UHF ASK/FSK Industrial Transmitter
ATA8401/ATA8402/ATA8403
1. Introduction
The ATA8401/ATA8402/ATA8403 are PLL transmitter ICs, which have been devel-
oped for the demands of RF low-cost transmission systems for industrial applications
at data rates up to 50 kBit/s ASK and 32 kBit/s FSK modulation scheme. With these
products Atmel® offers the solution for the PLL transmitter for industrial market cover-
ing frequency ranges 310 MHz to 350 MHz with ATA8401, 429 MHz to 439 MHz with
ATA8402 and 868 MHz to 928 MHz with ATA8403. The purpose of this application
note is firstly to summarize some important hints for the design using these transmit-
ters and secondly to describe the Atmel demo boards as well as the evaluation with
the demo software.
2. Application Hints
2.1 Antenna Design, Layout and Matching
Different applications and of course different operation frequency ranges need differ-
ent antenna solutions. Short Range Device (SRD) in the ISM bands around 315 MHz,
433.92 MHz and 868 MHz use mostly quarter-wave monopoles, helical antennas, or
printed small loop antennas. Antenna characteristic such as directivity, gain, polariza-
tion, impedance, and bandwidth determine the system performance of the application.
In addition to technical requirements, cost and the package are the most significant
parameters to consider for mass-production. Choosing an antenna design is for the
most part a compromise between cost, package, and technical requirements.
For the general application of hand-held wireless control transmitters, the printed
“small” loop antenna is free of cost and its size is smaller than a whip antenna. The
loop antenna performance satisfies most system requirements, and it also has the
added benefit of hand-in sensitivity. A “small” loop antenna is an antenna with total
loop length (circumference) of less than one fifth of a wavelength (λ/5). (The rule of
thumb is approximately tenth of the wavelength (λ/10).) Atmel’s demo board uses a
small loop antenna. Therefore, the equations in this application note are only valid for
the small loop antenna.
UHF ASK/FSK
Industrial
Transmitter
ATA8401/
ATA8402/
ATA8403
Application Note
9115A–INDCO–01/08
2
9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
For radiation, a loop antenna needs a strong current flowing through it in order to generate a
magnetic field as the loop antenna is a magnetic antenna. The radiation resistance of the
antenna is a primary determiner of the antenna’s transmitted power.
Equation 1
Notes: 1. A is the loop area in square meters
2. λ is the wavelength in meter
A second important parameter of the antenna’s transmitted power is the loss of the loop
antenna. This can be derived from the skin depth theory under the assumption that the trace
width is much greater than trace’s thickness, which is greater than the skin depth. The loss resis-
tance for a copper trace can be calculated with the following equation:
Equation 2
Notes: 1. L is the total perimeter of the antenna in meters referring to the trace’s centre
2. W is the trace width in meters
In order to estimate the transmit power using the loop antenna, it is necessary to determine the
efficiency of the antenna. This is given by:
Equation 3
Notes: 1. RRad is the radiation resistance of the antenna
2. Rloss_loop is the loss resistance of the loop’s trace
3. Rloss_cap is the loss of the capacitors for the matching
The radiated power can be calculated, as follows:
Equation 4
Note: Iloop is the current flow through the loop antenna
The relationship between the effective radiated power (ERP) and the IC’s output power
(Pout,IC) driving the antenna is:
Equation 5
RRad 31.2 103
×A2
λ4
------
⎝⎠
⎜⎟
⎛⎞
Rloss_loop l
2w
------- 2.59 10-7
×()×f
ηRRad
RRad Rloss_loop Rloss_cap
++
-------------------------------------------------------------------------=
PRad Iloop
()
2RRad
×=
ERP ηPout,IC
×=
3
9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
The equivalent circuit for the loop antenna is shown in Figure 2-1.
Figure 2-1. Equivalent Circuit of a Loop Antenna
An estimation of the loop inductance is necessary to match the loop antenna. This value can be
determined using a formula for inductance of a polygon of general shape (Equation 6). This for-
mula provides a result with 5% accuracy.
Equation 6
Notes: 1. L is the loop perimeter
2. A is the loop area
3. W is the trace width of the loop antenna
The Q factor of the loop antenna is given by
Equation 7
To optimize the performance of the loop antenna the following rules must be considered:
The area enclosed by the loop has to be designed as large as possible and the ground area
within the loop must be small.
The field density increases towards the loop edges. Therefore, enough space must be
provided near to the loop edges.
The trace width of the loop antenna should not exceed 1.5 mm to avoid a large antenna Q
factor.
Figure 2-2. Layout Design of the Loop Antenna
Ideal Suboptimal
RRad LoopRloss
L
210
-7
×l×ln 8A
lw
-------
⎝⎠
⎛⎞
×=
Qloop
ωLloop
Rloss
---------------=
Loop
Antenna
Ground
Loop
Antenna
Ground
4
9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
The Power Amplifier (PA) is an open collector output delivering a current pulse, which is nearly
independent from the load impedance. Therefore, the output power can be controlled via the
connected load impedance. To achieve the maximum output power, the PA’s output capaci-
tance has to be compensated for by the reactive part of the load impedance so that all the power
will be delivered to the resistive load. The saturation of the PA’s output transistor is the limitation
of the voltage swing at matching. The PA’s matching principle is illustrated in Figure 2-3. The
open collector output stage of the PA needs the DC current delivered by a low resistive path to
the power supply (VS). This low resistive path will be provided by connecting a feed inductor (RF
choke) on the PA output (pin Ant1).
Figure 2-3. Principle of Power Amplifier Matching
The simple matching method of the loop antenna to the power amplifier is illustrated in Figure
2-4 on page 5. The capacitors Cmatch1 and Cmatch2 transform the parallel resonance imped-
ance (Z||) of the loop antenna to match the optimal load impedance of the transmitter, Zload,opt.
The optimum load impedance of each transmitter is:
ATA8401 requires Zload,opt of (255 + j192)
ATA8402 requires Zload,opt of (166 + j223)
ATA8403 requires Zload,opt of (166 + j226)
Zload
optimum
Vce sat
VS
I(t)
I(t)
I
V(t)
V(t)
CPA_Out
5
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ATA8401/ATA8402/ATA8403
Figure 2-4. Matching Loop Antenna to the Power Amplifier
The parallel resonance impedance (Z||) can be calculated by equation 8.
Equation 8
The variable r in the equation 9 describes the transformation ratio of the matching structure
(Cmatch1,2).
Equation 9
Equation 10
Equation 11
Equation 12
In order to get lower influences of the capacitor's tolerance and to achieve an optimal matching
with standard elements, two capacitor are used in series for Cmatch2. The Cmatch1 has to be
placed as close as possible to the IC to suppress the first harmonic. The connection of the pin
ANT2 to ground must be designed properly. The best practical way is to place several vias direct
to the ground plane of the board. This rule of ground connection is also valid for the ground con-
nection of the matching elements.
If a higher harmonic rejection is needed, an additional low-pass filter has to be designed
between the loop antenna and the transmitter. Figure 2-5 on page 6 shows the principle sche-
matic. The Cx must be placed as close as possible to the power amplifier output.
Z
load
Z
II
C
match2
R
rad
Loop
ANT2
ANT1
RF
Choke
PA R
loss
C
match1
C
PA_Out
Loop Antenn
a
Cmatch2
Cmatch1
ANT2
ANT1
RF
Choke
PA
CPA_Out
CII
VS
ZII Qloop2πfLloop
=
ZII r2Zload
=
CII 1
ω2Lloop
------------------ Cmatch1 CPA_Out
+()Cmatch2
Cmatch1 CPA_Out
+()Cmatch2
+
------------------------------------------------------------------------------==
rCmatch1 CPA_Out
+()Cmatch2
+
Cmatch2
------------------------------------------------------------------------------Cmatch1 rC
II CPA_Out
×==
Cmatch2
Cmatch1 CPA_Out
+
r1
-----------------------------------------------=
6
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ATA8401/ATA8402/ATA8403
Figure 2-5. Matching Structure of the Loop Antenna with an Additional Harmonic Rejection
Caution: the formulas provide a theoretical start value for tuning of the real values on the appli-
cation board.
2.2 Board Layout
The decoupling measure of the power supply is very important to minimize any disturbance in
the internal circuit. It is recommended that a capacitor X7R with a value of 68 nF is placed
between VS (pin 6) and GND (pin 7) of the transmitter. The decoupling effect is better if the
capacitor is placed as close as possible to the IC. The ground connection between the decou-
pling capacitor and ground plane must be design properly.
Figure 2-6. Example for a Board Layout
Cmatch2
Cmatch1
ANT2
ANT1
RF
Choke
PA
CPA_Out
VS
LX
CX
CLK
PA_EN
ANT2
ANT1XTAL
Cd2
Cd3
Cd1
Vbatt
CL
Cx
C
C
C
Lx
L1
VS
GND
EN
7
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ATA8401/ATA8402/ATA8403
Figure 2-6 on page 6 shows an example of an ideal layout. In this example, a crystal with a
metal shielding is used. These types of crystals generally have four pads. The two ground pads
of the crystal must be connected to the board's ground plane properly. The connection between
the crystal and the pin XTO must be kept short. If the clock signal generated by the transmitter is
needed for the microprocessor, the trace between the pin CLK and the microprocessor pin must
be as short as possible. The layout in Figure 2-6 uses a discrete element as RF choke instead of
the printed inductor as found on the demo board. The discrete inductor needs less space than
the printed one.
Notes: 1. L1 is the RF choke
2. Cd1 is the decoupling capacitor near the battery
3. Cd2 is the decoupling capacitor for the transmitter's power supply
4. Cd3 is the capacitor to bypass the high-frequency coupling from the power amplifier output
into the transmitter's power supply. This capacitor must be placed near to the RF choke.
In a practical application, there are different supply voltages on the board, for example for the
microprocessor and for the transmitter. The different traces from the battery must be separated
and decoupled to the ground.
2.3 The Setting of the Transmitter
Figure 2-7 shows the typical applications for the transmitters in ASK or FSK mode.
Figure 2-7. Typical Application Schematic
If ENABLE = Low and PA_ENABLE = Low, the circuit is in standby mode. To start the crystal
oscillator (XTO), the pin ENABLE must be switched on. At the same time the Phase Locked
Loop (PLL) and the Clock Driver are active. To activate the power amplifier, the pin PA_ENABLE
must be set to high. After switching the pin ENABLE on, both the XTO circuit and the PLL need
a maximum of 1 ms to reach a stable condition. Therefore, the application software has to wait
at least 1 ms before switching the power amplifier on.
a) ASK mode b) FSK mode
RF
Choke
VS
VSS1
S2
C1
ANT1
BPXY
VSS
VDD
ATARx9x
OSC1
BPXY
BPXY
BPXY
ANT2
PA_EN
CLK
XTAL
VS
GND
EN
RF
Choke
VS
VSS1
S2
C1
C2
ANT1
BPXY
VSS
VDD
ATARx9x
OSC1
BPXY
BPXY
BPXY
ANT2
PA_EN
CLK
XTAL
VS
GND
EN
B42/
T20
8
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ATA8401/ATA8402/ATA8403
2.3.1 ASK (OOK) Transmission
The load capacitor of the crystal (C1 in Figure 2-7a) is used to adjust the desired RF transmit fre-
quency. For ASK modulation, the PA_ENABLE will be switched alternating between high and
low voltage due to the data to be transmitted. This results in the switching on and off of the
power amplifier, which is known as OOK (On Off Keying).
2.3.2 FSK Transmission
The crystal pulling method is used for the FSK modulation (seeFigure 2-7b). An additional
capacitor C2 will be used to modulate the crystal resonance frequency due to the data to be
transmitted. For this purpose the capacitor C2 will be connected to the capacitor C1 related to
the data. In practical terms this is a connection between capacitor C2 and the open drain port of
a microprocessor. In the event of modulation, the microprocessor switches the capacitor C2
alternately between high impedance condition and ground. This method pulls the crystal's series
resonance frequency between two values, which results in the RF operating frequency.
2.4 Crystal Oscillator
The crystal oscillator uses the crystal’s series resonance frequency to generate the reference
frequency. The series connection of the crystal and the load capacitor results in an impedance
ZXTAL seen from the pin XTAL (pin 5). According to the crystal’s specification, the crystal will
oscillate on the loaded resonance frequency fL, in which the impedance ZXTAL is real. This
means the imaginer part of the impedance Im{ZXTAL} is 0.
The impedance ZXTO is the large signal input impedance of the XTO seen into the pin XTAL
(pin 5) in steady state oscillation. For the oscillation start-up, the following conditions must be ful-
filled (see Figure 2-8).
Im{ZXTO + ZXTAL} = 0 Equation 13
Re{ZXTO + ZXTAL} < 0 Equation 14
Figure 2-8. Condition for Oscillation Start Up
To achieve the condition described by equation 13 at the specified loaded crystal frequency, the
capacitance CL can be determined as:
Equation 15
With lm{ZXTAL} = –lm{ZXTO}
XTAL
VS
XTAL
C
L
Z
XTO
Z
XTAL
CL1
2πfLlm ZXTAL
{}
-------------------------------------=
9
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ATA8401/ATA8402/ATA8403
In real applications, there are stray capacitances on the board have to be taken into account
when determining the load capacitance.
If FSK modulation is used, the crystal-loaded resonance frequency is pulled by two different
capacitance values (CL1 and CL2) due to the data. Figure 2-9 shows the principle circuit for FSK
modulation. The frequency deviation can be estimated using formula 16.
Figure 2-9. Circuitry for FSK Modulation
Equation 16
Notes: 1. f is the ± frequency deviation in ppm
2. CM is the motional capacitance of the crystal.
When determining C1 and C2, Cswitch of the microprocessor’s pin must be considered. If the
switch is open, the Cswitch must be taken into account in the calculation of the series resonance
resistance Re{ZXTAL}. If the switch is closed, the on resistance of the modulating port of the
microprocessor must be taken into account.
Caution: the formulas provide a theoretical start value for tuning of the real values on the appli-
cation board.
XTAL
VS
XTAL C
1
C
2
C
switch
Z
XTO
Z
XTAL
C
L1
C
L2
lm ZXTAL
{}-lm ZXTO
{}
2f
πfLCM
----------------=
10
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ATA8401/ATA8402/ATA8403
3. The Demo Board
3.1 Peripheral Interfaces
3.1.1 Clock Output
The transmitter provides a clock signal with a crystal accuracy, which can be used as reference
for an external microprocessor. The frequency of the clock signal is:
Equation 17
The clock output signal is CMOS-compatible if the load capacitance on the pin CLK (pin 1) is
lower than 10 pF. Hence, the trace connecting the pin CLK and the microprocessor port must be
as short as possible.
Atmel’s microprocessors M44C090, M44C890, and T48C893 have a special feature to take over
an external clock signal. In real applications with the Atmel’s transmitters, the microprocessor
starts with a RC oscillator to switch the transmitter. After the clock signal has stabilized, the
microprocessor takes over the clock signal as reference. The demo board ATAB8401,
ATAB8402, and ATAB8403 use Atmel’s microprocessor T48C893
3.1.2 Port Configuration of the Microprocessor
The transmitter pins EN and PA_EN must be connected to the CMOS-compatible output stage.
To ensure that the transmitter is in power-down mode during the microprocessor reset, a
pull-down resistor must be applied. For the switches on the demo board, a pull-up resistor is
needed.
With FSK modulation, the modulating port of the microprocessor must be properly defined. The
on resistance of the port must be very small so that the maximum series resonance of the crystal
circuit does not exceed the defined value. Either a pull-up or pull-down resistor is needed for this
port. The port must be set in an open-drain high-current configuration.
fCLK
fXTO
256
-----------=
Table 3-1. Port Configuration of T48C893 on the Demo Board
Port Function Output Driver
Pull-up/Pull-down
Resistor
BP20/NTE Programming CMOS Pull-down
BP21 Pin EN of the transmitter CMOS Pull-down
BP23 LED D1 CMOS Pull-down
BP40/SC/INT3 Switch S3/programming CMOS Pull-up
BP42/T2O FSK modulation switch/
programming Open drain None
BP43/SD/INT3 Programming CMOS Pull-down
BP50/INT6 Switch S2 CMOS Pull-up
BP53/INT1 Switch S1 CMOS Pull-up
BP60/T3O Pin PA_EN of the
transmitter CMOS Pull-down
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ATA8401/ATA8402/ATA8403
3.2 DC Feed Inductor for the Power Amplifier
Atmel’s demo boards use a printed inductor on PCB (L1) to reduce the cost of the external com-
ponents. This inductor provides a DC current for the open collector stage of the power amplifier.
The value of L1 must be between 50 nH to 100 nH. Formula 18 gives approximation of the
inductance for a printed inductor (see Figure 3-1).
L = 49.2 × n2 × rm Equation 18
Notes: 1. L is in nH
2. N is number of turns
3. Rm is mean radius in cm
Figure 3-1. Printed Inductor
A printed inductor on PCB can be expressed as a parallel circuit of inductor, capacitor, and
resistor. The printed inductor of the transmitter’s demo board can be estimated as
90 nH || 0.3 pF || 2.8 k.
rm
12
9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
3.3 Schematic of the Demo Board
Figure 3-2. The Schematic of the Demo Board
The demo board is designed for three different transmitters, T5750, T5753, T5754, ATA8401,
ATA8402, and ATA8403. The smaller loop antenna is designed for radiating 868 MHz and
915 MHz Frequency.
-
+
2
1
VDD
GND
EN
S1
S3
S2
XTAL
VCC
PA_EN
CLK
ANT1
5
6
7
8
4
3
2
1
ANT2
1
2
3
21
43
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
BP40/SC/INT3
BP53/INT1
BP52/INT1
BP51/INT6
BP53/INT6
OSC1
OSC2
BP50/T3O
BP10
B1
B2
B3
B4
B5
B6
B7
B8
A1
A2
A3
A4
A5
A6
A7
A8
VSS
BP43/SD/INT3
BP42/T2O
BP41/T2I/VMI
BP23
BP22
BP21
BP20/NTE
BP63/T3I/INT5
BP13
U2
T48C893N
U1
T5750
BA2032SM
21
43
21
43
X1
R1
C2
C9
C1
C10 C5
C6
C7
BR4
BR3
BR2
BR1
L2
Printed Coil
Loop Antenna
w = 1.5 mm
L2
C3
Q1
C8
D1
VS
VS
VS
VS
C4
13
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ATA8401/ATA8402/ATA8403
3.4 Demo Board’s Layout
Figure 3-3. Top Layer of the Demo Board
Figure 3-4. Bottom Layer of the Demo Board
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ATA8401/ATA8402/ATA8403
3.5 BOM List
Table 3-2. Bill of Materials of the Demo Board
Components List Transmitter Application Board
ATAB8401 (315 MHz)/ATAB8402 (433.92 MHz)/ATAB8403-8 (868.3 MHz)/ATAB8403-9 (915 MHz)
Components pcs
315 Mhz
433.92 Mhz
868.3 MHz
915 Mhz
Value Tolerance Material/Series Housing
Manufacturer/
Distributor
U1 1
X
X
XX
ATAB8401
ATAB8402
ATAB8403
TSSOP8 Atmel
U2 1 XXXX T48C893N SSO20 Atmel
Q1 1
X
X
X
X
9.843750 MHz
13.560000 MHz
13.567187 MHz
14.296875 MHz
Order No.: 4730007881
Order No.: 4730007882
Order No.: 4730007557
Order No.: 4730007559
HC-49/U4B ACAL
C1 1
X
X
XX
4.7 pF/50V
6.8 pF/50V
8.2 pF/50V
0.1 pF
0.1 pF
0.1 pF
GRM1885C1H4R7B
GRM1885C1H6R8B
GRM1885C1H8R2B
Size 0603 muRata®
C2 1
X
X
XX
12 pF/50V
6.8 pF/50V
4.7 pF/50V
5%
0.1 pF
0.1 pF
GRM1885C1H120J
GRM1885C1H6R8B
GRM1885C1H4R7B
Size 0603 muRata
C3 1 XXXX 68 nF/25V 10% GRM21BR71E683K Size 0805 muRata
C4 n.m.
C5 1
X
X
XX
15 pF/50V
6.8 pF/50V
1.5 pF/50V
5%
0.1 pF
0.1 pF
GRM1885C1H150J
GRM1885C1H6R8B
GRM1885C1H1R5B
Size 0603 muRata
C6 1
X
X
X
X
8.2 pF/50V
3.9 pF/50V
1.2 pF/50V
1.0 pF/50V
0.1 pF
0.1 pF
0.1 pF
0.1 pF
GRM1885C1H8R2B
GRM1885C1H3R9B
GRM1885C1H1R2B
GRM1885C1H1R0B
Size 0603 muRata
C7 1
X
X
X
X
15 pF/50V
6.8 pF/50V
1.5 pF/50V
1.0 pF/50V
5%
0.1 pF
0.1 pF
0.1 pF
GRM1885C1H150J
GRM1885C1H6R8B
GRM1885C1H1R5B
GRM1885C1H1R0B
Size 0603 muRata
C8 1 XXXX 100 nF/25V 10% GRM21BR71E104K Size 0805 muRata
C9 1 X 1 nF/50V 10% GRM188R71H102K Size 0603 muRata
C10 1
X
X
X
Xn.m.
0.3 pF
0.5 pF
0.05 pF
0.05 pF
04023j0R3ABW
04023j0R5ABW
Size 0402
Size 0402
AVX®
AVX
L2 1
X
X
X
X
1.8 nH
33 nH
18
0 bridge
LL1608-FS
LL1608-FS
Size 0603
Size 0603
TOKO®
TOKO
R1 1 XXXX 1 k/0.1W 5% Size 0603 e.g. Vishay®
D1 1 XXXXSMD LED red TLMK3100 P-LCC-2 Vishay
BR1 1 X X 0 bridge Size 0603 e.g. Vishay
BR2 1 X X 0 bridge Size 0603 e.g. Vishay
15
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ATA8401/ATA8402/ATA8403
BR3 1 X X 0 bridge Size 0603 e.g. Vishay
BR4 1 X X 0 bridge Size 0603 e.g. Vishay
S1, S2, S3 3 XXXX SMD switch KSC 241J
ITT Cannon®/
Spoerle
Electronic
VBatt1 1 XXXXBattery holder BA2032SM Roßmann
Electronic
Lithium cell 1 XXXX 3V/220mAh CR2032
e.g. SONY®/
Roßmann
Electronic
PCB jack 1 XXXX 8 pins MKFL13478-6-0808
Stocko®/
Hoppe
Electronic
PCB 1 XXXX T5750/53/54
V4.0 FR4 Thickness
1.2 mm
Table 3-2. Bill of Materials of the Demo Board (Continued)
Components List Transmitter Application Board
ATAB8401 (315 MHz)/ATAB8402 (433.92 MHz)/ATAB8403-8 (868.3 MHz)/ATAB8403-9 (915 MHz)
Components pcs
315 Mhz
433.92 Mhz
868.3 MHz
915 Mhz
Value Tolerance Material/Series Housing
Manufacturer/
Distributor
16
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ATA8401/ATA8402/ATA8403
4. Operating of Transmitter Demo board with RF Design Kit
Transmitter demo boards ATAB8401/02/03 show the feature ISP (in system programmable) and
can be used as an example of a stand-alone RF remote control transmitter that offers ASK and
FSK modulation. To evaluate the transmitter, Atmel offers a microprocessor board ATAB-RFMB
(ATAB-STKFLamingo) to configure the IC as well as the evaluation software RF Design Kit. This
section provides some important information needed to start the evaluation with the microcon-
troller board. For the complete description of both RF Design Kit and ATAB-RFMB
(ATAB-STKFlamingo), please refer to the application notes “ATAK57xx and ATAK862xx hard-
ware description” and “ATAK57xx, ATAK57xx-F, ATAK862xx and ATAK862xx-F software
description”.
Technical features:
Power supply: 3V Lithium cell (e.g. CR2032)
Frequency deviation: approximately. 30 kHz
Printed loop antenna
Three programmable buttons
No hardware changing is necessary for the verification of two different modulation schemes.
In-system configuration of the software setting to the EEPROM of the microcontroller
T48C893N is possible using the programming adapter JP1
The transmitter demo board is tested under the ETSI as well as FCC regulation. The test
results show that the transmitter can be applied in real applications and pass the type
approval
Configuration of the transmitter:
Connect the microcontroller board (ATAB-RFMB or ATAB-STKFlamingo) to a PC using a
serial link cable (RS232). Please use the free serial port (Com1 or Com2).
Switch on the 12V power supply of the microcontroller board
Start the RF Design Kit software (see Figure 4-1 on page 17)
Select the transmitter drop-down menu to choose the setting of a transmitter. The setting
software for T5750/53/54 is the same as for verification with ATA8401/ATA8402/ATA8403.
(Figure 4-2 on page 17)
Choose T5753 (315 MHz) for configuration of ATAB8401
Choose T5754 (315 MHz) for configuration of ATAB8402
Choose T5750 (868 MHz) for configuration of ATAB8403-8
Choose T5750 (915 MHz) for configuration of ATAB8403-9
Remove the lithium cell battery from the holder
Plug the transmitter into the adapter PCB of the microcontroller board
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9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
Figure 4-1. Windows® Interface of RF Design Kit
Figure 4-2. Selecting the Setting of a Transmitter (Setting for ATAB5750-8 and ATAB8403-8)
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9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
Set the desired transmitter’s setting (see Figure 4-2 on page 17)
Please follow the instructions below “Getting started evaluating the transmitter board”
Figure 4-3. Several Setting Menu to Configure the Transmitter
Getting started evaluating the transmitter board:
Insert the lithium cell battery into the holder.
Activate the transmitter by the pushing the S1 or S2 button (without programming the
transmitter board, the default setting will be activated)
Activate one of the three buttons for the required function.
The “continuous” transmission setting, the board will send the signal approximately 30s long.
The start of each function and the end of the continuous function will be indicated by LED D1
switched on.
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9115A–INDCO–01/08
ATA8401/ATA8402/ATA8403
Default configuration:
Modulation: FSK
Data Rate: 1 kBps
Test word: F09AF09A
Button functions:
–S1
continuous telegram
–S2
single telegram
–S3
continuous preburst
Preburst length is set to the value matching the Polling setting of the suitable receiver.
Reference:
Constantine Balanis, Antenna Theory, Analysis and Design, Second Edition, John Wiley &
Sons, 1997
Frederick Grover, Inductance Calculations Working Formulas and Tables, Dover Publications,
1946.
9115A–INDCO–01/08
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