ASMT-Mxx5 / ASMT-Mxx6
Moonstone® 1W Power LED Light Source
Data Sheet
Description
The Moonstone® 1W Power LED Light Source is a high
performance energy efficient device which can handle
high thermal and high driving current. The exposed pad
design has excellent heat transfer from the package to the
motherboard.
The Cool White Power LED is available in various color
temperature ranging from 4000K to 10000K and Warm
White Power LED ranging from 2600K to 4000K.
The low profile package design is suitable for a wide variety
of applications especially where height is a constraint.
The package is compatible with reflow soldering. This
will give more freedom and flexibility to the light source
designer.
Applications
Sign backlight
Safety, exit and emergency sign lightings
Specialty lighting such as task lighting and reading
lights
Retail display
Commercial lighting
Accent or marker lightings, strip or step lightings
Portable lightings, bicycle head lamp, torch lights.
Decorative lighting
Architectural lighting
Pathway lighting
Street lighting
Pedestrian street lighting
Tunnel lighting
Features
Available in Cool White & Warm White color
Energy efficient
Exposed pad for excellent heat transfer
Suitable for reflow soldering process
High current operation
Long operation life
Wide viewing angle
Silicone encapsulation
Non-ESD sensitive (threshold > 16KV)
MSL 4 products
Available in both electrically isolated and non-isolated
metal heat slug
Specifications
InGaN Technology
4.0 V (max) at 350 mA
110° viewing angle
2
Package Dimensions
Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1 mm unless otherwise specified.
3. Metal slug is connected to anode for electrically non-isolated option.
Metal Slug
Cathode
Anode1
2
3
10.00
8.50
3
12
8.50
Ø 5.26
Ø 8.00
5.08 0.81
2.00 5.25
1.30
10.60
1.27
3.30
Heat Sink
LED
ZENER
+
Figure 1. ASMT-Mxx5 / ASMT-Mxx6 package outline drawing.
3
Device Selection Guide (TJ = 2C)
Part Number Color
Luminous Flux, Φv[1,2] (lm)
Test Current
(mA)
Dice
Technology
Electrically
Isolated Metal
SlugMin.Typ.Max.
ASMT-MW05-NLM00 Cool White 73.0 80.0 124.0 350 InGaN No
ASMT-MW06-NLM00 Yes
ASMT-MY05-NKM00 Warm White 56.0 73.0 124.0 350 InGaN No
ASMT-MY06-NKM00 Yes
ASMT-MWB6-NLM00 Cool White Diffused 73.0 70.0 124.0 350 InGaN Yes
ASMT-MYB6-NKM00 Warm White Diffused 56.0 65.0 124.0 350 InGaN Yes
Notes:
1. ΦV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition.
2. Flux tolerance is ±10%.
Part Numbering System
ASMT – M x1 x2 x3 – N x4 x5 x6 x7
Packaging Option
Color Bin Selection
Max Flux Bin
Min Flux Bin
Color
W – Cool White
Y – Warm White
Silicone Type
0 – Non-diffused
B – Diffused
Heat Sink
5 – Electrically Non-isolated
6 – Electrically Isolated
Note:
1. Please refer to Page 7 for selection details.
4
Absolute Maximum Ratings
Parameter ASMT-Mxx5 / ASMT-Mxx6 Units
DC Forward Current [1] 500 mA
Peak Pulsing Current [2] 1000 mA
Power Dissipation 2000 mW
LED Junction Temperature 125 °C
Operating Metal Slug Temperature Range at 350 mA -40 to +110 °C
Storage Temperature Range -40 to +120 °C
Soldering Temperature Refer to Figure 12
Reverse Voltage [3] Not recommended
Note:
1. Derate linearly based on Figure 8.
2. Pulse condition: duty factor = 10%, Frequency = 1 kHz.
3. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (TJ = 2C)
Part Number Color
Correlated Color Temperature,
CCT (Kelvin)
Viewing Angle,
2θ½ [2] (°)
Luminous
Efficiency (lm/W)
Min.Max.Typ.Typ.
ASMT-MW05-NLM00 Cool White 4000 10000 110 63
ASMT-MW06-NLM00
ASMT-MY05-NKM00 Warm White 2600 4000 110 58
ASMT-MY06-NKM00
ASMT-MWB6-NLM00 Cool White Diffused 4000 10000 110 56
ASMT-MYB6-NKM00 Warm White Diffused 2600 4000 110 52
Notes:
1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Electrical Characteristic at 350 mA (TJ = 2C)
Dice Type
Forward Voltage,
VF (Volts)
Thermal Resistance,
Rθj-ms C/W)[1]
Min.Typ.Max.Typ.
InGaN 3.0 3.6 4.0 10
Note:
1. Rθj-ms is Thermal Resistance from LED junction to metal slug.
5
Figure 2. Relative Intensity vs. Wavelength.Figure 3. Relative Luminous Flux vs. Mono Pulse Current.
Figure 4. Forward Current vs. Forward Voltage.Figure 5. Radiation Pattern.
Figure 6. Maximum pulse current vs. ambient temperature. Derated based
on TA = 2C, RθJ-A = 30°C/W.
Figure 7. Maximum pulse current vs. ambient temperature. Derated based
on TA = 8C, RθJ-A = 30°C/W.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
WARM WHITE
COOL WHITE
0
0.2
0.4
0.6
0.8
1
1.2
1.4
050100 150 200 250 300 350400 450500
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
0
50
100
150
200
250
300
350
400
450
500
00.511.522.533.54
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90-60-30 0 30 6090
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.000010.00010.0010.010.1110100
PULSE DURATION, tp - sec PULSE DURATION, tp - sec
PULSE CURRENT, IP - A
D =
0.05
0.10
0.25
0.50
1.00
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0.000010.00010.0010.010.1110100
PULSE CURRENT, IP - A
D =
0.05
0.10
0.25
0.50
1.00
D=tp
T
tp
IF
T
D=tp
T
tp
IF
T
6
(Acc. to J-STD-020C)
217°C
200°C
60 - 120 SEC.
C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 - 30 SEC.
TIME
TEMPERATURE
10.70±0.10
8.40±0.10
3.0.10
5.08±0.10
1.00±0.10
17.00±0.20
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
-50-250255075100 125
JUNCTION TEMPERATURE,TJ - °C
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 2C)
0.0
20.0
40.0
60.0
80.0
100.0
120.0
-50-250255075100 125
JUNCTION TEMPERATURE,TJ - °C
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 2C)
WARM WHITE
COOL WHITE
0
100
200
300
400
500
600
020406080100 120 140
AMBIENT TEMPERATURE, TA - °C
MAX ALLOWABLE DC CURRENT - mA
0
100
200
300
400
500
600
020406080100 120 140
METAL SLUG TEMPERATURE, TMS - °C
MAX ALLOWABLE DC CURRENT - mA
RθJ-A = 20°C/W
RθJ-A = 2C/W
RθJ-A = 30°C/W
RθJ-MS = 10°C/W
Figure 11. Relative Light Output vs. Junction Temperature.
Figure 12. Recommended Reflow Soldering.Figure 13. Recommended soldering land pattern.
Figure 10. Forward Voltage Shift vs. Junction Temperature.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
Figure 8. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 12C, RθJ-A = 20°C/W, 2C/W and 30°C/W.
Figure 9. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 12C, Rθ
J-MS = 10°C/W.
7
Color Bin Selections [x6]
Individual reel will contain parts from one color bin selection only.
Cool White
Selection Bin ID
O Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
G G only
H H only
L A and G only
M B and H only
N A and C only
P B and D only
Q E and C only
R F and D only
S G and H only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
2 G, H, A and B only
4 C, D, E and F only
Warm White
Selection Bin ID
O Full Distribution
A A only
B B only
C C only
D D only
E E only
F F only
N A and C only
P B and D only
Q E and C only
R F and D only
U E and F only
W C and D only
Z A and B only
1 A, B, C and D only
4 C, D, E and F only
Flux Bin Limit [x4 x5]
Bin
Luminous Flux (lm) at IF = 350mA
Min.Max.
K 56.0 73.0
L 73.0 95.0
M 95.0 124.0
Tolerance for each bin limits is ±10%.
Option Selection Details
ASMT – M x1 x2 x3N x4 x5 x6 x7
x4 – Minimum Flux Bin
x5 – Maximum Flux Bin
x6 – Color Bin Selection
x7 – Packaging Option
8
Color Bin Limit
Cool Color Limits
White (Chromaticity Coordinates)
Bin A X 0.367 0.362 0.329 0.329
Y 0.400 0.372 0.345 0.369
Bin B X 0.362 0.356 0.329 0.329
Y 0.372 0.330 0.302 0.345
Bin C X 0.329 0.329 0.305 0.301
Y 0.369 0.345 0.322 0.342
Bin D X 0.329 0.329 0.311 0.305
Y 0.345 0.302 0.285 0.322
Bin E X 0.303 0.307 0.283 0.274
Y 0.333 0.311 0.284 0.301
Bin F X 0.307 0.311 0.290 0.283
Y 0.311 0.285 0.265 0.284
Bin G X 0.388 0.379 0.362 0.367
Y 0.417 0.383 0.372 0.400
Bin H X 0.379 0.369 0.356 0.362
Y 0.383 0.343 0.330 0.372
Tolerance: ± 0.01
Warm Color Limits
White (Chromaticity Coordinates)
Bin A X 0.452 0.488 0.470 0.438
Y 0.434 0.447 0.414 0.403
Bin B X 0.438 0.470 0.452 0.424
Y 0.403 0.414 0.384 0.376
Bin C X 0.407 0.418 0.452 0.438
Y 0.393 0.422 0.434 0.403
Bin D X 0.395 0.407 0.438 0.424
Y 0.362 0.393 0.403 0.376
Bin E X 0.381 0.387 0.418 0.407
Y 0.377 0.404 0.422 0.393
Bin F X 0.373 0.381 0.407 0.395
Y 0.349 0.377 0.393 0.362
Tolerance: ± 0.01
0.24
0.26
0.28
0.30
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.240.260.28 0.30 0.32 0.340.360.38 0.400.420.44
Y - COORDINATE
X - COORDINATE
B
C
ED
A
F
4.5k
7k
10k
4.0k
G
H
Black Body Curve
5.6k
0.32
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.340.360.38 0.400.420.44 0.46 0.480.500.52
X - COORDINATE
Y - COORDINATE
B
C
E
D
A
F
3.5k
4.0k
2.6k
3.0k
Black Body Curve
Packaging Option [x4]
Selection Option
0 Tube
1 Tape and Reel
Example
ASMT-MW05-NLMW0
ASMT-MW05-Nxxxx Cool White, Electrically
Non-isolated Heat Sink,
Non-diffused
X4 = L – Minimum Flux Bin L
X5 = M – Maximum Flux Bin M
X6 = W Color Bin C and D only
X7 = 0 – Tube Option
Figure 15. Color bins (Warm White).Figure 14. Color bins (Cool White).
9
Dimension Value
A08.80 ±0.10
B016.45 ±0.10
K03.60 ±0.10
E 1.75 ±0.10
F 11.50 ±0.10
W 24.0 ±0.10
P 16.0 ±0.10
Quantity/
Reel
250 units
All dimensions in millimeters.
Tape and Reel – Option 1
Packing Tube – Option 0
Figure 16. Tube dimensions.
Figure 17. Carrier tape dimensions.
535.00
1.00
5.45
5.80
4.65
5.50
10.10
37.00
8.30
TOP VIEW
SIDE VIEW
A
A
B
Ao
B
P
SECTION B
SECTION A
Ko
W
F
E
Bo
2.5
10
R10.00
60.0º
268.00
330.00 ± 1.00
99.50 ± 1.00
2.30 2.30
24.0+1.00
0.00
13.50 ± 0.50
2.50 ± 0.50
R10.50 ± 0.50
120.0º
END
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
START
Figure 18. Carrier tape leader and trailer dimensions.
Figure 19. Reel dimensions.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1698EN - April 23, 2010
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 4 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unfinished reel
For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5%RH.
D. Control of assembly boards
If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
floor life of 72 hours.
E. Baking is required if
HIC “10%” indicator is not blue and “5%” indicator is
pink.
The LEDs are exposed to condition of >30°C/60% RH
at any time.
The LEDs floor life exceeded 72hrs.
Recommended baking condition: 60±5°C for 20hrs.
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as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.