAG ANG MAG ANG MAG 43.072 43.517 44.432 45.513 45.679 45.670 44.793 43.016 40.519 37.946 35.122 32.108 29.221 26.656 23.895 21.576 19.567 17.743 16.040 14.717 13.475 12.327 11.154 10.262 9.490 8.793 8.149 7.652 7.134 6.726 6.295 -8.4 -17.1 -26.5 -36.9 -48.1 -59.7 -71.8 -84.3 -96.0 -107.3 -117.9 -128.0 -137.0 -145.8 -153.9 -161.6 -168.1 -174.4 179.6 173.5 168.8 163.1 158.7 154.4 150.4 146.4 142.4 138.9 135.1 131.5 128.4 0.012 0.010 0.010 0.012 0.012 0.013 0.014 0.014 0.013 0.016 0.016 0.015 0.015 0.015 0.013 0.016 0.015 0.018 0.017 0.021 0.020 0.021 0.022 0.023 0.025 0.028 0.030 0.031 0.031 0.039 0.039 15.2 10.7 20.2 26.9 27.0 31.3 27.9 34.9 26.6 30.8 26.6 39.5 39.7 50.2 50.8 56.6 69.0 61.7 70.0 71.2 83.0 76.7 87.9 81.4 91.9 88.7 93.4 92.1 93.0 88.3 89.6 0.156 0.164 0.185 0.225 0.255 0.283 0.312 0.301 0.307 0.311 0.307 0.282 0.270 0.248 0.236 0.215 0.200 0.196 0.180 0.175 0.166 0.171 0.159 0.164 0.158 0.166 0.175 0.183 0.191 0.200 0.203 K ANG 2.7 2.1 0.3 -5.5 -15.4 -27.6 -54.9 -40.2 -92.2 -79.5 -92.2 -104.6 -115.5 -127.0 -136.2 -145.3 -155.2 -162.5 -173.4 -178.1 172.0 167.7 159.7 154.0 147.0 141.8 135.7 131.6 123.4 118.9 111.5 1.08 1.17 1.10 0.92 0.85 0.77 0.74 0.74 0.85 0.79 0.85 0.99 1.12 1.27 1.56 1.49 1.71 1.59 1.88 1.71 1.94 1.99 2.08 2.15 2.19 2.06 2.13 2.13 2.26 1.97 2.08 UPC2710TB PIN CONNECTIONS OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 (Top View) (Top View) 2.1 0.1 C1F 3 1.25 0.1 2 0.65 4 3 1 (Bottom View) 4 4 3 5 5 2 6 6 1 +0.10 2.0 0.2 1.3 2 5 1 6 0.22 - 0.05 (All Leads) 1. 2. 3. 4. 5. 6. INPUT GND GND OUTPUT GND VCC 0.6 0.1 0.45 0.13 0.05 0 ~ 0.1 TEST CIRCUIT EQUIVALENT CIRCUIT 6 VCC VCC 1000 pF OUT 4 C3 L = 1000 nH 1. 2. 3. 4. 5. 6. 6 50 C2 C1 1 IN 1000 pF 50 4 2, 3, 5 OUT 1 IN 1000 pF INPUT GND GND OUTPUT GND VCC GND 2, 3, 5 ORDERING INFORMATION PART NUMBER MARKING QTY UPC2710TB-E3-A C1F 3K/Reel Note: Embossed Tape, 8 mm wide. Pins 1, 2 and 3 face perforated side of tape. Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES * Headquarters * 4590 Patrick Henry Drive * Santa Clara, CA 95054-1817 * (408) 988-3500 * Telex 34-6393 * FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) * Internet: http://WWW.CEL.COM DATA SUBJECT TO CHANGE WITHOUT NOTICE 07/17/2000 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix -A indicates that the device is Pb-free. The -AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL's understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. 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