All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_BP100_1011
www.bergquistcompany.com
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: 800-347-4572
Fax: 952-835-0430
The Bergquist Company -
European Headquarters
Netherlands
Phone: 31-35-5380684
Fax: 31-35-5380295
The Bergquist Company -
Asia Headquarters
Hong Kong
Phone: 852-2690-9296
Fax: 852-2690-2344
Bond-Ply
®
100
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape
Features and Benefits
• Thermal impedance:
0.52°C-in2/W (@50 psi)
• High bond strength to a variety of surfaces
• Double-sided, pressure sensitive
adhesive tape
• High performance, thermally conductive
acrylic adhesive
• Can be used instead of heat-cure adhesive,
screw mounting or clip mounting
Typical Applications
Include:
• Mount heat sink onto BGA graphic
processor or drive processor
• Mount heat spreader onto power
converter PCB or onto motor control PCB
Configurations Available:
• Sheet form, roll form and die-cut parts
Shelf Life: The double-sided, pressure
sensitive adhesive used in Bond-Ply products
requires the use of dual liners to protect
the surfaces from contaminants. Bergquist
recommends a 6-month shelf life at a
maximum continuous storage temperature
of 35°C or 3-month shelf life at a maximum
continuous storage temperature of 45°C, for
maintenance of controlled adhesion to the
liner.The shelf life of the Bond-Ply material,
without consideration of liner adhesion
(which is often not critical for manual assembly
processing), is recommended at 12 months
from date of manufacture at a maximum
continuous storage temperature of 60°C.
Building a Part Number Standard Options
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
BP100 = Bond-Ply 100 Material
BP100 0.008 00 1112 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.005", 0.008", 0.011"
00 = No adhesive
1112 = 11" x 12" sheets,11250 = 11" x 250' rolls
or 00 = custom configuration
––––
TYPICAL PROPERTIES OF BOND-PLY 100
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color White White Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.005, 0.008, 0.011 0.127, 0.203, 0.279 ASTM D374
Temp. Resistance, 30 sec. (°F) / (°C) 392 200 —
Elongation (%45° to Warp & Fill) 70 70 ASTM D412
Tensile Strength (psi) / (MPa) 900 6 ASTM D412
CTE (ppm) 325 325 ASTM D3386
Glass Transition (°F) / (°C) -22 -30 ASTM D1356
Continuous Use Temp (°F) / (°C) -22 to 248 -30 to 120 —
ADHESION
Lap Shear @ RT (psi) / (MPa) 100 0.7 ASTM D1002
Lap Shear after 5 hr @ 100°C 200 1.4 ASTM D1002
Lap Shear after 2 min @ 200°C 200 1.4 ASTM D1002
Static Dead Weight Shear (°F) / (°C) 302 150 PSTC#7
ELECTRICAL VALUE TEST METHOD
Dielectric Breakdown Voltage - 0.005" (Vac) 3000 ASTM D149
Dielectric Breakdown Voltage - 0.008" (Vac) 6000 ASTM D149
Dielectric Breakdown Voltage - 0.011" (Vac) 8500 ASTM D149
Flame Rating V-O U.L.94
THERMAL
Thermal Conductivity (W/m-K) 0.8 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Initial Assembly Pressure (psi for 5 seconds) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 0.005" 5.17 4.87 4.49 4.18 4.10
TO-220 Thermal Performance (°C/W) 0.008" 5.40 5.35 5.28 5.22 5.20
TO-220 Thermal Performance (°C/W) 0.011" 6.59 6.51 6.51 6.50 6.40
Thermal Impedance (°C-in2/W) 0.005" (1) 0.56 0.54 0.52 0.50 0.50
Thermal Impedance (°C-in2/W) 0.008" (1) 0.82 0.80 0.78 0.77 0.75
Thermal Impedance (°C-in2/W) 0.011" (1) 1.03 1.02 1.01 1.00 0.99
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These
values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and
pressure applied.
