Data Sheet Conexant Doc. No. 101476D
Proprietary Information and Specifications Are Subject to Change April 1, 2002
CX65105
1700 - 2200 MHz Linear Power Amplifier
Conexant’s CX65105 power amplifier is a fully matched 8-pin Leadless Chip
Carrier (LCC) surface mount module, developed for Personal Communication
System (PCS) and Wireless Local Loop (WLL) applications. This small, power-
efficient amplifier has a full 1700 to 2200 MHz bandwidth coverage packed into a
single compact package. All active circuitry in the module is contained in a single
Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC). This
device is manufactured with Conexant’s Aluminum (Al)GaAs Heterojunction Bipolar
Transistor (HBT) process, which allows for single supply operation while
maintaining high efficiency and good linearity.
Figure 1 shows a functional block diagram for the CX65105. The device package
and pinout are shown in Figure 2.
OUTPUT
MATCH
DA DA RFOUT
RFIN
GND
5, 7
62
VCC1
VCC2
43
INPUT MATCH
DRIVER STAGE
BIAS
INTERSTAGE
MATCH
POWER STAGE
BIAS
1
GND
VREF
MMIC
MODULE
8
Figure 1. CX65105 Functional Block Diagram
Distinguishing Features
• Typical POUT of 27 dBm
• High linearity
• Low power consumption
• 8-pin LCC package
• Single +5 V supply
Applications
• PCS/DCS/UMTS
• Repeaters
• WLL, and Industrial, Scientific, Medical (ISM)
bands
• Mobile radio
• Telematics
GND
VREF GND
GND
RFIN
VCC2 VCC1
RFOUT
1
2
3
4
5
6
7
8
Figure 2. CX65105 Pinout – 8-Pin LCC Package
Top View
CX65105 Power Amplifier
2 Conexant 101476D
Proprietary Information and Specifications Are Subject to Change April 1, 2002
Electrical and Mechanical Specifications
The signal pin assignments and functions are described in
Table 1. The absolute maximum ratings of the CX65105 are
provided in Table 2. The recommended operating conditions are
specified in Table 3 and electrical specifications are provided in
Table 4.
Typical performance characteristics over temperature of the
CX65105 are illustrated in Figures 3, 4, 5, 6, 7, and 8.
Table1. CX65105 Signal Descriptions
Pin # Name Description
1 GND Ground
2 RFIN RF input
3 VREF Reference voltage
4 VCC2 Supply voltage
5 GND Ground
6 RFOUT RF output
7 GND Ground
8 VCC1 Supply voltage
Table 2. CX65105 Absolute Maximum Ratings
Parameter Symbol Min Typical Max Units
RF input power PIN 7 dBm
Supply voltage VCC 8.5 V
Reference voltage VREF 4
Case operating temperature TC –30 110 °C
Storage temperature TST –55 125 °C
Note: No damage to device if only one parameter is applied at a time with other parameters at nominal conditions.
Table 3. CX65105 Recommended Operating Conditions
Parameter Symbol Min Typical Max Units
Supply voltage VCC 5 V
Reference voltage VREF 3.6 V
Operating frequency FO 1700 1900 2200 MHz
Case operating temperature TC –30 25 85 °C
Power Amplifier CX65105
101476D Conexant 3
April 1, 2002 Proprietary Information and Specifications Are Subject to Change
Table 4. CX65105 Electrical Characteristics
(VCC = 5 V, VREF = 3.6 V, Frequency = 1900 MHz, TC = 25 °C)
Parameter Symbol Test
Conditions
Min Typical Max Units
Analog Inputs
Frequency range 1700 1900 2200 MHz
Quiescent current Iq 143 185 mA
Small signal gain G PIN = –15 dBm 22.5 24.0 dB
Output power POUT PIN = 4 dBm 26 27 dBm
Efficiency PAE PIN = 4 dBm 20 25 %
Noise Figure (NF) NF 6 7 dB
Output IP3 OIP3 Two tones with
100 kHz spacing
PIN = 0 dBm
per tone
36 40 dBm
Note: The above specifications apply only to the 1900 MHz operating frequency.
24
25
26
27
28
29
30
31
234567
Pin (dBm)
Pout (dBm)
-30C
25C
85C
Figure 3. Typical POUT vs PIN Over Temperature
CX65105 Power Amplifier
4 Conexant 101476D
Proprietary Information and Specifications Are Subject to Change April 1, 2002
16
18
20
22
24
26
28
30
32
34
36
234567
Pin (dBm)
PAE (%)
85C
25C
-30C
Figure 4. Typical PAE vs PIN Over Temperature
0
5
10
15
20
25
30
1700 1800 1900 2000 2100 2200
Freq (MHz)
Small Signal Gain (dB)
85C
25C
-30C
Figure 5. Typical Small Signal Gain vs Frequency Over Temperature
0
1
2
3
4
5
6
7
8
1700 1800 1900 2000 2100 2200
Freq (MHz)
NF (dB)
85C
25C
-30C
Figure 6. Typical Noise Figure vs Frequency Over Temperature
Power Amplifier CX65105
101476D Conexant 5
April 1, 2002 Proprietary Information and Specifications Are Subject to Change
0
10
20
30
40
50
1700 1800 1900 2000 2100 2200
Freq (MHz)
OIP3 (dBm)
85C
25C
-30C
Figure 7. Typical OIP3 vs Frequency Over Temperature
0
5
10
15
20
25
30
35
1700 1800 1900 2000 2100 2200
Freq (MHz)
Pout (dBm)
-30C
25C
85C
Figure 8. Typical POUT vs Frequency Over Temperature
Evaluation Board Description
Conexant's CX65105 Evaluation Board is used to test the
CX65105 power amplifier’s performance. The CX65105
Evaluation Board schematic diagram is shown in Figure 9. The
schematic shows the basic design of the board for the 1700 to
2200 MHz range. Figure 10 provides the Evaluation Board
assembly diagram. Figure 11 provides the Evaluation Board
layer detail.
Circuit Design Considerations ________________________
The following design considerations are general in nature and
must be followed regardless of final use or configuration:
1. Paths to ground should be made as short as possible.
2. The ground pad of the CX65105 power amplifier has
special electrical and thermal grounding requirements. This
pad is the main thermal conduit for heat dissipation. Since
the circuit board acts as the heat sink, it must shunt as
much heat as possible from the amplifier. As such, design
the connection to the ground pad to dissipate the maximum
wattage produced to the circuit board. Multiple vias to the
grounding layer are required.
3. Two external output bypass capacitors, 0.01 µF and
4.7 µF, are required on the VCC1 (pin 8) supply input. The
same two capacitors are also required on the VCC2 (pin 4)
supply input. Both capacitors should be placed in parallel
CX65105 Power Amplifier
6 Conexant 101476D
Proprietary Information and Specifications Are Subject to Change April 1, 2002
between the supply line and ground. Also, a bypass
capacitor of 0.01 µF is required on the VREF input (pin 3).
See Figure 9 for a detailed diagram.
4. VCC1 (pin 8) and VCC2 (pin 4) may be connected together
at the supply.
5. At the RF input (pin 2), a DC blocking capacitor is required.
6. The RF output includes an onboard internal DC blocking
capacitor. All impedance matching is provided internally.
Therefore, the application only needs to provide a good
50 Ω load.
Testing Procedure __________________________________
Use the following procedure to set up the CX65105 Evaluation
Board for testing. Refer to Figure 12 for guidance:
1. Connect a +5.0 V supply voltage to VCC1 and VCC2, and
+3.6 V supply voltage to VREF. If available, enable the
current limiting function of the power supplies to 1.0 A for
the +5.0 V supply current and 30 mA for the +3.6 V supply
current.
2. Connect a signal generator to the RF signal input port. Set
it to the desired RF frequency at a power level of 4 dBm or
less to the Evaluation Board but do NOT enable the RF
signal.
3. Connect a spectrum analyzer to the RF signal output port.
4. Enable the power supply.
5. Enable the RF signal.
6. Take measurements.
Caution: If the input signal exceeds the rated power, the
CX65105 Evaluation Board can be permanently
damaged.
Package Dimensions
Figure 13 shows the package dimensions for the 8-pin CX65105
LCC and Figure 14 provides the tape and reel dimensions.
Package and Handling Information
Since the device package is sensitive to moisture absorption, it
is baked and vacuum packed before shipping. Instructions on
the shipping container label regarding exposure to moisture
after the container seal is broken must be followed. Otherwise,
problems related to moisture absorption may occur when the
part is subjected to high temperature during solder assembly.
If the part is attached in a reflow oven, the temperature ramp
rate should not exceed 5 °C per second. Maximum temperature
should not exceed 225 °C and the time spent at a temperature
that exceeds 210 °C should be limited to less than 10 seconds.
If the part is manually attached, precaution should be taken to
ensure that the part is not subjected to a temperature that
exceeds 300 °C for more than 10 seconds.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment. For
additional details on both attachment techniques, precautions,
and recommended handling procedures, refer to the Conexant
document Solder Reflow Application Note, document number
101536.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the
Conexant document Tape and Reel Information Application
Note, document number 101568.
Electro-Static Discharge (ESD) Sensitivity
The CX65105 is a static-sensitive electronic device. Do not
operate or store near strong electrostatic fields. Take proper
ESD precautions.
Power Amplifier CX65105
101476D Conexant 7
April 1, 2002 Proprietary Information and Specifications Are Subject to Change
RFIN
VREF
RF in
RF out
Pin 9
Package Base
+5.0 V
C3
0.01 F
C6
0.01 F
C5
4.7 pF
C4
4.7 F
T2
50
microstrip
T1
Notes:
1) Pin 9 provides both a thermal and electrical ground.
This ground path is critical and must be as short
as possible.
2) Transmission line lengths T1 and T2 should be
minimized.
T3
50
microstrip
7
6
5
RFOUT
1
2
3
4
8
VCC2
+3.6 V
C1237d
+5 V
C2
4.7 F
C1
0.01 F
VCC1
Figure 9. Evaluation Board Schematic, 1700 MHz to 2200 MHz
J1 (RF In)
J3
J2 (RF Out)
C1257b
C1
C5 C6
C4
C2
C3
07-02-01
CX65105
TW10 D845 REV A
8x8 PA EVALUATION BD.
GND
GND
GND
VCC2
VCC1
VREF
Figure 10. Evaluation Board Assembly Diagram
(Top View)
CX65105 Power Amplifier
8 Conexant 101476D
Proprietary Information and Specifications Are Subject to Change April 1, 2002
Layer 2: Inner Traces
Layer 3: Solid Ground Plane
Layer 1: Top - Metal
C1253d
Figure 11. Evaluation Board Layer Detail
Power Amplifier CX65105
101476D Conexant 9
April 1, 2002 Proprietary Information and Specifications Are Subject to Change
C1240d
Signal Generator
Power Meter
or
Spectrum Analyzer
CX65105
Evaluation Board
Power Supply
Input Output
Figure 12. CX65105 Evaluation Board Testing Configuration
SOLDER MASK BOTTOMCOPPER BOTTOM
R.20 (8X)
7.875 ± 0.075
7.875 ± 0.075
1.91 (2X) 1.91 (2X)
0.61 (12X)
0.81 (12X)
R 2.54
The bottom solder mask thickness = 0.063 maximum
All dimensions are in millimeters
3.94
3.94
1.65 (2X)
3.99
3.99
3.30 (2X)
1.65 (2X)
3.30 (2X)
1.45 ± 0.10
1.955 ± 0.155
0.51 ± 0.05
8.385 ± 0.125
8.385 ± 0.125
Pin 1
Pin 2
Pin 3
Pin 7
Pin 8
Pin 6
Pin 5
Pin 4
DETAIL A
SEE DETAIL A
Note: pin 1 connects to ground
Pin 9
C1201
Figure 13. CX65105 8-Pin LCC Package Dimension Drawing
CX65105 Power Amplifier
10 Conexant 101476D
Proprietary Information and Specifications Are Subject to Change April 1, 2002
AB
A
B
B
A
1.75 ± 0.10
8˚ Max 5˚ Max
1.50 ± 0. 25
2.00 ± 0.10
4.00 ± 0.10
12.00 ± 0.10
16.00 +0.30/-0.10
7.50 ± 0.10
0.318 ± 0.013
8.89 ± 0.10 8.88 ± 0. 10 2.14 ± 0. 10
1.50± 0.10
Pin #1
Notes:
C1221
1. Carrier tape: black conductive polycarbonate.
2. Cover tape material: transparent conductive PSA.
3. All dimensions are in millimeters.
Figure 14. CX65105 8-Pin LCC Tape and Reel Dimensions
Power Amplifier CX65105
101476D Conexant 11
April 1, 2002 Proprietary Information and Specifications Are Subject to Change
Ordering Information
Model Name Ordering Part Number Evaluation Kit Part
Number
CX65105 1700-2200 MHz Linear Power
Amplifier
CX65105-11 TW10-D842
© 2001, 2002, Conexant Systems, Inc. All Rights Reserved.
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