UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
DESCRIPTION
The UC1525B/1527B series of pulse width modulator integrated circuits
are designed to offer improved performance and lowered external parts
count when used in designing all types of switching power supplies. The
on-chip +5.1V buried zener reference is trimmed to ±0.75% and the input
common-mode range of the error amplifier includes the reference voltage,
eliminating external resistors. A sync input to the oscillator allows multiple
units to be slaved or a single unit to be synchronized to an external system
clock. A single resistor between the CT and the discharge terminals provide
a wide range of dead time adjustment. These devices also feature built-in
soft-start circuitry with only an external timing capacitor required. A shut-
down terminal controls both the soft-start circuitry and the output stages,
providing instantaneous turn off through the PWM latch with pulsed shut-
down, as well as soft-start recycle with longer shutdown commands. These
functions are also controlled by an undervoltage lockout which keeps the
outputs off and the soft-start capacitor discharged for sub-normal input volt-
ages. This lockout circuitry includes approximately 500mV of hysteresis for
jitter-free operation. Another feature of these PWM circuits is a latch follow-
ing the comparator. Once a PWM pulse has been terminated for any rea-
son, the outputs will remain off for the duration of the period. The latch is
reset with each clock pulse. The output stages are totem-pole designs ca-
pable of sourcing or sinking in excess of 200mA. The UC1525B output
stage features NOR logic, giving a LOW output for an OFF state. The
UC1527B utilizes OR logic which results in a HIGH output level when OFF.
Regulating Pulse Width Modulators
FEATURES
8 to 35V Operation
5.1V Buried Zener Reference
Trimmed to ±0.75%
100Hz to 500kHz Oscillator Range
Separate Oscillator Sync Terminal
Adjustable Deadtime Control
Internal Soft-Start
Pulse-by-Pulse Shutdown
Input Undervoltage Lockout with
Hysteresis
Latching PWM to Prevent Multiple
Pulses
Dual Source/Sink Output Drivers
Low Cross Conduction Output Stage
Tighter Reference Specifications
SLUS376 JULY 1995
BLOCK DIAGRAM
UDG-95055
application
INFO
available
2
UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
DIL-16, SOIC-16 (Top View)
J or N, DW Packages
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, (+VIN) ...........................+40V
Collector Supply Voltage (VC)......................+40V
Logic Inputs ............................–0.3V to +5.5V
Analog Inputs.............................–0.3V to VIN
Output Current, Source or Sink ...................500mA
Reference Output Current ........................50mA
Oscillator Charging Current ........................5mA
Power Dissipation at TA= +25°C.................1000mW
Power Dissipation at TC= +25°C ................2000mW
Operating Junction Temperature ..........–55°C to +150°C
Storage Temperature Range .............–65°C to +150°C
Lead Temperature (Soldering, 10 sec.).............+300°C
All currents are positive into, negative out of the specified ter-
minal. Consult Packaging Section of Databook for thermal limi-
tations and considerations of packages.
CONNECTION DIAGRAMS
LCC-20, PLCC-20 (Top View)
L, Q Packages
RECOMMENDED OPERATING CONDITIONS
(Note 1)
Input Voltage (+VIN) .......................+8Vto+35V
Collector Supply Voltage (VC) ..............+4.5V to +35V
Sink/Source Load Current (steady state) ........0to100mA
Sink/Source Load Current (peak) ..............0to400mA
Reference Load Current ......................0to20mA
Oscillator Frequency Range..............100Hz to 400kHz
Oscillator Timing Resistor ..................2kto 150k
Oscillator Timing Capacitor ..............0.001µFto0.1µF
Dead Time Resistor Range...................0to 500
Note 1: Range over which the device is functional and parame-
ter limits are guaranteed.
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for the
UC1525B and UC1527B; –40°C to +85°C for the UC2525B and UC2527B; 0°C to +70°C for the UC3525B and UC3527B; +VIN =
20V, TA=T
J.
PARAMETER TEST CONDITIONS
UC1525B/UC2525B
UC1527B/UC2527B UC3525B
UC3527B
MIN TYP MAX MIN TYP MAX UNITS
Reference Section
Output Voltage TJ= 25°C 5.062 5.10 5.138 5.036 5.10 5.164 V
Line Regulation VIN = 8V to 35V 5 10 5 10 mV
Load Regulation IL= 0mA to 20mA 7 15 7 15 mV
Temperature Stability (Note 2) Over Operating Range 10 50 10 50 mV
Total Output Variation Line, Load, and Temperature 5.036 5.164 5.024 5.176 V
Short Circuit Current VREF = 0, TJ=25°C 80 100 80 100 mA
Output Noise Voltage (Note 2) 10Hz f10kHz, TJ= 25°C 40 200 40 200 µVrms
Long Term Stability (Note 2) TJ= 125°C, 1000 Hrs. 3 10 3 10 mV
3
UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for the
UC1525B and UC1527B; –40°C to +85°C for the UC2525B and UC2527B; 0°C to +70°C for the UC3525B and UC3527B; +VIN =
20V, TA=T
J.
PARAMETER TEST CONDITIONS
UC1525B/UC2525B
UC1527B/UC2527B UC3525B
UC3527B
MIN TYP MAX MIN TYP MAX UNITS
Oscillator Section (Note 3)
Initial Accuracy (Notes2&3) T
J= 25°C ±2 ±6 ±2 ±6 %
Voltage Stability (Notes2&3) VIN=8Vto35V ±0.3 ±1 ±1 ±2 %
Temperature Stability (Note 2) Over Operating Range ±3 ±6 ±3 ±6 %
Minimum Frequency RT = 200kW,CT=0.1mF 120 120 Hz
Maximum Frequency RT = 2kW, CT = 470pF 400 400 kHz
Current Mirror IRT = 2mA 1.7 2.0 2.2 1.7 2.0 2.2 mA
Clock Amplitude (Notes2&3) 3.0 3.5 3.0 3.5 V
Clock Width (Notes2&3) T
J= 25°C 0.3 0.5 1.0 0.3 0.5 1.0 ms
Sync Threshold 1.2 2.0 2.8 1.2 2.0 2.8 V
Sync Input Current Sync Voltage = 3.5V 1.0 2.5 1.0 2.5 mA
Error Amplifier Section (VCM = 5.1V)
Input Offset Voltage 0.5 5 2 10 mV
Input Bias Current 1 10 1 10 mA
Input Offset Current 1 1 mA
DC Open Loop Gain RL ³10 MegW60 75 60 75 dB
Gain-Bandwidth Product (Note 2) AV= 0dB, TJ= 25°C 1 2 1 2 MHz
Output Low Level 0.2 0.5 0.2 0.5 V
Output High Level 3.8 5.6 3.8 5.6 V
Common Mode Rejection VCM = 1.5V to 5.2V 60 75 60 75 dB
Supply Voltage Rejection VIN = 8V to 35V 50 60 50 60 dB
PWM Comparator
Minimum Duty Cycle 0 0 %
Maximum Duty Cycle (Note 3) 45 49 45 49 %
Input Threshold (Note 3) Zero Duty Cycle 0.7 0.9 0.7 0.9 V
Input Threshold (Note 3) Maximum Duty Cycle 3.3 3.6 3.3 3.6 V
Input Bias Current (Note 2) 0.05 1.0 0.05 1.0 mA
Shutdown Section
Soft Start Current VSHUTDOWN = 0V, VSOFTSTART
=0V 25 50 80 25 50 80 mA
Soft Start Low Level VSHUTDOWN = 2.5V 0.4 0.7 0.4 0.7 V
Shutdown Threshold To outputs, VSOFTSTART =
5.1V, TJ=25°C 0.6 0.8 1.0 0.6 0.8 1.0 V
Shutdown Input Current VSHUTDOWN = 2.5V 0.4 1.0 0.4 1.0 mA
Shutdown Delay (Note 2) VSHUTDOWN = 2.5V, TJ= 25°C 0.2 0.5 0.2 0.5 ms
Output Drivers (Each Output) (Vc = 20V)
Output Low Level ISINK = 20mA 0.2 0.4 0.2 0.4 V
ISINK = 100mA 1.0 2.0 1.0 2.0 V
Output HIgh Level ISOURCE = 20mA 18 19 18 19 V
ISOURCE = 100mA 17 18 17 18 V
Undervoltage Lockout VCOMP and VSOFTSTART =
High 678678V
Collector Leakage VC = 35V 200 200 mA
4
UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for the
UC1525B and UC1527B; –40°C to +85°C for the UC2525B and UC2527B; 0°C to +70°C for the UC3525B and UC3527B; +VIN =
20V, TA=T
J.
PARAMETER TEST CONDITIONS
UC1525B/UC2525B
UC1527B/UC2527B UC3525B
UC3527B
MIN TYP MAX MIN TYP MAX UNITS
Output Drivers (Each Output) (VC = 20V) (cont.)
Rise Time (Note 2) CL= 1nF, TJ= 25°C 100 600 100 600 ns
Fall Time (Note 2) CL= 1nF, TJ= 25°C 50 300 50 300 ns
Cross conduction charge Per cycle, TJ= 25°C 30 30 nc
Total Standby Current
Supply Current VIN = 35V 14 20 14 20 mA
Note 2: Ensured by design. Not 100% tested in production.
Note 3: Tested at fosc= 40kHz (RT= 3.6KW,C
T= 0.01mF, RD=0W). Approximate oscillator frequency is defined by:
()
fCRR
TTD
=••+
1
07 3.
UDG-95056 UDG-95057
PRINCIPLES OF OPERATION AND TYPICAL CHARACTERISTICS
UC1525B Output Circuit (1/2 Circuit Shown) UC1525B Output Saturation Characteristics
For single-ended supplies, the driver outputs are
grounded. The VC terminal is switched to ground by the to-
tem-pole source transistors on alternate oscillator cycles.
In conventional push-pull bipolar designs, forward base
drive is controlled by R1-R3. Rapid turn-off times for the
power devices are achieved with speed-up capacitors C,
and C2.
UDG-95059
UDG-95058
5
UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
PRINCIPLES OF OPERATION AND TYPICAL
CHARACTERISTICS
Shutdown Options (See Block Diagram)
Since both the compensation and soft-start terminals
(Pins 9 and 8) have current source pull-ups, either can
readily accept a pull-down signal which only has to sink a
maximum of 100µA to turn off the outputs. This is subject
to the added requirement of discharging whatever exter-
nal capacitance may be attached to these pins.
An alternate approach is the use of the shutdown cir-
cuitry of Pin 10 which has been improved to enhance the
available shutdown options. Activating this circuit by ap-
plying a positive signal on Pin 10 performs two functions:
the PWM latch is immediately set providing the fastest
turn-off signal to the external soft-start capacitor. If the
shutdown command is short, the PWM signal is termi-
nated without significant discharge of the soft-start ca-
pacitor, thus, allowing, for example, a convenient
implementation of pulse-by-pulse current limiting.
Holding Pin 10 high for a longer duration, however, will
ultimately discharge this external capacitor, recycling
slow turn-on upon release.
UDG-95060 UDG-95061
The low source impedance of the output drivers provides
rapid charging of power FET input capacitance while mini-
mizing external components.
Low power transformers can be driven directly by the
UC1525B. Automatic reset occurs during dead time, when
both ends of the primary winding are switched to ground.
UDG-95062
UC1525B Oscillator Schematic
6
UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
UDG-95066
UDG-95064
UDG-95063
UDG-95065
Oscillator Charge Time vs. R
Tand CTOscillator Discharge Time vs. R
Dand CT
Error Amplifier Open-Loop Frequency ResponseUC1525B Error Amplifier
7
UC1525B UC1527B
UC2525B UC2527B
UC3525B UC3527B
LAB TEST FIXTURE
UDG-95067
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-8951105EA ACTIVE CDIP J 16 1 TBD Call TI Call TI
UC1525BJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC1525BJ883B ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
UC2525BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2525BDWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3525BDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3525BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3525BDWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3525BDWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3525BN ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3525BNG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3527BN ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3527BNG4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1525B, UC3525B :
Catalog: UC3525B
Military: UC1525B
Space: UC1525B-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC2525BDWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
UC3525BDWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC2525BDWTR SOIC DW 16 2000 367.0 367.0 38.0
UC3525BDWTR SOIC DW 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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