HSEC8-125-01-L-DV-A F-219 HSEC8-149-01-L-DV-A (0.80 mm) .0315" HSEC8-DV SERIES VERTICAL EDGE RATE CARD SOCKET (R) SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?HSEC8-DV Insulator Material: Black Liquid Crystal Polymer Contact: BeCu Plating: Au or Sn over 50 " (1.27 m) Ni Current Rating: 2.8 A per pin (2 adjacent pins powered) Operating Temp: -55 C to +125 C RoHS Compliant: Yes 10 YEAR MFG WITH 30 " GOLD EXTENDED LIFE PRODUCT HIGH MATING CYCLES HIGH-SPEED CHANNEL PERFORMANCE HSEC8-DV Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com RECOGNITIONS HSEC8 For complete scope of recognitions see www.samtec.com/quality MISALIGNMENT MITIGATION Cable Mates: ECDP PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (10-60) Mates with (1.60 mm) .062" or (2.36 mm) .093" cards Card Mates: (1.60 mm) .062" card, (2.36 mm) .093" card, HSC8 1 28 G b p s POSITIONS PER ROW Custom designs compensate for misalignment. PLATING OPTION CARD THICKNESS FILE NO. E111594 -01 09, 10, 13, 20, 25, 30, 37, 40, 49, 50, 60, 70, 80, 100 (13, 25, 49 only available with -L or -L2 option; 09 only available with -L2 option; 37 only available with -L option) = (1.60 mm) .062" thick card -03 = (2.36 mm) .093" thick card 01 A B CABLE CONNECTOR ECDP-04 ECDP-08 ECDP-16 ECDP-32 HSEC8-109-L2 HSEC8-113-L2 HSEC8-125-L2 HSEC8-149-L2 Notes: While optimized for 50 W applications, this connector with alternative signal/ground patterns may also perform well in certain 75 W applications. Some lengths, styles and options are non-standard, non-returnable. (No. of Positions + 6) x (0.80) .0315 + (0.60) .024 A -L = 10 " (0.25 m) Gold on contact, Matte Tin on tail -S = 30 " (0.76 m) Gold on contact, Matte Tin on tail POSITIONS PER ROW 09* 13* 25* 37 40 49* 50 60 70 80 (1.32) 100 .052 No. of Positions x (0.80) .0315 + (7.80) .307 02 DV A B (4.50) .177 (11.80) .465 (6.10) .240 (15.00) .591 (6.10) .240 (24.60) .969 (18.10) .713 (34.20) 1.346 (18.90) .744 (36.60) 1.441 (22.90) .902 (43.80) 1.724 (22.90) .902 (44.60) 1.756 (26.90) 1.059 (52.60) 2.071 (26.90) 1.059 (60.60) 2.386 (26.90) 1.059 (68.60) 2.701 (26.90) 1.059 (84.60) 3.331 Positions where no dimensions are given do not have keying feature. * Mates with ECDP Series. Available with -01 Card Only. 09, 13, 25, 37, 100 No. of Positions x (0.80) .0315 + (4.60) .181 02 (7.00)(5.60) .276 .220 01 (7.98) .314 (7.80) .307 (0.80) .0315 (1.75) .070 (1.12) .044 DIA No. of Positions x (0.80) .0315 + (2.20) .087 10, 20 & 30 Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. OTHER OPTION -K = (7.01 mm) .276" DIA Polyimide Film Pick & Place Pad (with -01 card) = (6.25 mm) .246" DIA Polyimide Film Pick & Place Pad (with -03 card) -BL = Board Locks (-01 card only) (Weld tab standard) -L = Latching Option (-01 card only) (13, 25, 37, 49 only) (Weld tab standard) -L2 = ECDP Latching (-01 card only) (09, 13, 25, 49 only) (For use with ECDP) (Weld tab standard) -WT = Weld tab -TR = Tape & Reel (09 - 70 only)