DATASHEET
BoardLevelCooling3741
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122

MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING‐3741
3741isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumberDeviceType
374124B00035GBGA,FPGA
374124B60023GBGA,FPGA
HEATSINKDETAILS
PropertyDetails
MaterialAluminum
FinishBlackAnodize
DeviceAttachmentOptions:
374124B00035GTape
DeviceAttachmentOptions:
374124B60023GSolderAnchorClip
ThermalInterfaceMaterial:
374124B00035G
T411ChomericsTapeforAll
Surfaces
ThermalInterfaceMaterial:
374124B60023G
T766ChomericsPhaseChangefor
AllSurfaces
PartNumber:374124B00035G
PropertyDetails
HeatSinkWidth(mm)23.00
HeatSinkLength(mm)23.00
HeatSinkHeight(mm)18.00
HeatSinkMountingDirectionHorizontal,Vertical
DATASHEET
BoardLevelCooling3741
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122

PartNumber:374124B60023G
MountingDetails: