Three-Wire Hall-Effect Latch with Advanced Diagnostics
APS12450
20
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
The device must be operated below the maximum junction
temperature, TJ (max). Reliable operation may require derating
supplied power and/or improving the heat dissipation properties
of the application.
Thermal Resistance (junction to ambient), RθJA, is a figure of
merit summarizing the ability of the application and the device to
dissipate heat from the junction (die), through all paths to ambi-
ent air. RθJA is dominated by the Effective Thermal Conductivity,
K, of the printed circuit board which includes adjacent devices
and board layout. Thermal resistance from the die junction to
case, RθJC, is a relatively small component of RθJA. Ambient air
temperature, TA, and air motion are significant external factors in
determining a reliable thermal operating point.
The following three equations can be used to determine operation
points for given power and thermal conditions.
PD = VIN × IIN (1)
∆T=PD × RθJA (2)
TJ = TA+∆T (3)
For example, given common conditions: TA = 25°C, VCC = 12 V,
ICC = 4 mA, and RθJA = 110°C/W for the LH package, then:
PD = VCC × ICC = 12 V × 4 mA = 48 mW
∆T=PD × RθJA = 48 mW × 110°C/W = 5.28°C
TJ = TA+∆T=25°C+5.28°C=31.28°C
Determining Maximum VCC
For a given ambient temperature, TA, the maximum allow-
able power dissipation as a function of VCC can be calculated.
PD (max) represents the maximum allowable power level without
exceeding TJ (max) at a selected RθJA and TA.
Example: VCC at TA = 150°C, package UA, using low-K PCB.
Using the worst-case ratings for the device, specifically: RθJA =
165°C/W, TJ (max) = 165°C, VCC (max) = 24 V, and ICC (max) =
4 mA, calculate the maximum allowable power level, PD (max).
First, using equation 3:
∆T(max)=TJ (max) – TA = 165°C – 150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, from equation 2:
PD(max)=∆T(max)÷RθJA=15°C÷165°C/W=91mW
Finally, using equation 1, solve for maximum allowable VCC for
the given conditions:
VCC (est) = PD(max)÷ICC(max)=91mW÷4mA=22.8V
The result indicates that, at TA, the application and device can
dissipateadequateamountsofheatatvoltages≤VCC (est).
If the application requires VCC > VCC(est) then RθJA must by
improved. This can be accomplished by adjusting the layout,
PCB materials, or by controlling the ambient temperature.
Determining Maximum TA
In cases where the VCC (max) level is known, and the system
designer would like to determine the maximum allowable ambi-
ent temperature TA (max), for example, in a worst-case scenario
with conditions VCC (max) = 40 V, ICC (max) = 4 mA, and RθJA
= 228°C/W for the LH package using equation 1, the largest pos-
sible amount of dissipated power is:
PD = VIN × IIN
PD = 40 V × 4 mA = 160 mW
Then, by rearranging equation 3 and substituting with equation 2:
TA (max) = TJ(max)–ΔT
TA (max) = 165°C – (160 mW × 228°C/W)
TA(max)=165°C–36.5°C=128.5°C
In another example, the maximum supply voltage is equal to
VCC (min). Therefore, VCC (max) = 3 V and ICC (max) = 4 mA.
By using equation 1 the largest possible amount of dissipated
power is:
PD = VIN × IIN
PD=3V×4mA=12mW
Then, by rearranging equation 3 and substituting with equation 2:
TA (max) = TJ(max)–ΔT
TA (max) = 165°C – (12 mW × 228°C/W)
TA(max)=165°C–11.6°C=162.3°C
The example above indicates that at VCC = 3 V and ICC = 4 mA,
the TA (max) can be as high as 162.3°C without exceeding
TJ (max). However the TA (max) rating of the device is 150°C;
the device performance is not guaranteed above TA = 150°C.
POWER DERATING