A2
A1
A2
D²PAK
TO-220AB TO-220AB Ins.
DPAK
IPAK
A2
A1
G
G
A1
A2
G
A2
A1
G
A2
A2
A2
A2
A1
G
A2
A1
G
Features
• On-state rms current, IT(RMS) 8 A
• Repetitive peak off-state voltage, VDRM / VRRM 600 V to 800 V
• Triggering gate current, IGT 5 to 50 mA
Description
Available either in through-hole and surface-mount packages, these devices are
suitable for general purpose AC switching. They can be used as an ON/OFF function
in applications such as static relays, heating regulation, induction motor starting
circuits or for phase control operation in light dimmers and motor speed controllers,
etc.
The Snubberless versions (BTA, BTB08_xxxxW and T8 series) are specially
recommended for use on inductive loads, thanks to their high commutation
performance.
Logic level versions are designed to interface directly with low power drivers such as
Microcontrollers.
By using an internal ceramic pad, the BTA series provide voltage insulated tab (rated
at 2500 VRMS) in compliance with UL standards (file ref.: E81734).
Product status link
BTA08
BTB08
T810
T835
T850
Snubberless™, logic level and standard 8 A Triacs
BTA08, BTB08, T810
T835, T850
Datasheet
DS2114 - Rev 15 - August 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute maximum ratings (Tj = 25 °C unless otherwise stated)
Symbol Parameter Value Unit
IT(RMS) RMS on-state current (full sine wave)
IPAK, DPAK,TO-220AB, D²PAK Tc = 110 °C
8 A
TO-220AB Ins. Tc = 100 °C
ITSM
Non repetitive surge peak on-state current (full
cycle, Tj initial = 25 °C)
f = 50 Hz t = 20 ms 80
A
f = 60 Hz tp = 16.7 ms 84
I2t I2t value for fusing tp = 10 ms 36 A2s
dl/dt Critical rate of rise of on-state current IG = 2 x
IGT, tr ≤ 100 ns f = 120 Hz Tj = 125 °C 50 A/µs
IGM Peak gate current tp = 20 µs Tj = 125 °C 4 A
PG(AV) Average gate power dissipation Tj = 125 °C 1 W
Tstg Storage junction temperature range -40 to +150 °C
TjOperating junction temperature range -40 to +125 °C
Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise specified) Snubberless and logic level (3
quadrants)
Symbol Parameter Quadrant
T8 BTA08/BTB08
Unit
10 35 50 TW SW CW BW
IGT (1)
VD = 12 V, RL = 30 Ω
I - II - III Max. 10 35 50 5 10 35 50 mA
VGT I - II - III Max. 1.2 V
VGD VD = VDRM, RL = 3.3 kΩ, Tj = 125 °C I - II - III Min. 0.2 V
IH (2) IT = 100 mA I - II - III Max. 15 35 75 10 15 35 50 mA
ILIG = 1.2 x IGT
I - III Max. 25 50 70 10 25 50 70
mA
II Max. 30 60 110 15 30 60 80
dV/dt (2) VD = 67% VDRM, gate open, Tj = 125 °C Max. 40 400 1000 20 40 400 1000 V/µs
(dl/dt)c (2)
(dV/dt)c = 0.1 V/µs, Tj = 125 °C Min. 5.4 3.5 5.4
A/ms
(dV/dt)c = 10 V/µs, Tj = 125 °C Min. 2.8 1.5 2.98
Without snubber, Tj = 125 °C Min. 4.5 7 4.5 7
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
BTA08, BTB08, T810, T835, T850
Characteristics
DS2114 - Rev 15 page 2/21
Table 3. Standard (4 quadrants)
Symbol Parameter Quadrant
BTA08/BTB08
Unit
C B
IGT (1)
VD = 12 V, RL = 33 Ω
I - II - III
Max.
25 50
mA
IV 50 100
VGT All Max. 1.3 V
VGD VD = VDRM, RL = 33 kΩ, Tj = 125 °C All Min. 0.2 V
IH (2) IT = 500 mA I - II - III Max. 25 50 mA
ILIG = 1.2 IGT
I - III - IV
Max.
40 50
mA
II 80 100
dV/dt (2) VD = 67 % VDRM gate open, Tj = 125 °C Min. 200 400 V/µs
(dV/dt)c (2) (dI/dt)c = 3.5 A/ms, Tj = 125 °C Min. 5 10 V/µs
1. Minimum IGT is guaranteed at 5 % of IGT max.
2. For both polarities of A2 referenced to A1
Table 4. Static electrical characteristics
Symbol Test conditions Value Unit
VTM (1) ITM = 11 A, tp = 380 µs Tj = 25 °C Max. 1.55 V
VTO (1) threshold on-state voltage Tj = 125 °C Max. 0.85 V
RD (1) Dynamic resistance Tj = 125 °C Max. 50 mΩ
IDRM IRRM VDRM = VRRM
Tj = 25 °C Max. 5 µA
Tj = 125 °C Max. 1 mA
1. For both polarities of A2 referenced to A1
Table 5. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Max. junction to case thermal resistance (AC)
IPAK / D2PAK / DPAK / TO-220AB 1.6
°C/W
TO-220AB Insulated 2.5
Rth(j-a)
Junction to ambient (typ.)
S = 2 cm² (1) D²PAK 45
°C/W
S = 1 cm²(1) DPAK 70
Junction to ambient (typ.)
TO-220AB / TO-220AB Insulated 60
IPAK 100
1. S = Copper surface under tab.
BTA08, BTB08, T810, T835, T850
Characteristics
DS2114 - Rev 15 page 3/21
1.1 Characteristics (curves)
Figure 1. Maximum power dissipation versus on-state
RMS current (full cycle)
0 1 2 3 4 5 6 7 8
0
1
2
3
4
5
6
7
8
9
10
P(W)
IT(RMS)(A)
Figure 2. RMS on-state current versus temperature (full
cycle)
0 25 50 75 100 125
0
1
2
3
4
5
6
7
8
9
10
IT(RMS)(A)
Tc(°C)
BTB/T8
BTA
Figure 3. RMS on-state current versus ambient
temperature (full cycle)
0 2 5 50 75 100 125
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
IT(RMS)(A)
Tc(°C)
Printed circuit board FR4, copper thickness: 35 µm
D²PAK
(S = 1 cm²)
DPAK
(S = 0.5 cm²)
Figure 4. Relative variation of thermal impedance versus
pulse duration
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
1E-3
1E-2
1E-1
1E+0
K = [Zth/Rth]
tp(s)
Zth(j-c)
DPAK/IPAK
Zth(j-a)
TO-220AB/D²PAK
Zth(j-a)
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
DS2114 - Rev 15 page 4/21
Figure 5. On-state characteristics (maximum values)
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
1
10
100
ITM(A)
VTM(V)
Tj max.
Vto = 0.85 V
Rd = 50 mΩ
Tj = Tj max.
Tj = 25 °C
Figure 6. Surge peak on-state current versus number of
cycles
0
10
20
30
40
50
60
70
80
90
1 10 100 1000
Number of cycles
ITSM(A)
Non repetitive
Tjinitial = 25 °C
Repetitive
TC = 110 °C
One cycle
t = 16.66 ms
Figure 7. Non repetitive surge peak on-state current for a
sinusoidal pulse (tp < 10 ms)
0.01 0.10 1.00 10.00
10
100
1000
t (ms)
p
T initial=25°C
j
ITSM
dI/dt limitation:
50A/µs
360°
α
ITSM(A)
Figure 8. Relative variation of gate trigger current
-40 -20 0 20 40 60 80 100 120 140
0.0
0.5
1.0
1.5
2.0
2.5
IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25 °C]
Tj (°C)
IH and IL
IGT
Holding current and latching current versus junction temperature (typical values)
Figure 9. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
0.1 1.0 10.0 100.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
(dl/dt)c [(dV/dt)c / specified (dl/dt)c
(dV/dt)c (V/µs)
T810/SW
TW
T835/T850/CW/SW/BW
Snubberless and logic level types
Figure 10. Relative variation of critical rate of decrease of
main current versus (dV/dt)c (typical values)
0.1 1.0 10.0 100.0
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(dl/dt)c [(dV/dt)c] / specified (dl/dt)c
(dV/dt)c (V/µs)
C
Standard types
B
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
DS2114 - Rev 15 page 5/21
Figure 11. Relative variation of critical rate of decrease of
main current versus junction temperature
0 25 50 75 100 125
0
1
2
3
4
5
6
(dl/dt)c [Tj] / [Tj specified]
Tj(°C)
Figure 12. DPAK and D2PAK thermal resistance junction
to ambient versus copper surface under tab
0 4 8 1 2 16 20 24 28 32 36 40
0
10
20
30
40
50
60
70
80
90
100
Rth(j-a)(°C/W)
S(cm²)
Printed circuit board FR4, copper thickness: 35 µm
DPAK
D²PAK
BTA08, BTB08, T810, T835, T850
Characteristics (curves)
DS2114 - Rev 15 page 6/21
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
BTA08, BTB08, T810, T835, T850
Package information
DS2114 - Rev 15 page 7/21
2.1 DPAK package information
• Epoxy meets UL94, V0
• Lead-free package
• Recommended torque: 0.4 to 0.6 N·m
Figure 13. DPAK package outline
A
E
b4
2L
D
4L
e
e1
bc
A1
H
c2
L
V2
A2
E1
D1
BTA08, BTB08, T810, T835, T850
DPAK package information
DS2114 - Rev 15 page 8/21
Table 6. DPAK package mechanical data
Ref.
Dimensions
Millimeters Inches(1)
Min. Typ. Max. Min. Typ. Max.
A 2.18 2.40 0.0858 0.0945
A1 0.90 1.10 0.0354 0.0433
A2 0.03 0.23 0.0012 0.0091
b 0.64 0.90 0.0252 0.354
b4 4.95 5.46 0.1949 0.2150
c 0.46 0.61 0.0181 0.0240
c2 0.46 0.60 0.0181 0.0236
D 5.97 6.22 0.2350 0.2449
D1 5.10 0.2008
E 6.35 6.73 0.2500 0.2650
E1 4.32 0.1701
e 2.29 0.0900
e1 4.57 0.1800
H 9.35 10.40 0.3681 0.4094
L 1.00 1.78 0.0394 0.0701
L2 1.27 0.0500
L4 0.60 1.02 0.0236 0.0402
V2 0° +8° 0° +8°
1. Dimensions in inches are given for reference only
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
Figure 14. DPAK recommended footprint (dimensions are in mm)
6.7
6.7 3.03.0
1.6
4.572 A
B
The device must be positioned within 0.05 AB
12.7
BTA08, BTB08, T810, T835, T850
DPAK package information
DS2114 - Rev 15 page 9/21
2.2 IPAK package information
Figure 15. IPAK package outline
D
V1
A
c2
H
L
b2
A1
e1
e
bc
L2
L1
E
b4
B5
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
BTA08, BTB08, T810, T835, T850
IPAK package information
DS2114 - Rev 15 page 10/21
Table 7. IPAK package mechanical data
Ref.
Dimensions
Millimeters Inches(1)
Min. Typ. Max. Min. Typ. Max.
A 2.20 2.40 0.0866 0.0945
A1 0.90 1.10 0.0354 0.0433
b 0.64 0.90 0.0252 0.0354
b2 0.95 0.0374
b4 5.20 5.43 0.2047 0.2138
B5 0.30 0.0118
c 0.45 0.60 0.0177 0.0236
c2 0.46 0.60 0.0181 0.0236
D 6.00 6.20 0.2362 0.2441
E 6.40 6.65 0.2520 0.2618
e 2.28 0.0898
e1 4.40 4.60 0.1732 0.1811
H 16.10 0.6339
L 9.00 9.60 0.3545 0.3780
L1 0.80 1.20 0.0315 0.0472
L2 0.80 1.25 0.0315 0.0492
V1 10° 10°
1. Inch dimensions are for reference only.
BTA08, BTB08, T810, T835, T850
IPAK package information
DS2114 - Rev 15 page 11/21
2.3 TO-220AB insulated package information
Figure 16. TO-220AB insulated package outline
C
b2
c2
F
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
Resin gate 0.5 mm
max. protusion(1)
Resin gate 0.5 mm
max. protusion(1)
(1)Resin gate position accepted in one of the two positions or in the symmetrical opposites.
I
BTA08, BTB08, T810, T835, T850
TO-220AB insulated package information
DS2114 - Rev 15 page 12/21
Table 8. TO-220AB insulated package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.5984 0.6260
a1 3.75 0.1476
a2 13.00 14.00 0.5118 0.5512
B 10.00 10.40 0.3937 0.4094
b1 0.61 0.88 0.0240 0.0346
b2 1.23 1.32 0.0484 0.0520
C 4.40 4.60 0.1732 0.1811
c1 0.49 0.70 0.0193 0.0276
c2 2.40 2.72 0.0945 0.1071
e 2.40 2.70 0.0945 0.1063
F 6.20 6.60 0.2441 0.2598
I 3.73 3.88 0.1469 0.1528
L 2.65 2.95 0.1043 0.1161
I2 1.14 1.70 0.0449 0.0669
I3 1.14 1.70 0.0449 0.0669
I4 15.80 16.40 16.80 0.6220 0.6457 0.6614
M 2.6 0.1024
1. Inch dimensions are for reference only.
BTA08, BTB08, T810, T835, T850
TO-220AB insulated package information
DS2114 - Rev 15 page 13/21
2.4 D²PAK package information
Figure 17. D²PAK package outline
BTA08, BTB08, T810, T835, T850
D²PAK package information
DS2114 - Rev 15 page 14/21
Table 9. D²PAK package mechanical data
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.1693 0.1811
A1 2.49 2.69 0.0980 0.1059
A2 0.03 0.23 0.0012 0.0091
A3 0.25 0.0098
b 0.70 0.93 0.0276 0.0366
b2 1.25 1.7 0.0492 0.0669
c 0.45 0.60 0.0177 0.0236
c2 1.21 1.36 0.0476 0.0535
D 8.95 9.35 0.3524 0.3681
D1 7.50 8.00 0.2953 0.3150
D2 1.30 1.70 0.0512 0.0669
e 2.54 0.1
E 10.00 10.28 0.3937 0.4047
E1 8.30 8.70 0.3268 0.3425
E2 6.85 7.25 0.2697 0.2854
G 4.88 5.28 0.1921 0.2079
H 15 15.85 0.5906 0.6240
L 1.78 2.28 0.0701 0.0898
L2 1.27 1.40 0.0500 0.0551
L3 1.40 1.75 0.0551 0.0689
R 0.40 0.0157
V2 0° 8° 0° 8°
1. Dimensions in inches are given for reference only
BTA08, BTB08, T810, T835, T850
D²PAK package information
DS2114 - Rev 15 page 15/21
Figure 18. D²PAK recommended footprint (dimensions are in mm)
16.90
10.30
3.70
5.08
1.30
8.90
BTA08, BTB08, T810, T835, T850
D²PAK package information
DS2114 - Rev 15 page 16/21
3Ordering information
Figure 19. Ordering information scheme (BTA08 and BTB08 series)
BT A 08 - 600 BW (RG)
Triac
Insulation
A = Insulated
B = Non-insulated
Current
Voltage
Sensitivity and type
Packing mode
RG = Tube
08 = 8A
600 = 600 V
800 = 800 V
B = 50 mA
C = 25 mA standard
SW = 10 mA logic level
BW = 50 mA Snubberless™
CW = 35 mA Snubberless™
TW = 5 mA logic level
Figure 20. Ordering information scheme (T8 series)
T 8 10 - 600 B (-TR)
Triac series
Package
B = DPAK
H = IPAK
G = D²PAK
Current
Voltage
Sensitivity
Packing mode
Blank = Tube
TR = Tape and reel
08 = 8A
600 = 600 V
800 = 800 V
10 = 10 mA
35 = 35 mA
50 = 50 mA
BTA08, BTB08, T810, T835, T850
Ordering information
DS2114 - Rev 15 page 17/21
Table 10. Product selector
Part Number
Voltage (xxx)
Sensitivity Type Package
600 800
T810-xxxB X X 10 mA Logic Level DPAK
T835-xxxH X 35 mA Snubberless™ IPAK
T810-xxxG X 10 mA Logic Level D2PAK
T835-xxxG X X 35 mA Snubberless™ D2PAK
T850-xxxG X X 50 mA Snubberless™ D2PAK
BTA08-xxxS X 10 mA Logic Level TO-220AB Ins.
BTA08-xxxC X X 35 mA Standard TO-220AB Ins.
BTA08-xxxB X 50 mA Standard TO-220AB Ins.
BTA08-xxxTW X 5 mA Logic Level TO-220AB Ins.
BTA08-xxxSW X 10 mA Logic Level TO-220AB Ins.
BTA08-xxxCW X 35 mA Snubberless™ TO-220AB Ins.
BTA08-xxxBW X X 50 mA Snubberless™ TO-220AB Ins.
BTB08-xxxS X 10 mA Logic Level TO-220AB
BTB08-xxxC X 35 mA Standard TO-220AB
BTB08-xxxB X 50 mA Standard TO-220AB
BTB08-xxxTW X X 5 mA Logic Level TO-220AB
BTB08-xxxSW X 10 mA Logic Level TO-220AB
BTB08-xxxCW X X 35 mA Snubberless™ TO-220AB
BTB08-xxxBW X 50 mA Snubberless™ TO-220AB
BTA08, BTB08, T810, T835, T850
Ordering information
DS2114 - Rev 15 page 18/21
Table 11. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
T810-600B T8 1060
DPAK 0.30
75 TubeT835-600B T8 3560
T835-800B T8 3580
T810-600B-TR T8 1060
2500 Tape&Reel 13"
T810-800B-TR T8 1080
T835-600B-TR T8 3560
T835-800B-TR T8 3580
T835-600H T8 3560 IPAK 0.40 75 Tube
T835-600G T835-600G
D2PAK 1.50
50 Tube
T835-8G T835-8G
T850-6G T850-6G
T850-8G T850-8G
T810-600G-TR T810-600G
1000 Tape&Reel 13"
T835-600G-TR T835-600G
T835-8G-TR T835-8G
T850-6G-TR T850-6G
T850-8G-TR T850-8G
BTA08-600SRG BTA08-600S
TO-220AB Ins.
2.30 50 Tube
BTA08-600BRG BTA08-600B
BTA08-600CRG BTA08-600C
BTA08-800CRG BTA08-800C
BTA08-600BWRG BTA08-600BW
BTA08-600CWRG BTA08-600CW
BTA08-600SWRG BTA08-600SW
BTA08-600TWRG BTA08-600TW
BTA08-800BWRG BTA08-800BW
BTB08-600BRG BTB08-600B
TO-220AB
BTB08-600CRG BTB08-600C
BTB08-600SRG BTB08-600S
BTB08-600BWRG BTB08-600BW
BTB08-600CWRG BTB08-600CW
BTB08-600SWRG BTB08-600SW
BTB08-600TWRG BTB08-600TW
BTB08-800CWRG BTB08-800CW
BTB08-800TWRG BTB08-800TW
BTA08, BTB08, T810, T835, T850
Ordering information
DS2114 - Rev 15 page 19/21
Table 12. Document revision history
Date Revision Changes
Apr-2002 5A Last update.
13-Feb-2006 6 TO-220AB delivery mode changed from bulk to tube. ECOPACK statement
added.
10-Mar-2010 7 Updated ECOPACK statement and Figure 26
02-Jun-2014 8 Updated DPAK and IPAK package information and reformatted to current
standard.
07-Nov-2016 9 Updated Table 1 and reformatted to current standard.
06-Jan-2017 10 Updated Figure 20: "Ordering information scheme (T8 series)", Table 10:
"Product selector" and Table 11: "Ordering information".
09-Feb-2017 11 Added T850 package information.
24-Apr-2017 12 Updated Figure 6..
Minor text changes to improve readability.
14-Mar-2018 13
Updated Table 2. Electrical characteristics (Tj = 25 °C, unless otherwise
specified) Snubberless and logic level (3 quadrants), cover image, Figure
9. Relative variation of critical rate of decrease of main current versus (dV/dt)c
(typical values) and Figure 20. Ordering information scheme (T8 series).
14-May-2018 14 Updated product status links.
09-Aug-2018 15 Updated Table 3. Standard (4 quadrants).
BTA08, BTB08, T810, T835, T850
DS2114 - Rev 15 page 20/21
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
BTA08, BTB08, T810, T835, T850
DS2114 - Rev 15 page 21/21