
CM1000DUC-34NF
Mega Power Dual IGBTMOD™
1000 Amperes/1700 Volts
307/11 Rev. 2
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
Electrical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V – – 1 mA
Gate Leakage Current IGES VGE = VGES, VCE = 0V – – 5 µA
Gate-Emitter Threshold Voltage VGE(th) IC = 100mA, VCE = 10V 6 7 8 Volts
Collector-Emitter Saturation Voltage (Chip) VCE(sat) IC = 1000A, VGE = 15V, Tj = 25°C*5 – 2.2 2.85 Volts
(Without Lead Resistance) IC = 1000A, VGE = 15V, Tj = 125°C*5 – 2.45 – Volts
Input Capacitance Cies – – 220 nF
Output Capacitance Coes VCE = 10V, VGE = 0V – – 25 nF
Reverse Transfer Capacitance Cres – – 4.7 nF
Total Gate Charge QG VCC = 1000V, IC = 1000A, VGE = 15V – 6000 – nC
Inductive Turn-on Delay Time td(on) VCC = 1000V, IC = 1000A, – – 600 ns
Load Rise Time tr VGE1 = VGE2 = 15V, – – 200 ns
Switch Turn-off Delay Time td(off) RG = 0.47Ω, Inductive Load – – 1000 ns
Times Fall Time tf Switching Operation – – 300 ns
Emitter-Collector Voltage (Chip) VEC*1 IE = 1000A, VGE = 0V*5 – 2.3 3 Volts
(Without Lead resistance)
Reverse Recovery Time trr*1 VCC = 1000V, IE = 1000A, VGE = ±15V, – – 500 ns
Reverse Recovery Charge Qrr*1 RG = 0.47Ω, Inductive Load – 90 – µC
Turn-on Switching Energy Per Pulse Eon VCC = 1000V, IC = IE = 1000A, – 272.4 – mJ
Turn-off Switching Energy Per Pulse Eoff VGE = 15V, RG = 0.47Ω, – 250.2 – mJ
Reverse Recovery Energy Per Pulse Err*1 Tj = 125°C, Inductive Load – 172.4 – mJ
Internal Lead Resistance R(lead) Main Terminals-Chip, Per Switch, – 0.286 – mΩ
Tj = 25°C*2
Internal Gate Resistance rg Per Switch – 0.67 – Ω
Thermal and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case*2 Rth(j-c)Q Per IGBT – – 0.014 °C/W
Thermal Resistance, Junction to Case*2 Rth(j-c)D Per Clamp Diode – – 0.023 °C/W
Contact Thermal Resistance, Rth(c-f) Per 1/2 Module – 0.012 – °C/W
Case to Heatsink*2 Thermal Grease Applied*6
Recommended Operating Conditions, Ta = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
DC Supply Voltage Rth(j-c)Q VCC Applied Across C1-E2 – 1000 1100 Volts
Gate (-Emitter Drive) Voltage VGE(on) Applied Across G1-Es1/G2-Es2 13.5 15.0 16.5 Volts
External Gate Resistance RG Per Switch 0.47 – 4.7 Ω
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) measured point is just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*6 Typical value is measured by using thermally conductive grease of λ = 0.9 W/(m•K).