Rev. 4534C–SIGE–10/03
Features
•Active Mixer with Conversion Gain
•No External LO Driver Necessary
•Low LO Drive Level Required
•RF and LO Ports May Be Driven Single-ended
•Single 5-V Supply Voltage
•High LO-RF Isolation
•Broadband Resistive 50-Ω Impedances on All Three Ports
Applications
•Infrastructure Digital Communication Systems
•1700 MHz to 2300 MHz Receivers for CDMA/PCS/DCS/UMTS Base Stations
Electrostatic sensitive device.
Observe precautions for handling.
Description
The T0781 is a high linearity active mixer which is manufactured using Atmel’s
advanced Silicon-Germanium (SiGe) technology. This mixer features a frequency
range of 1700 MHz to 2300 MHz. It operates from a single 5-V supply and provides
12 dB of conversion gain while requiring only 0 dBm input to the integrated LO driver.
An IF amplifier is also included.
The T0781 incorporates internal matching on each RF, IF and LO ports to enhance
ease of use and to reduce the external components required. The RF and LO inputs
can be driven differentially or single-ended.
Figure 1. Block Diagram
IFP
IFN
LOP
LON
RFP
RFN
4
5
13
1
16
12
1700 MHz -
2300 MHz
High Linearity
SiGe Active
Receiver Mixer
T0781
Preliminary
2T0781 [Preliminary]
4534C–SIGE–10/03
Pin Configuration
Figure 2. Pinning SSOP16
IFN
VCC
GND
LOP
LON
GND
VCC
L2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IFP
VCC
GND
RFP
RFN
GND
VCC
L1
Pin Description
Pin Symbol Function
1 IFP IF positive output
2 VCC 5-V power supply
3 GND Ground
4 RFP RF positive input
5 RFN RF negative input
6 GND Ground
7 VCC 5-V power supply
8 L1 External inductor terminal
9 L2 External inductor terminal
10 VCC 5-V power supply
11 GND Ground
12 LON Local oscillator, negative input
13 LOP Local oscillator, positive input
14 GND Ground
15 VCC 5-V power supply
16 IFN IF negative output
3
T0781 [Preliminary]
4534C–SIGE–10/03
Absolute Maximum Ratings (1)
All voltages are referred to GND.
Parameters Symbol Value Unit
Supply voltage VCC 5.5 V
LO input LOP, LON 10 dBm
IF input RFP, RFN 15 V
Operating temperature TOP -40 to +85 °C
Storage temperature Tstg -65 to +150 °C
Notes: 1. The device may not survive all maximum values applied simultaneously.
Thermal Resistance
Parameters Symbol Value Unit
Junction ambient RthJA TBD K/W
Junction case RthJC 46 °C/W
Electrical Characteristics
Test Conditions: VCC = 5 V, Tamb = 25°C, RF input: -40 dB at 1880 MHz, LO input: 0 dBm at 1680 MHz
No. Parameters Test Conditions Pin Symbol
1700 to 2000 MHz
Operation
2000 to 2300 MHz
Operation
Unit Type*Min. Typ. Max. Min. Typ. Max.
1 AC Performance
1.1 RF frequency
range
For RF = 2000 to
2300 MHz
operation, single-
ended RF + LO
drive is
recommended
4,
5fRF 1700 2000 2000 2300 MHz B, C
1.1
1
LO frequency
range fLO 1400 2000 1700 2300 MHz B, C
1.2 IF frequency
range
1,
16 FIF 30 200 300 30 200 300 MHz B, C
1.3 Input IP3
RF1 = RF2 =
-15 dBm/tone,
1MHz spacing
4,
5IIP3 12 15 12 15 dBm D
1.4 Input P1dB 4,
5P1dB 1 2 3 5 dBm D
1.5 Conversion gain 1,
16 G912 69 dBA
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note: 1. The return losses shown were measured with the T0781 mounted on Atmel’s FR4 evaluation boards using standard
matching practices as indicated on the respective application schematic (see Figure 23 on page 12 and Figure 24 on page
14). Users following the RF, LO and IF matching guidelines will achieve similar performance.
4T0781 [Preliminary]
4534C–SIGE–10/03
1.6 SSB noise figure 1,
16 NFSSB 14 15 16 19 dB D
1.7 RF return loss Matched to
50 W(1) 4,
5RLRF 20 20 dB D
1.8 LO return loss Matched to
50 W(1) 12,
13 RLLO 20 20 dB D
1.9 IF return loss Matched to
50 W(1) 1,
16 RLIF 20 20 dB D
1.1
0LO drive Matched to 50 W12,
13 PLO -3 0 +3 -3 0 +3 dBm D
2 Isolation Performance
2.1 Leakage (LO-RF) 12,
13 ALO-RF -60 -40 -30 -20 dBm D
2.2 Leakage (LO-IF) 12,
13 ALO-IF -30 -20 -30 -20 dBm D
2.3 Leakage (RF-IF) -53 -40 -35 -25 dBm D
3 Miscellaneous
3.1 Supply voltage
2,
7,
10,
15
VCC 4.75 5.0 5.25 4.75 5.0 5.25 V A
3.2 Supply current
2,
7,
10,
15
ICC 160 180 160 180 mA A
Electrical Characteristics (Continued)
Test Conditions: VCC = 5 V, Tamb = 25°C, RF input: -40 dB at 1880 MHz, LO input: 0 dBm at 1680 MHz
No. Parameters Test Conditions Pin Symbol
1700 to 2000 MHz
Operation
2000 to 2300 MHz
Operation
Unit Type*Min. Typ. Max. Min. Typ. Max.
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
Note: 1. The return losses shown were measured with the T0781 mounted on Atmel’s FR4 evaluation boards using standard
matching practices as indicated on the respective application schematic (see Figure 23 on page 12 and Figure 24 on page
14). Users following the RF, LO and IF matching guidelines will achieve similar performance.
5
T0781 [Preliminary]
4534C–SIGE–10/03
1700 MHz to 2000 MHz: Typical Device Performance
Figure 3. Conversion Gain versus Temperature, PLO = 0 dBm
Figure 4. Conversion Gain versus LO Drive, Tamb = 25°C
Figure 5. Leakages, PLO = 0 dBm at Pins, PRF = -20 dBm at Pins, Tamb = 25°C
Conversion Gain vs Temperature
Plo = 0dBm
0.0
4.0
8.0
12.0
16.0
20.0
1400 1600 1800 2000 2200
Frequency (MHz)
Conversion Gain (dB)
-40ºC
+25ºC
+85ºC
Conversion Gain vs LO Drive
T=+25ºC
0.0
4.0
8.0
12.0
16.0
20.0
1400 1600 1800 2000 2200
Frequency (MHz)
Conversion Gain (dB)
-3 dBm
0 dBm
+3 dBm
Leakages
Plo=0 dBm at pins, Prf=-20 dBm at pins,
T=+25ºC
-80
-60
-40
-20
0
1400 1600 1800 2000 2200
Frequency (MHz)
Leakage (dBm)
LO-RF
RF- IF
LO-IF
6T0781 [Preliminary]
4534C–SIGE–10/03
Figure 6. Input IP3 versus Temperature PLO = 0 dBm
Figure 7. Input IP3 versus LO Drive, Tamb = 25°C
Figure 8. Noise Figure versus Temperature, PLO = 0 dBm
Input IP3 vs Temperature
Plo = 0dBm
10.0
12.0
14.0
16.0
18.0
20.0
1700 1750 1800 1850 1900 1950 2000
Frequency (MHz)
Input IP3 (dBm
)
-40ºC
+25º C
+85º C
Input IP3 vs LO Drive
T=+25ºC
10.0
12.0
14.0
16.0
18.0
20.0
1700 1750 1800 1850 1900 1950 2000
Frequency (MHz)
Input IP3 (dBm
)
-3 dBm
0 dBm
+3dBm
Noise Figure vs Temperature
Plo=0dBm
10
12
14
16
18
20
1700 1750 1800 1850 1900 1950 2000
Frequency (MHz)
Noise Figure (dB)
-40ºC
+25º C
+85º C
7
T0781 [Preliminary]
4534C–SIGE–10/03
Figure 9. RF and LO Return Loss, Tamb = 25°C
Figure 10. IF Return Loss, Tamb = 25°C
Figure 11. Input P1dB versus Temperature, PLO = 0 dBm
RF & LO Return Loss (Note 1)
T=+25ºC
-30
-25
-20
-15
-10
-5
0
1400 1600 1800 2000 2200
Frequency (MHz)
Return Loss (dB)
RF RL
LO RL
IF Return Loss (Note 1)
T=+25ºC
-30
-25
-20
-15
-10
-5
0
30 60 90 120 150 180 210 240 270 300
Frequency (MHz)
Reutrn Loss (dB)
Input P1dB vs Tem perature
Plo=0 dBm
-5.0
-3.0
-1.0
1.0
3.0
5.0
1700 1750 1800 1850 1900 1950 2000
Frequency (MHz)
Input P1dB (dBm)
-40ºC
+25º C
+85º C
8T0781 [Preliminary]
4534C–SIGE–10/03
Figure 12. Input P1dB versus LO Drive, Tamb = 25°C
Input P1dB vs LO Drive
T=+25ºC
-5.0
-3.0
-1.0
1.0
3.0
5.0
1700 1750 1800 1850 1900 1950 2000
Frequency (MHz)
Input P1dB (dBm)
-3 dBm
0 dBm
+3dBm
9
T0781 [Preliminary]
4534C–SIGE–10/03
2200 MHz to 2300 MHz: Typical Device Performance, Single-ended Drive
Figure 13. Conversion Gain versus Temperature, PLO = 0 dBm
Figure 14. Conversion Gain versus LO Drive, Tamb = 25°C
Figure 15. Leakages, PLO = 0 dBm at Pins, PRF = -20 dBm at Pins, Tamb = 25°C
Conversion Gain vs Tem perature
Plo=0 dBm
0
4
8
12
16
20
2000 2100 2200 2300 2400 2500
Frequency (MHz)
Conversion Gain (dB)
-40ºC
+25º C
+85º C
Conversion Gain vs LO Drive
T=+25ºC
0
4
8
12
16
20
2000 2100 2200 2300 2400 2500
Frequency (MHz)
Conversion Gain (dB)
-3 dBm
0 dBm
+3 dBm
Leakages
Plo=0 dBm at pins, Prf=-20 dBm at pins,
T=+25ºC
-45
-40
-35
-30
-25
-20
1800 1900 2000 2100 2200 2300 2400 2500
Frequency (MHz)
Leakage (dBm)
LO-RF
RF-IF
LO-IF
10 T0781 [Preliminary]
4534C–SIGE–10/03
Figure 16. Input IP3 versus Temperature PLO = 0 dBm
Figure 17. Input IP3 versus LO Drive, Tamb = 25°C
Figure 18. Input P1dB versus Temperature, Tamb = 25°C
Input IP3 vs Tem perature
Plo=0dBm
10.0
12.0
14.0
16.0
18.0
20.0
2000 2050 2100 2150 2200 2250 2300
Frequency (MHz)
Input IP3 (dBm
)
-40ºC
+25º C
+85º C
Input IP3 vs LO Drive
T=+25ºC
10.0
12.0
14.0
16.0
18.0
20.0
2000 2050 2100 2150 2200 2250 2300
Frequency (MHz)
Input IP3 (dBm
)
-3 dBm
0 dBm
+3 dBm
Input P1dB vs Temperature
Plo=0dBm
0.0
2.0
4.0
6.0
8.0
10.0
2000 2050 2100 2150 2200 2250 2300
Frequency (MHz)
Input P1dB (dBm)
-40º C
+25º C
+85º C
11
T0781 [Preliminary]
4534C–SIGE–10/03
Figure 19. RF and LO Return Loss, VCC = 5 V, Tamb = 25°C
Figure 20. IF Return Loss, Tamb = 25°C
Figure 21. Input P1dB versus Temperature, PLO = 0 dBm
RF & LO Re tur n L o s s (Not e 1)
Vcc=5V, T=+25ºC
-35
-30
-25
-20
-15
-10
-5
0
1800 1900 2000 2100 2200 2300 2400
Frequency (MHz)
Return Loss (dB)
RF RL
LO RL
IF Return Loss (Note 1)
T=25C
-30
-25
-20
-15
-10
-5
0
30 75 120 165 210 255 300
Frequency (MHz)
Reutrn Loss (dB)
Input P1dB vs Temperature
Plo=0dBm
0.0
2.0
4.0
6.0
8.0
10.0
2000 2050 2100 2150 2200 2250 2300
Frequency (MHz)
Input P1dB (dBm)
-40ºC
+25ºC
+85ºC
12 T0781 [Preliminary]
4534C–SIGE–10/03
Figure 22. Input P1dB versus LO Drive, Tamb = 25°C
Figure 23. 1700 MHz to 2000 MHz Application Schematic (Differential Drive)
Input P1dB vs LO Drive
T=25C
0.0
2.0
4.0
6.0
8.0
10.0
2000 2050 2100 2150 2200 2250 2300
Frequency (MHz)
Input P1dB (dBm)
-3 dBm
0 dBm
+3 dBm
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
5V
L1
Vcc
T0781
T1
IFout
C2 C3
C4
Vcc
RFin
L7 L9
C15
Vcc
C14
Vcc
Vcc
C12
Vcc
C13
C5
Vcc
LOin
IC1
J1
J2
J3
C6
C10
T2 C11
C7
T3
C1
C8
13
T0781 [Preliminary]
4534C–SIGE–10/03
Bill of Materials (for 1700 MHz to 2000 MHz Evaluation Board)
The T0781 utilizes an IF tank circuit to maximize performance across the entire IF band-
width. the off-chip inductors L7 and L9 resonate with an on-chip capacitor (4 pF) to pro-
vide IF tunability. therefore, L7 and L9 must be selected such that the resonance occurs
at the desired IF.
The following table provides the inductor values required on the evaluation board for
some common intermediate frequencies. By default, all evaluation board are shipped
with L7 = L9 = 100 nH, resulting in a 200 MHz resonant IF.
Table 1. IF Tank Circuit
Component
Designator Value Vendor Part Number Description
IC1 Atmel T0781 SiGe receiver mixer
J1, J2, J3 Johnson
Components™742-0711-841 SMA connector, end launch with tab, for 1.07 mm
board
T2, T3 1:1 Panansonic®EHF-FD1619 RF transformer
T1 1:1 Mini-Circuits®TC1-1 IF transformer
L1 1 µH Würth Elektronik®74476401 Inductor, 1210 footprint, minimum 200 mA rating
L7, L9 see Table 1 Würth Elektronik 744786110 Inductor, 0603 footprint, high Q series
C1 10 µF KEMET®T491A106_010AS Tantal chip capacitor, size A
C4, C5, C12, C13 6.8 pF Vishay®VJ0402A6R8JXXA_ Capacitor, 0402 footprint
C14, C15 100 pF Vishay VJ0402A101JXXA_ Capacitor, 0402 footprint
C2, C3 120 pF Vishay VJ0402A121JXXA_ Capacitor, 0402 footprint
C6, C10 2.7 pF Vishay VJ0402A2R7JXXA_ Capacitor, 0402 footprint
C7, C11 3.9 pF Vishay VJ0402A3R9JXXA_ Capacitor, 0402 footprint
C8 n.c. - - Capacitor, 0402 footprint
IF (MHz) Typical L7, L9 (nH)
Würth Elektronik
Part Number
70 680 744780680
150 150 74478625
200 100 744786110
300 39 744786131
14 T0781 [Preliminary]
4534C–SIGE–10/03
Bill of Materials (for 2000 MHz to 2300 MHz Evaluation Board)
Figure 24. Demo Test Board (Fully Asembled PCB)
Figure 25. Recommended Package Footprint
Component
Designator Value Vendor Part Number Description
IC1 Atmel T0781 SiGe receiver mixer
J1, J2, J3 Johnson
Components 742-0711-841 SMA connector, end launch with tab, for 1.07 mm
board
T2, T3 1:1 Panansonic EHF-FD1619 RF transformer
T1 1:1 Mini-Circuits TC1-1 IF transformer
L1 1 µH Würth Elektronik 74476401 Inductor, 1210 footprint, minimum 200 mA rating
L7, L9 see Table 1
on page 13 Würth Elektronik 744786110 Inductor, 0603 footprint, high Q series
C1 10 µF KEMET T491A106_010AS Tantal chip capacitor, size A
C4, C5, C12, C13 6.8 pF Vishay VJ0402A6R8JXXA_ Capacitor, 0402 footprint
C14, C15 100 pF Vishay VJ0402A101JXXA_ Capacitor, 0402 footprint
C2, C3 120 pF Vishay VJ0402A121JXXA_ Capacitor, 0402 footprint
C6, C10 2.2 pF Vishay VJ0402A2R2JXXA_ Capacitor, 0402 footprint
C7, C11 2.2 pF Vishay VJ0402A2R2JXXA_ Capacitor, 0402 footprint
C8 1 pF Vishay VJ0402A1R0JXXA_ Capacitor, 0402 footprint
15
T0781 [Preliminary]
4534C–SIGE–10/03
In order to avoid soldering problems, plugging of the ground vias under the heat slug is recommended!
3.0
3.0
6.35
31.75
6.9
0.74
0.74
0.7
0.9
0.4
f0.33 via
- Indicates metalization - vias connect pad to underlying ground plane
all units are in mm
Remark: Heatslug must be soldered to GND.
16 T0781 [Preliminary]
4534C–SIGE–10/03
Package Information
Ordering Information
Extended Type Number Package Remarks
T0781-6C TSSOP16 –
Printed on recycled paper.
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does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are
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as critical components in life support devices or systems.
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4534C–SIGE–10/03
© Atmel Corporation 2003. All rights reserved. Atmel® and combinations thereof are the registered trademarks of Atmel Corporation or its
subsidiaries, Johnson Components™ is a trademark of Emerson Electric Co., Panasonic® is a registered trademark of Matsushita Electric Indus-
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GmbH & Co. KG, KEMET® is a registered trademark of KRC Trade Corporation, Vishay® is a registered trademark of Vishay Intertechnology,
Inc. Other terms and product names may be the trademarks of others.
