Part Number 440EPx Revision 1.32 - May 18, 2012 440EPx Data Sheet PowerPC 440EPx Embedded Processor Features * PowerPC(R) 440 processor operating up to 667MHz with 32KB I-cache and D-cache with parity checking. duplex interfaces. Operational modes supported are with packet reject, Jumbo frames, and interrupt coalescing. * 16KB of on-chip SRAM. * Up to four serial ports (16550 compatible UART). * Selectable processor:bus clock ratios of N:1, N:2. * One USB 2.0 Device or Host interface with internal PHY and one USB 2.0 direct Device UTMI interface. * Floating Point Unit with single- and doubleprecision and single-cycle throughput. * Dual bridged Processor Local Buses (PLBs) with 64- and 128-bit widths. * Double Data Rate 2/1 (DDR2/1) Synchronous DRAM (SDRAM) interface operating up to 166MHz (333 MHz data transfer rate) with optional ECC. * DMA support for external peripherals, internal UART and memory. * Programmable Interrupt Controller supports interrupts from a variety of sources. * Programmable General Purpose Timers (GPT). * PCI V2.2 interface (3.3V only). Thirty-two bits at up to 66MHz. * Two Ethernet 10/100/1000Mbps half- or full- * External peripheral bus (32-bit data) for up to six devices with external mastering. * Two IIC interfaces (one with boot parameter read capability). * NAND Flash interface. * SPI interface. * General Purpose I/O (GPIO) interface. * JTAG interface for board level testing. * Boot from PCI memory, NOR Flash on the external peripheral bus, or NAND Flash on the NAND Flash interface. * Optional security feature (PPC440EPx-S). * Available in RoHS compliant, lead-free package. Description Designed specifically to address high-end embedded applications, the PowerPC 440EPx (PPC440EPx) provides a high-performance, low-power solution that interfaces to a wide range of peripherals and incorporates on-chip power management features. This chip contains a high-performance RISC processor, on-chip SRAM, a floating point unit, DDR2/1 SDRAM controller, PCI bus interface, control for external ROM and peripherals, DMA with scatter/gather support, Ethernet ports, serial ports, IIC interfaces, SPI interface, USB ports, NAND Flash interface, an optional security feature AppliedMicro Proprietary (PPC440EPx-S), and general purpose I/O. Technology: CMOS Cu-11, 0.13m. Package: 35mm, 680-ball thermally enhanced plastic ball grid array (TE-EPBGA). RoHS compliant package available. Typical power: Less than 3W at 533MHz. Supply voltages required: 3.3V, 2.5V, 1.8V (DDR2) or 2.5V (DDR1), 1.5V. 1 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Contents Ordering and PVR Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Address Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 PowerPC 440 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Floating Point Unit (FPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 SRAM Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Internal Buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Security Function (optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 KASUMI Algorithm (optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 PCI Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DDR2/1 SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 External Peripheral Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Ethernet Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DMA-to-PLB3 (64-bit) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DMA-to-PLB4 (128-bit) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Serial Ports (UART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 IIC Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Serial Peripheral Controller (SPI/SCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Universal Serial Bus 2.0 (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 NAND Flash Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 General Purpose Timers (GPT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Signal Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 DDR2/1 SDRAM I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 DDR SDRAM Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 DDR SDRAM Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Strapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Serial EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 2 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Figures Figure 1. Order Part Number Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 2. PPC440EPx Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. 35mm, 680-Ball TE-EPBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 4. Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Figure 5. Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Figure 6. Input Setup and Hold Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 7. Output Delay and Float Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 8. Setup and Hold Timing Waveforms for RGMII Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Figure 9. DDR SDRAM Simulation Signal Termination Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Figure 10. DDR SDRAM Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Figure 11. DDR SDRAM DQS Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 Tables Table 1. System Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 2. DCR Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 3 Recommended Reflow Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 4. JEDEC Moisture Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Table 5. Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Table 6. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table 7. Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Table 8. Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table 9. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Table 10. Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Table 11. Overshoot and Undershoot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 12. Typical DC Power Supply Requirements Using DDR2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . 69 Table 13. Typical DC Power Supply Requirements Using DDR1 Memory . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 14. VDD Supply Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 15. DC Power Supply Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Table 16. Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 17. Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Table 18. Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 19. RGMII I/O Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 20. I/O Specifications--PCI, USB, UART, IIC, SPI, Ethernet, System and Debug Interfaces . . . . . 80 Table 21. I/O Specifications--EBC, EBMI, DMA and NAND Flash Interfaces . . . . . . . . . . . . . . . . . . . . . . 83 Table 22. Input Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Table 23. DDR SDRAM Output Driver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Table 24. DDR SDRAM Write Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Table 25. I/O Timing--DDR SDRAM TDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 26. I/O Timing--DDR SDRAM TSK, TSA, and THA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 27. I/O Timing--DDR SDRAM TSD and THD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89 Table 29. Strapping Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 AppliedMicro Proprietary 3 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Ordering and PVR Information For information on the availability of the following parts, contact your local AppliedMicro sales office. For additional information on the part number structure see Figure 1. Product Name Order Part Number (see Notes) Package Revision Level PVR Value JTAG ID PPC440EPx PPC440EPx-SpAfffT 35mm, 680 TE-EPBGA A 0x216218D0 0x0440F1E1 PPC440EPx PPC440EPx-NpAfffT 35mm, 680 TE-EPBGA A 0x216218D4 0x0440F1E1 Notes: Characters following the dash (-): 1. 2. 3. 4. 5. S = Security feature present, N = Security feature not present p = Package type: U = lead-free (RoHS compliant), T = contains lead. A = Chip revision level A fff = Processor frequency: 400 = 400MHz, 533 = 533MHz, 667 = 667MHz T = Case temperature range of -40C to +100C. Note: Parts shipped on trays. Each part number contains a revision code. This is the die mask revision number and is included in the part number for identification purposes only. The PVR (Processor Version Register) and the JTAG ID register are software accessible (read-only) and contain information that uniquely identifies the part. Refer to the PPC440EPx User's Manual for details on accessing these registers. Figure 1. Order Part Number Key PPC440EPx-SUA667T AppliedMicro Part Number Security Feature Package Case Temperature Range Processor Frequency Revision Level Note: The example P/N above contains the security feature, is lead-free and is capable of running at 667MHz. 4 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Block Diagram Figure 2. PPC440EPx Functional Block Diagram 10 External Interrupts Clock Control, Reset Power Mgmt MMU UIC PPC440 Processor DCR Bus FPU External Peripheral Controller Trace JTAG 32KB I-Cache 32KB D-Cache 66MHz max - 32 bits - 6 devices 83MHz max - 30-bit addr - 32/16-bit data DCRs Timers Security (optional) NAND Flash Controller PCI Bridge SRAM 16KB PLB-PLB Bridges PLB (PLB4--128 bits) PLB (PLB3--64 bits) OPB OPB OPB DMA Controller Bridge Bridge Bridge DDR2/1 SDRAM Controller 333MHz max data rate - 14-bit addr - 64/32-bit data Host USB 2.0 2.0 PHY DMA Controller GPT On-chip Peripheral Bus (OPB 0) OPB 2 OPB 1 Device OPB Bridge MAL Ethernet 10/100/1000 x2 ZMII GPIO SPI IIC x2 BSC UART x4 RGMII 1 host 2.0 PHY 1 Device UTMI or 1 Device 2.0 PHY D+/D- The PPC440EPx is a system on a chip (SOC) using IBM CoreConnect BusTM Architecture. Address Maps The PPC440EPx incorporates two address maps. The first is a fixed processor System Memory Address Map. This address map defines the possible contents of various address regions which the processor can access. The second is the DCR Address Map for Device Configuration Registers (DCRs). The DCRs are accessed by software running on the PPC440EPx processor through the use of mtdcr and mfdcr instructions. AppliedMicro Proprietary 5 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 1. System Memory Address Map (Sheet 1 of 2) Function Sub Function Start Address End Address Size 0 0000 0000 1 FFFF FFFF 8GB DDR SDRAM 0 0000 0000 0 7FFF FFFF 2GB Reserved 0 8000 0000 0 DFFF FFFF OPB1 Arbiter 0 E000 0000 0 E000 003F Reserved 0 E000 0040 0 E000 00FF Device Controller 0 E000 0100 0 E000 017F Reserved 0 5000 0180 0 5000 01FF OPB2 Arbiter 0 E000 0200 0 E000 023F Reserved 0 E000 0240 0 E000 02FF Host EHIC 0 E000 0300 0 E000 03FF 256B Host OHIC 0 E000 0400 0 E000 04FF 256B Reserved 0 E000 0500 0 E000 FFFF SRAM 0 E001 0000 0 E001 3FFF Reserved 0 E001 4000 0 E00F FFFF Security Function 0 E010 0000 0 E017 FFFF 512KB KASUMI Algorithm 0 E018 0000 0 E018 07FF 2KB Reserved 0 E018 0800 1 7FFF FFFF Memory 1 8000 0000 1 BFFF FFFF 1GB Controller 1 C000 0000 1 DFFF FFFF 512MB Reserved 1 E000 0000 1 E7FF FFFF I/O 1 E800 0000 1 E800 FFFF Reserved 1 E801 0000 1E87F FFFF I/O 1 E880 0000 1 EBFF FFFF Reserved 1 EC00 0000 1 EEBF FFFF Configuration Registers 1 EEC0 0000 1 EEC0 0007 Reserved 1 EEC0 0008 1 EECF FFFF Interrupt Ack/Special Cycle 1 EED0 0000 1 EED0 0003 Reserved 1 EED0 0004 1 EF3F FFFF Local Configuration Registers 1 EF40 0000 1 EF40 003F Reserved 1 EF40 0040 1 EF4F FFFF Total System Memory Address Space Local Memory USB 2.0 Device USB 2.0 Host On-Chip Memory Security (PPC440EPx-S) PCI 1 EBC 1 PCI 1 6 64B 128B 64B 16KB 64KB 56MB 8B 4B 64B AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 1. System Memory Address Map (Sheet 2 of 2) Function Internal Peripherals Sub Function Start Address End Address Reserved 1 EF50 0000 1 EF5F FFFF General Purpose Timer 1 EF60 0000 1 EF60 01FF Reserved 1 EF60 0200 1 EF60 02FF UART0 1 EF60 0300 1 EF60 0307 Reserved 1 EF60 0308 1 EF60 03FF UART1 1 EF60 0400 1 EF60 0407 Reserved 1 EF60 0408 1 EF60 04FF UART2 1 EF60 0500 1 EF60 0507 Reserved 1 EF60 0508 1 EF60 05FF UART3 1 EF60 0600 1 EF60 0607 Reserved 1 EF60 0608 1 EF60 06FF IIC0 1 EF60 0700 1 EF60 071F Reserved 1 EF60 0720 1 EF60 07FF IIC1 1 EF60 0800 1 EF60 081F Reserved 1 EF60 0820 1 EF60 08FF SPI 1 EF60 0900 1 EF60 0906 Reserved 1 EF60 0907 1 EF60 09FF OPB0 Arbiter 1 EF60 0A00 1 EF60 0A3F Reserved 1 EF60 0A40 1 EF60 0AFF GPIO0 Controller 1 EF60 0B00 1 EF60 0B7F Reserved 1 EF60 0B80 1 EF60 0BFF GPIO1 Controller 1 EF60 0C00 1 EF60 0C7F Reserved 1 EF60 0C80 1 EF60 0CFF Ethernet PHY ZMII 1 EF60 0D00 1 EF60 0D0F Reserved 1 EF60 0D10 1 EF60 0DFF Ethernet 0 Controller 1 EF60 0E00 1 EF60 0E77 Reserved 1 EF60 0E78 1 EF60 0EFF Ethernet 1 Controller 1 EF60 0F00 1 EF60 0F77 Reserved 1 EF60 0F78 1 EF60 0FFF Ethernet PHY RGMII 1 EF60 1000 1 EF60 1103 Reserved 1 EF60 1080 1 EFFF FFFF 1 F000 0000 1 FFDF FFFF 254MB 1 FFE0 0000 1 FFFF FFFF 2MB EBC 1 Boot space EBC Bank 0 or PCI Size 512B 8B 8B 8B 8B 32B 32B 6B 64B 128B 128B 16B 120B 120B 264B Notes: 1. EBC and PCI are relocatable, but this map reflects the suggested configuration. AppliedMicro Proprietary 7 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 2. DCR Address Map (Sheet 1 of 2) Function Start Address End Address Size 000 3FF 1KW (4KB)1 Reserved 000 00B 12W Clocking Power On Reset (CPR0) 00C 00D 2W System DCRs (SDR0) 00E 00F 2W Memory Controller (SDRAM0) 010 011 2W External Bus Controller (EBC0) 012 013 2W Reserved 014 01F 12W PLB4-to-PLB3 Bridge 020 02F 16W PLB3-to-PLB4 Bridge 030 03F 16W Reserved 040 06F 48W PLB3 Arbiter 070 07F 16W PLB4 Arbiter 080 08F 16W PLB3-to-OPB0 Bridge 090 09F 16W Reserved 0A0 0AF 16W Power Management 0B0 0B7 8W Reserved 0B8 0BF 8W Interrupt Controller 0 0C0 0CF 16W Interrupt Controller 1 0D0 0DF 16W Interrupt Controller 2 0E0 0EF 16W Power Management 1 0F0 0F7 8W Reserved 0F8 0FF 8W DMA-to-PLB3 Controller 100 13F 64W Reserved 140 17F 64W Ethernet MAL 180 1FF 128W PLB4-to-OPB1 Bridge 200 20F 16W Reserved 210 2FF 240W DMA-to-PLB4 Controller 300 33F 64W PLB4-to-OPB2 Bridge 340 34F 16W OPB2-to-PLB4 Bridge 350 357 8W Reserved 358 35F 8W USB 2.0 Host OPB Master DCR 360 367 8W Reserved 368 36F 8W USB 2.0 Host OPB Slave DCR 370 373 4W Reserved 374 37F 12W Total DCR Address Space1 By function: 8 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 2. DCR Address Map (Sheet 2 of 2) Function Start Address End Address Size On Chip Memory (SRAM Controller) 380 38F 16W Reserved 390 3FF 112W Notes: 1. DCR addresses are 10 bits (1024 or 1K unique addresses). Each unique address represents a single 32-bit (word) register. One kiloword (1024W) equals 4KB (4096 B). AppliedMicro Proprietary 9 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet PPC440EPx Features PowerPC 440 Processor The PowerPC 440 processor is designed for high-end applications: RAID controllers, SAN, iSCSI, routers, switches, printers, set-top boxes, etc. It implements the Book E PowerPC embedded architecture and uses the 128-bit version of IBM's on-chip CoreConnect Bus Architecture. Features include: * Up to 667MHz operation * PowerPC Book E architecture * 32KB I-cache, 32KB D-cache - UTLB Word Wide parity on data and tag address parity with exception force * Three logical regions in D-cache: locked, transient, normal * D-cache full line flush capability * 41-bit virtual address, 36-bit (64GB) physical address * Superscalar, out-of-order execution * 7-stage pipeline * 3 execution pipelines * Dynamic branch prediction * Memory management unit - 64-entry, full associative, unified TLB with optional parity - Separate instruction and data micro-TLBs - Storage attributes for write-through, cache-inhibited, guarded, and big or little endian * Debug facilities - Multiple instruction and data range breakpoints - Data value compare - Single step, branch, and trap events - Non-invasive real-time trace interface * 24 DSP instructions - Single cycle multiply and multiply-accumulate - 32 x 32 integer multiply - 16 x 16 -> 32-bit MAC Floating Point Unit (FPU) The chip has a built-in super scalar FPU that supports both single- and double-precision operations, and offers single cycle through put on most instructions. Features include: * Five stages with 2 MFlops/Hz * Hardware support for IEEE 754 * Single- and double-precision * Single-cycle throughput on most instructions * Thirty-two 64-bit floating point registers SRAM Controller The internal SRAM controller (ISC) supports the following features: * One bank (Bank 0) of 16KB configurable as 4KB, 8KB or 16KB (128 bits wide) * 128-bit slave attachment addressable by any PLB master * Transfers by PLB slave cycles: - Single-beat read and write (1 to 8 bytes for 64-bit masters, 1 to 16 bytes for 128-bit masters) - 4-word line read and write - 8-word line read and write - Double word read and write bursts for 64-bit masters - Quadword read and write bursts for 128-bit masters 10 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet * * * * - Slave-terminated double word and quadword fixed length bursts - Master-terminated variable length bursts Guarded memory access on 4 KB boundaries Data parity checking Data transfers occur at PLB bus speeds. Power management Internal Buses The PowerPC 440EPx features six standard internal buses: two Processor Local Buses (PLBs), three On-Chip Peripheral Buses (OPBs), and the Device Control Register Bus (DCR). The high performance, high bandwidth cores such as the PowerPC 440 processor, the DDR SDRAM memory controller, and the PCI bridge connect to the PLBs. OPB0 hosts lower data rate peripherals. OPB1 is dedicated to USB 2.0 Device support, and OPB2 is dedicated to USB 2.0 Host. The daisy-chained DCR provides a lower bandwidth path for passing status and control information between the processor and the other on-chip cores. Features include: * PLB4 (128-bit) - 128-bit implementation of the PLB architecture - Separate and simultaneous read and write data paths - 36-bit address - Simultaneous control, address, and data phases - Four levels of pipelining - Byte-enable capability supporting unaligned transfers - 32- and 64-byte burst transfers - 166MHz, maximum 5.3GB/s (simultaneous read and write) - Processor:bus clock ratios of N:1 and N:2 * PLB3 (64-bit) - 64-bit implementation of the PLB architecture - 32-bit address - 166MHz (1:1 ratio with PLB4), maximum 1.3GB/s (no simultaneous read and write) * OPBs (OPB0, OPB1, and OPB2) - 32-bit data path - 32-bit address - 83MHz * DCR - 32-bit data path - 10-bit address Security Function (optional) The built-in security function (PPC440EPx-S only) is a cryptographic engine attached to the 128-bit PLB with builtin DMA and interrupt controllers. Features include: * Federal Information Processing Standard (FIPS) 140-2 design * Support for an unlimited number of Security Associations (SA) * Different SA formats for each supported protocol (IPsec/SSL/TLS/sRTP) * Internet Protocol Security (IPSec) features * Full packet transforms (ESP & AH) * Complete header and trailer processing (IPv4 and IPv6) * Multi-mode automatic padding * "Mutable bit" handler for AH, including IPv4 option and IPv6 extension headers AppliedMicro Proprietary 11 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet * Secure Socket Layer (SSL) and Transport Layer Security (TLS) features - Packet transforms - One-pass hash-then-encrypt for SSL and TLS packet transforms for inbound packet using Stream Cipher * Secure Real-Time Protocol (sRTP) features - Packet transforms - ROC removal and TAG insertion - Variable bypass offset of header length per packet * IPsec/SSL security acceleration engine * DES, 3DES, AES, ARC-4 encryption * MD-5, SHA-1 hashing, HMAC encrypt-hash and hash-decrypt, and KASUMI * Public key acceleration for RSA, DSA and Diffie-Hellman * True or pseudo random number generators - Non-deterministic true random numbers - Pseudo random numbers with lengths of 8B or 16B - ANSI X9.17 Annex C compliant using a DES algorithm * Interrupt controller - Fifteen programmable, maskable interrupts - Initiate commands via an input interrupt - Sixteen programmable interrupts indicating completion of certain operations - All interrupts mapped to one level- or edge-sensitive programmable interrupt output * DMA controller - Autonomous, 4-channel - 1024-words (32 bits/word) per DMA transfer - Scatter/gather capability with byte aligned addressing KASUMI Algorithm (optional) * * * * * * Key scheduling hardware f8 and f9 algorithm support Automatic data padding mechanism for f9 algorithm KASUMI encryption and decryption modes 32-bit slave interface Fully synchronous to PLB clock PCI Controller The PCI interface allows connection of PCI devices to the PowerPC processor and local memory. This interface is designed to Version 2.2 of the PCI Specification and supports 32- bit PCI devices. Reference Specifications: * PowerPC CoreConnect Bus (PLB) Specification Version 3.1 * PCI Specification Version 2.2 * PCI Bus Power Management Interface Specification Version 1.1 Features include: * PCI 2.2 * Frequency to 66MHz * 32-bit bus * PCI Host Bus Bridge or an Adapter Device's PCI interface * Internal PCI arbitration function, supporting up to six external devices, that can be disabled for use with an external arbiter * Support for Message Signaled Interrupts * Simple message passing capability * Asynchronous to the PLB 12 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet * * * * * PCI Power Management 1.1 PCI register set addressable both from on-chip processor and PCI device sides Ability to boot from PCI bus memory Error tracking/status Supports initiation of transfers of the following types: - Single beat I/O reads and writes - Single beat and burst memory reads and writes - Single beat configuration reads and writes (type 0 and type 1) - Single beat special cycles DDR2/1 SDRAM Memory Controller The Double Data Rate 2/1 (DDR2/1) SDRAM memory controller supports industry standard discrete devices that are compatible with both the DDR1 or DDR2 specifications. The correct I/O supply voltage must be provided for the two types of DDR devices: DDR1 devices require +2.5V and DDR2 devices require +1.8V. Global memory timings, address and bank sizes, and memory addressing modes are programmable. Features include: * 32-bit memory interface for DDR1 * 32- or 64-bit memory interface for DDR2 * Optional Error Checking and Correcting (ECC) * 2.6-GB/s peak data rate * Two memory banks of up to 1 GB each * Maximum capacity of 2GB * Support for 128-Mb, 256-Mb, 512-Mb, and 1-Gb DDR devices, with CAS latencies of 2, 2.5, or 3 * Clock frequencies from 133MHz (266Mbps) to 166MHz (333Mbps) supported (Faster parts may be used, but must be clocked no faster than 166MHz) * Page mode accesses (up to 16 open pages) with configurable paging policy * Programmable address mapping and timing * Software initiated self-refresh * Power management (self-refresh, suspend, sleep) * One or two chip selects External Peripheral Bus Controller (EBC) Features include: * Up to six ROM, EPROM, SRAM, Flash memory, and slave peripheral I/O banks supported * Up to 83MHz operation * Burst and non-burst devices * 32-bit byte-addressable data bus * Data parity * 30-bit address * Peripheral Device pacing with external "Ready" * Latch data on Ready, synchronous or asynchronous * Programmable access timing per device - 256 Wait States for non-burst - 32 Burst Wait States for first access and up to 8 Wait States for subsequent accesses - Programmable CSon, CSoff relative to address - Programmable OEon, WEon, WEoff (1 to 4 clock cycles) relative to CS * Programmable address mapping * External DMA Slave Support AppliedMicro Proprietary 13 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet * External master interface - Write posting from external master - Read prefetching on PLB for external master reads - Bursting capable from external master - Allows external master access to all non-EBC PLB slaves - External master can control EBC slaves for access Ethernet Controller Ethernet support provided by the PPC440EPx interfaces to the physical layer but the PHY is not included on the chip: * Two 10/100/1000 interfaces running in full- and half-duplex modes providing: - One Gigabit Media Independent Interface (GMII) - One Media Independent Interface (MII) - Two Reduced Gigabit MII (RGMII) - Two Serial MII (SMII) at 100/10Mbps. - Packet reject support - Jumbo frame support - DMA capability - Interrupt coalescence DMA-to-PLB3 (64-bit) Controller This DMA controller provides a DMA interface between OPB0 and PLB3. Features include: * Supports the following transfers: - Memory-to-memory transfers - Buffered peripheral to memory transfers - Buffered memory to peripheral transfers * Four channels * Scatter/Gather capability for programming multiple DMA operations * 32-byte buffer * 8-, 16-, 32-bit peripheral support (OPB and external) * 32-bit addressing * Address increment or decrement * Supports internal and external peripherals * Support for memory mapped peripherals * Support for peripherals running on slower frequency buses DMA-to-PLB4 (128-bit) Controller This DMA controller provides a DMA interface between the OPB1 dedicated to the USB 2.0 device ports and PLB4. Features include: * Four independent channels supporting internal USB 2.0 Device endpoints 1 and 2 * Support for memory-to-memory, peripheral-to-memory, and memory-to-peripheral transfers * Scatter/gather capability * 128-byte buffer with programmable thresholds 14 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Serial Ports (UART) Features include: * Up to four ports in the following combinations: - One 8-pin (UART0) - Two 4-pin (UART0 and UART1) - One 4-pin (UART0) and two 2-pin (UART1 and UART2) - Four 2-pin (UART0, UART1, UART2, and UART3) * Selectable internal or external serial clock to allow wide range of baud rates * Register compatibility with NS16550 register set * Complete status reporting capability * Fully programmable serial-interface characteristics * Supports DMA using internal DMA function on PLB3 IIC Bus Controller Features include: * Two IIC interfaces provided * Support for Philips(R) Semiconductors I2C Specification, dated 1995 * Operation at 100kHz or 400kHz * 8-bit data * 10- or 7-bit address * Slave transmitter and receiver * Master transmitter and receiver * Multiple bus masters * Two independent 4 x 1 byte data buffers * Twelve memory-mapped, fully programmable configuration registers * One programmable interrupt request signal * Provides full management of all IIC bus protocols * Programmable error recovery * Includes an integrated bootstrap controller (BSC) that is multiplexed with the IIC0 interface Serial Peripheral Controller (SPI/SCP) The Serial Peripheral Interface (also known as the Serial Communications Port) is a full-duplex, synchronous, character-oriented (byte) port that allows the exchange of data with other serial devices. The SCP is a master on the serial port supporting a 3-wire interface (receive, transmit, and clock), and is a slave on the OPB. Features include: * Three-wire serial port interface * Full-duplex synchronous operation * SCP bus master * OPB bus slave * Programmable clock rate divider * Clock inversion * Reverse data * Local data loop back for test AppliedMicro Proprietary 15 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Universal Serial Bus 2.0 (USB) The USB 2.0 interface provides both device and host support. One interface provides host or device support and operates through an internal PHY. The other interface provides device support only through the UTMI interface with no internal PHY. Features include: * USB 2.0 Host with internal PHY - Fully compliant to the following specifications: * Universal Serial Bus Specification, Revision 2.0. * Enhanced Host Controller Interface (EHCI) Specification for USB, Revision 2.0. * Open Host Controller Interface (OHCI) Specification for USB, Revision 1.0a. - One USB port provided through a UTMI transceiver interface connected to the internal USB 2.0 Physical Layer (Single port USB 2.0 Physical Layer UTMI+ version 1.05). - One USB EHCI high speed (480Mbps) host controller with 1024-byte packet buffer. - One USB OHCI full/low speed (12Mbps/1.5Mbps) host controller. - Host controller does not support high-bandwidth isochronous transfers - Independent OPB master and slave ports which run asynchronously to the USB clocks. - USB OHCI/EHCI registers and data structures implemented in Big Endian format. * USB 2.0 Device UTMI or USB 2.0 Device with internal PHY (excluding USB 2.0 Host function) - Device support provides six end points (3 IN, 3 OUT) - 8192-byte FIFO by endpoint (supports high-bandwidth isochronous transfers, double buffering of 1024byte packets) - FIFOs are not shared between IN and OUT endpoints - Two USB 2.0 device end points have DMA dedicated channels (DMA-to-PLB4) NAND Flash Controller The NAND Flash controller provides a simple interface between the EBC and up to four separate external NAND Flash devices. It provides both direct command, address, and data access to the external device as well as a memory-mapped linear region that generates data accesses. NAND Flash data is transferred on the peripheral data bus. Features include: * One to four banks supported on EBC * Direct interface to: - Discrete NAND Flash devices (up to four devices) - SmartMedia Card socket (22-pins) * Device Sizes: - 4MB and larger supported for read/write access - 4MB to 256MB for boot-from-NAND flash (size supported depends on addressing mode) * (512 + 16)-B or (2K + 64)-B page sizes supported * Boot-from-NAND - Execute up to 4KB of boot code out of first block - Automatic page read accesses performed based on device configuration and addressing mode * ECC provides single-bit error correction and double-bit error detection in each 256B of stored data General Purpose Timers (GPT) Provides a separate time base counter and additional system timers in addition to those defined in the processor. Features include: * 32-bit Time Base Counter driven by the OPB bus clock * Seven 32-bit compare timers 16 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet General Purpose IO (GPIO) Controller * Controller functions and GPIO registers are programmed and accessed via memory-mapped OPB bus master accesses. * 64 GPIOs are multiplexed with other functions. DCRs control whether a particular pin that has GPIO capabilities acts as a GPIO or is used for another purpose. * Each GPIO output is separately programmable to emulate an open drain driver (that is, drives to zero, tri-stated if output bit is 1). Universal Interrupt Controller (UIC) Two Universal Interrupt Controllers (UIC) are employed. They provide control, status, and communications necessary between the external and internal sources of interrupts and the on-chip PowerPC processor. Note: Processor specific interrupts (for example, page faults) do not use UIC resources. Features include: * 10 external interrupts * Edge triggered or level-sensitive * Positive or negative active * Non-critical or critical interrupt to the on-chip processor * Programmable interrupt priority ordering * Programmable critical interrupt vector for faster vector processing JTAG Features include: * IEEE 1149.1 Test Access Port * JTAG Boundary Scan Description Language (BSDL) * Refer to http://www.apm.com/Embedded/Partners for a list of AppliedMicro partners supplying probes for use with this port. AppliedMicro Proprietary 17 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Package Diagram Figure 3. 35mm, 680-Ball TE-EPBGA Package Top View Logo View Part Number (R) 30 24 TYP TYP PPC440EPx e1 PPC440EPx-nprffft ccccccc 1YWWBZZZZZ MMDDQL Heat Slug Side View 2.65 max Mold Compound Lot Number (ZZZZZ) PCB Substrate Gold Gate Release Corresponds to A01 Ball Location Bottom View 0.4 - 0.6 35.0 0.20 33.0 AP AM AK AH AF AD AB Y V T P M K H F D AN AL 1.0 AJ AG AE AC Thermal Balls AA Notes: 1. All dimensions are in mm. 2. Package is available with lead or lead-free (RoHS compliant). 3. Package conforms to JEDEC MS-034. W U R N L 9.0 J G E C B A 01 03 05 07 09 11 13 15 17 19 21 23 25 27 29 31 33 02 04 06 08 10 12 14 16 18 20 22 24 26 28 30 32 34 18 680 x 0.60 0.10 Solder Ball AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Assembly Recommendations Table 3. Recommended Reflow Soldering Profile Profile Feature Sn-Pb Eutectic Assembly Pb Free Reflow Assembly Average ramp-up rate 3C/Second Max 3C/Second Max Preheat * Temperature Min * Temperature Max * Time (min to max) 100C 150C 60-120 Seconds 150C 180C 60-120 Seconds Time Maintained Above: * Temperature * Time 183C 60-150 Seconds 230C 30-50 Seconds Peak Temperature 225 +0/-5C 260 +5/-0C Time within 5C of Actual Peak Temperature 10-30 Seconds 10-20 Seconds Ramp-down Rate 6C/Second Max 6C/Second Max Time 25C to Peak Temperature 6 Minutes Max 8 Minutes Max Table 4. JEDEC Moisture Sensitivity Level and Ball Composition Sn-Pb Eutectic Assembly Pb Free Reflow Assembly MSL Level 3 3 Solder Ball Metallurgy 63Sn/37Pb Sn/4Ag/05Cu AppliedMicro Proprietary 19 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Signal Lists The following table lists all the external signals in alphabetical order and shows the ball (pin) number on which the signal appears. Multiplexed signals are shown with the default signal (following reset) not in brackets and alternate signals in brackets. Multiplexed signals appear alphabetically multiple times in the list--once for each signal name on the ball. The page number listed gives the page in Table 8 on page 57 where the signals in the indicated interface group begin. In cases where signals in the same interface group (for example, Ethernet) have different names to distinguish variations in the mode of operation, the names are separated by a comma with the primary mode name appearing first. In cases where the signals have the same function but are associated with different ports (for example, UART), the signals are separated by a slash (/). These signals are listed only once, and appear alphabetically by the primary mode or primary port name. Alphabetical Signal List Table 5. Signals Listed Alphabetically (Sheet 1 of 25) Signal Name Ball AGND AP25 AVDD AP24 BA0 AJ03 BA1 AK03 BA2 AP08 BankSel0 AH02 BankSel1 AH01 [BusReq][USB2TermSel]GPIO31 Interface Group Page Power 65 DDR SDRAM 58 DDR SDRAM 58 P04 External Master Peripheral 61 CAS AH04 DDR SDRAM 58 ClkEn AN09 DDR SDRAM 58 DM0 AL21 DM1 AM18 DM2 AP15 DM3 AL14 DM4 AE04 DDR SDRAM 58 DM5 AB03 DM6 Y01 DM7 U03 DM8 AN10 [DMAAck0][IRQ8]GPIO47 T34 [DMAAck1][IRQ4]GPIO44 V32 [DMAAck2][PerAddr06]GPIO01 C25 External Slave Peripheral 60 [DMAAck3][PerAddr03]GPIO04 D26 [DMAReq0][IRQ7]GPIO46 U32 [DMAReq1]IRQ5[ModeCtrl] W34 [DMAReq2][PerAddr07]GPIO00 B25 External Slave Peripheral 60 [DMAReq3][PerAddr04]GPIO03 A26 20 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 2 of 25) Signal Name Ball DQS0 AM21 DQS1 AM19 DQS2 AL16 DQS3 AM13 DQS4 AE03 DQS5 AB04 DQS6 W04 DQS7 U04 DQS8 AP10 [DrvrInh1]USB2LS0 R02 [DrvrInh2]Halt E32 EAGND AP27 EAVDD AP28 ECC0 AM11 ECC1 AL11 ECC2 AM09 ECC3 AL09 ECC4 AP11 ECC5 AN11 ECC6 AM10 ECC7 AP09 [EOT0/TC0][IRQ9]GPIO48 T32 [EOT1/TC1][IRQ6]GPIO45 U33 [EOT2/TC2][PerAddr05]GPIO02 D25 [EOT3/TC3][PerAddr02]GPIO05 C26 EOVDD AA22 EOVDD AB21 EOVDD AC33 EOVDD AF30 EOVDD AH30 EOVDD AJ30 EOVDD AK26 EOVDD AK28 EOVDD AK29 EOVDD AK33 EOVDD AN23 EOVDD AN30 [ExtAck][USB2XcvrSel]GPIO30 M03 AppliedMicro Proprietary Interface Group Page DDR SDRAM 58 System 64 Power 65 DDR SDRAM 58 External Slave Peripheral 60 Power 65 External Master Peripheral 61 21 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 3 of 25) Signal Name Ball Interface Group Page [ExtReq][USB2RxErr]GPIO27 A04 External Master Peripheral 61 ExtReset D06 External Master Peripheral 61 GMCCD, GMC1RxClk AJ32 GMCCrS, GMC1TxClk AK32 GMCGTxClk, GMC0TxClk AM27 GMCMDClk AL34 GMCMDIO AK34 GMCRefClk, SMIIRefClk AJ33 GMCRxClk, GMC0RxClk, SMIISync AN28 GMCRxD0, GMC0RxD0, SMII0RxD AL28 GMCRxD1, GMC0RxD1, SMII1RxD AP29 GMCRxD2, GMC0RxD2 AM28 GMCRxD3, GMC0RxD3 AN29 GMCRxD4, GMC1RxD0 AM29 GMCRxD5, GMC1RxD1 AP30 GMCRxD6, GMC1RxD2 AP31 GMCRxD7, GMC1RxD3 AM30 Ethernet 59 GMCRxDV, GMC0RxCtl AJ31 GMCRxEr, GMC1RxCtl AL33 GMCTxClk AL27 GMCTxD0, GMC0TxD0, SMII0TxD AL24 GMCTxD1, GMC0TxD1, SMII1TxD AN25 [GMCTxD2, GMC0TxD2] GPIO24 AM25 [GMCTxD3, GMC0TxD3] GPIO25 AL25 [GMCTxD4, GMC1TxD0] GPIO16 AP26 [GMCTxD5, GMC1TxD1] GPIO17 AL26 [GMCTxD6, GMC1TxD2] GPIO18 AN26 [GMCTxD7, GMC1TxD3] GPIO19 AM26 GMCTxEr, GMC1TxCtl AM24 GMCTxEn, GMC0TxCtl AN24 22 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 4 of 25) Signal Name Ball GND A01 GND A02 GND A03 GND A28 GND A32 GND A33 GND A34 GND B01 GND B02 GND B03 GND B04 GND B08 GND B16 GND B19 GND B26 GND B27 GND B31 GND B32 GND B33 GND B34 GND C02 GND C03 GND C04 GND C31 GND C32 GND C33 GND C34 GND D03 GND D04 GND D05 GND D30 GND D31 GND D32 GND D33 GND E05 GND E08 GND E10 AppliedMicro Proprietary Interface Group Power Page 65 23 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 5 of 25) Signal Name Ball GND E16 GND E18 GND E19 GND E25 GND E27 GND E30 GND E31 GND H01 GND H02 GND H05 GND H30 GND H33 GND K05 GND K30 GND N01 GND N04 GND N13 GND N15 GND N17 GND N18 GND N20 GND N22 GND P14 GND P15 GND P17 GND P18 GND P20 GND P21 GND R13 GND R14 GND R15 GND R16 GND R17 GND R18 GND R19 GND R20 GND R21 24 Interface Group Power Page 65 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 6 of 25) Signal Name Ball GND R22 GND T02 GND T05 GND T15 GND T16 GND T17 GND T18 GND T19 GND T20 GND T30 GND T33 GND U05 GND U13 GND U14 GND U15 GND U16 GND U17 GND U18 GND U19 GND U20 GND U21 GND U22 GND V13 GND V14 GND V15 GND V16 GND V17 GND V18 GND V19 GND V20 GND V21 GND V22 GND V30 GND W02 GND W05 GND W15 GND W16 AppliedMicro Proprietary Interface Group Power Page 65 25 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 7 of 25) Signal Name Ball GND W17 GND W18 GND W19 GND W20 GND W30 GND W33 GND Y13 GND Y14 GND Y15 GND Y16 GND Y17 GND Y18 GND Y19 GND Y20 GND Y21 GND Y22 GND AA14 GND AA15 GND AA17 GND AA18 GND AA20 GND AA21 GND AB13 GND AB15 GND AB17 GND AB18 GND AB20 GND AB22 GND AD01 GND AE05 GND AE30 GND AG02 GND AG05 GND AG30 GND AG33 GND AJ01 GND AK04 26 Interface Group Power Page 65 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 8 of 25) Signal Name Ball GND AK05 GND AK08 GND AK10 GND AK16 GND AK17 GND AK19 GND AK25 GND AK27 GND AK30 GND AK31 GND AL03 GND AL04 GND AL05 GND AL06 GND AL29 GND AL30 GND AL31 GND AL32 GND AM01 GND AM02 GND AM03 GND AM04 GND AM31 GND AM32 GND AM33 GND AM34 GND AN01 GND AN02 GND AN03 GND AN04 GND AN08 GND AN16 GND AN19 GND AN27 GND AN31 GND AN32 GND AN33 AppliedMicro Proprietary Interface Group Power Page 65 27 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 9 of 25) Signal Name Ball GND AN34 GND AP01 GND AP02 GND AP03 GND AP32 GND AP33 GND AP34 GPIO00[PerAddr07][DMAReq2] B25 GPIO01[PerAddr06][DMAAck2] C25 GPIO02[PerAddr05][EOT2/TC2] D25 GPIO03[PerAddr04][DMAReq3] A26 GPIO04[PerAddr03][DMAAck3] D26 GPIO05[PerAddr02][EOT3/TC3] C26 GPIO06[PerCS1][NFCE1] B09 GPIO07[PerCS2][NFCE2] D09 GPIO08[PerCS3][NFCE3] D08 GPIO09[PerCS4] A09 GPIO10[PerCS5] A08 GPIO11[PerErr] C07 GPIO12[NFREn] D17 GPIO13[NFWEn] A16 GPIO14[NFCLE] A18 GPIO15[NFALE] B17 GPIO16[GMCTxD4, GMC1TxD0] AP26 GPIO17[GMCTxD5, GMC1TxD1] AL26 GPIO18[GMCTxD6, GMC1TxD2] AN26 GPIO19[GMCTxD7, GMC1TxD3] AM26 GPIO20[RejectPkt0] AM23 GPIO21[RejectPkt1] AL23 GPIO22[NFRdyBusy] A17 GPIO23[SCPDO] AB31 GPIO24[GMCTxD2, GMC0TxD2] AM25 GPIO25[GMCTxD3, GMC0TxD3] AL25 [GPIO26]IIC0SData AB33 GPIO27[USB2RxErr][ExtReq] A04 GPIO28[USB2TxVal] C06 GPIO29[USB2Susp][HoldAck] C05 GPIO30[USB2XcvrSel][ExtAck] M03 GPIO31[USB2TermSel][BusReq] P04 28 Interface Group Page Power 65 System 64 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 10 of 25) Signal Name Ball GPIO32[USB2OM0][PerDataPar2] R03 GPIO33[USB2OM1][PerDataPar3] R04 GPIO34[UART0_DCD/UART1_CTS/UART2_Tx] C28 GPIO35[UART0_DSR/UART1_RTS/UART2_Rx] C29 GPIO36[UART0_CTS/UART3_Rx][PerDataPar0] A29 GPIO37[UART0_RTS/UART3_Tx][PerDataPar1] B29 GPIO38[UART0_DTR/UART1_Tx] D28 GPIO39[UART0_RI/UART1_Rx] B28 GPIO40[IRQ0] AD33 GPIO41[IRQ1] AC31 GPIO42[IRQ2] AD34 GPIO43[IRQ3] U34 GPIO44[IRQ4][DMAAck1] V32 GPIO45[IRQ6][EOT1/TC1] U33 GPIO46[IRQ7][DMAReq0] U32 GPIO47[IRQ8[DMAAck0] T34 GPIO48[IRQ9][EOT0/TC0] T32 GPIO49[TrcBS0] AE34 GPIO50[TrcBS1] AE32 GPIO51[TrcBS2] AE33 GPIO52[TrcES0] AE31 GPIO53[TrcES1] AF34 GPIO54[TrcES2] AF33 GPIO55[TrcES3] AF32 GPIO56[TrcES4] AF31 GPIO57[TrcTS0] AG34 GPIO58[TrcTS1] AG31 GPIO59[TrcTS2] AH33 GPIO60[TrcTS3] AH34 GPIO61[TrcTS4] AH32 GPIO62[TrcTS5] AJ34 GPIO63[TrcTS6] AH31 Halt[DrvrInh2] E32 [HoldAck][USB2Susp]GPIO29 C05 [HoldPri]USB2LS1[LeakTest] P01 [HoldReq]USB2RxAct[RcvrInh] D07 IIC0SClk AB32 IIC0SData[GPIO26] AB33 AppliedMicro Proprietary Interface Group Page System 64 System 64 External Master Peripheral 61 IIC0 Peripheral 61 29 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 11 of 25) Signal Name Ball [IIC1SClk]SCPClkOut AC34 [IIC1SData]SCPDI AC32 [IRQ0]GPIO40 AD33 [IRQ1]GPIO41 AC31 [IRQ2]GPIO42 AD34 [IRQ3]GPIO43 U34 [IRQ4]GPIO44[DMAAck1] V32 IRQ5[ModeCtrl][DMAReq1] W34 [IRQ6]GPIO45[EOT1/TC1] U33 [IRQ7]GPIO46[DMAReq0] U32 [IRQ8]GPIO47[DMAAck0] T34 [IRQ9]GPIO48[EOT0/TC0] T32 [LeakTest]USB2LS1[HoldPri] P01 [LeakTest2]USB2RxDV C08 MemAddr00 AM05 MemAddr01 AP04 MemAddr02 AP05 MemAddr03 AM06 MemAddr04 AP06 MemAddr05 AN06 MemAddr06 AL07 MemAddr07 AN07 MemAddr08 AM07 MemAddr09 AP07 MemAddr10 AL02 MemAddr11 AL08 MemAddr12 AM08 MemAddr13 AG04 MemClkOut AL01 MemClkOut AK01 30 Interface Group Page IIC1 Peripheral 61 Interrupts 63 System 64 DDR SDRAM 58 DDR SDRAM 58 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 12 of 25) Signal Name Ball MemData00 AN22 MemData01 AP22 MemData02 AM20 MemData03 AL20 MemData04 AL22 MemData05 AM22 MemData06 AN21 MemData07 AP21 MemData08 AP20 MemData09 AL18 MemData10 AN17 MemData11 AP17 MemData12 AN20 MemData13 AP19 MemData14 AN18 MemData15 AP18 MemData16 AM16 MemData17 AP16 MemData18 AL15 MemData19 AP14 MemData20 AL17 MemData21 AM17 MemData22 AN15 MemData23 AM15 MemData24 AP13 MemData25 AN13 MemData26 AP12 MemData27 AL12 MemData28 AM14 MemData29 AN14 MemData30 AL13 MemData31 AM12 AppliedMicro Proprietary Interface Group DDR SDRAM Page 58 31 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 13 of 25) Signal Name Ball MemData32 AF03 MemData33 AF01 MemData34 AD04 MemData35 AD03 MemData36 AG03 MemData37 AF02 MemData38 AE02 MemData39 AE01 MemData40 AC03 MemData41 AC01 MemData42 AA04 MemData43 AA03 MemData44 AD02 MemData45 AC04 MemData46 AB01 MemData47 AB02 MemData48 Y03 MemData49 Y02 MemData50 V04 MemData51 V03 MemData52 AA02 MemData53 AA01 MemData54 W03 MemData55 W01 MemData56 U01 MemData57 U02 MemData58 T04 MemData59 R01 MemData60 V02 MemData61 V01 MemData62 T01 MemData63 T03 MemODT0 AH03 MemODT1 AG01 [ModeCtrl]IRQ5[DMAReq1] W34 32 Interface Group Page DDR SDRAM 58 DDR SDRAM 58 System 64 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 14 of 25) Signal Name Ball [NFALE]GPIO15 B17 [NFCE0]PerCS0 D10 [NFCE1][PerCS1]GPIO06 B09 [NFCE2][PerCS2]GPIO07 D09 [NFCE3][PerCS3]GPIO08 D08 [NFCLE]GPIO14 A18 [NFRdyBusy]GPIO22 A17 [NFREn]GPIO12 D17 [NFWEn]GPIO13 A16 No ball F06-F29 No ball G06-G29 No ball H06-H29 No ball J06-J29 No ball K06-K29 No ball L06-L29 No ball M06-M29 No ball N06-N12 No ball N23-N29 No ball P06-P12 No ball P23-P29 No ball R06-R12 No ball R23-R29 No ball T06-T12 No ball T23-T29 No ball U06-U12 No ball U23-U29 No ball V06-V12 No ball V23-V29 No ball W06-W12 No ball W23-W29 No ball Y06-Y12 No ball Y23-Y29 No ball AA06-AA12 No ball AA23-AA29 No ball AB06-AB12 No ball AB23-AB29 AppliedMicro Proprietary Interface Group Page NAND Flash 62 A physical ball does not exist at these ball coordinates. NA 33 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 15 of 25) Signal Name Ball No ball AC06-AC29 No ball AD06-AD29 No ball AE06-AE29 No ball AF06-AF29 No ball AG06-AG29 No ball AH06-AH29 No ball AJ06-AJ29 OVDD B05 OVDD B12 OVDD B23 OVDD B30 OVDD E02 OVDD E06 OVDD E07 OVDD E09 OVDD E17 OVDD E26 OVDD E28 OVDD E29 OVDD E33 OVDD F05 OVDD F30 OVDD G05 OVDD G30 OVDD J05 OVDD J30 OVDD M02 OVDD M33 OVDD N14 OVDD N21 OVDD P13 OVDD P22 OVDD U30 34 Interface Group Page A physical ball does not exist at these ball coordinates. NA Power 65 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 16 of 25) Signal Name Ball PCIAD00 D29 PCIAD01 A30 PCIAD02 C30 PCIAD03 A31 PCIAD04 D34 PCIAD05 F31 PCIAD06 E34 PCIAD07 F32 PCIAD08 F33 PCIAD09 F34 PCIAD10 G31 PCIAD11 G33 PCIAD12 G34 PCIAD13 H31 PCIAD14 H32 PCIAD15 H34 PCIAD16 L31 PCIAD17 L33 PCIAD18 M32 PCIAD19 M31 PCIAD20 M34 PCIAD21 N31 PCIAD22 N33 PCIAD23 N32 PCIAD24 P31 PCIAD25 P33 PCIAD26 P32 PCIAD27 P34 PCIAD28 R31 PCIAD29 R32 PCIAD30 R33 PCIAD31 R34 PCIC0/BE0 G32 PCIC1/BE1 J31 PCIC2/BE2 L34 PCIC3/BE3 N34 PCIClk Interface Group Page PCI 57 PCI 57 AA32 PCI 57 PCIDevSel K32 PCI 57 PCIFrame L32 PCI 57 AppliedMicro Proprietary 35 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 17 of 25) Signal Name Ball PCIGnt0/Req Y34 PCIGnt1 Y33 PCIGnt2 Y32 PCIGnt3 Y31 PCIGnt4 AA33 PCIGnt5 AA34 PCIIDSel Interface Group Page PCI 57 T31 PCI 57 PCIINT AB34 PCI 57 PCIIRDY K33 PCI 57 PCIPar J32 PCI 57 PCIPErr J33 PCI 57 PCIReq0/Gnt V34 PCIReq1 U31 PCIReq2 V33 PCIReq3 V31 PCI 57 PCIReq4 W32 PCIReq5 W31 PCIReset AA31 PCI 57 PCISErr J34 PCI 57 PCIStop K31 PCI 57 PCITRDY K34 PCI 57 36 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 18 of 25) Signal Name Ball [PerAddr02]GPIO05[EOT3/TC3] C26 [PerAddr03]GPIO04[DMAAck3] D26 [PerAddr04]GPIO03[DMAReq3] A26 [PerAddr05]GPIO02[EOT2/TC2] D25 [PerAddr06]GPIO01[DMAAck2] C25 [PerAddr07]GPIO00[DMAReq2] B25 PerAddr08 A25 PerAddr09 C24 PerAddr10 D24 PerAddr11 B24 PerAddr12 D23 PerAddr13 A24 PerAddr14 C23 PerAddr15 A23 PerAddr16 D22 PerAddr17 C22 PerAddr18 A22 PerAddr19 D21 PerAddr20 C21 PerAddr21 B21 PerAddr22 A21 PerAddr23 D20 PerAddr24 C20 PerAddr25 B20 PerAddr26 D19 PerAddr27 C19 PerAddr28 A19 PerAddr29 D18 PerAddr30 C18 PerAddr31 B18 PerBLast Interface Group Page External Slave Peripheral 60 B07 External Slave Peripheral 60 PerClk A07 External Master Peripheral 61 PerCS0[NFCE0] D10 [PerCS1][NFCE1]GPIO06 B09 [PerCS2][NFCE2]GPIO07 D09 [PerCS3][NFCE3]GPIO08 D08 External Slave Peripheral 60 [PerCS4]GPIO09 A09 [PerCS5]GPIO10 A08 AppliedMicro Proprietary 37 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 19 of 25) Signal Name Ball PerData00 C14 PerData01 D14 PerData02 A13 PerData03 B13 PerData04 C13 PerData05 D13 PerData06 A12 PerData07 C12 PerData08 A11 PerData09 D12 PerData10 B11 PerData11 C11 PerData12 D11 PerData13 A10 PerData14 B10 PerData15 C10 PerData16[USB2DO0] E03 PerData17[USB2DO1] C01 PerData18[USB2DO2] D02 PerData19[USB2DO3] E04 PerData20[USB2DO4] D01 PerData21[USB2DO5] E01 PerData22[USB2DO6] F04 PerData23[USB2DO7] F03 PerData24[USB2DI0] F02 PerData25[USB2DI1] F01 PerData26[USB2DI2] G03 PerData27[USB2DI3] G04 PerData28[USB2DI4] G02 PerData29[USB2DI5] G01 PerData30[USB2DI6] H04 PerData31[USB2DI7] H03 [PerDataPar0]GPIO36[UART0_CTS/UART3_Rx] A29 [PerDataPar1]GPIO37[UART0_RTS//UART3_Tx] B29 [PerDataPar2]GPIO32[USB2OM0] R03 [PerDataPar3]GPIO33[USB2OM1] R04 [PerErr]GPIO11 Interface Group Page External Slave Peripheral 60 C07 External Master Peripheral 60 PerOE B14 External Slave Peripheral 60 PerReady C17 External Slave Peripheral 60 38 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 20 of 25) Signal Name Ball PerR/W A14 PerWBE0 A15 PerWBE1 B15 PerWBE2 C15 PerWBE3 D15 PSROOut Interface Group Page External Slave Peripheral 60 External Slave Peripheral 60 A20 System 64 RAS AJ04 DDR SDRAM 58 [RcvrInh]USB2RxAct[HoldReq] D07 System 64 [RefEn]USB2TxRdy B06 System 64 [RejectPkt0]GPIO20 AM23 [RejectPkt1]GPIO21 AL23 Ethernet 59 SCPClkOut[IIC1SClk] AC34 SCPDI[IIC1SData] AC32 Serial Peripheral (SPI) 63 [SCPDO]GPIO23 AB31 SOVDD V05 SOVDD AA13 SOVDD AB14 SOVDD AC02 SOVDD AF05 SOVDD AH05 SOVDD AJ05 SOVDD AK02 Power 65 SOVDD AK06 SOVDD AK07 SOVDD AK09 SOVDD AK18 SOVDD AN05 SOVDD AN12 SVREF1A Y04 SVREF1B AL10 SVREF2A AF04 DDR SDRAM 58 SVREF2B AL19 SysClk AP23 System 64 SysErr AD32 System 64 SysReset AD31 System 64 TCK P02 JTAG 63 TDI K03 JTAG 63 AppliedMicro Proprietary 39 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 21 of 25) Signal Name Ball Interface Group Page TDO B22 JTAG 63 TestEn C09 System 64 TherMonA C16 TherMonB D16 System 64 TmrClk P03 System 64 TMS K02 JTAG 63 [TrcBS0]GPIO49 AE34 [TrcBS1]GPIO50 AE32 Trace 65 [TrcBS2]GPIO51 AE33 TrcClk AG32 Trace 65 [TrcES0]GPIO52 AE31 [TrcES1]GPIO53 AF34 [TrcES2]GPIO54 AF33 Trace 65 [TrcES3]GPIO55 AF32 [TrcES4]GPIO56 AF31 [TrcTS0]GPIO57 AG34 [TrcTS1]GPIO58 AG31 [TrcTS2]GPIO59 AH33 [TrcTS3]GPIO60 AH34 Trace 65 [TrcTS4]GPIO61 AH32 [TrcTS5]GPIO62 AJ34 [TrcTS6]GPIO63 AH31 TRST A06 JTAG 63 [UART0_CTS/UART3_Rx]GPIO36[PerDataPar0] A29 [UART0_DCD/UART1_CTS/UART2_Tx]GPIO34 C28 [UART0_DSR/UART1_RTS/UART2_Rx]GPIO35 C29 [UART0_DTR/UART1_Tx]GPIO38 D28 [UART0_RI/UART1_Rx]GPIO39 B28 UART Peripheral 61 [UART0_RTS/UART3_Tx]GPIO37[PerDataPar1] B29 UART0_Rx C27 UARTSerClk A27 UART0_Tx D27 40 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 22 of 25) Signal Name Ball U1AVDD L01 U1AVDD L02 U2AVDD J04 U2AVDD L04 U1AGND M01 U1AGND M04 U2AGND J03 U2AGND K04 UA2GND K01 USB2Clk A05 [USB2DI0]PerData24 F02 [USB2DI1]PerData25 F01 [USB2DI2]PerData26 G03 [USB2DI3]PerData27 G04 [USB2DI4]PerData28 G02 [USB2DI5]PerData29 G01 [USB2DI6]PerData30 H04 [USB2DI7]PerData31 H03 [USB2DO0]PerData16 E03 [USB2DO1]PerData17 C01 [USB2DO2]PerData18 D02 [USB2DO3]PerData19 E04 [USB2DO4]PerData20 D01 [USB2DO5]PerData21 E01 [USB2DO6]PerData22 F04 [USB2DO7]PerData23 F03 USB2LS0[DrvrInh1] R02 USB2LS1[LeakTest][HoldPri] P01 [USB2OM0]GPIO32[PerDataPar2] R03 [USB2OM1]GPIO33[PerDataPar3] R04 USB2RExt Interface Group Page Power 65 Universal Serial Bus 62 Universal Serial Bus 62 Universal Serial Bus 62 Universal Serial Bus 62 Universal Serial Bus 62 L03 Universal Serial Bus 62 USB2RxAct[HoldReq][RcvrInh] D07 Universal Serial Bus 62 USB2RxDV[LeakTest2] C08 Universal Serial Bus 62 [USB2RxErr]GPIO27[ExtReq] A04 Universal Serial Bus 62 [USB2Susp]GPIO29[HoldAck] C05 Universal Serial Bus 62 [USB2TermSel]GPIO31[BusReq] P04 Universal Serial Bus 62 USB2TxRdy[RefEn] B06 Universal Serial Bus 62 [USB2TxVal]GPIO28 C06 Universal Serial Bus 62 AppliedMicro Proprietary 41 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 23 of 25) Signal Name Ball [USB2XcvrSel]GPIO30[ExtAck] M03 USB2Xcvr J02 USB2Xcvr J01 USB2XtalIn N02 USB2XtalOut N03 42 Interface Group Page Universal Serial Bus 62 Universal Serial Bus 62 Universal Serial Bus 62 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 5. Signals Listed Alphabetically (Sheet 24 of 25) Signal Name Ball VDD E11 VDD E12 VDD E13 VDD E14 VDD E15 VDD E20 VDD E21 VDD E22 VDD E23 VDD E24 VDD L05 VDD L30 VDD M05 VDD M30 VDD N05 VDD N16 VDD N19 VDD N30 VDD P05 VDD P16 VDD P19 VDD P30 VDD R05 VDD R30 VDD T13 VDD T14 VDD T21 VDD T22 VDD W13 VDD W14 VDD W21 VDD W22 VDD Y05 VDD Y30 AppliedMicro Proprietary Interface Group Power Page 65 43 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 5. Signals Listed Alphabetically (Sheet 25 of 25) Signal Name Ball VDD AA05 VDD AA16 VDD AA19 VDD AA30 VDD AB05 VDD AB16 VDD AB19 VDD AB30 VDD AC05 VDD AC30 VDD AD05 VDD AD30 VDD AK11 VDD AK12 VDD AK13 VDD AK14 VDD AK15 VDD AK20 VDD AK21 VDD AK22 VDD AK23 VDD AK24 WE AJ02 44 Interface Group Page Power 65 DDR SDRAM 58 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Signals in Ball Assignment Order In the following table, only the primary (default) signal name is shown for each ball. Multiplexed or multifunction signals are marked with an asterisk (*). To determine what other signals or functions are on those balls, look up the primary signal name in Table 5 on page 20. AppliedMicro Proprietary 45 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 1 of 9) Ball 46 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name A01 GND B01 GND C01 PerData17* D01 PerData20* A02 GND B02 GND C02 GND D02 PerData18* A03 GND B03 GND C03 GND D03 GND A04 GPIO27* B04 GND C04 GND D04 GND A05 USB2Clk B05 OVDD C05 GPIO29* D05 GND A06 TRST B06 USB2TxRdy* C06 GPIO28* D06 ExtReset A07 PerClk B07 PerBLast C07 GPIO11* D07 USB2RxAct* A08 GPIO10* B08 GND C08 USB2RxDV* D08 GPIO08* A09 GPIO09* B09 GPIO06* C09 TestEn D09 GPIO07* A10 PerData13 B10 PerData14 C10 PerData15 D10 PerCS0* A11 PerData08 B11 PerData10 C11 PerData11 D11 PerData12 A12 PerData06 B12 OVDD C12 PerData07 D12 PerData09 A13 PerData02 B13 PerData03 C13 PerData04 D13 PerData05 A14 PerR/W B14 PerOE C14 PerData00 D14 PerData01 A15 PerWBE0 B15 PerWBE1 C15 PerWBE2 D15 PerWBE3 A16 GPIO13* B16 GND C16 TherMonA D16 TherMonB A17 GPIO22* B17 GPIO15* C17 PerReady D17 GPIO12* A18 GPIO14* B18 PerAddr31 C18 PerAddr30 D18 PerAddr29 A19 PerAddr28 B19 GND C19 PerAddr27 D19 PerAddr26 A20 PSROOut B20 PerAddr25 C20 PerAddr24 D20 PerAddr23 A21 PerAddr22 B21 PerAddr21 C21 PerAddr20 D21 PerAddr19 A22 PerAddr18 B22 TDO C22 PerAddr17 D22 PerAddr16 A23 PerAddr15 B23 OVDD C23 PerAddr14 D23 PerAddr12 A24 PerAddr13 B24 PerAddr11 C24 PerAddr09 D24 PerAddr10 A25 PerAddr08 B25 GPIO00* C25 GPIO01* D25 GPIO02* A26 GPIO03* B26 GND C26 GPIO05* D26 GPIO04* A27 UARTSerClk B27 GND C27 UART0_Rx D27 UART0_Tx A28 GND B28 GPIO39* C28 GPIO34* D28 GPIO38* A29 GPIO36* B29 GPIO37* C29 GPIO35* D29 PCIAD00 A30 PCIAD01 B30 OVDD C30 PCIAD02 D30 GND A31 PCIAD03 B31 GND C31 GND D31 GND A32 GND B32 GND C32 GND D32 GND A33 GND B33 GND C33 GND D33 GND A34 GND B34 GND C34 GND D34 PCIAD04 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 2 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name E01 PerData21* F01 PerData25* G01 PerData29* H01 GND E02 OVDD F02 PerData24* G02 PerData28* H02 GND E03 PerData16* F03 PerData23* G03 PerData26* H03 PerData31* E04 PerData19* F04 PerData22* G04 PerData27* H04 PerData30* E05 GND F05 OVDD G05 OVDD H05 GND E06 OVDD F06 No Ball G06 No Ball H06 No Ball E07 OVDD F07 No Ball G07 No Ball H07 No Ball E08 GND F08 No Ball G08 No Ball H08 No Ball E09 OVDD F09 No Ball G09 No Ball H09 No Ball E10 GND F10 No Ball G10 No Ball H10 No Ball E11 VDD F11 No Ball G11 No Ball H11 No Ball E12 VDD F12 No Ball G12 No Ball H12 No Ball E13 VDD F13 No Ball G13 No Ball H13 No Ball E14 VDD F14 No Ball G14 No Ball H14 No Ball E15 VDD F15 No Ball G15 No Ball H15 No Ball E16 GND F16 No Ball G16 No Ball H16 No Ball E17 OVDD F17 No Ball G17 No Ball H17 No Ball E18 GND F18 No Ball G18 No Ball H18 No Ball E19 GND F19 No Ball G19 No Ball H19 No Ball E20 VDD F20 No Ball G20 No Ball H20 No Ball E21 VDD F21 No Ball G21 No Ball H21 No Ball E22 VDD F22 No Ball G22 No Ball H22 No Ball E23 VDD F23 No Ball G23 No Ball H23 No Ball E24 VDD F24 No Ball G24 No Ball H24 No Ball E25 GND F25 No Ball G25 No Ball H25 No Ball E26 OVDD F26 No Ball G26 No Ball H26 No Ball E27 GND F27 No Ball G27 No Ball H27 No Ball E28 OVDD F28 No Ball G28 No Ball H28 No Ball E29 OVDD F29 No Ball G29 No Ball H29 No Ball E30 GND F30 OVDD G30 OVDD H30 GND E31 GND F31 PCIAD05 G31 PCIAD10 H31 PCIAD13 E32 Halt* F32 PCIAD07 G32 PCIC0/BE0 H32 PCIAD14 E33 OVDD F33 PCIAD08 G33 PCIAD11 H33 GND E34 PCIAD06 F34 PCIAD09 G34 PCIAD12 H34 PCIAD15 AppliedMicro Proprietary 47 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 3 of 9) Ball 48 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name J01 USB2Xcvr K01 U2AGND L01 U1AVDD M01 U1AGND J02 USB2Xcvr K02 TMS L02 U1AVDD M02 OVDD J03 U2AGND K03 TDI L03 USB2RExt M03 GPIO30* J04 U2AVDD K04 U2AGND L04 U2AVDD M04 U1AGND J05 OVDD K05 GND L05 VDD M05 VDD J06 No Ball K06 No Ball L06 No Ball M06 No Ball J07 No Ball K07 No Ball L07 No Ball M07 No Ball J08 No Ball K08 No Ball L08 No Ball M08 No Ball J09 No Ball K09 No Ball L09 No Ball M09 No Ball J10 No Ball K10 No Ball L10 No Ball M10 No Ball J11 No Ball K11 No Ball L11 No Ball M11 No Ball J12 No Ball K12 No Ball L12 No Ball M12 No Ball J13 No Ball K13 No Ball L13 No Ball M13 No Ball J14 No Ball K14 No Ball L14 No Ball M14 No Ball J15 No Ball K15 No Ball L15 No Ball M15 No Ball J16 No Ball K16 No Ball L16 No Ball M16 No Ball J17 No Ball K17 No Ball L17 No Ball M17 No Ball J18 No Ball K18 No Ball L18 No Ball M18 No Ball J19 No Ball K19 No Ball L19 No Ball M19 No Ball J20 No Ball K20 No Ball L20 No Ball M20 No Ball J21 No Ball K21 No Ball L21 No Ball M21 No Ball J22 No Ball K22 No Ball L22 No Ball M22 No Ball J23 No Ball K23 No Ball L23 No Ball M23 No Ball J24 No Ball K24 No Ball L24 No Ball M24 No Ball J25 No Ball K25 No Ball L25 No Ball M25 No Ball J26 No Ball K26 No Ball L26 No Ball M26 No Ball J27 No Ball K27 No Ball L27 No Ball M27 No Ball J28 No Ball K28 No Ball L28 No Ball M28 No Ball J29 No Ball K29 No Ball L29 No Ball M29 No Ball J30 OVDD K30 GND L30 VDD M30 VDD J31 PCIC1/BE1 K31 PCIStop L31 PCIAD16 M31 PCIAD19 J32 PCIPar K32 PCIDevSel L32 PCIFrame M32 PCIAD18 J33 PCIPErr K33 PCIIRDY L33 PCIAD17 M33 OVDD J34 PCISErr K34 PCITRDY L34 PCIC2/BE2 M34 PCIAD20 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 4 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name N01 GND P01 USB2LS1* R01 MemData59 T01 MemData62 N02 USB2XtalIn P02 TCK R02 USB2LS0* T02 GND N03 USB2XtalOut P03 TmrClk R03 GPIO32* T03 MemData63 N04 GND P04 GPIO31* R04 GPIO33* T04 MemData58 N05 VDD P05 VDD R05 VDD T05 GND N06 No Ball P06 No Ball R06 No Ball T06 No Ball N07 No Ball P07 No Ball R07 No Ball T07 No Ball N08 No Ball P08 No Ball R08 No Ball T08 No Ball N09 No Ball P09 No Ball R09 No Ball T09 No Ball N10 No Ball P10 No Ball R10 No Ball T10 No Ball N11 No Ball P11 No Ball R11 No Ball T11 No Ball N12 No Ball P12 No Ball R12 No Ball T12 No Ball N13 GND P13 OVDD R13 GND T13 VDD N14 OVDD P14 GND R14 GND T14 VDD N15 GND P15 GND R15 GND T15 GND N16 VDD P16 VDD R16 GND T16 GND N17 GND P17 GND R17 GND T17 GND N18 GND P18 GND R18 GND T18 GND N19 VDD P19 VDD R19 GND T19 GND N20 GND P20 GND R20 GND T20 GND N21 OVDD P21 GND R21 GND T21 VDD N22 GND P22 OVDD R22 GND T22 VDD N23 No Ball P23 No Ball R23 No Ball T23 No Ball N24 No Ball P24 No Ball R24 No Ball T24 No Ball N25 No Ball P25 No Ball R25 No Ball T25 No Ball N26 No Ball P26 No Ball R26 No Ball T26 No Ball N27 No Ball P27 No Ball R27 No Ball T27 No Ball N28 No Ball P28 No Ball R28 No Ball T28 No Ball N29 No Ball P29 No Ball R29 No Ball T29 No Ball N30 VDD P30 VDD R30 VDD T30 GND N31 PCIAD21 P31 PCIAD24 R31 PCIAD28 T31 PCIIDSel N32 PCIAD23 P32 PCIAD26 R32 PCIAD29 T32 GPIO48* N33 PCIAD22 P33 PCIAD25 R33 PCIAD30 T33 GND N34 PCIC3/BE3 P34 PCIAD27 R34 PCIAD31 T34 GPIO47* AppliedMicro Proprietary 49 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 5 of 9) Ball 50 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name U01 MemData56 V01 MemData61 W01 MemData55 Y01 DM6 U02 MemData57 V02 MemData60 W02 GND Y02 MemData49 U03 DM7 V03 MemData51 W03 MemData54 Y03 MemData48 U04 DQS7 V04 MemData50 W04 DQS6 Y04 SVREF1A U05 GND V05 SOVDD W05 GND Y05 VDD U06 No Ball V06 No Ball W06 No Ball Y06 No Ball U07 No Ball V07 No Ball W07 No Ball Y07 No Ball U08 No Ball V08 No Ball W08 No Ball Y08 No Ball U09 No Ball V09 No Ball W09 No Ball Y09 No Ball U10 No Ball V10 No Ball W10 No Ball Y10 No Ball U11 No Ball V11 No Ball W11 No Ball Y11 No Ball U12 No Ball V12 No Ball W12 No Ball Y12 No Ball U13 GND V13 GND W13 VDD Y13 GND U14 GND V14 GND W14 VDD Y14 GND U15 GND V15 GND W15 GND Y15 GND U16 GND V16 GND W16 GND Y16 GND U17 GND V17 GND W17 GND Y17 GND U18 GND V18 GND W18 GND Y18 GND U19 GND V19 GND W19 GND Y19 GND U20 GND V20 GND W20 GND Y20 GND U21 GND V21 GND W21 VDD Y21 GND U22 GND V22 GND W22 VDD Y22 GND U23 No Ball V23 No Ball W23 No Ball Y23 No Ball U24 No Ball V24 No Ball W24 No Ball Y24 No Ball U25 No Ball V25 No Ball W25 No Ball Y25 No Ball U26 No Ball V26 No Ball W26 No Ball Y26 No Ball U27 No Ball V27 No Ball W27 No Ball Y27 No Ball U28 No Ball V28 No Ball W28 No Ball Y28 No Ball U29 No Ball V29 No Ball W29 No Ball Y29 No Ball U30 OVDD V30 GND W30 GND Y30 VDD U31 PCIReq1 V31 PCIReq3 W31 PCIReq5 Y31 PCIGnt3 U32 GPIO46* V32 GPIO44* W32 PCIReq4 Y32 PCIGnt2 U33 GPIO45* V33 PCIReq2 W33 GND Y33 PCIGnt1 U34 GPIO43* V34 PCIReq0/Gnt W34 IRQ5* Y34 PCIGnt0/Req AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 6 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name AA01 MemData53 AB01 MemData46 AC01 MemData41 AD01 GND AA02 MemData52 AB02 MemData47 AC02 SOVDD AD02 MemData44 AA03 MemData43 AB03 DM5 AC03 MemData40 AD03 MemData35 AA04 MemData42 AB04 DQS5 AC04 MemData45 AD04 MemData34 AA05 VDD AB05 VDD AC05 VDD AD05 VDD AA06 No Ball AB06 No Ball AC06 No Ball AD06 No Ball AA07 No Ball AB07 No Ball AC07 No Ball AD07 No Ball AA08 No Ball AB08 No Ball AC08 No Ball AD08 No Ball AA09 No Ball AB09 No Ball AC09 No Ball AD09 No Ball AA10 No Ball AB10 No Ball AC10 No Ball AD10 No Ball AA11 No Ball AB11 No Ball AC11 No Ball AD11 No Ball AA12 No Ball AB12 No Ball AC12 No Ball AD12 No Ball AA13 SOVDD AB13 GND AC13 No Ball AD13 No Ball AA14 GND AB14 SOVDD AC14 No Ball AD14 No Ball AA15 GND AB15 GND AC15 No Ball AD15 No Ball AA16 VDD AB16 VDD AC16 No Ball AD16 No Ball AA17 GND AB17 GND AC17 No Ball AD17 No Ball AA18 GND AB18 GND AC18 No Ball AD18 No Ball AA19 VDD AB19 VDD AC19 No Ball AD19 No Ball AA20 GND AB20 GND AC20 No Ball AD20 No Ball AA21 GND AB21 EOVDD AC21 No Ball AD21 No Ball AA22 EOVDD AB22 GND AC22 No Ball AD22 No Ball AA23 No Ball AB23 No Ball AC23 No Ball AD23 No Ball AA24 No Ball AB24 No Ball AC24 No Ball AD24 No Ball AA25 No Ball AB25 No Ball AC25 No Ball AD25 No Ball AA26 No Ball AB26 No Ball AC26 No Ball AD26 No Ball AA27 No Ball AB27 No Ball AC27 No Ball AD27 No Ball AA28 No Ball AB28 No Ball AC28 No Ball AD28 No Ball AA29 No Ball AB29 No Ball AC29 No Ball AD29 No Ball AA30 VDD AB30 VDD AC30 VDD AD30 VDD AA31 PCIReset AB31 GPIO23* AC31 GPIO41* AD31 SysReset AA32 PCIClk AB32 IIC0SClk AC32 SCPDI* AD32 SysErr AA33 PCIGnt4 AB33 IIC0SData* AC33 EOVDD AD33 GPIO40* AA34 PCIGnt5 AB34 PCIINT AC34 SCPClkOut* AD34 GPIO42* AppliedMicro Proprietary 51 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 7 of 9) Ball 52 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name AE01 MemData39 AF01 MemData33 AG01 MemODT1 AH01 BankSel1 AE02 MemData38 AF02 MemData37 AG02 GND AH02 BankSel0 AE03 DQS4 AF03 MemData32 AG03 MemData36 AH03 MemODT0 AE04 DM4 AF04 SVREF2A AG04 MemAddr13 AH04 CAS AE05 GND AF05 SOVDD AG05 GND AH05 SOVDD AE06 No Ball AF06 No Ball AG06 No Ball AH06 No Ball AE07 No Ball AF07 No Ball AG07 No Ball AH07 No Ball AE08 No Ball AF08 No Ball AG08 No Ball AH08 No Ball AE09 No Ball AF09 No Ball AG09 No Ball AH09 No Ball AE10 No Ball AF10 No Ball AG10 No Ball AH10 No Ball AE11 No Ball AF11 No Ball AG11 No Ball AH11 No Ball AE12 No Ball AF12 No Ball AG12 No Ball AH12 No Ball AE13 No Ball AF13 No Ball AG13 No Ball AH13 No Ball AE14 No Ball AF14 No Ball AG14 No Ball AH14 No Ball AE15 No Ball AF15 No Ball AG15 No Ball AH15 No Ball AE16 No Ball AF16 No Ball AG16 No Ball AH16 No Ball AE17 No Ball AF17 No Ball AG17 No Ball AH17 No Ball AE18 No Ball AF18 No Ball AG18 No Ball AH18 No Ball AE19 No Ball AF19 No Ball AG19 No Ball AH19 No Ball AE20 No Ball AF20 No Ball AG20 No Ball AH20 No Ball AE21 No Ball AF21 No Ball AG21 No Ball AH21 No Ball AE22 No Ball AF22 No Ball AG22 No Ball AH22 No Ball AE23 No Ball AF23 No Ball AG23 No Ball AH23 No Ball AE24 No Ball AF24 No Ball AG24 No Ball AH24 No Ball AE25 No Ball AF25 No Ball AG25 No Ball AH25 No Ball AE26 No Ball AF26 No Ball AG26 No Ball AH26 No Ball AE27 No Ball AF27 No Ball AG27 No Ball AH27 No Ball AE28 No Ball AF28 No Ball AG28 No Ball AH28 No Ball AE29 No Ball AF29 No Ball AG29 No Ball AH29 No Ball AE30 GND AF30 EOVDD AG30 GND AH30 EOVDD AE31 GPIO52* AF31 GPIO56* AG31 GPIO58* AH31 GPIO63* AE32 GPIO50* AF32 GPIO55* AG32 TrcClk AH32 GPIO61* AE33 GPIO51* AF33 GPIO54* AG33 GND AH33 GPIO59* AE34 GPIO49* AF34 GPIO53* AG34 GPIO57* AH34 GPIO60* AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 8 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name AJ01 GND AK01 MemClkOut AL01 MemClkOut AM01 GND AJ02 WE AK02 SOVDD AL02 MemAddr10 AM02 GND AJ03 BA0 AK03 BA1 AL03 GND AM03 GND AJ04 RAS AK04 GND AL04 GND AM04 GND AJ05 SOVDD AK05 GND AL05 GND AM05 MemAddr00 AJ06 No Ball AK06 SOVDD AL06 GND AM06 MemAddr03 AJ07 No Ball AK07 SOVDD AL07 MemAddr06 AM07 MemAddr08 AJ08 No Ball AK08 GND AL08 MemAddr11 AM08 MemAddr12 AJ09 No Ball AK09 SOVDD AL09 ECC3 AM09 ECC2 AJ10 No Ball AK10 GND AL10 SVREF1B AM10 ECC6 AJ11 No Ball AK11 VDD AL11 ECC1 AM11 ECC0 AJ12 No Ball AK12 VDD AL12 MemData27 AM12 MemData31 AJ13 No Ball AK13 VDD AL13 MemData30 AM13 DQS3 AJ14 No Ball AK14 VDD AL14 DM3 AM14 MemData28 AJ15 No Ball AK15 VDD AL15 MemData18 AM15 MemData23 AJ16 No Ball AK16 GND AL16 DQS2 AM16 MemData16 AJ17 No Ball AK17 GND AL17 MemData20 AM17 MemData21 AJ18 No Ball AK18 SOVDD AL18 MemData09 AM18 DM1 AJ19 No Ball AK19 GND AL19 SVREF2B AM19 DQS1 AJ20 No Ball AK20 VDD AL20 MemData03 AM20 MemData02 AJ21 No Ball AK21 VDD AL21 DM0 AM21 DQS0 AJ22 No Ball AK22 VDD AL22 MemData04 AM22 MemData05 AJ23 No Ball AK23 VDD AL23 GPIO21* AM23 GPIO20* AJ24 No Ball AK24 VDD AL24 GMCTxD0* AM24 GMCTxEr* AJ25 No Ball AK25 GND AL25 GPIO25* AM25 GPIO24* AJ26 No Ball AK26 EOVDD AL26 GPIO17* AM26 GPIO19* AJ27 No Ball AK27 GND AL27 GMCTxClk AM27 GMCGTxClk* AJ28 No Ball AK28 EOVDD AL28 GMCRxD0* AM28 GMCRxD2* AJ29 No Ball AK29 EOVDD AL29 GND AM29 GMCRxD4* AJ30 EOVDD AK30 GND AL30 GND AM30 GMCRxD7* AJ31 GMCRxDV* AK31 GND AL31 GND AM31 GND AJ32 GMCCD* AK32 GMCCrS* AL32 GND AM32 GND AJ33 GMCRefClk* AK33 EOVDD AL33 GMCRxEr* AM33 GND AJ34 GPIO62* AK34 GMCMDIO AL34 GMCMDClk AM34 GND AppliedMicro Proprietary 53 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 6. Signals Listed by Ball Assignment (Sheet 9 of 9) Ball 54 Signal Name Ball Signal Name AN01 GND AP01 GND AN02 GND AP02 GND AN03 GND AP03 GND AN04 GND AP04 MemAddr01 AN05 SOVDD AP05 MemAddr02 AN06 MemAddr05 AP06 MemAddr04 AN07 MemAddr07 AP07 MemAddr09 AN08 GND AP08 BA2 AN09 ClkEn AP09 ECC7 AN10 DM8 AP10 DQS8 AN11 ECC5 AP11 ECC4 AN12 SOVDD AP12 MemData26 AN13 MemData25 AP13 MemData24 AN14 MemData29 AP14 MemData19 AN15 MemData22 AP15 DM2 AN16 GND AP16 MemData17 AN17 MemData10 AP17 MemData11 AN18 MemData14 AP18 MemData15 AN19 GND AP19 MemData13 AN20 MemData12 AP20 MemData08 AN21 MemData06 AP21 MemData07 AN22 MemData00 AP22 MemData01 AN23 EOVDD AP23 SysClk AN24 GMCTxEn* AP24 AVDD AN25 GMCTxD1* AP25 AGND AN26 GPIO18* AP26 GPIO16* AN27 GND AP27 EAGND AN28 GMCRxClk* AP28 EAVDD AN29 GMCRxD3* AP29 GMCRxD1* AN30 EOVDD AP30 GMCRxD5* AN31 GND AP31 GMCRxD6* AN32 GND AP32 GND AN33 GND AP33 GND AN34 GND AP34 GND Ball Signal Name Ball Signal Name AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Signal Descriptions The PPC440EPx embedded controller is packaged in a 680-ball thermally enhanced plastic ball grid array (TE-EPBGA). The following tables describe the package level pin-out. Table 7. Pin Summary Group No. of Pins Total Signal Pins 367 AVDD 1 AGND 1 EAVDD 1 EAGND 1 UAVDD 4 UAGND 5 OVDD 26 SOVDD 14 EOVDD 12 VDD 56 GND 192 Total Power Pins 313 Reserved 0 Total Pins 680 In the table Table 8 on page 57, each I/O signal is listed along with a short description of its function. Active-low signals (for example, RAS) are marked with an overline. Please see Table 5 on page 20 for the pin (ball) number to which each signal is assigned. Multiplexed Signals Some signals are multiplexed on the same pin so that the pin can be used for different functions. In most cases, the signal names shown in this table are not accompanied by signal names that may be multiplexed on the same pin. If you need to know what, if any, signals are multiplexed with a particular signal, look up the name in Table 5 on page 20. It is expected that in any single application a particular pin will always be programmed to serve the same function. The flexibility of multiplexing allows a single chip to offer a richer pin selection than would otherwise be possible. Note: Signals multiplexed with GPIO default to GPIO receivers and float after reset. Initialization software must configure the GPIO registers for the desired function as described in the GPIO chapter of the user's manual. Any of these signals requiring a particular state prior to running initialization code must be terminated with pull ups or pull downs. Multipurpose Signals In addition to multiplexing, some pins are also multi-purpose. For example, the EBC peripheral controller address pins (PerAddr) are used as outputs by the PPC440EPx to broadcast an address to external slave devices when the PPC440EPx has control of the external bus. When, during normal operation, an external master gains ownership AppliedMicro Proprietary 55 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet of the external bus, these same pins are used as inputs which are driven by the external master and received by the EBC in the PPC440EPx. In this example, the pins are also bidirectional, serving both as inputs and outputs. Multimode Signals In some cases (for example, Ethernet) the function of a pin may vary with different modes of operation. When a pin has multiple signal names assigned to distinguish different modes of operation, all of the names are shown. Strapping Pins One group of pins is used as strapped inputs during system reset. These pins function as strapped inputs only during reset and are used for other functions during normal operation (see "Strapping" on page 92). Note that these are not multiplexed pins since the function of the pins is not programmable. Unused I/Os Termination of unused receivers is generally required; however, there are some exceptions that reduce or eliminate the need for termination. Signals Multiplexed with GPIO: By default after reset, signals shared with GPIO pins are configured as GPIO receivers. Termination however, is not needed if the GPIO during initialization are configured as outputs. To configure as drivers, set and clear the appropriate bits in the GPIOx_ODR, GPIOx_TCR and GPIOx_OR registers as described in the GPIO chapter of the user's manual. PCI: When the PCI bridge is unused, configure the PCI controller to park on the bus by pulling the PCIReg0[Gnt} signal low. Parking forces the PLB3 to PCI bridge to actively drive PCIAD31:0 and PCIC3:0[BE3:0]. The remaining PCI control signals must be terminated as follows: - Disable the internal PCI arbiter and enable PCI synchronous mode. (See IIC Boot Strap Chapter in the user's manual). Synchronous mode is not supported when operating the PCI bus. (This mode should only be used for terminating an unused PCI interface). Note: - Individually connect PCISErr, PCITRDY, and PCIStop through 3k resistors to +3.3V. - Individually connect PCIReq1:5 through 3k resistors to +3.3V. - Connect PCIReq0[Gnt] through 1k resistor to GND. DDR: - In 32 bit mode, termination is not needed on the upper data, strobe and mask signals when the DDR I/O and DDR controller are configured for 32 bit mode, SDR0_DDRCFG[64B32B]=0 and DDR0_14[REDUC]=1. - Termination of unused ECC signals (ECC0:7, DM8, DQS8) is not needed. GMII and MII: - Configure EMAC0 and EMAC1 to use internal clocks by setting SDR0_MFR[EnCS]=1 and reset EMACn by setting EMACn_MR0[SRST]=1. - Pull down the following signals with 1K resistor: GMCRefClk, GMCCD, GMCTxCLK and GMCRxClk. Pull downs are only required if the interface is never used. SMIIx - Configure the unused EMACn to use an internal clock by setting SDR0_MFR[EnCS]=1 and reset EMACn by setting EMACn_MR1[SRST]=1. - No pull ups or pull downs required. RGMIIx - Configure the unused EMACn to use an internal clock by setting SDR0_MFR[EnCS]=1 and reset EMACn by setting EMACn_MR1[SRST]=1 - Pull down the unused GMCnRxClk signal with a 1K resistor. Pull down is only required if the interface is never used. 56 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 1 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes PCI Interface PCIAD00:31 Address/Data bus (bidirectional). I/O 3.3V PCI PCIC0:3/BE0:3 PCI Command/Byte Enables. I/O 3.3V PCI PCIClk Provides timing to the PCI interface for PCI transactions. I 3.3V PCI PCIDevSel Indicates the driving device has decoded its address as the target of the current access. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI PCIFrame Driven by the current master to indicate beginning and duration of an access. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI O 3.3V PCI PCIGnt0/Req Indicates that the specified agent is granted access to the bus. When the internal arbiter is enabled, output is PCIGnt0. When the internal arbiter is disabled, output is Req. 1, 5 Note: When not using the PCI interface use termination recommendation "Unused I/Os" on page 56. PCIGnt1:5 Indicates that the specified agent is granted access to the bus. Used only when internal PCI arbiter enabled. O 3.3V PCI PCIIDSel Used as a chip select during configuration read and write transactions. I 3.3V PCI PCIINT Level sensitive PCI interrupt. O 3.3V PCI PCIIRDY Indicates initiating agent's ability to complete the current data phase of the transaction. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI PCIPar Even parity. I/O 3.3V PCI PCIPErr Reports data parity errors during all PCI transactions except a Special Cycle. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI PCIReq0/Gnt Indicates to the PCI arbiter that the specified agent wishes to use the bus. When the internal arbiter is enabled, input is PCIReq0. When internal arbiter is disabled, input is Gnt. I 3.3V PCI 1, 4 PCIReq1:5 An indication to the PCI arbiter that the specified agent wishes to use the bus. Used only when internal PCI arbiter enabled. I 3.3V PCI 1, 4 PCIReset Brings PCI device registers and logic to a consistent state. O 3.3V PCI PCISErr Reports address parity errors, data parity errors on the Special Cycle command, or other catastrophic system errors. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI PCIStop Indicates the current target is requesting the master to stop the current transaction. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI PCITRDY Indicates the target agent's ability to complete the current data phase of the transaction. (PCI 2.2 specification requires 8.2K pull up on host system) I/O 3.3V PCI AppliedMicro Proprietary 57 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 2 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes DDR2/1 SDRAM Interface BA0:2 Bank Address supporting up to eight internal banks. O 2.5V (1.8V) SDRAM-DDR BankSel0:1 Selects up to two external DDR SDRAM banks. O 2.5V (1.8V) SDRAM-DDR CAS Column Address Strobe. O 2.5V (1.8V) SDRAM-DDR ClkEn Clock Enable. O 2.5V (1.8V) SDRAM-DDR DM0:7 DM8 Memory write data byte lane masks. DM8 is the byte lane mask for the ECC byte lane. O 2.5V (1.8V) SDRAM-DDR DQS0:7 DQS8 Byte lane data strobe. Byte lane data strobe for ECC. I/O 2.5V (1.8V) SDRAM-DDR ECC0:7 ECC check bits 0:7. I/O 2.5V (1.8V) SDRAM-DDR MemAddr00:13 Memory address bus. O 2.5V (1.8V) SDRAM-DDR MemData00:63 Memory data bus (MemData32:63 available for DDR2 only). I/O 2.5V (1.8V) SDRAM-DDR MemClkOut MemClkOut Subsystem clock. O 2.5V (1.8V) SDRAM-DDR Diff driver MemODT0:1 DDR2 On-die termination enable (not used with DDR1). O 2.5V (1.8V) SDRAM-DDR RAS Row Address Strobe. O 2.5V (1.8V) SDRAM-DDR WE Write Enable. O 2.5V (1.8V) SDRAM-DDR SVREF1A:B DDR SDRAM reference voltage 1 input. I Volt ref receiver (1.25V or 0.9V) SVREF2A:B DDR SDRAM reference voltage 2 input. I Volt ref driver (1.25V or 0.9V) 58 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 3 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes Ethernet Interface GMCRxD0:1, GMC0RxD0:1, SMII0:1RxD GMII/MII: Receive data. RGMII 0: Receive data. SMII 0:1: Receive data. I 3.3V tolerant 2.5V CMOS 1 GMCRxD2:3 GMC0RxD2:3 GMII/MII: Receive data. RGMII 0: Receive data. I 3.3V tolerant 2.5V CMOS 1 GMCRxD4:7, GMC1RxD0:3 GMII/MII: Receive data. RGMII 1: Receive data. I 3.3V tolerant 2.5V CMOS 1 GMCTxD0:1, GMC0TxD0:1, SMII0:1TxD GMII/MII: Transmit data. RGMII 0: Transmit data. SMII 0:1: Transmit data. O 3.3V tolerant 2.5V CMOS GMCTxD2:3, GMC0TxD2:3 GMII/MII: Transmit data. RGMII 0: Transmit data. O 3.3V tolerant 2.5V CMOS 1 GMCTxD4:7, GMC1TxD0:3 GMII/MII: Transmit data. RGMII 1: Transmit data. O 3.3V tolerant 2.5V CMOS 1 GMCRxEr, GMC1RxCtl GMII/MII: Receive error. RGMII 1: Receive control. I 3.3V tolerant 2.5V CMOS 1 GMCRxClk, GMC0RxClk, SMIISync GMII/MII: Receive clock. RGMII 0: Receive clock. SMII: Synchronizing signal. Note: Redrive SMIISync when driving more than one load. SMIISync is a weak driver. I 3.3V tolerant 2.5V CMOS 1, 5 GMCRxDV, GMC0RxCtl GMII/MII: Receive data valid. RGMII 0: Receive control. I 3.3V tolerant 2.5V CMOS 1 GMCCrS, GMC1TxClk GMII/MII: Carrier sense. RGMII 1: Transmit clock. I/O 3.3V tolerant 2.5V CMOS 1 GMCTxEr, GMC1TxCtl GMII/MII: Transmit error. RGMII 1: Transmit control. O 3.3V tolerant 2.5V CMOS GMCTxEn, GMC0TxCtl GMII/MII: Transmit enable. RGMII 0: Transmit control. O 3.3V tolerant 2.5V CMOS GMCTxClk MII: Transmit clock for MII. I 3.3V tolerant 2.5V CMOS 1, 5 GMCCD, GMC1RxClk GMII/MII: Collision detect. RGMII 1: Receive clock. I 3.3V tolerant 2.5V CMOS 1, 5 GMCMDClk Management data clock O 3.3V tolerant 2.5V CMOS GMCMDIO Management data I/O I/O 3.3V tolerant 2.5V CMOS GMCGTxClk, GMC0TxClk GMII: Transmit clock for GMII. RGMII 0: Transmit clock. O 3.3V tolerant 2.5V CMOS GMCRefClk, SMIIRefClk GMII, RGMII: Reference clock. SMII: Reference clock. I 3.3V tolerant 2.5V CMOS Rcvr 1, 5 RejectPkt0:1 External request to reject a packet. I 3.3V tolerant 2.5V CMOS 1 AppliedMicro Proprietary 59 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 4 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes External Slave Peripheral Interface DMAAck0:3 Used by the PPC440EPx to indicate that data transfers have occurred. O 3.3V LVTTL 1 DMAReq0 Used by slave peripherals to indicate they are prepared to transfer data. I 3.3V LVTTL 1 DMAReq1 Used by slave peripherals to indicate they are prepared to transfer data. I 3.3V LVTTL 1, 5 DMAReq2:3 Used by slave peripherals to indicate they are prepared to transfer data. I 3.3V LVTTL 1 EOT0:3/TC0:3 End Of Transfer/Terminal Count. I/O 3.3V LVTTL 1 PerAddr02:07 Peripheral address bus used by the PPC440EPx when not in external master mode; otherwise, used by external master. I/O 3.3V LVTTL 1, 2 PerAddr08:31 Peripheral address bus used by the PPC440EPx when not in external master mode; otherwise, used by external master. I/O 3.3V LVTTL PerData00:31 Peripheral data bus used by the PPC440EPx when not in external master mode; otherwise, used by external master. Note: PerData00 is the most significant bit (msb) on this bus. I/O 3.3V LVTTL PerDataPar0:3 Peripheral data bus parity used by the PPC440EPx when not in external master mode; otherwise, used by external master. I/O 3.3V LVTTL PerBLast Used by either the peripheral controller, DMA controller, or external master to indicates the last transfer of a memory access. I/O 3.3V LVTTL PerCS0 External peripheral device select. O 3.3V LVTTL 2 PerCS1:5 External peripheral device select. I/O 3.3V LVTTL 1, 2 PerOE Used by either peripheral controller or DMA controller depending upon the type of transfer involved. When the PPC440EPx is the bus master, it enables the selected device to drive the bus. O 3.3V LVTTL 1, 2 PerReady Used by a peripheral slave to indicate it is ready to transfer data. I 3.3V LVTTL 1 PerR/W Used by the PPC440EPx when not in external master mode, as output by either the peripheral controller or DMA controller depending upon the type of transfer involved. High indicates a read from memory, low indicates a write to memory. Otherwise, it is used by the external master as an input to indicate the direction of transfer. I/O 3.3V LVTTL 1, 2 PerWBE0:3 External peripheral data bus byte enables. I/O 3.3V LVTTL 1, 2 PerErr External Error. Used as an input to record external slave peripheral errors. I 3.3V LVTTL 1 60 1, 4 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 5 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes External Master Peripheral Interface BusReq Bus Request. Used when the PPC440EPx needs to regain control of peripheral interface from an external master. O 3.3V LVTTL ExtAck External Acknowledgement. Used by the PPC440EPx to indicate that a data transfer occurred. O 3.3V LVTTL ExtReq External Request. Used by an external master to indicate it is prepared to transfer data. I 3.3V LVTTL ExtReset Peripheral Reset. Used by an external master and by synchronous peripheral slaves. Note: The state of signals or clocks cannot be guaranteed until the ExtReset signal has been de-asserted. O 3.3V LVTTL HoldAck Hold Acknowledge. Used by the PPC440EPx to transfer ownership of peripheral bus to an external master. O 3.3V LVTTL HoldReq Hold Request. Used by an external master to request ownership of the peripheral bus. I 3.3V LVTTL HoldPri Hold Primary. Used by an external master to indicate the priority of a given external master tenure. I 3.3V LVTTL w/pull-up PerClk Peripheral Clock. Used by an external master and by synchronous peripheral slaves. O 3.3V LVTTL 1 1 UART Peripheral Interface The UART interface can be configured as follows: 1. One 8-pin, where n = 0 2. Two 4-pin, where n = 0 & 1 3. One 4-pin, where n = 0 and two 2-pin, where n = 1 & 2 4. Four 2-pin, where n = 0 & 1 & 2 & 3 UARTSerClk The SerClk input provides an alternative to the internally generated serial clock. It is used in cases where the allowable internally generated clock rates are not satisfactory. I 3.3V LVTTL 1, 4 UARTn_Rx Receive data. I 3.3V LVTTL Rcvr 1, 4 UARTn_Tx Transmit data. O 3.3V LVTTL UARTn_DCD Data Carrier Detect. I 3.3V LVTTL 1, 6 UARTn_DSR Data Set Ready. I 3.3V LVTTL 1, 6 UARTn_CTS Clear To Send. I 3.3V LVTTL 1, 6 UARTn_DTR Data Terminal Ready. O 3.3V LVTTL 1 UARTn_RTS Request To Send. O 3.3V LVTTL 1 UARTn_RI Ring Indicator. I 3.3V LVTTL 1 I/O 3.3V LVTTL 1, 2 IIC Peripheral Interface IIC0SClk IIC0 Serial Clock. IIC0SData IIC0 Serial Data. I/O 3.3V LVTTL 1, 2 IIC1SClk IIC1 Serial Clock. I/O 3.3V LVTTL 2 IIC1SData IIC1 Serial Data. I/O 3.3V LVTTL 2 AppliedMicro Proprietary 61 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 6 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes USB UTMI Peripheral Interface USB2DI7:0 Unidirectional data inputs. I/O 3.3V LVTTL USB2DO7:0 Unidirectional data outputs. I/O 3.3V LVTTL USB2TxRdy Transmit data ready. I 3.3V LVTTL w/pull-down USB2RxAct Receive active. I 3.3V LVTTL USB2RxDV Receive valid. I/O 3.3V LVTTL w/pull-up 1 USB2RxErr Receive error. I/O 3.3V LVTTL 1 USB2LS0:1 Line state 0 and Line state 1. I 3.3V LVTTL w/pull-up USB2TxVal Transmit valid. I/O 3.3V LVTTL 1 USB2Susp Suspend. I/O 3.3V LVTTL 1 USB2XcvrSel Transceiver select. I/O 3.3V LVTTL 1 USB2TermSel Termination select. I/O 3.3V LVTTL 1 USB2OM0:1 Operational mode. Only Normal Mode is supported. USB2OM0:1 is fixed to = 2'b00. I/O 3.3V LVTTL 1 USB2Clk USB 2.0 Clock (60MHz). I 3.3V LVTTL 1, 5 5 USB PHY Peripheral Interface USB2Xcvr USB2Xcvr USB 2.0 differential transceiver. I/O 5V tolerant Analog USB2XtalIn USB2XtalOut USB 2.0 external crystal (48MHz) or external oscillator (48MHz). External crystal: In/Out differential must not be less than 500mV. External oscillator: Connect oscillator with signal swing of 3.3V between USB2XtalOut and ground. See Table 18 on page 75. I/O Analog USB2RExt External resistor connection for bias current. Use 3.4k, 1% resistor connected to GND. I/O Analog NFALE Address Latch Enable. O 3.3V LVTTL 1 NFCE0:3 Chip Enable (multiplexed with the PerCS0:3 signals). O 3.3V LVTTL 1 NFCLE Command Latch Enable. Latches operational commands into the NAND Flash. O 3.3V LVTTL 1 NFRdyBusy Ready/Busy. Indicates status of device during program erase or page read. This signal is wire-OR connected from all NAND Flash devices. I 3.3V LVTTL 1 NFREn Read Enable. Data is latched on the rising edge. O 3.3V LVTTL 1 NFWEn Write Enable. Data is latched on the rising edge. O 3.3V LVTTL 1 NAND Flash Interface 62 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 7 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes Serial Peripheral Interface SCPClkOut Clock output. I/O 3.3V LVTTL 2 SCPDI Data input. I/O 3.3V LVTTL 2 SCPDO Data output. O 3.3V LVTTL 2 IRQ0:4 External interrupt requests 0 through 4. I/O 3.3V LVTTL 1 IRQ5 External interrupt request 5. I 3.3V LVTTL Rcvr 1, 5 IRQ6:9 External interrupt requests 6 through 9. I/O 3.3V LVTTL 1 Interrupts Interface JTAG Interface TCK Test Clock. I 3.3V LVTTL w/pull-up 1 TDI Test Data In. I 3.3V LVTTL w/pull-up 1, 4 TDO Test Data Out. O 3.3V LVTTL TMS Test Mode Select. I 3.3V LVTTL w/pull-up 1 TRST Test Reset. Note: Must be asserted low during a power-on system reset in order to reset the JTAG interface. If the JTAG interface is not reset, the processor may not boot. I 3.3V LVTTL w/pull-up 1, 5 AppliedMicro Proprietary 63 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 8 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes 1 System Interface SysClk Main system clock input. I 3.3V tolerant 2.5V CMOS SysErr Set to 1 by an instruction machine check. The machine check is a result of the attempted execution of an instruction transferred on the PLB with a bus error. This output signal remains a logic 1 until the machine check error is cleared in the Exception Syndrome Register (ESR). O 3.3V tolerant 2.5V CMOS SysReset Main system reset. External logic can drive this bidirectional pin low (minimum of 16 cycles) to initiate a system reset. A system reset can also be initiated by software. Implemented as an opendrain output (two states; 0 or open circuit). I/O 3.3V tolerant 2.5V CMOS Halt Halt from external debugger. I 3.3V LVTTL Rcvr w/pull-up TmrClk Processor timer external input clock. I 3.3V LVTTL GPIO00:15 GPIO22:23 GPIO26:48 General purpose I/O. To access these functions, software must set DCR register bits. I/O 3.3V LVTTL 1 GPIO16:21 GPIO24:25 General purpose I/O. To access these functions, software must set DCR register bits. I/O 3.3V tolerant 2.5V CMOS 1 GPIO49:63 General purpose I/O. To access these functions, software must set DCR register bits. I/O 3.3V tolerant 2.5V CMOS TestEn Test Enable. Note: Do not connect for normal operation. I 3.3V LVTTL Rcvr w/pulldown RcvrInh Receiver Inhibit. Active only when TestEn is active. Used for manufacturing test only. I 3.3V LVTTL 1 ModeCtrl Mode Control. Active only when TestEn is active. Used for manufacturing test only. I 3.3V tolerant 2.5V CMOS Rcvr 1 LeakTest LeakTest2 Leakage Test. Active only when TestEn is active. Used for manufacturing test only. I 3.3V LVTTL w/pull-up 1 RefEn Reference Enable. Active only when TestEn is active. Used for manufacturing test only. I 3.3V LVTTL 1 DrvrInh1:2 Driver Inhibit. Active only when TestEn is active. Used for manufacturing test only. I 3.3V LVTTL w/pull-up 1 TherMonA:B On-chip PNP thermal monitor transistor. A is the emitter and B is the base. The collector is grounded. I Thermal monitor 5 PSROOut Module characterization and screening. Use for test purposes only. Tie down as specified in Note 3 for normal operation. O Perf screen ring oscillator 1, 3 64 1, 2 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 8. Signal Functional Description (Sheet 9 of 9) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 3. Must pull down (recommended value is 1k) 4. If not used, must pull up (recommended value is 3k to OVDD (EOVDD for Ethernet) 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up or pull-down required Signal Name Description I/O Type Notes Trace Interface TrcBS0:2 Trace branch execution status. I/O 3.3V tolerant 2.5V CMOS TrcClk Trace data capture clock, runs at 1/4 the frequency of the processor. O 3.3V tolerant 2.5V CMOS TrcES0:4 Trace Execution Status is presented every fourth processor clock cycle. I/O 3.3V tolerant 2.5V CMOS TrcTS0:6 Additional information on trace execution and branch status. I/O 3.3V tolerant 2.5V CMOS VDD +1.5V--Logic voltage. n/a n/a OVDD +3.3V--I/O (except DDR2 SDRAM and Ethernet). n/a n/a EOVDD +2.5V--I/O Ethernet. n/a n/a SOVDD +1.8V (DDR2) or +2.5V (DDR1)--I/O DDR SDRAM. n/a n/a GND Ground for logic and I/O voltage. n/a n/a AVDD +1.5V--Filtered voltage for system PLLs (analog). n/a n/a AGND Ground for system PLL voltage (analog). n/a n/a EAVDD +1.5V--Filtered voltage for Ethernet PLLs (analog). n/a n/a EAGND Ground for Ethernet PLL voltage (analog). n/a n/a U1AVDD +3.3V--Filtered voltage for USB PLL (analog). Connect to OVDD. n/a n/a U2AVDD +3.3V--Filtered voltage for USB PHY (analog). Connect to OVDD. n/a n/a U1AGND Ground for USB PLL (analog) voltage. Connect to GND. n/a n/a U2AGND Ground for USB PHY (analog) voltage. Connect to GND. n/a n/a Power AppliedMicro Proprietary 65 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Device Characteristics Table 9. Absolute Maximum Ratings The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device. None of the performance specification contained in this document are guaranteed when operating at these maximum ratings. Characteristic Symbol Value Unit Notes VDD 0 to +1.65 V 1 OVDD 0 to +3.6 V 1 Ethernet I/O supply voltage EOVDD 0 to +2.7 V 1 DDR2 (DDR1) SDRAM I/O supply voltage SOVDD 0 to +1.94 (+2.7V) V 1 System analog supply voltage AVDD 0 to +1.65 V Ethernet analog supply voltage EAVDD 0 to +1.65 V USB PLL analog supply voltage U1AVDD 0 to +3.6 V USB PHY analog supply voltage U2AVDD 0 to +3.6 V Storage Temperature Range TSTG -55 to +150 C Case temperature under bias TC -40 to +120 C Internal logic supply voltage I/O supply voltage 2 Notes: 1. If OVDD 0.4V, it is required that VDD 0.4V. Supply excursions not meeting this criteria must be limited to less than 25ms duration during each power up or power down event. 2. This value is not a specification of the operational temperature range, it is a stress rating only. Table 10. Recommended DC Operating Conditions (Sheet 1 of 2) Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability. Parameter Symbol Minimum Typical Maximum Unit Notes VDD +1.425 +1.5 +1.6 V 4 OVDD +3.15 +3.3 +3.45 V 4 Ethernet I/O Supply Voltage EOVDD +2.4 +2.5 +2.6 V 4 DDR2 (DDR1) SDRAM I/O Supply Voltage SOVDD +1.7 (+2.4) +1.8 (+2.5) +1.9 (+2.6) V 4 AVDD +1.425 +1.5 +1.6 V 3, 4 EAVDD +1.425 +1.5 +1.6 V 3, 4 UnAVDD +3.15 +3.3 +3.45 V 3, 4 SVREF +0.85 (+1.19) +0.9 (+1.25) +0.95 (+1.31) V 2 Logic Supply Voltage I/O Supply Voltage System Analog Supply Voltages Ethernet Analog Voltage USB Analog Voltages DDR2 (DDR1) SDRAM Reference Voltage 66 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 10. Recommended DC Operating Conditions (Sheet 2 of 2) Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability. Parameter Symbol Maximum Unit Notes 0.5OVDD OVDD+0.5 V 1 +2.0 +3.6 V +1.7 +3.6 V SVREF + 0.125 (0.15) 2.2 (3.0) V -0.5 0.35OVDD V 0 +0.8 V 0 +0.7 V Input Logic Low 1.8V DDR2 (2.5V DDR1) -0.3 (-0.3) SVREF - 0.125 (0.15) V Output Logic High 3.3V PCI 0.9OVDD - V +2.4 +3.6 V +2.0 +2.7 V +0.95 (+1.7) +1.95 (+2.7) V 5 - 0.1OVDD V 1 0 +0.4 V 0 +0.4 V 0 +0.43 (+0.54) V Input Logic High 3.3V PCI Input Logic High 3.3V LVTTL Input Logic High 2.5V CMOS, 3.3V tolerant VIH Input Logic High 1.8V DDR2 (2.5V DDR1) Input Logic Low 3.3V PCI Input Logic Low 3.3V LVTTL Input Logic Low 2.5V CMOS Output Logic High 3.3V LVTTL Output Logic High 2.5V CMOS VIL VOH Output Logic High 1.8V DDR2 (2.5V DDR1) Output Logic Low 3.3V PCI Output Logic Low 3.3V LVTTL Output Logic Low 2.5V CMOS VOL Output Logic Low 1.8V DDR2 (2.5V DDR1) Minimum Typical Input Leakage Current (no pull-up or pull-down) IIL1 0 0 A Input Leakage Current for pull-down IIL2 0 (LPDL) 200 (MPUL) A Input Leakage Current for pull-up IIL3 -150 (LPDL) 0 (MPUL) A +3.9 V Input Max Allowable Overshoot 3.3V LVTTL VIMAO Input Max Allowable Undershoot 3.3V LVTTL VIMAU Output Max Allowable Overshoot 3.3V LVTTL VOMAO Output Max Allowable Undershoot 3.3V LVTTL VOMAU3 -0.6 TC -40 Case Temperature -0.6 1 1 5 V +3.9 V V +100 C 6 Notes: 1. PCI drivers meet PCI specifications. 2. SVREF = SOVDD/2. SOVDD = +1.8V for DDR2 memory or +2.5V for DDR1 memory. 3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the PPC440EPx. See "Absolute Maximum Ratings" on page 66. 4. Startup sequencing of the power supply voltages is not required. A power-down cycle must complete (OVDD and VDD are below +0.4V) before a new power-up cycle is started 5. At IOH = IOL= 10ma. 6. Case temperature, TC, is measured at top center of case surface with device soldered to a circuit board. AppliedMicro Proprietary 67 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Figure 4. Overshoot Waveform AC Overshoot (V) DC Overshoot (V) TCYC DC Undershoot (V) AC Undershoot (V) TOS TOS Table 11. Overshoot and Undershoot Receiver AC Overshoot (V) DC Overshoot (V) DC Undershoot (V) AC Undershoot (V) TOS 3.3V LVTTL 3.9 3.6 0 -0.6 0.1*TCYC1 2.5V (3.3V tolerant) 3.9 3.6 0 -0.6 0.1*TCYC1 DDR 1.2*SOVDD SOVDD + 0.3 0 -0.6 0.1/MemClkOut PCI 1.2*OVDD OVDD + 0.5 0 -0.2*OVDD 0.1/PCIClk Notes: 1. TCYC is the period of the bus clock. 1/PerClk - EBC and NAND flash interfaces. 1/GMCRXClk - GMII and MII mode 1/SMIIRefClk - SMII mode 1/GMC0RxClk and 1/GMC1RxClk - RGMII mode 1/USB2Clk - UTMI 1/TrcClk - instruction trace interface 1/IIC0Clk and 1/IIC1Clk - IIC interfaces 1/SPIClkOut - SPI 68 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Power Sequencing Startup sequencing of the power supply voltages is not required. However, a power-down cycle must complete (OVDD and VDD are below +0.4V) before a new power-up cycle is started. Analog Voltage Filter The analog voltages (AVdd, EAVdd, and UnAVdd) used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before the PPC440EPx. A Separate filter, as shown below, is recommended for each voltage. * The filter should keep the analog voltage to analog ground compression/expansion due to noise less than +50 mV. * Keep all wire lengths as short as possible. * Analog grounds must be brought out and connected to the digital ground plane at the filter capacitor. * The impedance of the ferrite bead should be much greater than that of the capacitor at frequencies where noise is expected. VDD AVDD, EAVDD, UnAVdd L C AGND, EAGND, UnAGND L - SMT ferrite bead chip, Murata BLM21PG600SN1 C - 0.1F ceramic dielectric GND Power Specification The following tables contain measured power numbers. The measurement conditions are listed as Notes below each table. Table 12. Typical DC Power Supply Requirements Using DDR2 Memory Frequency (MHz) +1.5V Supply (VDD+AVDD+EAVDD) +1.8V Supply (SOVDD) +2.5V Supply (EOVDD) +3.3V Supply (OVDD+UAVDD) Total Unit Notes 400 1.61 0.35 0.28 0.2 2.44 W 1 533 1.82 0.36 0.28 0.2 2.66 W 1 667 2.16 0.37 0.28 0.2 3.01 W 1 Notes: 1. Typical power is measured and is based on a nominal voltage of VDD = +1.5V, TC = 100C, while running Linux and a test application that exercises each function with representative traffic. AppliedMicro Proprietary 69 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 13. Typical DC Power Supply Requirements Using DDR1 Memory Frequency (MHz) +1.5V Supply (VDD+AVDD+EAVDD) +1.8V Supply (SOVDD) +2.5V Supply (SOVDD + EOVDD) +3.3V Supply (OVDD+UAVDD) Total Unit Notes 400 1.69 na 1.33 0.2 3.22 W 1 533 1.88 na 1.35 0.2 3.43 W 1 667 2.20 na 1.37 0.2 3.77 W 1 Notes: 1. Typical power is measured and is based on a nominal voltage of VDD = +1.5V, TC = 100C, while running Linux and a test application that exercises each function with representative traffic. Table 14. VDD Supply Power Dissipation Frequency (MHz) +1.425V +1.5V +1.6V Unit Notes 400 1.49 1.69 2.00 W 1 533 1.64 1.88 2.21 W 1 667 1.94 2.20 2.78 W 1 Notes: 1. Power is measured and is based on VDD specified in the table and TC = 100C, while running Linux and a test application that exercises each function with representative traffic. 70 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 15. DC Power Supply Loads Symbol Typical 4 Maximum 5 Unit IDD 1575 3350 mA OVDD (+3.3V) active operating current IODD 60 70 mA EOVDD (+2.5V) active operating current IEODD 115 120 mA SOVDD (+1.8V) DDR2 active operating current 2 ISODD2 210 300 mA SOVDD (+2.5V) DDR1 active operating current 2 ISODD1 440 450 mA AVDD (+1.5V) input current 1 IADD 20 30 mA EAVDD (+1.5V) active operating current IEADD 20 30 mA 1 UnAVDD (+3.3V) active operating current IUADD 90 110 mA 1 Parameter VDD (+1.5V) active operating current Notes Notes: 1. See "Absolute Maximum Ratings" on page 66 for filter recommendations. 2. SOVDD will be either +2.5V or +1.8V but not both. 3. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature, and the power supply voltages. Your specific application can produce significantly different results. VDD (logic) current and power are primarily dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD (I/O) current and power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses. 4. Typical current is estimated at 667MHz with VDD = +1.5V, OVDD = +3.3V, EOVDD = +2.5V, SOVDD = +2.5V (DDR1) or +1.8V (DDR2), and TC = +100C with a typical process. 5. Maximum current is measured at 667MHz with VDD = +1.6V, OVDD = +3.45V, EOVDD = +2.6V, SOVDD = +2.6V (DDR1) or +1.9V (DDR2), and TC = +100C, and best-case process (which drives worst-case power). AppliedMicro Proprietary 71 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Package Thermal Specifications Table 16. Package Thermal Specifications Thermal resistance values for the TE-EPBGA package in a convection environment at 6.3W are as follows: Parameter Airflow ft/min (m/sec) Symbol 0 (0) 100 (0.51) 200 (1.02) 300 (1.53 400 (2.04) 500 (2.55) Unit Notes Junction-to-ambient thermal resistance without heat sink JA 13.1 11.7 10.9 10.5 10.3 10 C/W 5 Junction-to-ambient thermal resistance with heat sink JA 11.1 8.2 7.2 6.8 6.6 6.3 C/W 5, 6 Resistance Value Junction-to-case thermal resistance JC 3.5 C/W 5 Junction-to-board thermal resistance JB 7.3 C/W 5 Notes: 1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. 2. TA = TC - Px CA, where TA is ambient temperature and P is power consumption. 3. TCMax = TJMax - PxJC, where TJMax is maximum junction temperature (+125C) and P is power consumption. 4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes. 5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4 layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-EPBGA package). 6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a 0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK. Heat Sink The following heat sink was used in the above thermal analysis: ALPHA LPD35-15B (35mm x 35mm x15mm) The heat sink is manufactured by: Alpha Novatech, Inc. (www.alphanovatech.com) 473 Sapena Court, #12 Santa Clara, CA 95054 Phone: 408-567-8082 72 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Thermal Monitor Thermal monitoring of the chip is accomplished using the PNP transistor ( 2) provided on the chip. The collector of the transistor is connected to ground (GND). The emitter (TherMonA) and base (TherMonB) are connected to chip pins. A voltage measurement (VBE1 and VBE2) across the TherMonA and TherMonB pins at the two current values I1 and I2 provides the chip temperature in K according to the equation: T = (q/nk)(VBE2-VBE1)/ln(I2/I1) K where q = 1.602 176 53x10-19, n = 1.0 0.015, and k = 1.380 6505x10-23. Note: VBE2 and VBE1 should be specified in Volts. I1 and I2 can be any units of measure provided they are the same. The small values require precision measurement and current sources. The calculated on chip (ball to ball) series resistance for the PPC440EPx thermal monitor circuit is 2.0 ohms. The thermal sensor reflects the PPC440EPx junction temperature. PPC440EPx C TherMonA E I1, I2 (Max = 300A) VBE1, VBE2 B TherMonB Note: The bias voltage VEB should be between +0.5V and +0.7V. Clocking Specification Table 17. Clocking Specifications Symbol Parameter Min Max Units Notes 33.33 66.66 MHz 1 SysClk Input FC Frequency TC Period 15 30 ns TCS Edge stability (cycle-tocycle jitter) - 0.15 ns TCH High time 40% of nominal period 60% of nominal period ns TCL Low time 40% of nominal period 60% of nominal period ns Note: Input rising and falling edge slew rate 1V/ns 2 3 TrcClk Output FC Frequency CPU FC/4 CPU FC/4 FC Frequency 600 1333.33 MHz TC Period 0.750 1.66 ns 333.33 666.66 MHz PLL VCO Processor (CPU) Clock FC Frequency AppliedMicro Proprietary 73 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 17. Clocking Specifications (continued) Symbol TC Parameter Period Min Max Units 1.5 3 ns 133.33 166.66 MHz 6 7.5 ns Notes MemClkOut and PLB Clock FC Frequency TC Period TCH High time 45% of nominal period 55% of nominal period ns FC Frequency 45 83.33 MHz TC Period 12 22.2 ns MAL Clock Note: 1. SysClk supports spread spectrum clocking with a -1% down-spread and a 40 kHz or less modulation frequency. For a 33.33MHz minimum SysClk, the modulation frequency range of 33.00 MHz to 33.33 MHz is supported. 2. The maximum input cycle-to-cycle jitter is 100 ps within the frequency range 100 kHz to 20 MHz. Outside the frequency range of 100 kHz to 20 MHz, the maximum input cycle-to-cycle jitter is 150 ps. 3. Slew rate is measured between 0.7V and 1.7V. Figure 5. Timing Waveform 1.7V (2.0V) 0.7V (0.8V) TCH TCL TC Note: SysClk and GMCRefClk are 2.5V (3.3V tolerant). Slew rate should be measured between 0.7V and 1.7V. Spread Spectrum Clocking Care must be taken when using a spread spectrum clock generator (SSCG) with the PPC440EPx. This controller uses a PLL for clock generation inside the chip. The accuracy with which the PLL follows the SSCG is referred to as tracking skew. The PLL bandwidth and phase angle determine how much tracking skew there is between the SSCG and the PLL for a given frequency deviation and modulation frequency. When using an SSCG with the PPC440EPx the following conditions must be met: * The frequency deviation must not violate the minimum clock cycle time. Therefore, when operating the PPC440EPx with one or more internal clocks at their maximum supported frequency, the SSCG can only lower the frequency. * The maximum frequency deviation of SysClk cannot exceed -1%, and the modulation frequency cannot exceed 40kHz. In some cases, on-board PPC440EPx peripherals impose more stringent requirements. 74 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Notes: 1. The serial port baud rates are synchronous to the modulated clock. The serial port has a tolerance of approximately 1.5% on baud rate before framing errors begin to occur. The 1.5% tolerance assumes that the connected device is running at precise baud rates. 2. Ethernet operation is unaffected. 3. IIC operation is unaffected. Important: It is up to the system designer to ensure that any SSCG used with the PPC440EPx meets the above requirements and does not adversely affect other aspects of the system. I/O Specifications Table 18. Peripheral Interface Clock Timings (Sheet 1 of 3) Parameter Min Max Units PCIClk frequency (asynchronous mode) - 66.66 MHz PCIClk period (asynchronous mode) 15 - ns PCIClk high time 40% of nominal period 60% of nominal period ns PCIClk low time 40% of nominal period 60% of nominal period ns - 2.5 MHz GMCMDClk period 400 - ns GMCMDClk high time 160 - ns GMCMDClk low time 160 - ns GMCTxClk frequency MII 2.5 25 MHz GMCTxClk period MII 40 400 ns GMCTxClk high time 35% of nominal period - ns GMCTxClk low time 35% of nominal period - ns GMCRxClk frequency MII 2.5 25 MHz GMCRxClk period MII 40 400 ns GMCRxClk high time 35% of nominal period - ns GMCRxClk low time 35% of nominal period - ns GMCRefClk frequency - 125 MHz GMCRefClk period 8 - ns GMCRefClk high time 40% of nominal period 60% of nominal period ns 2 GMCRefClk low time 40% of nominal period 60% of nominal period ns 2 GMCRefClk Edge Stability (cycle-to-cycle jitter) - +0.15 ns 2 GMCRefClk Slew Rate 2 - V/ns 2 GMCMDClk frequency AppliedMicro Proprietary Notes 75 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 18. Peripheral Interface Clock Timings (Sheet 2 of 3) Parameter Min Max Units 33.33MHz 83.33 MHz 12 30 ns PerClk high time 50% of nominal period 66% of nominal period ns PerClk low time 33% of nominal period 50% of nominal period ns - 1000 / (2TOPB1+2ns) MHz 1 UARTSerClk period 2TOPB1+2 - ns 1 UARTSerClk high time TOPB1+1 - ns 1 UARTSerClk low time TOPB1+1 - ns 1 60 60 MHz 3 16.66 16.66 ns 3 12 48 MHz 3 20.8 83.33 ns 3 USB2XtalIn/USB2XtalOut high time 40% of nominal period 60% of nominal period ns USB2XtalIn/USB2XtalOut low time 40% of nominal period 60% of nominal period ns PerClk (and OPB Clock) frequency (for ext. master or sync. slaves) PerClk period UARTSerClk frequency USB2Clk frequency USB2Clk period USB2XtalIn/USB2XtalOut frequency USB2XtalIn/USB2XtalOut period 76 Notes AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 18. Peripheral Interface Clock Timings (Sheet 3 of 3) Parameter Min Max Units TmrClk frequency - 100 MHz TmrClk period 10 - ns TmrClk high time 40% of nominal period 60% of nominal period ns TmrClk low time 40% of nominal period 60% of nominal period ns Notes Notes: 1. TOPB is the period in ns of the OPB clock. The internal OPB clock runs at 1/2 the frequency of the PLB clock. The maximum OPB clock frequency is 83 MHz. 2. An internal PLL improves this duty cycle to a worst case of 48% minimum, 52% maximum. 3. Crystals, external clocks, or external oscillators must have a maximum tolerance of 100ppm and maximum jitter of 100ps.Only a frequencies of 48MHz is allowed for oscillators; only a frequencies of 48MHz is allowed for crystals. Crystals and oscillators should be connected as shown below: PPC440EPx PPC440EPx USB2XtalOUT USB2XtalIn C Crystal C USB2XtalOut USB2XtalIn Osc Crystal - Frequency: 48MHz Resonance mode: parallel CO: 15-30pF ESR: 20-60 Drive level: 50-500W C = 2(CL - CStray) where CL is the load capacitance required by the crystal for oscillation CStray is the board parasitic capacitance AppliedMicro Proprietary 77 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Figure 6. Input Setup and Hold Waveform Clock 1.25V(1.5V) TIS min TIH min Inputs Valid Figure 7. Output Delay and Float Timing Waveform Clock 1.25V(1.5V) Outputs TOV max TOV max TOV max TOH min TOH min TOH min High (Drive) Float (High-Z) Valid Valid Low (Drive) 78 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Figure 8. Setup and Hold Timing Waveforms for RGMII Signals GMCnTxClk TskewT GMCnTxD/Ctl Valid Valid GMCnRxClk TskewR GMCnRxD/Ctl Valid Valid Table 19. RGMII I/O Timing Input (ns) Signal Output (ns) Output Current (mA) Clock Notes TskewR (min) TskewR (max) TskewT (min) TskewT (max) I/O H (min) I/O L (min) - - - - n/a n/a - GMCnRxD0:3 1.0 2.8 n/a n/a n/a n/a GMCnRxClk 1 GMCnRxCtl 1.0 2.8 n/a n/a n/a n/a GMCnRxClk 1 GMCnTxClk v - - - 5.1 6.8 - GMCnTxD0:3 n/a n/a -0.5 0.5 5.1 6.8 GMCnTxClk GMCnTxCtl n/a n/a -0.5 0.5 5.1 6.8 GMCnTxClk GMCnRxClk Notes: 1. Assumes GMCnRxClk is delayed either on the board or by the PHY to ensure adequate timing margin. AppliedMicro Proprietary 79 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 20. I/O Specifications--PCI, USB, UART, IIC, SPI, Ethernet, System and Debug Interfaces (Sheet 1 of 3) Notes: 1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard. 2. SMIISync is a weak driver. Redrive SMIISync when driving more than one load. 3. TDO timing is referenced to the falling edge of TCK. Input (ns) Signal Output (ns) Output Current (mA) Setup Time (TIS min) Hold Time (TIH min) Valid Delay (TOV max) Hold Time (TOH min) I/O H (minimum) I/O L (minimum) Clock PCIAD31:00 3 0 6 2 0.5 1.5 PCIClk PCIC3:0/BE3:0 3 0 6 2 0.5 1.5 PCIClk PCIDevSel 5 0 6 2 0.5 1.5 PCIClk PCIFrame 5 0 6 2 0.5 1.5 PCIClk 6 2 0.5 1.5 PCIClk n/a n/a PCIClk 0.5 1.5 Notes PCI Interface PCIGnt0:5 PCIIDSel 5 0 PCIINT async PCIIRDY 5 0 6 2 0.5 1.5 PCIClk PCIPar 5 0 6 2 0.5 1.5 PCIClk PCIPErr 5 0 6 2 0.5 1.5 PCIClk PCIReq0:5 5 0 n/a n/a PCIClk n/a n/a PCIReset async PCISErr 5 0 6 2 0.5 1.5 PCIClk PCIStop 5 0 6 2 0.5 1.5 PCIClk PCITRDY 5 0 6 2 0.5 1.5 PCIClk GMCCD 5.1 6.8 async GMCCrS 5.1 6.8 async GMCMDClk 5.1 6.8 GMCMDIO 5.1 6.8 GMCRxClk n/a n/a 5.1 6.8 5.1 6.8 GMCTxClk 5.1 6.8 GMCRxClk 5.1 6.8 GMCRxClk n/a n/a Ethernet MII Interface GMCRxD0:3 10 10 GMCTxD0:3 10 GMCRxDV 10 10 GMCRxEr 10 10 1 GMCTxClk GMCMDClk 1 GMCRxClk GMCTxEr 10 1 5.1 6.8 GMCTxClk GMCTxEn 10 1 5.1 6.8 GMCTxClk GMCCD 5.1 6.8 async GMCCrS 5.1 6.8 async GMCGTxClk 5.1 6.8 GMCMDClk 5.1 6.8 GMCMDIO 5.1 6.8 GMCRxClk 5.1 6.8 Ethernet GMII Interface GMCRxD0:3 2 0 GMCTxD0:3 2.5 1 GMCMDClk 5.1 6.8 GMCRxClk 5.1 6.8 GMCGTxClk GMCRxClk GMCRxDV 2 0 5.1 6.8 GMCRxEr 2 0 5.1 6.8 GMCRxClk GMCTxEr 2.5 1 5.1 6.8 GMCGTxClk GMCTxEn 2.5 1 5.1 6.8 GMCGTxClk 80 1 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 20. I/O Specifications--PCI, USB, UART, IIC, SPI, Ethernet, System and Debug Interfaces (Sheet 2 of 3) Notes: 1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard. 2. SMIISync is a weak driver. Redrive SMIISync when driving more than one load. 3. TDO timing is referenced to the falling edge of TCK. Input (ns) Signal Output (ns) Setup Time (TIS min) Hold Time (TIH min) SMII0RxD 1.5 1 SMII1RxD 1.5 1 Output Current (mA) Valid Delay (TOV max) Hold Time (TOH min) 3 1 I/O H (minimum) I/O L (minimum) Clock Notes 2 Ethernet SMII Interface SMIISync 5.1 6.8 SMIIRefClk 5.1 6.8 SMIIRefClk 5.1 6.8 SMIIRefClk SMII0TxD 3 1 5.1 6.8 SMIIRefClk SMII1TxD 3 1 5.1 6.8 SMIIRefClk n/a 12.8 5 0 Internal Peripheral Interface IIC0SClk IIC0SData IIC1SClk IIC1SData 5 0 SCPClkOut SCPDI 5 1.5 SCPDO 6 0 n/a 12.8 n/a 12.8 n/a 12.8 n/a 12.8 IIC0SClk IIC1SClk n/a 12.8 SCPClkOut n/a 10.2 SCPClkOut UARTn_Rx n/a n/a async UARTn_Tx 19.1 8.7 async UARTn_DCD n/a n/a async UARTn_DSR n/a n/a async UARTn_CTS n/a n/a async UARTn_DTR 19.1 8.7 async UARTn_RI n/a n/a async UARTn_RTS 19.1 8.7 async USB2Xcvr USB 2.0 USB 2.0 USB2Xcvr USB 2.0 USB 2.0 USB2DI0:7 4 0 USB2DO0:7 USB2LS0:1 4 4 0 4 0 USB2OM0:1 USB2RxAct 4 USB2RxDV 4 1 1 1 14.6 6.6 14.6 6.6 USB2Clk USB2Clk n/a n/a USB2Clk 19.1 8.7 USB2Clk n/a n/a USB2Clk n/a n/a USB2Clk USB2Clk USB2RxErr 4 1 19.1 8.7 USB2Susp 4 1 19.1 8.7 USB2Clk USB2TermSel 4 1 19.1 8.7 USB2Clk n/a n/a USB2Clk USB2TxVal 4 1 19.1 8.7 USB2Clk USB2XcvrSel 4 1 19.1 8.7 USB2Clk n/a n/a n/a n/a 40MHz n/a n/a TCK USB2TxRdy 4 0 Interrupts Interface IRQ0:9 JTAG Interface TCK TDI 2 5.5 2 5.5 TDO TMS TRST AppliedMicro Proprietary 9.5 1 n/a n/a TCK n/a n/a TCK n/a n/a Max 3 async 81 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 20. I/O Specifications--PCI, USB, UART, IIC, SPI, Ethernet, System and Debug Interfaces (Sheet 3 of 3) Notes: 1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard. 2. SMIISync is a weak driver. Redrive SMIISync when driving more than one load. 3. TDO timing is referenced to the falling edge of TCK. Input (ns) Signal Setup Time (TIS min) Hold Time (TIH min) Output (ns) Valid Delay (TOV max) Hold Time (TOH min) Output Current (mA) Clock Notes I/O H (minimum) I/O L (minimum) SysReset n/a n/a async Halt n/a n/a async SysErr 5.1 6.8 async GPIO00:11 19.1 8.7 async GPIO12:25 5.1 6.8 async GPIO26:48 14.6 6.6 async GPIO49:63 5.1 6.8 async System Interface Trace Interface TrcClk 5.1 6.8 TrcBS0:2 5.1 6.8 TrcClk TrcES0:4 5.1 6.8 TrcClk TrcTS0:6 5.1 6.8 TrcClk 82 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 21. I/O Specifications--EBC, EBMI, DMA and NAND Flash Interfaces Notes: 1. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 1.3ns. Input (ns) Signal Setup Time (TIS min) Output (ns) Hold Time (TIH min) Output Current (mA) Valid Delay (TOV max) Hold Time (TOH min) I/O H (minimum) I/O L (minimum) Clock 6 1 19.1 8.7 PerClk n/a n/a PerClk Notes External Slave Peripheral Interface DMAAck0:3 DMAReq0:3 4 1 EOT0:3/TC0:3 4 1 6 1 19.1 8.7 PerClk PerAddr02:31 4 1 6 1 19.1 8.7 PerClk PerBLast 4 1 6 1 19.1 8.7 PerClk 6 1 19.1 8.7 PerClk PerCS0:5 PerData00:15 4 1 6 1 19.1 8.7 PerClk PerData16:31 4 1 6 1 14.6 6.6 PerClk 6 1 19.1 8.7 PerClk 19.1 8.7 PerClk PerOE PerReady 4 1 PerR/W 4 1 6 1 19.1 8.7 PerClk PerWBE0:1 4 1 6 1 19.1 8.7 PerClk BusReq 6 1 19.1 8.7 PerClk ExtAck 6 1 19.1 8.7 PerClk 19.1 8.7 PerClk PerClk External Master Peripheral Interface ExtReq 4 1 ExtReset 6 1 19.1 8.7 HoldAck 6 1 19.1 8.7 PerClk n/a n/a PerClk HoldReq 4 1 HoldPri 4 1 PerClk PerErr 4 1 n/a n/a PerClk 19.1 8.7 PLB Clk n/a n/a PerClk 1 NAND Flash Interface NFALE 6 1 19.1 8.7 PerClk NFCE0:3 6 1 19.1 8.7 PerClk 6 1 19.1 8.7 PerClk n/a n/a PerClk NFCLE NFRdyBusy 4 1 NFREn 6 1 19.1 8.7 PerClk NFWEn 6 1 19.1 8.7 PerClk AppliedMicro Proprietary 83 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 22. Input Capacitance Parameter Symbol Maximum Unit 2.5V/1.8V DDR CIN1 2.9 pF 3.3V LVTTL CIN2 2.1 pF PCI CIN3 2.5 pF 3.3V tolerant CMOS CIN5 2.4 pF USB CIN6 3.0 pF Notes Test Conditions Clock timing and switching characteristics are specified in accordance with operating conditions shown in Table 10 on page 66. AC specifications are characterized with VDD = +1.5V, TC = +85 C and a 50pF test load as shown in the figure to the right. Output Pin 50pF DDR2/1 SDRAM I/O Specifications The DDR2/1 SDRAM controller times its operation using the internal PLB clock signal and generates MemClkOut from the PLB clock. The PLB clock is an internal signal that cannot be directly observed. However, MemClkOut is the same frequency as the PLB clock signal and is in phase with the PLB clock signal. The phase skew between MemClkOut and the PLB clock is affected by the loading on MemClkOut. Read capture logic in the DDR controller captures read data using a delayed version of DQS and internally resynchronizes the data to the PLB clock.The PPC440EPx contains three independently programmable digital delay lines (DLLs) that control the timing of the indicated signals in read and write operations: 1. DQS (with respect to MemClkOut) for write operations. 2. MemData, ECC, and DM (with respect to MemClkOut) for write operations. 3. DQS (with respect to inbound MemData) for read operations. There is also a master delay line for calibration. Programming details can be found in the PPC440EPx Embedded Processor Users Manual. The signals are terminated as indicated in Figure 9 for the DDR timing data in the following sections. The PPC440EPx uses a clock forwarding scheme in which it drives the clock to the memory devices. Data signals are divided into eight subgroups--one for each byte lane (see Table 27 on page 89)-- plus a ninth subgroup for the ECC byte lane. These signals include MemData00:63, DQS0:8, DM0:8, and ECC0:7 signals. Signals within a data subgroup (byte lane) should be routed together. Command Bus Operation The command bus (MemAddr, RAS, CAS, WE, BA, ClkEn, BankSel, MemODT) is driven 180 out-of-phase with MemClkOut, and has no corresponding delay line. Therefore, board designers must consider two different types of systems: 1) registered DIMMs and 2) unbuffered DIMMs. The system clocking design must also be considered. To avoid crosstalk, the command bus signals and the data signals should not be routed together. 84 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Board Layout Restrictions The paths (traces) for the data and the associated data strobe signal should be routed with the same length between the PPC440EPx and the SDRAM devices, allowing the rising and falling edges of the strobe to arrive at the capture logic at the same time the data is in transition. All of the following timing assumes a trace velocity of 167ps/in. Board designs must meet the following criteria: * Skew on the signals in any byte lane should not exceed 50ps (0.3 in). * Data subgroup trace lengths must be no more than 5in. (800ps) and have a difference of no more than 2.5in. (400ps). * Byte lane subgroup trace length must be no less than 1.25 in. (209ps). For example, traces that average 3.00in. in length and 167ps/in., and meet the maximum 50ps skew requirement, would have a maximum length difference of 0.3in. So, they would be between 2.85in. and 3.15in. in length. If the above timing recommendations are followed, the package wire bond lengths can be ignored. Clocking Clocking skew to all DRAMs must be minimized. The maximum allowed is considered to be 10ps. Because of the stringent requirements on DDR device clock inputs, it is expected that board designers will use some type of external PLL suitable to redrive the clock to the DDR SDRAMs. In such a system, the PLL acts like a zero-delay insertion buffer. When using unbuffered DIMMS, the loading on the address bus will be considerably greater than the clock (up to 18 loads for double-sided DIMMs). In this case, it is strongly suggested that a delay of 500ps in the clock path so that the Address/Command setup time at the DIMMs can be met. This delay is sufficient to meet the setup time, without having to change the programmable delay (internal to the PPC440EPx) between the DQS/DQ/DM and the clock (assuming nominal settings as specified in the PPC440EPx Users Manual). While the clock is now 500ps later than the nominal DQS arrival time, this still falls well within the window allowed by the JEDEC spec for TDQSS ( 0.25 cycle, or 1.5ns at 166MHz). In the case where it is not possible to anticipate which kind of DIMMs may be employed in a system, it is always safe to use this 500ps clock delay, since registered DIMMs (the least heavily loaded) will have more than enough margin (almost 1/2 cycle) to accommodate the slight decrease in address hold time. AppliedMicro Proprietary 85 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Termination Model Figure 9. DDR SDRAM Simulation Signal Termination Model MemClkOut 10pF 120 10pF MemClkOut VTT = SOVDD/2 PPC440EPx 50 Addr/Ctrl (DDR2) Addr/Ctrl/Data/DQS/DM (DDR1) 30pF Note: This diagram illustrates the model of the DDR SDRAM interface used when generating simulation timing data. It is not a recommended physical circuit design for this interface. An actual interface design will depend on many factors, including the type of memory used and the board layout. DDR2 SDRAM On-Die Termination Impedance Setting For all DDR2 applications, the On-Die Termination (ODT) impedance value must be set to 75 ohms in the DIMM Extended Mode Register (EMR) in order to optimize the data transmission during memory write operations. Table 23. DDR SDRAM Output Driver Specifications Signal Path Output Current (mA) I/O H (maximum) I/O L (maximum) MemData00:63 10 10 ECC0:7 10 10 DM0:8 10 10 MemClkOut 10 10 MemAddr00:13 10 10 BA0:2 10 10 RAS 10 10 CAS 10 10 WE 10 10 BankSel0:1 10 10 ClkEn 10 10 DQS0:8 10 10 MemODT0:1 10 10 Write Data 86 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet DDR SDRAM Write Operation The rising edge of MemClkOut aligns with the first rising edge of the DQS signal on writes. The following data is generated by means of simulation and includes logic, driver, package RLC, and lengths. Values are calculated over best case and worst case processes with speed, junction temperature, and voltage as follows: Table 24. DDR SDRAM Write Operation Conditions Case Process Speed Junction Temperature (C) Voltage (V) Best Fast -40 +1.6 Worst Slow +125 +1.425 Note: In the following tables and timing diagrams, minimum values are measured under best case conditions and maximum values are measured under worst case conditions. The timing numbers in the following sections are obtained using a simulation that assumes a model as shown in Figure 9. The following diagram illustrates the relationship among the signals involved with a DDR write operation. Figure 10. DDR SDRAM Write Cycle Timing PLB Clk MemClkOut TSA Addr/Cmd TSK TDS THA TDS DQS TSD TSD MemData THD THD TSK = Delay from falling edge of MemClkOut to rising/falling edge of signal (skew) TSA = Setup time for address and command THA = Hold time for address and command signals from MemClkOut TSD = Setup time for data signals (minimum time data is valid before rising/falling edge of DSQ) THD = Hold time for data signals (minimum time data is valid after rising/falling edge of DSQ) TDS = Delay from rising/falling edge of clock to the rising/falling edge of DQS Note: The timing data in the following tables is based on simulation runs using Einstimer. AppliedMicro Proprietary 87 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Table 25. I/O Timing--DDR SDRAM TDS Notes: 1. All of the DQS signals are referenced to MemClkOut with the DQS delay line programmed to 1 cycle. 2. Clock speed is 166MHz. TDS (ns) Signal Name Minimum Maximum DQS0 -0.030 +0.650 DQS1 -0.030 +0.620 DQS2 -0.050 +0.580 DQS3 -0.110 +0.480 DQS4 -0.140 +0.410 DQS5 -0.120 +0.480 DQS6 -0.060 +0.580 DQS7 -0.010 +0.690 DQS8 -0.140 +0.420 Table 26. I/O Timing--DDR SDRAM TSK, TSA, and THA Notes: 1. Clock speed is 166MHz. TSK is referenced to MemClkOut falling edge. TSA and THA are referenced to MemClkOut rising edge. 2. The timing in this table assumes a single registered DIMM load on the outputs. To adjust the timing for unbuffered DIMMs, use the following values by subtracting them from TSA and adding them to TSK and THA: 5 loads adjust by 0.41ns 9 loads adjust by 1.12ns 18 loads adjust by 2.12ns 3. To obtain adjusted TSA values for lower clock frequencies, use 1/2 of the cycle time for the lower clock frequency and subtract TSK maximum (0.5TCYC - TSKmax). 4. To obtain adjusted THA values for lower clock frequencies, use 1/2 of the cycle time for the lower clock frequency and add TSK minimum (0.5TCYC + TSKmin). Signal Name TSA (ns) THA (ns) Minimum TSK (ns) Maximum Minimum Minimum -0.960 -0.270 3.27 2.04 MemAddr00:13 BA0:2 BankSel0:1 ClkEn CAS RAS WE 88 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 27. I/O Timing--DDR SDRAM TSD and THD Notes: 1. TSD and THD are measured under worst case conditions. 2. Clock speed for the values in the table is 166MHz. 3. The time values in the table include 1/4 of a cycle at 166MHz (6ns x 0.25 = 1.5 ns). 4. To obtain adjusted TSD and THD values for lower clock frequencies, subtract 1.5 ns from the values in the table and add 1/4 of the cycle time for the lower clock frequency (for example, TSD - 1.5 + 0.25TCYC). Reference Signal TSD (ns) THD (ns) MemData00:07, DM0 DQS0 1.37 1.23 MemData08:15, DM1 DQS1 1.41 1.18 MemData16:23, DM2 DQS2 1.40 1.17 MemData24:31, DM3 DQS3 1.41 1.20 MemData32:39, DM4 DQS4 1.45 1.18 MemData40:47, DM5 DQS5 1.40 1.18 MemData48:55, DM6 DQS6 1.46 1.17 MemData56:63, DM7 DQS7 1.45 1.10 ECC0:7, DM8 DQS8 1.46 1.18 Signal Names AppliedMicro Proprietary 89 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet DDR SDRAM Read Operation The read data capture logic is responsible for capturing the data outputs from the SDRAM devices and passing the data back to the system clock domain. The data strobe signal (DQS) signals used to capture data are delayed to ensure that the rising and falling edges of these strobes are in the middle of the valid window of data. DDR devices send a DQS coincident with the read data so that the data can be reliably captured by the PPC440EPx. The edges of these strobe signals are aligned with the data output by the SDRAM devices. In order to reliably latch the data into a synchronizing FIFO, the PPC440EPx produces an internal, delayed version of DQS. The amount of delay is user programmable. In the example shown in Figure , the delay is set to approximately 25% of the system clock. A delay compensation circuit in the PPC440EPx keeps this delay constant. Figure 11. DDR SDRAM DQS Read Timing MemClkOut DQS DQS delay MemData Delayed DQS (data strobe) DQS Delay programmed in bitfields DDR0_17[DDQSD0], DDR0_18[DDQD4:1] and DDR0_19[DDQD8:5]. TSD = Setup time for data signals (minimum time data is valid before rising/falling edge of DSQ) THD = Hold time for data signals (minimum time data is valid after rising/falling edge of DSQ) 90 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Table 28. Read I/O Timing--DDR SDRAM TSD and THD Notes: TSD and THD are measured under worst case conditions. Reference Signal TSD (ns) THD (ns) MemData00:07, DM0 DQS0 0.650 0.500 MemData08:15, DM1 DQS1 0.650 0.510 MemData16:23, DM2 DQS2 0.670 0.530 MemData24:31, DM3 DQS3 0.680 0.540 MemData32:39, DM4 DQS4 0.710 0.510 MemData40:47, DM5 DQS5 0.640 0.430 MemData48:55, DM6 DQS6 0.640 0.430 MemData56:63, DM7 DQS7 0.560 0.390 ECC0:7, DM8 DQS8 0.720 0.520 Signal Names AppliedMicro Proprietary 91 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Boot Configuration The PPC440EPx supports several configurable boot parameters that must be initialized prior to booting. These parameters are configured by one of several default boot options or programmed by data read from an IIC serial EEPROM (see "Serial EEPROM" below). Strap signals sampled during reset select which method is used to initialize the boot parameters (see "Strapping" below). Strapping The Bootstrap Controller selects the boot options based on the state of the strap signals during reset. The strap signals are sampled on the rising edge of SysClk while SysReset is driven low. They must not change state until after SysReset is driven high in order to guarantee the correct boot option is selected. These pins are used for strap functions only during reset. Following reset, they are used as UART signals. The UART signal names are shown in parentheses following the pin number. Note: To isolate the strapping pins, the ExtReset signal may be used as a buffer enable or multiplexer select. The following table lists the strapping pins along with their functions and boot strap options: Table 29. Strapping Pin Assignments Pin Strapping Function Serial device is disabled. Each of the six options (A-F) is a combination of boot source, boot-source width, and clock frequency specifications. Refer to the IIC Bootstrap Controller chapter in the PPC440EPx Embedded Processor User's Manual for details. Serial device is enabled. Boot Option G and H enable the Bootstrap Controller to program boot parameters using data read from an IIC serial EEPROM. Option G and H support different IIC addresses. Option G - Address 0xA8 is left justified (0x1010100 + R/W bit). Option H - Address 0xA4 is left justified (0x1010010 + R/W bit). Option C28 (UART0_DCD) C29 (UART0_DSR) A29 (UART0_CTS) A1 0 0 0 B1 0 0 1 C 0 1 0 D1 0 1 1 E1 1 0 0 F 1 1 0 G (0xA8) 1 0 1 H (0xA4) 1 1 1 1. Bootstrap options A, B, D, and E result in a PLL Forward Divisor B setting such that Forward Divisor B output frequency exceeds the CPU clock frequency. Following a power up, system reset or chip reset (when CPR0_ICFG[RLI] = 0), FWDVB and PRBDV0 must be reprogrammed as documented in the PowerPC 440EPx/GRx Embedded Processor User's Manual in the Bootstrap Options section. The dividers must be re-programmed before the DDR is tuned such that the output of PLL Forward Divider B does not exceed the CPU clock frequency. Serial EEPROM Boot Options G and H enable the Bootstrap Controller to read 16 bytes of configuration data from a serial EEPROM attached to the IIC0 bus after SysReset de-asserts. The Bootstrap Controller stores the data in the SDR0_SDSTP0:3 registers. Note: The IIC serial EEPROM must have a one-byte base address. Multi-byte base addresses are not supported. The initialization settings and their default values are covered in detail in the PowerPC 440EPx/GRx Embedded Processor User's Manual. 92 AppliedMicro Proprietary 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Revision Log Date Version Contents of Modification 06/01/2005 Initial creation of document. 06/03/2005 Add "Preliminary--Subject to Change" watermark. 07/06/2005 Change maximum NAND Flash to 256MB. 08/29/2005 Update with signal-to-pin assignment and I/O circuit type specifications. 09/12/2005 Replace existing DDR SDRAM information with new DDR2 SDRAM information. 10/03/2005 Implement updates from the 09/12 review. 10/05/2005 Misc. updates. 11/14/2005 1.07 Correct MemClkOut duty cycle. Correct description and move PerErr signal from master to slave. Change maximum VCO frequency to 1334MHz. 03/01/2006 1.08 Update corporate address and copyright date Update available Ethernet interface configurations (no RMII). 03/15/2006 1.09 Add four peripheral data parity signals. Change multiplexing of six GPIO signals. Update DDR2 SDRAM data. Adjust all other I/O timing. 04/05/2006 1.10 Misc. updates. Remove Confidential status. Correct OPB bridge information. 04/24/2006 1.11 Misc. updates. Correct security function designation. Add new power and current values. 05/12/2006 1.12 Misc. updates. Remove data for 333MHz CPU speed. Change all GPIOxx signals from alternate to primary. Change UART designations to eliminate letter designations B, C, D. 05/15/2006 1.13 Misc. updates. 05/30/2006 1.14 Correct list containing balls by ball number. Update power and temperature data. Add clocking information. Update EEPROM. 07/12/2006 1.15 Memory address corrections. 07/19/2006 1.16 Change and delete incorrect MemClkEn references. Correct enable/disable specifications for PCI Gnt/Req signals. 1.17 Change USB2Rext pull-down from 2.4k to 3.4k Change analog voltage filter circuit inductor part number. Switch multiplex defaults for PerData16:31 from the USB signals to the PerData signals. Correct I/O designation for some Ethernet signals. Add thermal monitor information. Provide corrected and additional information on USB crystal/oscillator inputs. Remove leaded PNs. 11/02/2006 AppliedMicro Proprietary 93 Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Date Version Contents of Modification 12/28/2006 1.18 Indicate that two USB analog voltages are needed with separate filters. Correct descriptions of LeakTest, RcvrInh, ModeCtrl, RefEn, and DrvrInh1:2 signals. Add information concerning address bus loading on DDR SDRAMs. Additions to information on USB crystal/oscillator inputs. Restore leaded PNs. 01/10/2007 1.19 Update DDR2/1 SDRAM timing and board design data. 02/01/2007 1.20 Update power data. Change VIL. 03/12/2007 1.21 Change Typical Power on first page. Change VIL back to what it was. Update package drawing with another view. 04/23/2007 1.22 Remove all valid USB oscillator and crystal frequencies except 48MHz. 07/18/2007 1.23 Added more information to the Thermal Monitor section. 08/06/2007 1.24 Changes to Figure 3. 08/24/2007 1.25 Added Assembly Recommendations, added Tables 3 and 4. Added recommendations for Unused I/O. Updated signal description in table 7 for signals SPCClkOUT, SCPDI, SCPDO, LeakTest and LeakTest2. Updated Table 19 to include reference clocks. Removed all references to TBI and RTBI as these modes are not supported due to errata: Chip_4 and Chip_5. Added voltage reference to Figures 4, 5, and 6 Corrected I/O comments for UART and Ethernet signals in Table 6. Removed Note 2 from Table 7 and added section on Analog Voltage Filter Added Figure and Table for Overshoot and Undershoot. Added section on Power Sequencing. Added slew rate and jitter requirements for GMCRefClk in Table 20. Added note in Strapping section Changed GPIO26[IIC0SData] to [GPIO26]IIC0SData. Added figures showing setup, hold, output valid and output hold timing for RGMII signals. 10/15/2007 1.26 Corrected telephone numbers on the last page. Corrected RGMII timing relative to GMCnTXClk in table 21. Pull up recommendations to Table 9 for PCI signals. 1.27 Correction to table 19 "GMCRefClk Period" unit column, changed MHz to ns. Corrected DC Overshoot in Overshoot. Added note for SMIISync signal to I/O Specification table. Added timing references to I/O Specification tables. Added an unused termination recommendation for Ethernet interfaces. Added TrcClk supported range to Clock Specification table. Remove tape and reel as a shipping option. Corrected GMCTxClk entry in Table 8 to indicate that it is an input. 03/18/2008 1.28 Replaced 16750 compatible UART to 16550 Replaced NS16750 with NS16550. Updated the Drvrinh1:2. Updated the Analog Voltage Filter from SAVDD to EAVDD and SAGND to EAGND Updated the RejectPkt0:1 note in table 8. Update to table 6 signals list: F02, AB33, and AL27 07/22/2008 1.29 Add JTAG timing specification to Table 20. 01/072008 94 AppliedMicro Proprietary Revision 1.32 - May 18, 2012 440EPx - PPC440EPx Embedded Processor Data Sheet Date Version Contents of Modification 1.30 Doc Issue 5025: Added C value to filter AVdd circuit on page 68. Doc Issue 5172: Replaced Figure 8 with new RGMII timing figure. Removed former Figure 9. Added new Table 20 with RGMII I/O Timing data. Removed RGMII timing data from former Table 20 (is now Table 21). Doc Issue 5437: Update USB Host EHCI description to USB 2.0. Doc Issue 5632: Updated Boot Configuration, Strapping, and Serial EEPROM information on page 89. Doc Issue 5856: Added notes to Table 18 regarding Spread Spectrum, SysClk jitter, and slew rate. Doc Issue 5894: Removed "Preliminary". 02/16/2012 1.31 Updated to AppliedMicro and new logo. Doc Issue 5121: Added DDR read timing table (Table 28) and updated Figure 11. Updated PDF bookmarks. Updated PCIGnt0/Req and SysErr signal descriptions (Table 8). Doc Issue 6823: Updated pack type to TE-EPBGA. 05/18/2012 1.32 Updated signal description for USB2OM in Table 8. 02/27/2009 AppliedMicro Proprietary 95 440EPx - PPC440EPx Embedded Processor Revision 1.32 - May 18, 2012 Data Sheet Applied Micro Circuits Corporation 215 Moffett Park Dr., Sunnyvale, CA 94089 Phone: (408) 542-8600 -- Fax: (408) 542-8601 http://www.apm.com AppliedMicro reserves the right to make changes to its products, its data sheets, or related documentation, without notice and warrants its products solely pursuant to its terms and conditions of sale, only to substantially comply with the latest available data sheet. Please consult AppliedMicro's Term and Conditions of Sale for its warranties and other terms, conditions and limitations. AppliedMicro may discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information is current. AppliedMicro does not assume any liability arising out of the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AppliedMicro reserves the right to ship devices of higher grade in place of those of lower grade. APPLIEDMICRO SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. AppliedMicro and AMCC are Trademarks of Applied Micro Circuits Corporation. Copyright (c) 2009 Applied Micro Circuits Corporation. 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