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D1
G2
S2
G1
S1
Pin 1
D2 D2
D1
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
POWERDI®
Product Summary
V(BR)DSS
ID max
TA = +25°C
20V
10.7A
9.3A
8.6A
Description
This new generation MOSFET has been designed to minimize the on-
state resistance (RDS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
Power Management Functions
Load Switch
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Complementary Pair MOSFET
ESD Protected Up to 2kV
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: POWERDI®3333-8
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish Matte Tin Annealed over Copper Leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.0065 grams (Approximate)
Ordering Information (Note 4)
Part Number
Case
Packaging
DMN2022UNS-7
POWERDI®3333-8
2000/Tape & Reel
DMN2022UNS-13
POWERDI®3333-8
3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Internal Schematic
ESD PROTECTED
Bottom View
POWERDI®3333-8
S23 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 15 = 2015)
WW = Week Code (01 to 53)
S23
YYWW
D1
S1
G1
Gate Protection
Diode
D2
S2
G2
Gate Protection
Diode
Top View
e3
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DMN2022UNS
Document number: DS38050 Rev. 2 - 2
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November 2015
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Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
20
V
Gate-Source Voltage
VGSS
±10
V
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
TA = +25°C
TA = +70°C
ID
10.7
8.6
A
t<10s
TA = +25°C
TA = +70°C
ID
13.9
11.1
A
Maximum Body Diode Forward Current (Note 6)
IS
2
A
Pulsed Drain Current (10s pulse, Duty cycle = 1%)
IDM
60
A
Avalanche Current (Note 7) L = 0.1mH
IAS
A
Avalanche Energy (Note 7) L = 0.1mH
EAS
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
1.2
W
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RJA
107
°C/W
t<10s
64
Total Power Dissipation (Note 6)
PD
1.9
W
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RJA
67
°C/W
t<10s
40
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BVDSS
20
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
1
µA
VDS = 20V, VGS = 0V
Gate-Source Leakage
IGSS
±10
µA
VGS = ±10V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
VGS(TH)
0.4
1
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS(ON)
9.0
10.8
mΩ
VGS = 4.5V, ID = 4A
9.2
11.2
VGS = 4.0V, ID = 4A
9.8
13.0
VGS = 3.1V, ID = 4A
10.5
14.5
VGS = 2.5V, ID = 4A
13.9
17.0
VGS = 1.8V, ID = 4A
Diode Forward Voltage
VSD
0.7
1.1
V
VGS = 0V, IS = 5A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Ciss
1870
pF
VDS = 10V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
320
pF
Reverse Transfer Capacitance
Crss
160
pF
Gate Resistance
Rg
96
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
20.3
nC
VGS = 4.5V, VDS = 10V,
ID = 6.5A
Gate-Source Charge
Qgs
2.8
nC
Gate-Drain Charge
Qgd
3.6
nC
Turn-On Delay Time
tD(ON)
62
ns
VGS = 4.5V, VDS = 10V,
RG = 6Ω, RL = 1.0Ω
Turn-On Rise Time
tR
101
ns
Turn-Off Delay Time
tD(OFF)
596
ns
Turn-Off Fall Time
tF
224
ns
Reverse Recovery Time
tRR
150
ns
IF = 4A, di/dt = 100A/μs
Reverse Recovery Charge
QRR
135
nC
IF = 4A, di/dt = 100A/μs
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
7. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = +25°C .
8 .Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
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0.0
5.0
10.0
15.0
20.0
25.0
30.0
0 0.5 1 1.5 2 2.5 3
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 1. Typical Output Characteristic
VGS = 1.0V
VGS = 1.2V
VGS = 1.5V
VGS = 10.0V
VGS = 4.0V
VGS=3.1V
VGS = 3.7V
VGS = 4.5V
VGS=1.8V
VGS=2.0V
VGS=2.5V
0
0.005
0.01
0.015
0.02
0.025
0 5 10 15 20 25 30
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ID, DRAIN-SOURCE CURRENT (A)
Figure 3. Typical On-Resistance vs. Drain Current and
Gate Voltage
VGS = 4.5V
VGS = 4.0V
VGS = 3.1V
VGS = 2.5V
VGS = 1.8V
0
0.01
0.02
0.03
0.04
0.05
0 2 4 6 8 10
RDS(ON), DRAIN-SOURCE On-RESISTANCE (Ω)
VGS, GATE-SOURCE VOLTAGE (V)
Figure 4. Typical Transfer Characteristic
ID = 4.0A
0
0.005
0.01
0.015
0.02
0 5 10 15 20
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
ID, DRAIN CURRENT (A)
Figure 5. Typical On-Resistance vs. Drain Current and
Junction Temperature
-55
25
85
150
125
VGS = 4.5V
0
0.5
1
1.5
2
2.5
-50 -25 025 50 75 100 125 150
RDS(ON), DRAIN-SOURCE ON-RESISTANCE
(NORMALIZED)
TJ, JUNCTION TEMPERATURE ()
Figure 6. On-Resistance Variation with Junction
Temperature
VGS = 4.5V, ID = 4A
VGS = 3.1V, ID = 4A
0
2
4
6
8
10
12
14
16
18
20
0 0.5 1 1.5 2 2.5
ID, DRAIN CURRENT (A)
VGS, GATE-SOURCE VOLTAGE (V)
Figure 2. Typical Transfer Characteristic
VDS = 5V
-55
25
85
125
150
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0
0.005
0.01
0.015
0.02
0.025
0.03
-50 -25 025 50 75 100 125 150
RDS(ON), DRAIN-SOURCE ON-RESISTANCE (Ω)
TJ, JUNCTION TEMPERATURE ()
Figure 7. On-Resistance Variation with Junction
Temperature
VGS = 4.5V, ID = 4A
VGS = 3.1V, ID = 4A
0
5
10
15
20
0 0.3 0.6 0.9 1.2 1.5
IS, SOURCE CURRENT (A)
VSD, SOURCE-DRAIN VOLTAGE (V)
Figure 9. Diode Forward Voltage vs. Current
TJ= 125oCTJ= 85oC
TJ= 25oC
TJ= -55oC
VGS = 0V
TJ= 150oC
0
2
4
6
8
10
0 5 10 15 20 25 30 35 40 45 50
VGS (V)
Qg(nC)
Figure 10. Gate Charge
VDS = 10V, ID = 6.5A
0.01
0.1
1
10
100
0.01 0.1 1 10 100
ID, DRAIN CURRENT (A)
VDS, DRAIN-SOURCE VOLTAGE (V)
Figure 11. SOA, Safe Operation Area
PW=10s
PW=10ms
PW=100µs
DC
RDS(ON) Limited
PW=1ms
PW=100ms
TJ(Max) = 150TC = 25
Single Pulse
DUT on 1*MRP Board
VGS= 10V
PW=1s
0
0.2
0.4
0.6
0.8
1
1.2
-50 -25 025 50 75 100 125 150
VGS(TH), GATE THRESHOLD VOLTAGE (V)
TJ, JUNCTION TEMPERATURE ()
Figure 8. Gate Threshold Variation vs. Junction
Temperature
ID = 250μA
ID = 1mA
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0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10 100 1000
r(t), TRANSIENT THERMAL RESISTANCE
t1, PULSE DURATION TIME (sec)
Figure 12. Transient Thermal Resistance
RθJA(t) = r(t) * RθJA
RθJA = 114/W
Duty Cycle, D = t1 / t2
D=Single Pulse
D=0.005
D=0.01
D=0.02
D=0.05
D=0.1
D=0.3
D=0.5
D=0.9
D=0.7
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
POWERDI®3333-8 (Type UXB)
POWERDI®3333-8
(Type UXB)
Dim
Min
Max
Typ
A
0.75
0.85
0.80
A1
0.00
0.05
--
b
0.25
0.40
0.32
c
0.10
0.25
0.15
D
3.20
3.40
3.30
D1
2.95
3.15
3.05
D2
0.10
0.35
0.23
E
3.20
3.40
3.30
E1
2.95
3.15
3.05
E2
0.10
0.30
0.20
e


0.65
L
0.35
0.55
0.45
a
0°
12°
10°
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
POWERDI®3333-8 (Type UXB)
D
EE1
D1
A
c
L
L
E2
b
e
D2
A1
a
Dimensions
Value (in mm)
C
0.650
X
0.420
X1
2.370
Y
0.730
Y1
3.500
X1
Y1
Y
CX
Y
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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