ACMD-7409
Miniature PCS Band Duplexer
Data Sheet
Description
The Avago ACMD-7409 is a miniature duplexer designed
for US PCS handsets.
The ACMD-7409 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q lters at a fraction of
their usual size.
The ACMD-7409 also utilizes Avago’s innovative Microcap
bonded-wafer, chip scale packaging technology. This
process allows the lters to be assembled in a molded
chip-on-board module that is less than 1.3 mm high with
a footprint of only 3.8 x 3.8 mm.
The ACMD-7409 enhances the sensitivity and dynamic
range of PCS receivers by providing more than 54 dB
attenuation of the transmitted signal at the receiver input
and more than 45 dB rejection of transmit-generated
noise in the receive band.
Maximum Insertion Loss in the Tx channel is only 3.5 dB,
which minimizes current drain from the power amplier.
Insertion Loss in the Rx channel is 3.8 dB max, improving
receiver sensitivity.
The excellent power handling capability of the FBAR bulk-
mode resonators supports the high output power levels
needed in PCS handsets while adding virtually no distor-
tion.
The ACMD-7409 is an environmentally green version of
the ACMD-7402 duplexer.
Functional Block Diagram
Features
• Miniature size
– 3.8 x 3.8 mm footprint size
– 1.3 mm max height
• High power rating size
– +33 dBm max Tx power
• Environmental
– RoHS Compliant
– Halogen Free
– TBBPA Free
Specications
• Performance guaranteed –30 to +85°C
• Rx band performance (1930.5 – 1989.5 mHz) size
– Insertion loss: 3.8 dB max size
– Noise blocking: 43 dB min
• Tx band performance (1850.5 – 1909.5 mHz) size
– Insertion loss: 3.5 dB max size
– Interferer blocking: 52 dB min
Applications
• Handsets or data terminals operating in the US PCS
frequency band
Tx
PORT 1
Rx
PORT 2
ANT PORT 3
2
ACMD-7409 Electrical Specications, Z0 = 50 Ω, TC [1,2] as indicated
Symbol Parameter Units
– 30°C[2] +25°C[2] +85°C[2]
Min Typ[3] Max Min Typ[3] Max Min Typ[3] Max
Antenna Port to Receive Port
S23 Insertion Loss in Receive Band
(1930.5 – 1989.5 MHz)
dB 3.8 1.5 3.5 3.5
ΔS23 Ripple (p-p) in Receive Band dB 3.0 1.5 2.6 2.6
S22 Return Loss of Receive Port
in Receive Band
dB 9.5 9.5 17 9.5
S23 Attenuation in Transmit Band
(1850.5 – 1909.5 MHz)
dB 52 52 56 52
S23 Attenuation 0 – 1600 MHz dB 20 31
S23 Attenuation in Receive 2nd
Harmonic Band
(3861 – 3979 MHz)
dB 18 19
Transmit Port to Antenna Port
S31 Insertion Loss in Transmit Band
(1850.5 – 1909.5 MHz)
dB 3.0 1.1 3.0 3.5[4]
ΔS31 Ripple (p-p) in Transmit Band dB 2.3 0.9 2.3 2.8
S11 Return Loss of Transmit Port
in Transmit Band
dB 9.5 9.5 20 9.5
S31 Attenuation in Receive Band
(1930.5 – 1989.5 MHz)
dB 43 43 48 43
S31 Attenuation 0 – 1600 MHz dB 22 34
S31 Attenuation in Transmit 2nd
Harmonic Band
(3701 – 3819 MHz)
dB 8 13
Antenna Port
S33 Return Loss of Antenna Port in
Receive Band
(1930.5 – 1989.5 MHz)
dB 9 9 16 9
S33 Return Loss of Antenna Port in
Transmit Band
(1850.5 – 1909.5 MHz)
dB 9 9 19 9
Isolation Transmit Port to Receive Port
S21 Tx-Rx Isolation in Receive Band
(1930.5 – 1989.5 MHz)
dB 45 45 48 45
S21 Tx-Rx Isolation in Transmit Band
(1850.5 – 1909.5 MHz)
dB 54 54 58 54
Notes:
1. TC is the case temperature and is dened as the temperature of the underside of the Duplexer where it makes contact with the circuit board.
2. Min/Max specications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx
frequencies unless otherwise noted.
3. Typical data is the average value of the parameter over the indicated band at the specied temperature. Typical values may vary over time. Refer
to “Characterization” section for measurement details.
4. At Tx input power between +26 dBm and +29 dBm, the Insertion Loss at the upper edge of the Tx band (1907– 1909.5 MHz) will be slightly
degraded. From 1907 to 1909.5 MHz, the maximum Insertion Loss specication at Tc = +85°C is guaranteed to +26 dBm input power.
3
Characterization
A test circuit similar to that shown in Figure 1 was used
to measure typical device performance. This circuit is
designed to interface with Air Coplanar (ACP), Ground-
Signal-Ground (GSG) RF probes of the type commonly
used to test semiconductor wafers.
The test circuit is a 7 x 7 mm PCB with a well-grounded pad
to which the device under test (DUT) is solder-mounted.
Short lengths of 50-ohm microstripline connect the DUT
to the ACP probe patterns on the board.
Absolute Maximum Ratings[1]
Parameter Unit Value
Storage Temperature °C –65 to +125
Maximum RF Input Power
to Tx Ports
dBm +33
Maximum Recommended Operating Conditions[2]
Parameter Unit Value
Operating Temperature, Tc[3],
Tx Power 29 dBm
°C –40 to +100
Operating temperature, Tc[3],
Tx Power 30 dBm
°C –40 to +85
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance, but
is not guaranteed to meet electrical specications.
3. TC is dened as case temperature, the temperature of the underside
of the Duplexer where it makes contact with the circuit board.
A test circuit with a ACMD-7409 mounted in place is
shown in Figure 2. S-parameters are then measured using
a network analyzer and calibrated ACP probe set.
Phase data for s-parameters measured with ACP probe
circuits are adjusted to place the reference plane at the
edge of the Duplexer
Figure 1. ACP probe test circuit Figure 2. Test circuit with ACMD-7409 duplexer
4
Typical Performance at Tc = 25°C
Figure 3. Tx–Ant insertion loss Figure 4. Ant–Rx insertion loss
Figure 5. Tx and Rx port return loss Figure 6. Tx rejection in Rx band and Rx rejection in Tx band
Figure 7. Tx–Rx isolation Figure 8. Antenna port return loss
-4.0
-3.0
-2.0
-1.0
0.0
1850 1860 1870 1880 1890 1900 1910
Frequency [MHz]
Insertion Loss [dB]
-4.0
-3.0
-2.0
-1.0
0.0
1930 1940 1950 1960 1970 1980 1990
Frequency [MHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Insertion Loss [dB]
-25
-20
-15
-10
-5
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Return Loss [dB]
-80
-75
-70
-65
-60
-55
-50
-45
-40
-35
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Insertion Loss [dB]
-25
-20
-15
-10
-5
0
1750 1800 1850 1900 1950 2000 2050 2100
Frequency [MHz]
Return Loss [dB]
5
Figure 9. Tx–Ant rejection at Tx second harmonic Figure 10. Tx–Ant and Ant–Rx wideband insertion loss
Figure 11. Tx–Ant low frequency rejection Figure 12. Ant–Rx low frequency rejection
-40
-30
-20
-10
0
3700 3720 3740 3760 3780 3800 3820
Frequency [MHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0
0.0 1.0 2.0 3.0 4.0 5.0 6.0
Frequency [GHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Frequency [GHz]
Insertion Loss [dB]
-60
-50
-40
-30
-20
-10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Frequency [GHz]
Insertion Loss [dB]
6
Figure 13. Package outline drawing
Figure 14. Package marking
ANT
PACKAGE
ORIENTATION
RX TX
H = ACMD-7409
FI = Mfg Information
Y = Year
WW = Work Week
DC = Date Code
NNNN = Assembly Lot
[PRODUCT
MARKING]
Rx Tx
Ant
Rx
Tx
Ant
SOLDER MASK
OVER VIAS (2 PLS)
0.8
0.5
0.1
1.8
1.4
2.4
1.9
1.4
1.2
3.8
3 .8
2 .8
1 .1
0 .4
1 .9
Notes:
1. Dimensions in millimeters
2. Dimensions nominal unless otherwise noted
3. Tolerance:
X.X = ± 0.1
X.XX = ±0.05
4. I/O pads (3 ea), 0.40 x 0.40
5. Contact areas are gold plated
6. Internal vias (2 ea) shown for reference only;
covered with Ø 0.50 mm solder mask
7
Figure 15. Recommended PCB land print
Figure 16. Duplexer superposed on PCB land print
1.8 1.01.0
1.2
1.4
1.2
0.8 0.2
0.4
0.3
0.3
0.6
WT
1.0
1.8
1.2 1.2 1.21.2
1.4
0.3 0.3
0.2 0.2
0.4 0.4
0.3 0.3
0.5 0.5
NOTES:
DIMENSIONS IN MILLIMETERS (mm)
ALL VIAS ∆ 0.40
ANGLES 45
RF PORTS ARE CPW
T AND W SELECTED FOR 50 OHMS
PATTERN CENTERED ON DUPLEXER
8
Figure 17. Recommended solder stencil Figure 18. Duplexer superposed on solder stencil
Package Moisture Sensitivity
Feature Test Method Performance
Moisture Sensitivity Level (MSL) at 260°C J-STD-020C Level 3
Figure 19. Veried SMT solder prole
3.25
1.00
1.00
3.40
NOTES:
1. DIMENSIONS IN MILLIMETERS (mm).
2. SOLDER STRIPES (14 PLS) ARE 0.20 WIDE, PITCH.
3. SOLDER PADS FOR I/O ARE 0.35 x 0.35.
4. STENCIL PATTERN IS CENTERED ON DUPLEXER.
1.63
1.25
2.70
0.40
TEMPERATURE C
0
0
TIME, SECONDS
250
300
100
150
200
250
150 200 300
50
10050
9
Figure 20. SMD tape packing
Figure 21. Unit orientation In tape
1.75 0.10
5.50 0.05
12.00 0.10
8.00 0.10 ø1.50 (MIN.)
ø1.55 0.05
4.00 0.10 SEE NOTE 2
2.00 0.05
AA
B
B
Bo
Ko
5° MAX.
SECTION B-B
Ao
SECTION A-A
5° MAX.
0.30 0.05
Ao
Bo
Ko
PITCH
WIDTH
= 4.10
= 4.10
= 1.45
= 8.00
= 12.00
NOTES:
1. Ao and Bo MEASURED AT 0.3 mm ABOVE BASE OF POCKET.
2. 10 PITCHES CUMULATIVE TOLERANCE 0.2 mm.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1824EN - March 24, 2009
Ordering Information
Part Number No. of Devices Container
ACMD-7409-BLK 25 Anti-static Bag
ACMD-7409-TR1 1000 7-inch Reel