DAC081S101CIMKX/NOPB - NATIONAL SEMICONDUCTOR

DAC081S101

DAC081S101 8-Bit Micro Power Digital-to-Analog Converter with Rail-to-Rail

Output

Literature Number: SNAS323B

December 11, 2008

DAC081S101

8-Bit Micro Power Digital-to-Analog Converter with Rail-to-

Rail Output

General Description

The DAC081S101 is a full-featured, general purpose 8-bit

voltage-output digital-to-analog converter (DAC) that can op-

erate from a single +2.7V to 5.5V supply and consumes just

175 µA of current at 3.6 Volts. The on-chip output amplifier

allows rail-to-rail output swing and the three wire serial inter-

face operates at clock rates up to 30 MHz over the specified

supply voltage range and is compatible with standard SPI™,

QSPI, MICROWIRE and DSP interfaces. Competitive de-

vices are limited to 20 MHz clock rates at supply voltages in

the 2.7V to 3.6V range.

The supply voltage for the DAC081S101 serves as its voltage

reference, providing the widest possible output dynamic

range. A power-on reset circuit ensures that the DAC output

powers up to zero volts and remains there until there is a valid

write to the device. A power-down feature reduces power

consumption to less than a microWatt.

The low power consumption and small packages of the

DAC081S101 make it an excellent choice for use in battery

operated equipment.

The DAC081S101 is a direct replacement for the AD5300 and

is one of a family of pin compatible DACs, including the 10-

bit DAC101S101 and the 12-bit DAC121S101. The

DAC081S101 operates over the extended industrial temper-

ature range of −40°C to +105°C.

Features

■Guaranteed Monotonicity

■Low Power Operation

■Rail-to-Rail Voltage Output

■Power-on Reset to Zero Volts Output

■SYNC Interrupt Facility

■Wide power supply range (+2.7V to +5.5V)

■Small Packages

■Power Down Feature

Key Specifications

■Resolution 8 bits

■DNL +0.04, -0.02 LSB (typ)

■Output Settling Time 3 µs (typ)

■Zero Code Error 3.8 mV (typ)

■Full-Scale Error −0.07 %FS (typ)

■Power Consumption

■—Normal Mode 0.63 mW (3.6V) / 1.41 mW (5.5V) typ

—Pwr Down

Mode

0.14 µW (3.6V) / 0.33 µW (5.5V) typ

Applications

■Battery-Powered Instruments

■Digital Gain and Offset Adjustment

■Programmable Voltage & Current Sources

■Programmable Attenuators

Pin Configuration

20155101 20155102

Ordering Information

Order Numbers Temperature Range Package Top Mark

DAC081S101CIMM −40°C ≤ TA ≤ +105°C MSOP X64C

DAC081S101CIMMX −40°C ≤ TA ≤ +105°C MSOP Tape-and-Reel X64C

DAC081S101CIMK −40°C ≤ TA ≤ +105°C TSOT X65C

DAC081S101CIMKX −40°C ≤ TA ≤ +105°C TSOT Tape-and-Reel X65C

DAC081S101EVAL Evaluation Board

SPI™ is a trademark of Motorola, Inc.

DAC081S101 8-Bit Micro Power Digital-to-Analog Converter with Rail-to-Rail Output

Block Diagram

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Pin Descriptions

TSOT

(SOT-23)

Pin No.

MSOP

Pin No. Symbol Description

1 4 VOUT DAC Analog Output Voltage.

2 8 GND Ground reference for all on-chip circuitry.

3 1 VAPower supply and Reference input. Should be decoupled to GND.

4 7 DIN

Serial Data Input. Data is clocked into the 16-bit shift register on the falling

edges of SCLK after the fall of SYNC.

5 6 SCLK Serial Clock Input. Data is clocked into the input shift register on the falling

edges of this pin.

6 5 SYNC

Frame synchronization input for the data input. When this pin goes low,

it enables the input shift register and data is transferred on the falling

edges of SCLK. The DAC is updated on the 16th clock cycle unless

SYNC is brought high before the 16th clock, in which case the rising edge

of SYNC acts as an interrupt and the write sequence is ignored by the

DAC.

2, 3 NC No Connect. There is no internal connection to these pins.

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DAC081S101

Absolute Maximum Ratings

(Notes 1, 2)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage, VA6.5V

Voltage on any Input Pin −0.3V to (VA + 0.3V)

Input Current at Any Pin (Note 3) 10 mA

Package Input Current (Note 3) 20 mA

Power Consumption at TA = 25°C See (Note 4)

ESD Susceptibility (Note 5)

Human Body Model

Machine Model

2500V

250V

Soldering Temperature, Infrared,

10 Seconds (Note 6) 235°C

Storage Temperature −65°C to +150°C

Operating Ratings (Notes 1, 2)

Operating Temperature Range −40°C ≤ TA ≤ +105°C

Supply Voltage, VA+2.7V to 5.5V

Any Input Voltage (Note 7) −0.1 V to (VA + 0.1 V)

Output Load 0 to 1500 pF

SCLK Frequency Up to 30 MHz

Package Thermal Resistances

Package θJA

8-Lead MSOP 240°C/W

6-Lead TSOT 250°C/W

Electrical Characteristics

Values shown in this table are design targets and are subject to change before product release.

The following specifications apply for VA = +2.7V to +5.5V, RL = 2kΩ to GND, CL = 200 pF to GND, fSCLK = 30 MHz, input code

range 4 to 251. Boldface limits apply for TMIN ≤ TA ≤ TMAX: all other limits TA = 25°C, unless otherwise specified.

Symbol Parameter Conditions Typical

(Note 9)

Limits

(Note 9)

Units

(Limits)

STATIC PERFORMANCE

Resolution 8Bits (min)

Monotonicity 8Bits (min)

INL Integral Non-Linearity +0.16 +0.75 LSB (max)

−0.12 −0.75 LSB (min)

DNL Differential Non-Linearity +0.04 +0.1 LSB (max)

−0.02 −0.1 LSB (min)

ZE Zero Code Error IOUT = 0 +3.8 +15 mV (max)

FSE Full-Scale Error IOUT = 0 −0.07 −1.0 %FSR (max)

GE Gain Error All ones Loaded to DAC register −0.10 ±1.0 %FSR (max)

ZCED Zero Code Error Drift −20 µV/°C

TC GE Gain Error Tempco VA = 3V −0.7 ppm/°C

VA = 5V −1.0 ppm/°C

OUTPUT CHARACTERISTICS

Output Voltage Range (Note 10) 0

V (min)

V (max)

ZCO Zero Code Output

VA = 3V, IOUT = 10 µA 2.0 mV

VA = 3V, IOUT = 100 µA 5.0 mV

VA = 5V, IOUT = 10 µA 3.0 mV

VA = 5V, IOUT = 100 µA 5.4 mV

FSO Full Scale Output

VA = 3V, IOUT = 10 µA 2.986 V

VA = 3V, IOUT = 100 µA 2.976 V

VA = 5V, IOUT = 10 µA 4.976 V

VA = 5V, IOUT = 100 µA 4.970 V

Maximum Load Capacitance RL = ∞1500 pF

RL = 2kΩ1500 pF

DC Output Impedance 1.3 Ohm

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DAC081S101

Symbol Parameter Conditions Typical

(Note 9)

Limits

(Note 9)

Units

(Limits)

IOS Output Short Circuit Current

VA = 5V, VOUT = 0V,

Input code = FFh −63 mA

VA = 3V, VOUT = 0V,

Input code = FFh −50 mA

VA = 5V, VOUT = 5V,

Input code = 00h 74 mA

VA = 3V, VOUT = 3V,

Input code = 00h 53 mA

LOGIC INPUT

IIN Input Current (Note 10) ±1 µA (max)

VIL Input Low Voltage (Note 10) VA = 5V 0.8 V (max)

VA = 3V 0.5 V (max)

VIH Input High Voltage (Note 10) VA = 5V 2.4 V (min)

VA = 3V 2.1 V (min)

CIN Input Capacitance (Note 10) 3pF (max)

POWER REQUIREMENTS

IASupply Current (output unloaded)

Normal Mode

fSCLK = 30 MHz

VA = 5.5V 256 328 µA (max)

VA = 3.6V 174 224 µA (max)

Normal Mode

fSCLK = 20 MHz

VA = 5.5V 221 294 µA (max)

VA = 3.6V 154 200 µA (max)

Normal Mode

fSCLK = 0

VA = 5.0V 142 µA (max)

VA = 3.0V 107 µA (max)

All PD Modes,

fSCLK = 30 MHz

VA = 5.0V 83 µA (max)

VA = 3.0V 42 µA (max)

All PD Modes,

fSCLK = 20 MHz

VA = 5.0V 56 µA (max)

VA = 3.0V 28 µA (max)

All PD Modes,

fSCLK = 0 (Note 10)

VA = 5.5V 0.06 1.0 µA (max)

VA = 3.6V 0.04 1.0 µA (max)

Power Consumption (output

unloaded)

Normal Mode

fSCLK = 30 MHz

VA = 5.5V 1.41 1.80 mW (max)

VA = 3.6V 0.63 0.81 mW (max)

Normal Mode

fSCLK = 20 MHz

VA = 5.5V 1.22 1.62 mW (max)

VA = 3.6V 0.55 0.72 mW (max)

Normal Mode

fSCLK = 0

VA = 5.0V 0.71 µW (max)

VA = 3.0V 0.32 µW (max)

All PD Modes,

fSCLK = 30 MHz

VA = 5.0V 0.42 µW (max)

VA = 3.0V 0.13 µW (max)

All PD Modes,

fSCLK = 20 MHz

VA = 5.0V 0.28 µW (max)

VA = 3.0V 0.08 µW (max)

All PD Modes,

fSCLK = 0 (Note 10)

VA = 5.5V 0.33 5.5 µW (max)

VA = 3.6V 0.14 3.6 µW (max)

IOUT / IAPower Efficiency ILOAD = 2mA VA = 5V 91 %

VA = 3V 94 %

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DAC081S101

A.C. and Timing Characteristics

Values shown in this table are design targets and are subject to change before product release.

The following specifications apply for VA = +2.7V to +5.5V, RL = 2kΩ to GND, CL = 200 pF to GND, fSCLK = 30 MHz, input code

range 4 to 251. Boldface limits apply for TMIN ≤ TA ≤ TMAX: all other limits TA = 25°C, unless otherwise specified.

Symbol Parameter Conductions Typical Limits Units

(Limits)

fSCLK SCLK Frequency 30 MHz (max)

Output Voltage Settling Time

(Note 10)

40h to C0h code

change, RL = 2kΩCL ≤ 200 pF 35µs (max)

SR Output Slew Rate 1 V/µs

Glitch Impulse Code change from 80h to 7Fh 12 nV-sec

Digital Feedthrough 0.5 nV-sec

tWU Wake-Up Time VA = 5V 6 µs

VA = 3V 39 µs

1/fSCLK SCLK Cycle Time 33 ns (min)

tHSCLK High time 5 13 ns (min)

tLSCLK Low Time 5 13 ns (min)

tSUCL

Set-up Time SYNC to SCLK Rising

Edge −15 0ns (min)

tSUD Data Set-Up Time 2.5 5ns (min)

tDHD Data Hold Time 2.5 4.5 ns (min)

tCS SCLK fall to rise of SYNC VA = 5V 03ns (min)

VA = 3V −2 1ns (min)

tSYNC SYNC High Time 2.7 ≤ VA ≤ 3.6 920 ns (min)

3.6 ≤ VA ≤ 5.5 510 ns (min)

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is

functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed

specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test

conditions.

Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified

Note 3: When the input voltage at any pin exceeds the power supplies (that is, less than GND, or greater than VA), the current at that pin should be limited to 10

mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two.

Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the

junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values

for maximum power dissipation will be reached only when the device is operated in a severe fault condition (e.g., when input or output pins are driven beyond

the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.

Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through ZERO Ohms.

Note 6: See the section entitled "Surface Mount" found in any post 1986 National Semiconductor Linear Data Book for methods of soldering surface mount

devices.

Note 7: The analog inputs are protected as shown below. Input voltage magnitudes up to VA + 300 mV or to 300 mV below GND will not damage this device.

However, errors in the conversion result can occur if any input goes above VA or below GND by more than 100 mV. For example, if VA is 2.7VDC, ensure that

−100mV ≤ input voltages ≤2.8VDC to ensure accurate conversions.

20155104

Note 8: To guarantee accuracy, it is required that VA be well bypassed.

Note 9: Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are guaranteed to National's AOQL (Average Outgoing Quality

Level).

Note 10: This parameter is guaranteed by design and/or characterization and is not tested in production.

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DAC081S101

Specification Definitions

DIFFERENTIAL NON-LINEARITY (DNL) is the measure of

the maximum deviation from the ideal step size of 1 LSB,

which is VREF / 256 = VA / 256.

DIGITAL FEEDTHROUGH is a measure of the energy inject-

ed into the analog output of the DAC from the digital inputs

when the DAC outputs are not updated. It is measured with a

full-scale code change on the data bus.

FULL-SCALE ERROR is the difference between the actual

output voltage with a full scale code (FFh) loaded into the DAC

and the value of VA x 255 / 256.

GAIN ERROR is the deviation from the ideal slope of the

transfer function. It can be calculated from Zero and Full-

Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE

is Full-Scale Error and ZE is Zero Error.

GLITCH IMPULSE is the energy injected into the analog out-

put when the input code to the DAC register changes. It is

specified as the area of the glitch in nanovolt-seconds.

INTEGRAL NON-LINEARITY (INL) is a measure of the de-

viation of each individual code from a straight line through the

input to output transfer function. The deviation of any given

code from this straight line is measured from the center of that

code value. The end point method is used. INL for this product

is specified over a limited range, per the Electrical Tables.

LEAST SIGNIFICANT BIT (LSB) is the bit that has the small-

est value or weight of all bits in a word. This value is

LSB = VREF / 2n

where VREF is the supply voltage for this product, and "n" is

the DAC resolution in bits, which is 8 for the DAC081S101.

MAXIMUM LOAD CAPACITANCE is the maximum capaci-

tance that can be driven by the DAC with output stability

maintained.

MONOTONICITY is the condition of being monotonic, where

the DAC has an output that never decreases when the output

code increases.

MOST SIGNIFICANT BIT (MSB) is the bit that has the largest

value or weight of all bits in a word. Its value is 1/2 of VA.

POWER EFFICIENCY is the ratio of the output current to the

total supply current. The output current comes from the power

supply. The difference between the supply and output cur-

rents, is the power consumed by the device without a load.

SETTLING TIME is the time for the output to settle within 1/2

LSB of the final value after the input code is updated.

WAKE-UP TIME is the time for the output to settle to within

1/2 LSB of the final value after the device is commanded to

the active mode from any of the power down modes.

ZERO CODE ERROR is the output error, or voltage, present

at the DAC output after a code of 00h has been entered.

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DAC081S101

Transfer Characteristic

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FIGURE 1. Input / Output Transfer Characteristic

Timing Diagram

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FIGURE 2. DAC081S101 Timing

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DAC081S101

Typical Performance Characteristics fSCLK = 30 MHz, TA = 25C, Input Code Range 4 to 251, unless

otherwise stated

DNL at VA = 3.0V

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DNL at VA = 5.0V

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INL at VA = 3.0V

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INL at VA = 5.0V

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TUE at VA = 3.0V

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TUE at VA = 5.0V

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DAC081S101

DNL vs. VA

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INL vs. VA

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3V DNL vs. fSCLK

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5V DNL vs. fSCLK

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3V DNL vs. Clock Duty Cycle

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5V DNL vs. Clock Duty Cycle

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DAC081S101

3V DNL vs. Temperature

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5V DNL vs. Temperature

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3V INL vs. fSCLK

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5V INL vs. fSCLK

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3V INL vs. Clock Duty Cycle

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5V INL vs. Clock Duty Cycle

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DAC081S101

3V INL vs. Temperature

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5V INL vs. Temperature

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Zero Code Error vs. fSCLK

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Zero Code Error vs. Clock Duty Cycle

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Zero Code Error vs. Temperature

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Full-Scale Error vs. fSCLK

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DAC081S101

Full-Scale Error vs. Clock Duty Cycle

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Full-Scale Error vs. Temperature

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Supply Current vs. VA

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Supply Current vs. Temperature

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5V Glitch Response

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Power-On Reset

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DAC081S101

3V Wake-Up Time

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5V Wake-Up Time

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DAC081S101

1.0 Functional Description

1.1 DAC SECTION

The DAC081S101 is fabricated on a CMOS process with an

architecture that consists of switches and a resistor string that

are followed by an output buffer. The power supply serves as

the reference voltage. The input coding is straight binary with

an ideal output voltage of:

VOUT = VA x (D / 256)

where D is the decimal equivalent of the binary code that is

loaded into the DAC register and can take on any value be-

tween 0 and 255.

1.2 RESISTOR STRING

The resistor string is shown in Figure 3. This string consists

of 4096 equal valued resistors with a switch at each junction

of two resistors, plus a switch to ground. The code loaded into

the DAC register determines which switch is closed, connect-

ing the proper node to the amplifier. This configuration guar-

antees that the DAC is monotonic.

20155107

FIGURE 3. DAC Resistor String

1.3 OUTPUT AMPLIFIER

The output buffer amplifier is a rail-to-rail type, providing an

output voltage range of 0V to VA. All amplifiers, even rail-to-

rail types, exhibit a loss of linearity as the output approaches

the supply rails (0V and VA, in this case). For this reason,

linearity is specified over less than the full output range of the

DAC. The output capabilities of the amplifier are described in

the Electrical Tables.

1.4 SERIAL INTERFACE

The three-wire interface is compatible with SPI, QSPI and

MICROWIRE as well as most DSPs. See the Timing Diagram

for information on a write sequence.

A write sequence begins by bringing the SYNC line low. Once

SYNC is low, the data on the DIN line is clocked into the 16-

bit serial input register on the falling edges of SCLK. On the

16th falling clock edge, the last data bit is clocked in and the

programmed function (a change in the mode of operation and/

or a change in the DAC register contents) is executed. At this

point the SYNC line may be kept low or brought high. In either

case, it must be brought high for the minimum specified time

before the next write sequence as a falling edge of SYNC is

used to initiate the next write cycle.

Since the SYNC and DIN buffers draw more current when they

are high, they should be idled low between write sequences

to minimize power consumption.

1.5 INPUT SHIFT REGISTER

The input shift register, Figure 4, has sixteen bits. The first

two bits are "don't cares" and are followed by two bits that

determine the mode of operation (normal mode or one of

three power-down modes). The contents of the serial input

falling edge of SCLK. See Timing Diagram, Figure 2.

20155108

FIGURE 4. Input Register Contents

Normally, the SYNC line is kept low for at least 16 falling

edges of SCLK and the DAC is updated on the 16th SCLK

falling edge. However, if SYNC is brought high before the 16th

falling edge, the shift register is reset and the write sequence

is invalid. The DAC register is not updated and there is no

change in the mode of operation or in the output voltage.

1.6 POWER-ON RESET

The power-on reset circuit controls the output voltage during

power-up. Upon application of power the DAC register is filled

with zeros and the output voltage is 0 Volts and remains there

until a valid write sequence is made to the DAC.

1.7 POWER-DOWN MODES

The DAC081S101 has four modes of operation. These

modes are set with two bits (DB13 and DB12) in the control

TABLE 1. Modes of Operation

DB13 DB12 Operating Mode

0 0 Normal Operation

0 1 Power-Down with 1kΩ to GND

1 0 Power-Down with 100kΩ to GND

1 1 Power-Down with Hi-Z

When both DB13 and DB12 are 0, the device operates nor-

mally. For the other three possible combinations of these bits

the supply current drops to its power-down level and the out-

put is pulled down with either a 1kΩ or a 100KΩ resistor, or

is in a high impedance state, as described in Table 1.

The bias generator, output amplifier, the resistor string and

other linear circuitry are all shut down in any of the power-

down modes. However, the contents of the DAC register are

unaffected when in power-down, so when coming out of pow-

er down the output voltage returns to the same voltage it was

before entering power down. Minimum power consumption is

achieved in the power-down mode with SCLK disabled and

SYNC and DIN idled low. The time to exit power-down (Wake-

Up Time) is typically tWU µsec as stated in the A.C. and Timing

Characteristics Table.

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DAC081S101

2.0 Applications Information

The simplicity of the DAC081S101 implies ease of use. How-

ever, it is important to recognize that any data converter that

utilizes its supply voltage as its reference voltage will have

essentially zero PSRR (Power Supply Rejection Ratio).

Therefore, it is necessary to provide a noise-free supply volt-

age to the device.

2.1 DSP/MICROPROCESSOR INTERFACING

Interfacing the DAC081S101 to microprocessors and DSPs

is quite simple. The following guidelines are offered to hasten

the design process.

2.1.1 ADSP-2101/ADSP2103 Interfacing

Figure 5 shows a serial interface between the DAC081S101

and the ADSP-2101/ADSP2103. The DSP should be set to

operate in the SPORT Transmit Alternate Framing Mode. It is

programmed through the SPORT control register and should

be configured for Internal Clock Operation, Active Low Fram-

ing and 16-bit Word Length. Transmission is started by writing

a word to the Tx register after the SPORT mode has been

enabled.

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FIGURE 5. ADSP-2101/2103 Interface

2.1.2 80C51/80L51 Interface

A serial interface between the DAC081S101 and the

80C51/80L51 microcontroller is shown in Figure 6. The

SYNC signal comes from a bit-programmable pin on the mi-

crocontroller. The example shown here uses port line P3.3.

This line is taken low when data is to transmitted to the

DAC081S101. Since the 80C51/80L51 transmits 8-bit bytes,

only eight falling clock edges occur in the transmit cycle. To

load data into the DAC, the P3.3 line must be left low after the

first eight bits are transmitted. A second write cycle is initiated

to transmit the second byte of data, after which port line P3.3

is brought high. The 80C51/80L51 transmit routine must rec-

ognize that the 80C51/80L51 transmits data with the LSB first

while the DAC081S101 requires data with the MSB first.

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FIGURE 6. 80C51/80L51 Interface

2.1.3 68HC11 Interface

A serial interface between the DAC081S101 and the 68HC11

microcontroller is shown in Figure 7. The SYNC line of the

DAC081S101 is driven from a port line (PC7 in the figure),

similar to the 80C51/80L51.

The 68HC11 should be configured with its CPOL bit as a zero

and its CPHA bit as a one. This configuration causes data on

the MOSI output to be valid on the falling edge of SCLK. PC7

is taken low to transmit data to the DAC. The 68HC11 trans-

mits data in 8-bit bytes with eight falling clock edges. Data is

transmitted with the MSB first. PC7 must remain low after the

first eight bits are transferred. A second write cycle is initiated

to transmit the second byte of data to the DAC, after which

PC7 should be raised to end the write sequence.

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FIGURE 7. 68HC11 Interface

2.1.4 Microwire Interface

Figure 8 shows an interface between a Microwire compatible

device and the DAC081S101. Data is clocked out on the rising

edges of the SCLK signal.

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FIGURE 8. Microwire Interface

2.2 USING REFERENCES AS POWER SUPPLIES

Recall the need for a quiet supply source for devices that use

their power supply voltage as a reference voltage.

Since the DAC081S101 consumes very little power, a refer-

ence source may be used as the supply voltage. The advan-

tages of using a reference source over a voltage regulator are

accuracy and stability. Some low noise regulators can also be

used for the power supply of the DAC081S101. Listed below

are a few power supply options for the DAC081S101.

2.2.1 LM4130

The LM4130 reference, with its 0.05% accuracy over tem-

perature, is a good choice as a power source for the

DAC081S101. Its primary disadvantage is the lack of 3V and

5V versions. However, the 4.096V version is useful if a 0 to

4.095V output range is desirable or acceptable. Bypassing

the LM4130 VIN pin with a 0.1µF capacitor and the VOUT pin

with a 2.2µF capacitor will improve stability and reduce output

noise. The LM4130 comes in a space-saving 5-pin SOT23.

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FIGURE 9. The LM4130 as a power supply

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DAC081S101

2.2.2 LM4050

Available with accuracy of 0.44%, the LM4050 shunt refer-

ence is also a good choice as a power regulator for the

DAC081S101. It does not come in a 3 Volt version, but 4.096V

and 5V versions are available. It comes in a space-saving 3-

pin SOT23.

20155114

FIGURE 10. The LM4050 as a power supply

The minimum resistor value in the circuit of Figure 10 should

be chosen such that the maximum current through the

LM4050 does not exceed its 15 mA rating. The conditions for

maximum current include the input voltage at its maximum,

the LM4050 voltage at its minimum, the resistor value at its

minimum due to tolerance, and the DAC081S101 draws zero

current. The maximum resistor value must allow the LM4050

to draw more than its minimum current for regulation plus the

maximum DAC081S101 current in full operation. The condi-

tions for minimum current include the input voltage at its

minimum, the LM4050 voltage at its maximum, the resistor

value at its maximum due to tolerance, and the DAC081S101

draws its maximum current. These conditions can be sum-

marized as

R(min) = ( VIN(max) − VZ(min) / (IA(min) + IZ(max))

and

R(max) = ( VIN(min) − VZ(max) / (IA(max) + IZ(min) )

where VZ(min) and VZ(max) are the nominal LM4050 output

voltages ± the LM4050 output tolerance over temperature, IZ

(max) is the maximum allowable current through the LM4050,

IZ(min) is the minimum current required by the LM4050 for

proper regulation, IA(max) is the maximum DAC081S101 sup-

ply current, and IA(min) is the minimum DAC081S101 supply

current.

2.2.3 LP3985

The LP3985 is a low noise, ultra low dropout voltage regulator

with a 3% accuracy over temperature. It is a good choice for

applications that do not require a precision reference for the

DAC081S101. It comes in 3.0V, 3.3V and 5V versions, among

others, and sports a low 30 µV noise specification at low fre-

quencies. Since low frequency noise is relatively difficult to

filter, this specification could be important for some applica-

tions. The LP3985 comes in a space-saving 5-pin SOT23 and

5-bump micro SMD packages.

20155115

FIGURE 11. Using the LP3985 regulator

An input capacitance of 1.0µF without any ESR requirement

is required at the LP3985 input, while a 1.0µF ceramic ca-

pacitor with an ESR requirement of 5mΩ to 500mΩ is required

at the output. Careful interpretation and understanding of the

capacitor specification is required to ensure correct device

operation.

2.2.4 LP2980

The LP2980 is an ultra low dropout regulator with a 0.5% or

1.0% accuracy over temperature, depending upon grade. It is

available in 3.0V, 3.3V and 5V versions, among others.

20155116

FIGURE 12. Using the LP2980 regulator

Like any low dropout regulator, the LP2980 requires an output

capacitor for loop stability. This output capacitor must be at

least 1.0µF over temperature, but values of 2.2µF or more will

provide even better performance. The ESR of this capacitor

should be within the range specified in the LP2980 data sheet.

Surface-mount solid tantalum capacitors offer a good combi-

nation of small size and ESR. Ceramic capacitors are attrac-

tive due to their small size but generally have ESR values that

are too low for use with the LP2980. Aluminum electrolytic

capacitors are typically not a good choice due to their large

size and have ESR values that may be too high at low tem-

peratures.

2.3 BIPOLAR OPERATION

The DAC081S101 is designed for single supply operation and

thus has a unipolar output. However, a bipolar output may be

obtained with the circuit in Figure 13. This circuit will provide

an output voltage range of ±5 Volts. A rail-to-rail amplifier

should be used if the amplifier supplies are limited to ±5V.

www.national.com 16

DAC081S101

20155117

FIGURE 13. Bipolar Operation

The output voltage of this circuit for any code is found to be

VO = (VA x (D / 256) x ((R1 + R2) / R1) - VA x R2 / R1)

where D is the input code in decimal form. With VA = 5V and

R1 = R2,

VO = (10 x D / 256) - 5V

A list of rail-to-rail amplifiers suitable for this application are

indicated in Table 2.

TABLE 2. Some Rail-to-Rail Amplifiers

AMP PKGS Typ VOS Typ ISUPPLY

LMC7111 DIP-8

SOT23-5 0.9 mV 25 µA

LM7301 SO-8

SOT23-5 0.03 mV 620 µA

LM8261 SOT23-5 0.7 mV 1 mA

2.4 LAYOUT, GROUNDING, AND BYPASSING

For best accuracy and minimum noise, the printed circuit

board containing the DAC081S101 should have separate

analog and digital areas. The areas are defined by the loca-

tions of the analog and digital power planes. Both of these

planes should be located in the same board layer. There

should be a single ground plane. A single ground plane is

preferred if digital return current does not flow through the

analog ground area. Frequently a single ground plane design

will utilize a "fencing" technique to prevent the mixing of ana-

log and digital ground current. Separate ground planes should

only be utilized when the fencing technique is inadequate.

The separate ground planes must be connected in one place,

preferably near the DAC081S101. Special care is required to

guarantee that digital signals with fast edge rates do not pass

over split ground planes. They must always have a continu-

ous return path below their traces.

The DAC081S101 power supply should be bypassed with a

10µF and a 0.1µF capacitor as close as possible to the device

with the 0.1µF right at the device supply pin. The 10µF ca-

pacitor should be a tantalum type and the 0.1µF capacitor

should be a low ESL, low ESR type. The power supply for the

DAC081S101 should only be used for analog circuits.

Avoid crossover of analog and digital signals and keep the

clock and data lines on the component side of the board. The

clock and data lines should have controlled impedances.

17 www.national.com

DAC081S101

Physical Dimensions inches (millimeters) unless otherwise noted

8-Lead MSOP

Order Numbers DAC081S101CIMM

NS Package Number MUA08A

6-Lead TSOT

Order Numbers DAC081S101CIMK

NS Package Number MK06A

www.national.com 18

DAC081S101

Notes

19 www.national.com

DAC081S101

Notes

DAC081S101 8-Bit Micro Power Digital-to-Analog Converter with Rail-to-Rail Output

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