CRCW...BC e3
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Revision: 19-Oct-17 1Document Number: 28743
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Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors
FEATURES
• High volume product suitable for commercial
applications
• Excellent stability (R/R 1 % for 1000 h at
70 °C)
• Lead (Pb)-free solder contacts on Ni barrier layer
• Metal glaze on high quality ceramic
• Protective overglaze
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Notes
• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.
• Power rating depends on the maximum temperature at the solder point, the component placement density and the substrate material.
STANDARD ELECTRICAL SPECIFICATIONS
TYPE
CASE
SIZE
IMPERIAL
CASE
SIZE
METRIC
POWER RATING
P70
W
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
TEMPERATURE
COEFFICIENT
ppm/K
TOLERANCE
%
RESISTANCE
RANGE
SERIES
CRCW01005...BC 01005 RR0402M 0.031 15
± 250 ± 1 10.0 to 1M E24; E96
± 2, ± 5 E24
-200 / +600 ± 1 1.0 to 9.76 E24; E96
± 2, ± 5 1.0 to 9.1 E24
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. = 0.5 A
CRCW0201...BC 0201 RR 0603M 0.05 30
± 200 ± 0.5 10R to 10M E96
- 200/+ 400 1R0 to 9R76
± 100
± 1
47R to 1M
E24; E96± 200 10R to 10M
- 200 / + 400 1R0 to 9R76
± 200 ± 5 10R to 10M E24
- 200 / + 400 1R0 to 9R1
Zero-Ohm-Resistor: Rmax. = 50 m, Imax. at 70 °C = 1.0 A
CRCW0402...BC 0402 RR 1005M 0.063 50
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 1.5 A
CRCW0603...BC 0603 RR 1608M 0.10 75
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.0 A
CRCW0805...BC 0805 RR 2012M 0.125 150
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 2.5 A
CRCW1206...BC 1206 RR 3216M 0.25 200
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 3.5 A
CRCW1210...BC 1210 RR 3225M 0.50 200
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 4.0 A
CRCW2010...BC 2010 RR 5025M 0.75 400
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 5.0 A
CRCW2512...BC 2512 RR 6332M 1.0 500
± 100 ± 1 1R0 to 10M E24; E96
± 200 1R0 to 9R76
± 200 ± 5 1R0 to 10M E24
Zero-Ohm-Resistor: Rmax. = 20 m, Imax. at 70 °C = 7.0 A
CRCW...BC e3
www.vishay.com Vishay BCcomponents
Revision: 19-Oct-17 2Document Number: 28743
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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Note
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
TECHNICAL SPECIFICATIONS
PARAMETER UNIT CRCW
01005...BC
CRCW
0201...BC
CRCW
0402...BC
CRCW
0603...BC
CRCW
0805...BC
CRCW
1206...BC
CRCW
1210...BC
CRCW
2010...BC
CRCW
2512...BC
Rated
Dissipation
P70 (1)
W 0.031 0.050 0.063 0.10 0.125 0.25 0.50 0.75 1.0
Limiting
Element
Voltage
Umax.
ACRMS/DC
V 15 30 50 75 150 200 200 400 500
Insulation
Voltage
Uins (1 min)
V 30 50 75 100 200 300 300 300 300
Insulation
Resistance > 109
Operating
Temperature
Range
°C -55 to +125 -55 to +155
Failure Rate °C 0.3 x 10-9
Mass mg 0.07 0.17 0.65 2 5.5 10 16 25.5 40.5
PART NUMBER AND PRODUCT DESCRIPTION
PART NUMBER: CRCW0603562RFKTCBC
TYPE RESISTANCE TOLERANCE TCR PACKAGING Special
CRCW0100
CRCW0201
CRCW0402
CRCW0603
CRCW0805
CRCW1206
CRCW1210
CRCW2010
CRCW2512
R = decimal
K = thousand
M = million
0000 = jumper
D = ± 0.5 %
F = ± 1.0 %
G = ± 2.0 %
J = ± 5.0 %
Z = Jumper
K = ± 100 ppm/K
N = ± 200 ppm/K
R = ± 250 ppm/K
X = -200 ppm/K /
+400 ppm/K
Y = -200 ppm/K /
+600 ppm/K
0 = Jumper
TA, TB,
TC, TD,
TE, TF,
TH, TI,
TL
Up to 2 digits
BC = commodity
PRODUCT DESCRIPTION: CRCW0603-BC 100 562R 1 % RT6 e3
CRCW0603-BC 100 562R 1 % RT6 e3
TYPE TCR RESISTANCE TOLERANCE
VALUE PACKAGING LEAD (Pb)-FREE
CRCW01005-BC
CRCW0201-BC
CRCW0402-BC
CRCW0603-BC
CRCW0805-BC
CRCW1206-BC
CRCW1210-BC
CRCW2010-BC
CRCW2512-BC
± 100 ppm/K
± 200 ppm/K
± 250 ppm/K
-200 ppm/K /
+400 ppm/K
-200 ppm/K /
+600 ppm/K
10R = 10
562R = 562
10K = 10.0 k
1M = 1 M
0R0 = Jumper
± 0.5 %
± 1 %
± 2 %
± 5 %
RT1, RT2,
RT3, RT5,
RT6, RT7,
RF4, R02,
R82
e3 = pure tin
termination finish
C R C W 0 6 0 3 5 6 2 R F K T C B C
CRCW...BC e3
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Revision: 19-Oct-17 3Document Number: 28743
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DIMENSIONS in millimeters
Notes
(1) The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of
power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials maybe required to maintain
the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in
standards IEC 61188-5-x, or in publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also
strongly influenced by many other parameters. Still the given solder pad dimensions will be found adequate for most general applications.
(2) No marking for 01005, 0201, and 0402 sizes.
PACKAGING
TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER
CRCW01005…BC TL = RT3 20 000
Paper tape acc. to
IEC 60286-3, Type 1a
8 mm 2 mm 180 mm/7"
CRCW0201…BC
TD = RT7 10 000
8 mm 2 mm
180 mm/7"
TI = RT2 20 000 254 mm/10"
TE = RF4 50 000 330 mm/13"
CRCW0402…BC
TD = RT7 10 000
8 mm 2 mm
180 mm/7"
TI = RT2 20 000 254 mm/10"
TE = RF4 50 000 330 mm/13"
CRCW0603…BC
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 254 mm/10"
TC = RT6 20 000 330 mm/13"
CRCW0805…BC
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 254 mm/10"
TC = RT6 20 000 330 mm/13"
CRCW1206…BC
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 254 mm/10"
TC = RT6 20 000 330 mm/13"
CRCW1210…BC
TA = RT1 5000
8 mm 4 mm
180 mm/7"
TB = RT5 10 000 254 mm/10"
TC = RT6 20 000 330 mm/13"
CRCW2010…BC TF = R02 4000 12 mm 4 mm 180 mm/7"
CRCW2512…BC TH = R82 4000 12 mm 4 mm 180 mm/7"
SIZE DIMENSIONS RECOMMENDED SOLDER PAD DIMENSIONS (1)
REFLOW SOLDERING WAVE SOLDERING
IMPERIAL METRIC L W H T1 T2 a b l a b l
01005 0402 0.4 ± 0.02 0.2 ± 0.02 0.13 ± 0.02 0.10 ± 0.03 0.10 ± 0.03 0.15 0.2 0.2 - - -
0201 0603 0.6 ± 0.05 0.3 ± 0.05 0.23 ± 0.05 0.15 ± 0.05 0.10 ± 0.05 0.3 0.43 0.2 - - -
0402 1005 1.0 ± 0.10 0.5 ± 0.05 0.30 ± 0.05 0.25 ± 0.10 0.2 ± 0.1 0.4 0.6 0.5 - - -
0603 1608 1.6 ± 0.10 0.80 ± 0.10 0.45 ± 0.10 0.3 ± 0.2 0.3 ± 0.2 0.5 0.9 1.0 0.9 0.9 1.0
0805 2012 2.0 ± 0.10 1.25 ± 0.15 0.50 ± 0.10 0.35 ± 0.15 0.35 ± 0.2 0.7 1.3 1.2 0.9 1.3 1.3
1206 3216 3.05 ± 0.10 1.55 ± 0.10 0.50 + 0.10
- 0.05 0.35 ± 0.15 0.45 ± 0.2 0.9 1.7 2.0 1.1 1.7 2.3
1210 3225 3.05 ± 0.10 2.5 ± 0.2 0.55 ± 0.10 0.50 ± 0.2 0.50 ± 0.2 0.9 2.5 2.0 1.1 2.5 2.2
2010 5025 5.0 ± 0.20 2.5 ± 0.20 0.55 ± 0.10 0.6 ± 0.2 0.6 ± 0.2 1.0 2.5 3.9 1.2 2.5 3.9
2512 6332 6.3 ± 0.2 3.20 ± 0.20 0.55 ± 0.1 0.6 ± 0.2 0.6 ± 0.2 1.0 3.2 5.2 1.2 3.2 5.2
CRCW...BC e3
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Revision: 19-Oct-17 4Document Number: 28743
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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DERATING
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS PERMISSIBLE CHANGE (R)
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
SIZE 0201
Stability for product types:
CRCW....BC e3 1 to 10 M1 to 10 M1 to 10 M
4.5 - Resistance - ± 1 % ± 5 %
± 0.5 %, ± 1 %, ± 5 %
4.8.4.2 - Temperature
coefficient
(20 / -55 / 20) °C and
(20 / 125 / 20) °C
± 100 ppm/K,
± 200 ppm/K ± 200 ppm/K
± 100 ppm/K,
± 200 ppm/K,
- 200 ppm/K/
+ 400 ppm/K
4.13 - Short time
overload
U = 2.5 x 2 x Umax.;
duration: Acc. to the style ± (0.25 % R + 0.05 )± (0.5 % R + 0.05 )± (1 % R + 0.05 )
4.17.5 58 (Td) Solderability
Pre-aging
4 h at 155 °C,
dryheat
Solder bath
method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath
method;
Sn96.5Ag3Cu0.5
non activated flux;
(245 ± 5) °C
(3 ± 0.3) s
Good tinning ( 95 % covered)
no visible damage
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method
(260 ± 5) °C;
(10 ± 1) s
± (0.25 % R + 0.05 )± (0.5 % R + 0.05 )± (1 % R + 0.05 )
4.19 14 (Na) Rapid change
of temperature
30 min. at - 55 °C;
30 min. at 125 °C;
5 cycles ± (0.25 % R + 0.05 )± (0.5 % R + 0.05 )± (0.5 % R + 0.05 )
1000 cycles ± (1 % R + 0.05 ) ± (1 % R + 0.05 ) ± (1 % R + 0.05 )
4.24 78 (Cab) Damp heat,
steady state
(40 ± 2) °C;
56 days;
(93 ± 3) % RH
± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
- 55 - 25 0 25 50 75 100 125 155 175
120
100
80
60
40
20
0
70 Ambient Temperature in °C
Rated Power in %
CRCW-BC e3
CRCW01005-BC e3
P70 x R
CRCW...BC e3
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Revision: 19-Oct-17 5Document Number: 28743
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4.23 - Climatic
sequence: -
± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
4.23.2 2 (Ba) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat,
cyclic
55 °C; 90 % RH;
24 h; 1 cycle
4.23.4 1 (Aa) Cold -55 °C; 2 h
4.23.5 13 (M) Low air
pressure 1 kPa; (25 ± 10) °C; 1 h
4.23.6 30 (Db) Damp heat,
cyclic
55 °C; 90 % RH;
24 h; 5 cycles
4.23.7 - DC load U = Umax.
4.25.1 - Endurance
at 70 °C
U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
70 °C; 8000 h ± (2 % R + 0.1 )± (4 % R + 0.1 )± (4 % R + 0.1 )
4.25.3 - Endurance
at 125 °C 125 °C, 1000 h ± (1 % R + 0.05 )± (2 % R + 0.1 )± (2 % R + 0.1 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
Stability for product types:
1 to 1 M
CRCW01005 e3
4.5 - Resistance - ± 1 %; ± 2 %; ± 5 %
4.13 - Short time overload U = 2.5 x 2 x Umax.;
duration according to style ± (2 % R + 0.1 )
4.17.2 58 (Td) Solderability
Solder bath method;
Sn60Pb40
non activated flux;
(235 ± 5) °C
(2 ± 0.2) s
Good tinning ( 95 % covered)
no visible damage
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(235 ± 3) °C
(2 ± 0.5) s
Good tinning ( 95 % covered)
no visible damage
4.8.4.2 - Temperature coefficient (20/-55/20) °C and
(20/125/20) °C
- 200 ppm/K/+600 ppm/K,
± 250 ppm/K
4.33 21 (Uu1) Substrate bending Depth 3 mm; 1 time
No visible damage,
no open circuit in bent position
± (1 % R + 0.05 )
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS PERMISSIBLE CHANGE (R)
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
SIZE 0201
Stability for product types:
CRCW....BC e3 1 to 10 M1 to 10 M1 to 10 M
P70 x R
P70 x R
P70 x R
CRCW...BC e3
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Revision: 19-Oct-17 6Document Number: 28743
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4.19 14 (Na) Rapid change
of temperature
15 min. at -55 °C;
15 min. at 125 °C;
300 cycles
± (2 % R + 0.1 )
4.25.1 - Endurance at 70 °C
U = Umax.;
1.5 h on; 0.5 h off;
70 °C; 1000 h
± (5 % R + 0.1 )
4.18.2 58 (Td) Resistance to
soldering heat
Solder bath method
(260 ± 5) °C; (10 ± 1) s ± (2 % R + 0.1 )
4.24 78 (Cab) Damp heat, steady state (40 ± 2) °C; (90 to 95) % RH;
1000 h ± (5 % R + 0.1 )
4.25.3 - Endurance at upper
category temperature 125 °C, 1000 h ± (2 % R + 0.1 )
4.29 45 (XA) Component
solvent resistance
Isopropyl alcohol;
(20 to 25) °C; (5 ± 0.5) min No visible damage
APPLICABLE SPECIFICATIONS
• EN60115-1 Generic specification
• EN60115-8 Sectional specification
• EN140401-802 Detail specification
• IEC 60068-2-X Environmental test procedures
• IEC 60286-3 Packaging of SMD components
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 1 OR BETTER
Stability for product types:
1 to 1 M
CRCW01005 e3
P70 x R
