MCC 250 MCD 250 ITRMS = 2x450 A ITAVM = 2x287 A VRRM = 800-1800 V Thyristor Modules Thyristor/Diode Modules VRSM VDSM VRRM VDRM V V 900 1300 1500 1700 1900 800 1200 1400 1600 1800 3 Type Version 1 Version 1 MCC MCC MCC MCC MCC MCD MCD MCD MCD MCD 250-08io1 250-12io1 250-14io1 250-16io1 250-18io1 Symbol Conditions ITRMS, IFRMS ITAVM, IFAVM TVJ = TVJM TC = 85C; 180 sine ITSM, IFSM TVJ = 45C VR = 0 i2dt (di/dt)cr 1 Maximum Ratings 450 287 A A t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 9000 9600 A A TVJ = TVJM VR = 0 t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 7800 8500 A A TVJ = 45C VR = 0 t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 405 000 380 000 A2s A2s TVJ = TVJM VR = 0 t = 10 ms (50 Hz), sine t = 8.3 ms (60 Hz), sine 304 000 300 000 A2s A2s TVJ = TVJM; repetitive, IT = 860 A f = 50 Hz; tP = 200 s VD = 2/3 VDRM 100 A/s IG = 1 A; diG/dt = 1 A/s 800 A/s 1000 V/s 120 60 W W 20 W non repetitive, IT = 290 A TVJ = TVJM; VDR = 2/3 VDRM RGK = ; method 1 (linear voltage rise) PGM TVJ = TVJM; IT = ITAVM; tP = 30 s tP = 500 s PGAV VRGM 10 V TVJ TVJM Tstg -40...+140 140 -40...+125 C C C 3000 3600 V~ V~ 50/60 Hz, RMS; IISOL 1 mA; t = 1 min t=1s Md Mounting torque (M5) Terminal connection torque (M8) Weight Typical including screws 5 4 250-08io1 250-12io1 250-14io1 250-16io1 250-18io1 (dv/dt)cr VISOL 7 6 2 2.5-5/22-44 Nm/lb.in. 12-15/106-132 Nm/lb.in. 320 g 3 6 7 1 5 4 2 3 1 5 4 2 MCC MCD Features * International standard package * Direct copper bonded Al2O3 -ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ * UL registered, E 72873 * Keyed gate/cathode twin pins Applications * Motor control * Power converter * Heat and temperature control for industrial furnaces and chemical processes * Lighting control * Contactless switches Advantages * Space and weight savings * Simple mounting * Improved temperature and power cycling * Reduced protection circuits IXYS reserves the right to change limits, test conditions and dimensions (c) 2004 IXYS All rights reserved 419 Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated. IXYS reserves the right to change limits, test conditions and dimensions 1-4 http://store.iiic.cc/ MCC 250 MCD 250 Symbol Conditions IRRM IDRM TVJ = TVJM; VR = VRRM; VD = VDRM VT, VF IT /IF = 600 A; TVJ = 25C 1.36 V VT0 rT For power-loss calculations only (TVJ = 140C) 0.85 0.82 V m VGT VD = 6 V; IGT VD = 6 V; 25C -40C 25C -40C 2 3 150 200 V V mA mA VGD IGD TVJ = TVJM; VD = 2/3 VDRM 0.25 10 V mA IL TVJ = 25C; tP = 30 s; VD = 6 V IG = 0.45 A; diG/dt = 0.45 A/s 200 mA IH TVJ = 25C; VD = 6 V; RGK = 150 mA tgd TVJ = 25C; VD = 1/2 VDRM IG = 1 A; diG /dt = 1 A/s 2 s tq TVJ = TVJM; IT = 300 A, tP = 200 s; -di/dt = 10 A/s VR = 100 V; dv/dt = 50 V/s; VD = 2/3 VDRM typ. 200 s QS IRM TVJ = 125C; IT /IF = 400 A, -di/dt = 50 A/s 760 275 C A RthJC per per per per 0.129 0.0645 0.169 0.0845 K/W K/W K/W K/W 12.7 9.6 50 mm mm m/s2 RthJK dS dA a Characteristic Values TVJ TVJ TVJ TVJ = = = = thyristor/diode; DC current module thyristor/diode; DC current module 70 40 other values see Fig. 8/9 Creepage distance on surface Strike distance through air Maximum allowable acceleration mA mA Fig. 1 Gate trigger characteristics Optional accessories for modules Keyed gate/cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red Type ZY 180L (L = Left for pin pair 4/5) UL 758, style 1385, Type ZY 180R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-1 Fig. 2 Gate trigger delay time Dimensions in mm (1 mm = 0.0394") MCC MCD Threaded spacer for higher Anode/ Cathode construction: Type ZY 250, material brass 20 12 419 14 IXYS reserves the right to change limits, test conditions and dimensions (c) 2004 IXYS All rights reserved 2-4 http://store.iiic.cc/ MCC 250 MCD 250 Fig. 3 Surge overload current ITSM, IFSM: Crest value, t: duration Fig. 4 i2dt versus time (1-10 ms) Fig. 4a Maximum forward current at case temperature Fig. 5 Power dissipation versus onstate current and ambient temperature (per thyristor or diode) IXYS reserves the right to change limits, test conditions and dimensions (c) 2004 IXYS All rights reserved 419 Fig. 6 Three phase rectifier bridge: Power dissipation versus direct output current and ambient temperature 3-4 http://store.iiic.cc/ MCC 250 MCD 250 Fig. 7 Three phase AC-controller: Power dissipation versus RMS output current and ambient temperature Fig. 8 Transient thermal impedance junction to case (per thyristor or diode) 0.15 30 DC K/W RthJC for various conduction angles d: ZthJC 0.10 0.05 d RthJC (K/W) DC 180C 120C 60C 30C 0.129 0.131 0.131 0.132 0.132 Constants for ZthJC calculation: i 0.00 10-3 10-2 10-1 100 101 102 s t Rthi (K/W) ti (s) 0.0035 0.0165 0.1091 0.099 0.168 0.456 Fig. 9 Transient thermal impedance junction to heatsink (per thyristor or diode) 0.20 K/W 30 DC ZthJK 1 2 3 RthJK for various conduction angles d: 0.15 0.10 d RthJK (K/W) DC 180C 120C 60C 30C 0.169 0.171 0.172 0.172 0.173 Constants for ZthJK calculation: 0.05 i 0.00 10-3 10-2 10-1 100 101 s 102 ti (s) 0.0033 0.0159 0.1053 0.04 0.099 0.168 0.456 1.36 419 t 1 2 3 4 Rthi (K/W) IXYS reserves the right to change limits, test conditions and dimensions (c) 2004 IXYS All rights reserved 4-4 http://store.iiic.cc/