ASMT-Mxx5 / ASMT-Mxx6 Moonstone(R) 1W Power LED Light Source Data Sheet Description Features The Moonstone(R) 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. * * * * * * * * * * * The Cool White Power LED is available in various color temperature ranging from 4000K to 10000K and Warm White Power LED ranging from 2600K to 4000K. The low profile package design is suitable for a wide variety of applications especially where height is a constraint. The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. Available in Cool White & Warm White color Energy efficient Exposed pad for excellent heat transfer Suitable for reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation Non-ESD sensitive (threshold > 16KV) MSL 4 products Available in both electrically isolated and non-isolated metal heat slug Applications Specifications * Sign backlight * Safety, exit and emergency sign lightings * Specialty lighting such as task lighting and reading lights * Retail display * Commercial lighting * Accent or marker lightings, strip or step lightings * Portable lightings, bicycle head lamp, torch lights. * Decorative lighting * Architectural lighting * Pathway lighting * Street lighting * Pedestrian street lighting * Tunnel lighting * InGaN Technology * 4.0 V (max) at 350 mA * 110 viewing angle Package Dimensions 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 Metal Slug 1.27 3 O 5.26 10.60 O 8.00 2.00 5.25 1.30 2 5.08 0.81 Notes: 1. All dimensions are in millimeters. 2. Tolerance is 0.1 mm unless otherwise specified. 3. Metal slug is connected to anode for electrically non-isolated option. Figure 1. ASMT-Mxx5 / ASMT-Mxx6 package outline drawing. 2 + 8.50 1 LED ZENER Part Numbering System A S M T - M x1 x2 x3 - N x4 x5 x6 x7 Packaging Option Color Bin Selection Max Flux Bin Min Flux Bin Heat Sink 5 - Electrically Non-isolated 6 - Electrically Isolated Silicone Type 0 - Non-diffused B - Diffused Color W - Cool White Y - Warm White Note: 1. Please refer to Page 7 for selection details. Device Selection Guide (TJ = 25C) Luminous Flux, v[1,2] (lm) Part Number Color Min. Typ. Max. Test Current (mA) ASMT-MW05-NLM00 Cool White 73.0 80.0 124.0 350 Dice Technology Electrically Isolated Metal Slug InGaN No ASMT-MW06-NLM00 ASMT-MY05-NKM00 Yes Warm White 56.0 73.0 124.0 350 InGaN ASMT-MY06-NKM00 No Yes ASMT-MWB6-NLM00 Cool White Diffused 73.0 70.0 124.0 350 InGaN Yes ASMT-MYB6-NKM00 Warm White Diffused 56.0 65.0 124.0 350 InGaN Yes Notes: 1. V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is 10%. 3 Absolute Maximum Ratings Parameter ASMT-Mxx5 / ASMT-Mxx6 Units DC Forward Current [1] 500 mA Peak Pulsing Current [2] 1000 mA Power Dissipation 2000 mW LED Junction Temperature 125 C Operating Metal Slug Temperature Range at 350 mA -40 to +110 C Storage Temperature Range -40 to +120 C Soldering Temperature Refer to Figure 12 Reverse Voltage [3] Not recommended Note: 1. Derate linearly based on Figure 8. 2. Pulse condition: duty factor = 10%, Frequency = 1 kHz. 3. Not designed for reverse bias operation. Optical Characteristics at 350 mA (TJ = 25C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 21/2 [2] () Luminous Efficiency (lm/W) Part Number Color Min. Max. Typ. Typ. ASMT-MW05-NLM00 Cool White 4000 10000 110 63 Warm White 2600 4000 110 58 ASMT-MW06-NLM00 ASMT-MY05-NKM00 ASMT-MY06-NKM00 ASMT-MWB6-NLM00 Cool White Diffused 4000 10000 110 56 ASMT-MYB6-NKM00 Warm White Diffused 2600 4000 110 52 Notes: 1. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic at 350 mA (TJ = 25C) Thermal Resistance, Rj-ms (C/W)[1] Forward Voltage, VF (Volts) Dice Type Min. Typ. Max. Typ. InGaN 3.0 3.6 4.0 10 Note: 1. Rj-ms is Thermal Resistance from LED junction to metal slug. 4 1.4 1.2 WARM WHITE COOL WHITE RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 480 530 580 630 WAVELENGTH - nm 680 730 0 0.5 1 50 100 150 200 250 300 350 400 450 500 DC FORWARD CURRENT - mA Figure 3. Relative Luminous Flux vs. Mono Pulse Current. NORMALIZED INTENSITY FORWARD CURRENT - mA 0 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 4 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 5. Radiation Pattern. 1.4 1.4 D= 0.05 0.10 0.25 0.50 1.00 1.0 0.8 1.2 PULSE CURRENT, IP - A 1.2 PULSE CURRENT, IP - A 0.4 780 Figure 4. Forward Current vs. Forward Voltage. 0.6 0.4 t D= p T 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec tp IF D= tp T tp IF T 1.0 0.8 0.6 D= 0.05 0.10 0.25 0.50 1.00 0.4 0.2 T 10 100 Figure 6. Maximum pulse current vs. ambient temperature. Derated based on TA = 25C, RJ-A = 30C/W. 5 0.6 0 430 Figure 2. Relative Intensity vs. Wavelength. 0.2 0.8 0.2 380 500 450 400 350 300 250 200 150 100 50 0 1 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec 10 100 Figure 7. Maximum pulse current vs. ambient temperature. Derated based on TA = 85C, RJ-A = 30C/W. 600 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 600 500 400 300 RJ-A = 20C/W RJ-A = 25C/W RJ-A = 30C/W 200 100 500 400 300 RJ-MS = 10C/W 200 100 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - C 120 0 20 40 60 80 100 METAL SLUG TEMPERATURE, TMS - C 120 140 Figure 9. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125C, RJ-MS = 10C/W. 120.0 100.0 RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25C) FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25C) Figure 8. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125C, RJ-A = 20C/W, 25C/W and 30C/W. 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -50 0 140 -25 0 25 50 75 JUNCTION TEMPERATURE,TJ - C 100 125 Figure 10. Forward Voltage Shift vs. Junction Temperature. 80.0 WARM WHITE COOL WHITE 60.0 40.0 20.0 0.0 -50 -25 0 25 50 75 JUNCTION TEMPERATURE,TJ - C 100 125 Figure 11. Relative Light Output vs. Junction Temperature. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 10.700.10 TEMPERATURE 10 - 30 SEC. 217C 200C 8.400.10 255 - 260C 3C/SEC. MAX. 17.000.20 6C/SEC. MAX. 150C 1.000.10 3C/SEC. MAX. 3.10.10 100 SEC. MAX. 60 - 120 SEC. 5.080.10 TIME (Acc. to J-STD-020C) Figure 12. Recommended Reflow Soldering. 6 Figure 13. Recommended soldering land pattern. Option Selection Details Flux Bin Limit [x4 x5] Luminous Flux (lm) at IF = 350mA ASMT - M x1 x2 x3 - N x4 x5 x6 x7 x4 - Minimum Flux Bin x5 - Maximum Flux Bin x6 - Color Bin Selection x7 - Packaging Option Bin Min. Max. K 56.0 73.0 L 73.0 95.0 M 95.0 124.0 Tolerance for each bin limits is 10%. Color Bin Selections [x6] Individual reel will contain parts from one color bin selection only. Cool White Warm White Selection Bin ID Selection O Full Distribution O Full Distribution A A only A A only B B only B B only C C only C C only D D only D D only E E only E E only F F only F F only G G only N A and C only H H only P B and D only L A and G only Q E and C only M B and H only R F and D only N A and C only U E and F only P B and D only W C and D only Q E and C only Z A and B only R F and D only 1 A, B, C and D only S G and H only 4 C, D, E and F only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only 7 Bin ID Color Bin Limit Cool White Color Limits (Chromaticity Coordinates) Warm White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin A X Y 0.452 0.434 0.488 0.447 0.470 0.414 0.438 0.403 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 Bin B X Y 0.438 0.403 0.470 0.414 0.452 0.384 0.424 0.376 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin C X Y 0.407 0.393 0.418 0.422 0.452 0.434 0.438 0.403 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin D X Y 0.395 0.362 0.407 0.393 0.438 0.403 0.424 0.376 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin E X Y 0.381 0.377 0.387 0.404 0.418 0.422 0.407 0.393 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin F X Y 0.373 0.349 0.381 0.377 0.407 0.393 0.395 0.362 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Tolerance: 0.01 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k C B H 0.34 5.6k Black Body Curve 0.32 7k D E 0.30 10k F 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE 0.48 0.46 0.44 Y - COORDINATE Y - COORDINATE Tolerance: 0.01 A 0.42 C 0.40 0.38 0.36 E 4.0k F 3.5k D Packaging Option [x4] Example 0 Tube 1 Tape and Reel 8 Black Body Curve 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52 X - COORDINATE Figure 15. Color bins (Warm White). Option 2.6k 0.34 Figure 14. Color bins (Cool White). Selection 3.0k B ASMT-MW05-NLMW0 ASMT-MW05-Nxxxx - Cool White, Electrically Non-isolated Heat Sink, Non-diffused X4 = L - Minimum Flux Bin L X5 = M - Maximum Flux Bin M X6 = W - Color Bin C and D only X7 = 0 - Tube Option Packing Tube - Option 0 1.00 5.80 4.65 5.50 37.00 5.45 10.10 8.30 535.00 SIDE VIEW TOP VIEW Figure 16. Tube dimensions. Tape and Reel - Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Dimension Value A0 8.80 0.10 B0 16.45 0.10 K0 3.60 0.10 E 1.75 0.10 F 11.50 0.10 W 24.0 0.10 P 16.0 0.10 Quantity/ Reel 250 units All dimensions in millimeters. Ao SECTION B Figure 17. Carrier tape dimensions. 9 END START MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 18. Carrier tape leader and trailer dimensions. +1.00 24.0 -0.00 2.30 2.30 0 60. 99.50 1.00 R10.0 2.50 0.50 0 .50 50 10. 268.00 R 13.50 330.00 1.00 120.0 Figure 19. Reel dimensions. 10 0 0.50 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 4 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 72 hours. C. Control for unfinished reel - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembly boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 72 hours. E. Baking is required if - HIC "10%" indicator is not blue and "5%" indicator is pink. - The LEDs are exposed to condition of >30C/60% RH at any time. - The LEDs floor life exceeded 72hrs. Recommended baking condition: 605C for 20hrs. DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. AV02-1698EN - April 23, 2010