Low Voltage Temperature Sensors
TMP35/TMP36/TMP37
Rev. E
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FEATURES
Low voltage operation (2.7 V to 5.5 V)
Calibrated directly in °C
10 mV/°C scale factor (20 mV/°C on TMP37)
±2°C accuracy over temperature (typ)
±0.5°C linearity (typ)
Stable with large capacitive loads
Specified −40°C to +125°C, operation to +150°C
Less than 50 μA quiescent current
Shutdown current 0.5 μA max
Low self-heating
APPLICATIONS
Environmental control systems
Thermal protection
Industrial process control
Fire alarms
Power system monitors
CPU thermal management
GENERAL DESCRIPTION
The TMP35/TMP36/TMP37 are low voltage, precision centi-
grade temperature sensors. They provide a voltage output that
is linearly proportional to the Celsius (centigrade) temperature.
The TMP35/ TMP36/TMP37 do not require any external
calibration to provide typical accuracies of ±1°C at +25°C
and ±2°C over the −40°C to +125°C temperature range.
The low output impedance of the TMP35/TMP36/TMP37 and
its linear output and precise calibration simplify interfacing to
temperature control circuitry and ADCs. All three devices are
intended for single-supply operation from 2.7 V to 5.5 V maxi-
mum. The supply current runs well below 50 μA, providing
very low self-heating—less than 0.1°C in still air. In addition, a
shutdown function is provided to cut the supply current to less
than 0.5 μA.
FUNCTIONAL BLOCK DIAGRAM
+
V
S
(2.7V TO 5.5V)
V
OUT
SHUTDOWN
TMP35/
TMP36/
TMP37
00337-001
Figure 1.
PIN CONFIGURATIONS
1
2
3
5
4
TOP VIEW
(Not to Scale)
NC = NO CONNECT
V
OUT
SHUTDOWN
GND
NC
+V
S
00337-002
Figure 2. RJ-5 (SOT-23)
1
2
3
4
8
7
6
5
TOP VIEW
(Not to Scale)
NC = NO CONNECT
V
OUT
SHUTDOWN
NC
NC
+V
S
NC
NC
GND
00337-003
Figure 3. R-8 (SOIC_N)
1 3
2
BOTTOM VIEW
(Not to Scale)
PIN 1, +V
S
; PIN 2, V
OUT
; PIN 3, GND
00337-004
Figure 4. T-3 (TO-92)
The TMP35 is functionally compatible with the LM35/LM45
and provides a 250 mV output at 25°C. The TMP35 reads
temperatures from 10°C to 125°C. The TMP36 is specified from
−40°C to +125°C, provides a 750 mV output at 25°C, and
operates to 125°C from a single 2.7 V supply. The TMP36 is
functionally compatible with the LM50. Both the TMP35 and
TMP36 have an output scale factor of 10 mV/°C.
The TMP37 is intended for applications over the range of 5°C
to 100°C and provides an output scale factor of 20 mV/°C. The
TMP37 provides a 500 mV output at 25°C. Operation extends
to 150°C with reduced accuracy for all devices when operating
from a 5 V supply.
The TMP35/TMP36/TMP37 are available in low cost 3-lead
TO-92, 8-lead SOIC_N, and 5-lead SOT-23 surface-mount
packages.
TMP35/TMP36/TMP37
Rev. E | Page 2 of 20
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Pin Configurations ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Typical Performance Characteristics ............................................. 5
Functional Description .................................................................... 8
Applications Information ................................................................ 9
Shutdown Operation .................................................................... 9
Mounting Considerations ........................................................... 9
Thermal Environment Effects .....................................................9
Basic Temperature Sensor Connections .................................. 10
Fahrenheit Thermometers ........................................................ 10
Average and Differential Temperature Measurement ........... 12
Microprocessor Interrupt Generator ....................................... 13
Thermocouple Signal Conditioning with Cold-Junction
Compensation ............................................................................. 14
Using TMP3x Sensors in Remote Locations .......................... 15
Temperature to 4–20 mA Loop Transmitter .......................... 15
Temperature-to-Frequency Converter .................................... 16
Driving Long Cables or Heavy Capacitive Loads .................. 17
Commentary on Long-Term Stability ..................................... 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 19
REVISION HISTORY
8/08—Rev. D to Rev. E
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 19
3/05—Rev. C to Rev. D
Updated Format .................................................................. Universal
Changes to Specifications ................................................................ 3
Additions to Absolute Maximum Ratings ..................................... 4
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 19
10/02—Rev. B to Rev. C
Changes to Specifications ................................................................. 3
Deleted Text from Commentary on Long-Term Stability
Sect ion .............................................................................................. 13
Updated Outline Dimensions ....................................................... 14
9/01—Rev. A to Rev. B
Edits to Specifications ....................................................................... 2
Addition of New Figure 1 ................................................................. 2
Deletion of Wafer Test Limits Section ............................................ 3
6/97—Rev. 0 to Rev. A
3/96—Revision 0: Initial Version
TMP35/TMP36/TMP37
Rev. E | Page 3 of 20
SPECIFICATIONS
VS = 2.7 V to 5.5 V, −40°C ≤ TA ≤ +125°C, unless otherwise noted.
Table 1.
Parameter1 Symbol Test Conditions/Comments Min Typ Max Unit
ACCURACY
TMP35/TMP36/TMP37 (F Grade) TA = 25°C ±1 ±2 °C
TMP35/TMP36/TMP37 (G Grade) TA = 25°C ±1 ±3 °C
TMP35/TMP36/TMP37 (F Grade) Over rated temperature ±2 ±3 °C
TMP35/TMP36/TMP37 (G Grade) Over rated temperature ±2 ±4 °C
Scale Factor, TMP35 10°C ≤ TA ≤ 125°C 10 mV/°C
Scale Factor, TMP36 −40°C ≤ TA ≤ +125°C 10 mV/°C
Scale Factor, TMP37 5°C ≤ TA ≤ 85°C 20 mV/°C
5°C ≤ TA ≤ 100°C 20 mV/°C
3.0 V ≤ VS ≤ 5.5 V
Load Regulation 0 μA ≤ IL ≤ 50 μA
−40°C ≤ TA ≤ +105°C 6 20 m°C/μA
−105°C ≤ TA ≤ +125°C 25 60 m°C/μA
Power Supply Rejection Ratio PSRR TA = 25°C 30 100 m°C/V
3.0 V ≤ VS ≤ 5.5 V 50 m°C/V
Linearity 0.5 °C
Long-Term Stability TA = 150°C for 1 kHz 0.4 °C
SHUTDOWN
Logic High Input Voltage VIH VS = 2.7 V 1.8 V
Logic Low Input Voltage VIL VS = 5.5 V 400 mV
OUTPUT
TMP35 Output Voltage TA = 25°C 250 mV
TMP36 Output Voltage TA = 25°C 750 mV
TMP37 Output Voltage TA = 25°C 500 mV
Output Voltage Range 100 2000 mV
Output Load Current IL 0 50 μA
Short-Circuit Current ISC Note 2 250 μA
Capacitive Load Driving CL No oscillations21000 10000 pF
Device Turn-On Time Output within ±1°C, 100 kΩ||100 pF load2 0.5 1 ms
POWER SUPPLY
Supply Range VS 2.7 5.5 V
Supply Current ISY (ON) Unloaded 50 μA
Supply Current (Shutdown) ISY (OFF) Unloaded 0.01 0.5 μA
1 Does not consider errors caused by self-heating.
2 Guaranteed but not tested.
TMP35/TMP36/TMP37
Rev. E | Page 4 of 20
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter1, 2 Rating
Supply Voltage 7 V
Shutdown Pin GND ≤ SHUTDOWN ≤ +VS
Output Pin GND ≤ VOUT ≤ +VS
Operating Temperature Range −55°C to +150°C
Die Junction Temperature 175°C
Storage Temperature Range −65°C to +160°C
IR Reflow Soldering
Peak Temperature 220°C (0°C/5°C)
Time at Peak Temperature Range 10 sec to 20 sec
Ramp-Up Rate 3°C/sec
Ramp-Down Rate −6°C/sec
Time 25°C to Peak Temperature 6 min
IR Reflow Soldering—Pb-Free Package
Peak Temperature 260°C (0°C)
Time at Peak Temperature Range 20 sec to 40 sec
Ramp-Up Rate 3°C/sec
Ramp-Down Rate −6°C/sec
Time 25°C to Peak Temperature 8 min
1 Digital inputs are protected; however, permanent damage can occur on
unprotected units from high energy electrostatic fields. Keep units in
conductive foam or packaging at all times until ready to use. Use proper
antistatic handling procedures.
2 Remove power before inserting or removing units from their sockets.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device in
socket.
Table 3. Thermal Resistance
Package Type θJA θ
JC Unit
TO-92 (T-3) 162 120 °C/W
SOIC_N (R-8) 158 43 °C/W
SOT-23 (RJ-5) 300 180 °C/W
ESD CAUTION
TMP35/TMP36/TMP37
Rev. E | Page 5 of 20
TYPICAL PERFORMANCE CHARACTERISTICS
TEMPERATURE (°C)
–50
LOAD REGULATION (m°C/µA)
0 50 100 150
50
30
20
10
0
40
00337-005
Figure 5. Load Regulation vs. Temperature (m°C/μA)
TEMPERATURE (°C)
1.4
0
1.2
1.0
0.8
0.6
0.4
0.2
1.6
1.8
2.0
–50 –25 0 25 50 75 100 125
OUTPUT VOLTAGE (V)
a
b
c
a. TMP35
b. TMP36
c. TMP37
+V
S
= 3V
00337-007
Figure 6. Output Voltage vs. Temperature
a. MAXIMUM LIMIT (G GRADE)
b. TYPICAL ACCURACY ERROR
c. MINIMUM LIMIT (G GRADE)
TEMPERATURE (°C)
2
–5
1
0
–1
–2
–3
–4
3
4
5
0 20 40 60 80 100 120 140
a
b
c
ACCURACY ERROR (°C)
00337-008
Figure 7. Accuracy Error vs. Temperature
TEMPERATURE (°C)
0.4
0.3
0
–50 125–25 0 25 50 75 100
0.2
0.1
POWER SUPPLY REJECTION (°C/V)
+VS = 3V TO 5.5V, NO LOAD
00337-009
Figure 8. Power Supply Rejection vs. Temperature
FREQUENCY (Hz)
100.000
0.010
20 100k100 1k 10k
31.600
10.000
3.160
1.000
0.320
0.100
0.032
POWER SUPPLY REJECTION (°C/V)
00337-010
Figure 9. Power Supply Rejection vs. Frequency
TEMPERATURE (°C)
4
3
0
2
1
5
–50 125–25 0 25 50 75 100
MINIMUM SUPPLY VOLTAGE (V)
b
a
MINIMUM SUPPLY VOLTAGE REQUIRED TO MEET
DATA SHEET SPECIFICATION
NO LOAD
a. TMP35/TMP36
b. TMP37
00337-011
Figure 10. Minimum Supply Voltage vs. Temperature
TMP35/TMP36/TMP37
Rev. E | Page 6 of 20
SUPPLY CURRENT (µA)
TEMPERATURE (°C)
50
40
10
30
20
60
–50 125–250 255075100
NO LOAD
b
a
a. +V
S
= 5V
b. +V
S
= 3V
00337-012
Figure 11. Supply Current vs. Temperature
SUPPLY VOLTAGE (V)
40
30
0
20
10
50
07123 456
SUPPLY CURRENT (
μ
A)
T
A
= 25
°
C, NO LOAD
8
00337-013
Figure 12. Supply Current vs. Supply Voltage
TEMPERATURE (°C)
40
30
0
20
10
50
–50 125–25 025 50 75 100
a. +V
S
= 5V
b. +V
S
= 3V
NO LOAD
a
b
SUPPLY CURRENT (nA)
00337-014
Figure 13. Supply Current vs. Temperature (Shutdown = 0 V)
TEMPERATURE (°C)
400
300
0
200
100
–50 125–250255075
100
= +V
S
AND SHUTDOWN PINS
LOW TO HIGH (0V TO 3V)
V
OUT
SETTLES WITHIN ±1°C
= +V
S
AND SHUTDOWN PINS
HIGH TO LOW (3V TO 0V)
RESPONSE TIME (µs)
00337-015
Figure 14. VOUT Response Time for +VS Power-Up/Power-Down vs.
Temperature
TEMPERATURE (°C)
400
300
0
200
100
–50 125–25 0 25 50 75 100
= SHUTDOWN PIN
HIGH TO LOW (3V TO 0V)
= SHUTDOWN PIN
LOW TO HIGH (0V TO 3V)
V
OUT
SETTLES WITHIN ±1°C
RESPONSE TIME (µs)
00337-016
Figure 15. VOUT Response Time for SHUTDOWN Pin vs. Temperature
TIME (µs)
0
1.0
0.8
0.6
0.4
0.2
–50 2500 10050 150 200 300 350 400 450
OUTPUT VOLTAGE (V)
0
1.0
0.8
0.6
0.4
0.2
TA = 25°C
+VS = 3V
SHUTDOWN =
SIGNAL
TA = 25°C
+VS AND SHUTDOWN =
SIGNAL
00337-017
Figure 16. VOUT Response Time to SHUTDOWN Pin and +VS Pin vs. Time
TMP35/TMP36/TMP37
Rev. E | Page 7 of 20
10
0%
100
90
1ms
10mV
TIME/DIVISION
VOLT/DIVISION
00337-019
TIME (s)
70
0
60
50
40
30
20
10
80
90
100
110
0100 200 300 400 500 600
a
bc+V
S
= 3V, 5V
CHANGE (%)
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
00337-034
Figure 20. Temperature Sensor Wideband Output Noise Voltage;
Gain = 100, BW = 157 kHz
Figure 17. Thermal Response Time in Still Air
AIR VELOCITY (FPM)
0
60
40
20
80
140
100
120
0 100 200 300 400 500 600
TIME CONSTANT (s)
a
b
c
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
+V
S
= 3V, 5V
700
00337-018
a
b
FREQUENCY (Hz)
2400
1000
010 10k100 1k
2200
2000
1600
1800
1400
1200
800
600
400
200
a. TMP35/TMP36
b. TMP37
VOLTAGE NOISE DENSITY (nV/ Hz)
00337-020
Figure 21. Voltage Noise Spectral Density vs. Frequency
Figure 18. Thermal Response Time Constant in Forced Air
TIME (s)
70
0
60
50
40
30
20
10
80
90
100
110
010 20 30 40 50 60
a
b
c
CHANGE (%)
+V
S
= 3V, 5V
a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB
b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB
c. TMP35 TO-92 IN SOCKET SOLDERED TO
1" × 0.4" Cu PCB
00337-035
Figure 19. Thermal Response Time in Stirred Oil Bath
TMP35/TMP36/TMP37
Rev. E | Page 8 of 20
FUNCTIONAL DESCRIPTION
An equivalent circuit for the TMP3x family of micropower,
centigrade temperature sensors is shown in Figure 22. The core
of the temperature sensor is a band gap core that comprises
transistors Q1 and Q2, biased by Q3 to approximately 8 μA. The
band gap core operates both Q1 and Q2 at the same collector
current level; however, because the emitter area of Q1 is 10
times that of Q2, the VBE of Q1 and the VBE of Q2 are not equal
by the following relationship:
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
×=Δ
E,Q2
E,Q1
T
BE A
A
VV ln
Resistors R1 and R2 are used to scale this result to produce
the output voltage transfer characteristic of each temperature
sensor and, simultaneously, R2 and R3 are used to scale the VBE of
Q1 as an offset term in VOUT. Table 4 summarizes the differences
in the output characteristics of the three temperature sensors.
The output voltage of the temperature sensor is available at the
emitter of Q4, which buffers the band gap core and provides
load current drive. The current gain of Q4, working with the
available base current drive from the previous stage, sets the
short-circuit current limit of these devices to 250 μA.
SHUTDOWN
V
OUT
+V
S
3X
25µA
2X
Q2
1X
R1
R2
R3
7.5µA
Q3
2X
GND
Q4
Q1
10X
6X
00337-006
Figure 22. Temperature Sensor Simplified Equivalent Circuit
Table 4. TMP3x Output Characteristics
Sensor
Offset
Voltage (V)
Output Voltage
Scaling (mV/°C)
Output Voltage
@ 25°C (mV)
TMP35 0 10 250
TMP36 0.5 10 750
TMP37 0 20 500
TMP35/TMP36/TMP37
Rev. E | Page 9 of 20
APPLICATIONS INFORMATION
SHUTDOWN OPERATION
All TMP3x devices include a shutdown capability, which
reduces the power supply drain to less than 0.5 μA maximum.
This feature, available only in the SOIC_N and the SOT-23
packages, is TTL/CMOS level-compatible, provided that the
temperature sensor supply voltage is equal in magnitude to the
logic supply voltage. Internal to the TMP3x at the SHUTDOWN
pin, a pull-up current source to +VS is connected. This allows
the SHUTDOWN pin to be driven from an open-collector/drain
driver. A logic low, or zero-volt condition, on the SHUTDOWN
pin is required to turn off the output stage. During shutdown,
the output of the temperature sensors becomes high impedance
where the potential of the output pin is then determined by
external circuitry. If the shutdown feature is not used, it is
recommended that the SHUTDOWN pin be connected to +VS
(Pin 8 on the SOIC_N; Pin 2 on the SOT-23).
The shutdown response time of these temperature sensors is
shown in Figure 14, Figure 15, and Figure 16.
MOUNTING CONSIDERATIONS
If the TMP3x temperature sensors are thermally attached and
protected, they can be used in any temperature measurement
application where the maximum temperature range of the
medium is between −40°C and +125°C. Properly cemented or
glued to the surface of the medium, these sensors are within
0.01°C of the surface temperature. Caution should be exercised,
especially with T-3 packages, because the leads and any wiring
to the device can act as heat pipes, introducing errors if the
surrounding air-surface interface is not isothermal. Avoiding this
condition is easily achieved by dabbing the leads of the temper-
ature sensor and the hookup wires with a bead of thermally
conductive epoxy. This ensures that the TMP3x die temperature
is not affected by the surrounding air temperature. Because
plastic IC packaging technology is used, excessive mechanical
stress should be avoided when fastening the device with a clamp
or a screw-on heat tab. Thermally conductive epoxy or glue,
which must be electrically nonconductive, is recommended
under typical mounting conditions.
These temperature sensors, as well as any associated circuitry,
should be kept insulated and dry to avoid leakage and corrosion.
In wet or corrosive environments, any electrically isolated metal
or ceramic well can be used to shield the temperature sensors.
Condensation at very cold temperatures can cause errors and
should be avoided by sealing the device, using electrically non-
conductive epoxy paints or dip or any one of the many printed
circuit board coatings and varnishes.
THERMAL ENVIRONMENT EFFECTS
The thermal environment in which the TMP3x sensors are used
determines two important characteristics: self-heating effects
and thermal response time. Figure 23 illustrates a thermal model
of the TMP3x temperature sensors, which is useful in under-
standing these characteristics.
T
J
θ
JC
T
C
θ
CA
C
CH
C
C
P
D
T
A
00337-021
Figure 23. Thermal Circuit Model
In the T-3 package, the thermal resistance junction-to-case, θJC,
is 120°C/W. The thermal resistance case-to-ambient, CA, is the
difference between θJA and θJC, and is determined by the char-
acteristics of the thermal connection. The power dissipation of
the temperature sensor, PD, is the product of the total voltage
across the device and its total supply current, including any
current delivered to the load. The rise in die temperature above
the ambient temperature of the medium is given by
TJ = PD × (θJC + θCA) + TA
Thus, the die temperature rise of a TMP35 SOT-23 package
mounted into a socket in still air at 25°C and driven from a 5 V
supply is less than 0.04°C.
The transient response of the TMP3x sensors to a step change
in the temperature is determined by the thermal resistances and
the thermal capacities of the die, CCH, and the case, CC. The
thermal capacity of CC varies with the measurement medium
because it includes anything in direct contact with the package.
In all practical cases, the thermal capacity of CC is the limiting
factor in the thermal response time of the sensor and can be
represented by a single-pole RC time constant response. Figure 17
and Figure 19 show the thermal response time of the TMP3x
sensors under various conditions. The thermal time constant
of a temperature sensor is defined as the time required for the
sensor to reach 63.2% of the final value for a step change in the
temperature. For example, the thermal time constant of a
TMP35 SOIC package sensor mounted onto a 0.5" × 0.3" PCB is
less than 50 sec in air, whereas in a stirred oil bath, the time
constant is less than 3 sec.
TMP35/TMP36/TMP37
Rev. E | Page 10 of 20
BASIC TEMPERATURE SENSOR CONNECTIONS
Figure 24 illustrates the basic circuit configuration for the
TMP3x family of temperature sensors. The table in Figure 24
shows the pin assignments of the temperature sensors for the
three package types. For the SOT-23, Pin 3 is labeled NC, as are
Pin 2, Pin 3, Pin 6, and Pin 7 on the SOIC_N package. It is
recommended that no electrical connections be made to these
pins. If the shutdown feature is not needed on the SOT-23 or
on the SOIC_N package, the SHUTDOWN pin should be
connected to +VS.
2.7V < +V
S
< 5.5V
V
OUT
0.1µF
+V
S
GND
PACKAGE +V
S
GND V
OUT
SOIC_N 8 4 1 5
SOT-23 2 5 1 4
TO-92 1 3 2 NA
PIN ASSIGNMENTS
SHUTDOWN
TMP3x
00337-022
SHUTDOWN
Figure 24. Basic Temperature Sensor Circuit Configuration
Note the 0.1 μF bypass capacitor on the input. This capacitor
should be a ceramic type, have very short leads (surface-mount
is preferable), and be located as close as possible in physical
proximity to the temperature sensor supply pin. Because these
temperature sensors operate on very little supply current and
may be exposed to very hostile electrical environments, it is
important to minimize the effects of radio frequency interference
(RFI) on these devices. The effect of RFI on these temperature
sensors specifically and on analog ICs in general is manifested as
abnormal dc shifts in the output voltage due to the rectification
of the high frequency ambient noise by the IC. When the
devices are operated in the presence of high frequency radiated
or conducted noise, a large value tantalum capacitor (±2.2 μF)
placed across the 0.1 μF ceramic capacitor may offer additional
noise immunity.
FAHRENHEIT THERMOMETERS
Although the TMP3x temperature sensors are centigrade
temperature sensors, a few components can be used to convert
the output voltage and transfer characteristics to directly read
Fahrenheit temperatures. Figure 25 shows an example of a
simple Fahrenheit thermometer using either the TMP35 or the
TMP37. Using the TMP35, this circuit can be used to sense
temperatures from 41°F to 257°F with an output transfer
characteristic of 1 mV/°F; using the TMP37, this circuit can be
used to sense temperatures from 41°F to 212°F with an output
transfer characteristic of 2 mV/°F. This particular approach
does not lend itself to the TMP36 because of its inherent 0.5 V
output offset. The circuit is constructed with an AD589, a 1.23 V
voltage reference, and four resistors whose values for each sensor
are shown in the table in Figure 25. The scaling of the output
resistance levels ensures minimum output loading on the temp-
erature sensors. A generalized expression for the transfer
equation of the circuit is given by
()
()
AD589
R4R3
R3
TMP35
R2R1
R1
VOUT ⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
+
+
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
+
=
where:
TMP35 is the output voltage of the TMP35 or the TMP37 at the
measurement temperature, TM.
AD589 is the output voltage of the reference, that is, 1.23 V.
The output voltage of this circuit is not referenced to the
circuit’s common ground. If this output voltage were applied
directly to the input of an ADC, the ADC common ground
should be adjusted accordingly.
SENSOR TCV
OUT
R1 (kΩ)
TMP35 1mV/°F 45.3 10 10 374
TMP37 2mV/°F 45.3 10 10 182
R2 (kΩ)R3 (kΩ)R4 (kΩ)
TMP35/
TMP37
GND
R1
R2
R3
R4
AD589
1.23V
0.1µF
V
OUT
+V
S
V
OUT
+V
S
–
+
00337-023
Figure 25. TMP35/TMP37 Fahrenheit Thermometers
TMP35/TMP36/TMP37
Rev. E | Page 11 of 20
The same circuit principles can be applied to the TMP36, but
because of the inherent offset of the TMP36, the circuit uses only
two resistors, as shown in Figure 26. In this circuit, the output
voltage transfer characteristic is 1 mV/°F but is referenced to
the common ground of the circuit; however, there is a 58 mV
(58°F) offset in the output voltage. For example, the output
voltage of the circuit reads 18 mV if the TMP36 is placed in a
−40°F ambient environment and 315 mV at +257°F.
At the expense of additional circuitry, the offset produced by
the circuit in Figure 26 can be avoided by using the circuit in
Figure 27. In this circuit, the output of the TMP36 is conditioned
by a single-supply, micropower op amp, the OP193. Although
the entire circuit operates from a single 3 V supply, the output
voltage of the circuit reads the temperature directly, with a
transfer characteristic of 1 mV/°F, without offset. This is accom-
plished through an ADM660, which is a supply voltage inverter.
The 3 V supply is inverted and applied to the V− terminal of the
OP193. Thus, for a temperature range between −40°F and +257°F,
the output of the circuit reads −40 mV to +257 mV. A general
expression for the transfer equation of the circuit is given by
TMP36
GND
0.1µF
V
OUT
+V
S
R1
45.3kΩ
R2
10kΩ
+V
S
V
OUT
@ –40°F = 18mV
V
OUT
@ +257°F = 315mV
00337-024
V
OUT
@ 1mV/°F –58°F
()
⎟
⎠
⎞
⎜
⎝
⎛
⎟
⎠
⎞
⎜
⎝
⎛
−
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛+
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
+
=2
1S
OUT
V
R3
R4
TMP36
R3
R4
R6R5
R6
V
Figure 26. TMP36 Fahrenheit Thermometer Version 1
ELEMENT
R3
R4
R5
R6
VALUE
V
OUT
R1
50kΩ
+V
S
ADM660
TMP36
OP193
R2
50kΩ
R3 R4
+3V
C1
10µF
R5
0.1µF
10µF
–3V
10µF/0.1µF
GND
NC
10µF
NC
R6
1
2
3
4
5
6
7
2
3
4
6
7
8
258.6kΩ
10kΩ
47.7kΩ
10kΩ
+
+
+
+
–
+
V
OUT
@ 1mV/°F
–40°F ≤ T
A
≤ +257°F
00337-025
Figure 27. TMP36 Fahrenheit Thermometer Version 2
TMP35/TMP36/TMP37
Rev. E | Page 12 of 20
AVERAGE AND DIFFERENTIAL TEMPERATURE
MEASUREMENT
In many commercial and industrial environments, temperature
sensors often measure the average temperature in a building, or
the difference in temperature between two locations on a factory
floor or in an industrial process. The circuits in Figure 28 and
Figure 29 demonstrate an inexpensive approach to average and
differential temperature measurement.
In Figure 28, an OP193 sums the outputs of three temperature
sensors to produce an output voltage scaled by 10 mV/°C that
represents the average temperature at three locations. The circuit
can be extended to include as many temperature sensors as
required as long as the transfer equation of the circuit is
maintained. In this application, it is recommended that one
temperature sensor type be used throughout the circuit;
otherwise, the output voltage of the circuit cannot produce an
accurate reading of the various ambient conditions.
The circuit in Figure 29 illustrates how a pair of TMP3x sensors
used with an OP193 configured as a difference amplifier can
read the difference in temperature between two locations. In
these applications, it is always possible that one temperature
sensor is reading a temperature below that of the other sensor.
To accommodate this condition, the output of the OP193 is
offset to a voltage at one-half the supply via R5 and R6. Thus,
the output voltage of the circuit is measured relative to this
point, as shown in Figure 29. Using the TMP36, the output
voltage of the circuit is scaled by 10 mV/°C. To minimize the
error in the difference between the two measured temperatures,
a common, readily available thin-film resistor network is used
for R1 to R4.
OP193
0.1µF
2
3
4
6
7
V
TEMP(AVG)
@ 10mV/°C FOR TMP35/TMP36
@ 20mV/°C FOR TMP37
2.7V < +V
S
< 5.5V
FOR R1 = R2 = R3 = R;
V
TEMP(AVG)
= 1 (TMP3x
1
+ TMP3x
2
+ TMP3x
3
)
3
R1
300kΩ
R2
300kΩ
R3
300kΩ
R4
7.5kΩ
R1
3
R4 = R6
R6
7.5kΩ
R5
100kΩ
R5 =
TMP3x
TMP3x
TMP3x
–
+
00337-026
Figure 28. Configuring Multiple Sensors for
Average Temperature Measurements
TMP36
@ T1
0.1µF
0.1µF
2
3
4
6
7
OP193
1µF
V
OUT
R3
1
R4
1
R2
1
R1
1
2.7V < +V
S
< 5.5V
TMP36
@ T2
R5
100kΩ
R6
100kΩV
OUT
= T2 – T1 @ 10mV/°C
V
S
2
NOTE:
1
R1–R4, CADDOCK T914–100k–100, OR EQUIVALENT.
0.1µF
R7
100kΩ
R8
25kΩ
R9
25kΩ
0°C ≤ T
A
≤ 125°C
CENTERED AT
CENTERED AT
–
+
00337-027
Figure 29. Configuring Multiple Sensors for
Differential Temperature Measurements
TMP35/TMP36/TMP37
Rev. E | Page 13 of 20
MICROPROCESSOR INTERRUPT GENERATOR Because temperature is a slowly moving quantity, the possibility
for comparator chatter exists. To avoid this condition, hysteresis
is used around the comparator. In this application, a hysteresis
of 5°C about the trip point was arbitrarily chosen; the ultimate
value for hysteresis should be determined by the end application.
The output logic voltage swing of the comparator with R1 and
R2 determines the amount of comparator hysteresis. Using a
3.3 V supply, the output logic voltage swing of the CMP402 is
2.6 V; therefore, for a hysteresis of 5°C (50 mV @ 10 mV/°C),
R1 is set to 20 kΩ, and R2 is set to 1 MΩ. An expression for the
hysteresis of this circuit is given by
These inexpensive temperature sensors can be used with a
voltage reference and an analog comparator to configure an
interrupt generator for microprocessor applications. With the
popularity of fast microprocessors, the need to indicate a
microprocessor overtemperature condition has grown
tremendously. The circuit in Figure 30 demonstrates one way to
generate an interrupt using a TMP35, a CMP402 analog
comparator, and a REF191, a 2 V precision voltage reference.
The circuit is designed to produce a logic high interrupt signal
if the microprocessor temperature exceeds 80°C. This 80°C trip
point was arbitrarily chosen (final value set by the microprocessor
thermal reference design) and is set using an R3 to R4 voltage
divider of the REF191 output voltage. Because the output of the
TMP35 is scaled by 10 mV/°C, the voltage at the inverting
terminal of the CMP402 is set to 0.8 V.
( )
CMP402SWINGLOGICHYS V
R2
R1
V,
⎟
⎠
⎞
⎜
⎝
⎛
=
Because this circuit is probably used in close proximity to high
speed digital circuits, R1 is split into equal values and a 1000 pF
capacitor is used to form a low-pass filter on the output of the
TMP35. Furthermore, to prevent high frequency noise from
contaminating the comparator trip point, a 0.1 μF capacitor is
used across R4.
R2
1MΩ
3
4
V
OUT
+V
S
TMP35
0.1µF
GND
0.1µF
CMP402
INTERRUPT
<80°C
>80°C
REF191
R1A
10kΩ
R1B
10kΩ
3.3V
2
6
C
L
1000pF
R3
16kΩ
1µF R4
10kΩ
V
REF
0.1µF
0.1µF
C1 = CMP402
4
1
2
4
3
14
13
5
6
R5
100kΩ
+
–
+
00337-028
Figure 30. Microprocessor Overtemperature Interrupt Generator
TMP35/TMP36/TMP37
Rev. E | Page 14 of 20
THERMOCOUPLE SIGNAL CONDITIONING WITH
COLD-JUNCTION COMPENSATION
The circuit in Figure 31 conditions the output of a Type K
thermocouple, while providing cold-junction compensation for
temperatures between 0°C and 250°C. The circuit operates from
a single 3.3 V to 5.5 V supply and is designed to produce an
output voltage transfer characteristic of 10 mV/°C.
A Type K thermocouple exhibits a Seebeck coefficient of
approximately 41 μV/°C; therefore, at the cold junction, the
TMP35, with a temperature coefficient of 10 mV/°C, is used
with R1 and R2 to introduce an opposing cold-junction temp-
erature coefficient of −41 μV/°C. This prevents the isothermal,
cold-junction connection between the PCB tracks of the circuit
and the wires of the thermocouple from introducing an error in
the measured temperature. This compensation works extremely
well for circuit ambient temperatures in the range of 20°C to 50°C.
Over a 250°C measurement temperature range, the thermocouple
produces an output voltage change of 10.151 mV. Because the
required output full-scale voltage of the circuit is 2.5 V, the gain
of the circuit is set to 246.3. Choosing R4 equal to 4.99 kΩ sets
R5 equal to 1.22 MΩ. Because the closest 1% value for R5 is
1.21 MΩ, a 50 kΩ potentiometer is used with R5 for fine trim of
the full-scale output voltage. Although the OP193 is a superior
single-supply, micropower operational amplifier, its output stage
is not rail-to-rail; therefore, the 0°C output voltage level is 0.1 V.
If this circuit is digitized by a single-supply ADC, the ADC
common should be adjusted to 0.1 V accordingly.
V
OUT
+V
S
TMP35
0.1µF
GND
OP193
0.1µF
R1
1
24.9kΩ
R4
4.99kΩR5
1
1.21MΩ
TYPE K
THERMO-
COUPLE
CU
CU
R2
1
102Ω
V
OUT
0V TO 2.5V
R6
100kΩ
5%
R3
10MΩ
5%
3.3V < +V
S
< 5.5V
COLD
JUNCTION
CHROMEL
ALUMEL
ISOTHERMAL
BLOCK
0°C ≤ T
A
≤ 250°C
7
6
4
3
2
P1
50kΩ
–
+
–
+
NOTE:
1
ALL RESISTORS 1% UNLESS OTHERWISE NOTED.
00337-029
Figure 31. Single-Supply, Type K Thermocouple Signal Conditioning Circuit with Cold-Junction Compensation
TMP35/TMP36/TMP37
Rev. E | Page 15 of 20
USING TMP3x SENSORS IN REMOTE LOCATIONS
In many industrial environments, sensors are required to
operate in the presence of high ambient noise. These noise
sources take many forms, for example, SCR transients, relays,
radio transmitters, arc welders, and ac motors. They can also
be used at considerable distances from the signal conditioning
circuitry. These high noise environments are typically in the
form of electric fields, so the voltage output of the temperature
sensor can be susceptible to contamination from these noise
sources.
Figure 32 illustrates a way to convert the output voltage of a
TMP3x sensor into a current to be transmitted down a long
twisted pair shielded cable to a ground referenced receiver. The
temperature sensors are not capable of high output current
operation; thus, a standard PNP transistor is used to boost the
output current drive of the circuit. As shown in the table in
Figure 32, the values of R2 and R3 were chosen to produce an
arbitrary full-scale output current of 2 mA. Lower values for the
full-scale current are not recommended. The minimum-scale
output current produced by the circuit could be contaminated
by ambient magnetic fields operating in the near vicinity of the
circuit/cable pair. Because the circuit uses an external transistor,
the minimum recommended operating voltage for this circuit is
5 V. To minimize the effects of EMI (or RFI), both the circuit
and the temperature sensor supply pins are bypassed with good
quality ceramic capacitors.
TWISTED PAIR
BELDEN TYPE 9502
OR EQUIVALENT
TMP3x
R2
R1
4.7kΩ
V
OUT
0.1µF
2N2907
0.01µF
GND
+V
S
5V
R3
V
OUT
SENSOR R2 R3
TMP35 634 634
TMP36 887 887
TMP37 1k 1k
00337-030
Figure 32. Remote, 2-Wire Boosted Output Current Temperature Sensor
TEMPERATURE TO 4–20 mA LOOP TRANSMITTER
In many process control applications, 2-wire transmitters are
used to convey analog signals through noisy ambient environ-
ments. These current transmitters use a zero-scale signal current
of 4 mA, which can be used to power the signal conditioning
circuitry of the transmitter. The full-scale output signal in these
transmitters is 20 mA.
Figure 33 illustrates a circuit that transmits temperature inform-
ation in this fashion. Using a TMP3x as the temperature sensor,
the output current is linearly proportional to the temperature of
the medium. The entire circuit operates from the 3 V output of
the REF193. The REF193 requires no external trimming because
of its tight initial output voltage tolerance and the low supply
current of the TMP3x, the OP193, and the REF193. The entire
circuit consumes less than 3 mA from a total budget of 4 mA.
The OP193 regulates the output current to satisfy the current
summation at the noninverting node of the OP193. A generalized
expression for the KCL equation at Pin 3 of the OP193 is given by
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛×
+
×
×
⎟
⎠
⎞
⎜
⎝
⎛
=R2
R3V
R1
R3TMP3x
R7
1
IREF
OUT
For each temperature sensor, Table 5 provides the values for the
components P1, P2, and R1 to R4.
Table 5. Circuit Element Values for Loop Transmitter
Sensor R1 P1 R2 P2 R3 R4
TMP35 97.6 kΩ 5 kΩ 1.58 MΩ 100 kΩ 140 kΩ 56.2 kΩ
TMP36 97.6 kΩ 5 kΩ 931 kΩ 50 kΩ 97.6 kΩ 47 kΩ
TMP37 97.6 kΩ 5 kΩ 10.5 kΩ 500 Ω 84.5 kΩ 8.45 kΩ
The 4 mA offset trim is provided by P2, and P1 provides the
full-scale gain trim of the circuit at 20 mA. These two trims do
not interact because the noninverting input of the OP193 is
held at a virtual ground. The zero-scale and full-scale output
currents of the circuit are adjusted according to the operating
temperature range of each temperature sensor. The Schottky
diode, D1, is required in this circuit to prevent loop supply
power-on transients from pulling the noninverting input of the
OP193 more than 300 mV below its inverting input. Without
this diode, such transients can cause phase reversal of the
operational amplifier and possible latch-up of the transmitter.
The loop supply voltage compliance of the circuit is limited by
the maximum applied input voltage to the REF193; it is from
9 V to 18 V.
TMP35/TMP36/TMP37
Rev. E | Page 16 of 20
V
OUT
4
6
7
1µF
R5
100kΩ
V
OUT
R
L
250Ω
V
LOOP
9V TO 18V
3
2
D1: HP5082-2810
REF193
TMP3x
R7
100Ω
R3
1
R1
1
+V
S
R2
1
P2
1
4mA
ADJUST
D1
R4
1
R6
100kΩ
P1
1
20mA
ADJUST
GND
Q1
2N1711
0.1µF
2
4
6
3V
I
L
NOTE:
1
SEE TEXT FOR VALUES.
–
+
00337-032
+
OP193
Figure 33. Temperature to 4–20 mA Loop Transmitter
TEMPERATURE-TO-FREQUENCY CONVERTER
Another common method of transmitting analog information
from a remote location is to convert a voltage to an equivalent
value in the frequency domain. This is readily done with any of
the low cost, monolithic voltage-to-frequency converters (VFCs)
available. These VFCs feature a robust, open-collector output
transistor for easy interfacing to digital circuitry. The digital
signal produced by the VFC is less susceptible to contamination
from external noise sources and line voltage drops because the
only important information is the frequency of the digital sig-
nal. When the conversions between temperature and frequency
are done accurately, the temperature data from the sensors can
be reliably transmitted.
The circuit in Figure 34 illustrates a method by which the
outputs of these temperature sensors can be converted to a
frequency using the AD654. The output signal of the AD654 is
a square wave that is proportional to the dc input voltage across
Pin 4 and Pin 3. The transfer equation of the circuit is given by
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛
××
−
=)(10 TT
OFFSETTPM
OUT CR
VV
f
TMP3x
+V
S
GND
6
4
2
3
7
8
5
1
AD654
V
OUT
10µF/0.1µF
5V
P2
100kΩR
OFF1
470Ω
fOUT
OFFSET
R
OFF2
10Ω
R1
P1
R
T1
0.1µF C
T1
5V
R
PU
5kΩ
f
OUT
NB: ATT
A
(MIN),
fOUT
= 0Hz
NOTE:
1
R
T
AND C
T
– SEE TABLE
SENSOR R
T
(R1 + P1) C
T
TMP35
TMP36
TMP37
11.8kΩ + 500Ω
16.2kΩ + 500Ω
18.2kΩ + 1kΩ
1.7nF
1.8nF
2.1nF
00337-031
Figure 34. Temperature-to-Frequency Converter
TMP35/TMP36/TMP37
Rev. E | Page 17 of 20
An offset trim network (fOUT OFFSET ) is included with this
circuit to set fOUT to 0 Hz when the minimum output voltage of
the temperature sensor is reached. Potentiometer P1 is required
to calibrate the absolute accuracy of the AD654. The table in
Figure 34 illustrates the circuit element values for each of the
three sensors. The nominal offset voltage required for 0 Hz
output from the TMP35 is 50 mV; for the TMP36 and TMP37,
the offset voltage required is 100 mV. For the circuit values
shown, the output frequency transfer characteristic of the
circuit was set at 50 Hz/°C in all cases. At the receiving end, a
frequency-to-voltage converter (FVC) can be used to convert
the frequency back to a dc voltage for further processing. One
such FVC is the AD650.
For complete information about the AD650 and the AD654,
consult the individual data sheets for those devices.
DRIVING LONG CABLES OR HEAVY CAPACITIVE
LOADS
Although the TMP3x family of temperature sensors can drive
capacitive loads up to 10,000 pF without oscillation, output
voltage transient response times can be improved by using a
small resistor in series with the output of the temperature
sensor, as shown in Figure 35. As an added benefit, this resistor
forms a low-pass filter with the cable capacitance, which helps
to reduce bandwidth noise. Because the temperature sensor is
likely to be used in environments where the ambient noise level
can be very high, this resistor helps to prevent rectification by
the devices of the high frequency noise. The combination of this
resistor and the supply bypass capacitor offers the best protection.
TMP3x
0.1µF
GND
+V
S
750Ω
LONG CABLE OR
HEAVY CAPACITIVE
LOADS
V
OUT
00337-033
Figure 35. Driving Long Cables or Heavy Capacitive Loads
COMMENTARY ON LONG-TERM STABILITY
The concept of long-term stability has been used for many years
to describe the amount of parameter shift that occurs during
the lifetime of an IC. This is a concept that has been typically
applied to both voltage references and monolithic temperature
sensors. Unfortunately, integrated circuits cannot be evaluated
at room temperature (25°C) for 10 years or more to determine
this shift. As a result, manufacturers very typically perform
accelerated lifetime testing of integrated circuits by operating
ICs at elevated temperatures (between 125°C and 150°C) over a
shorter period of time (typically, between 500 and 1000 hours).
As a result of this operation, the lifetime of an integrated circuit
is significantly accelerated due to the increase in rates of reaction
within the semiconductor material.
TMP35/TMP36/TMP37
Rev. E | Page 18 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-A A
012407-A
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099) 45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
85
5.00 (0.1968)
4.80 (0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
PIN 1
1.60 BSC 2.80 BSC
1.90
BSC
0.95 BSC
5
123
4
0.22
0.08
10°
5°
0°
0.50
0.30
0.15 MAX SEATING
PLANE
1.45 MAX
1.30
1.15
0.90
2.90 BSC
0.60
0.45
0.30
COMPLIANT TO JEDEC STANDARDS MO-178-A A
Figure 36. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-8)
Dimensions shown in millimeters and (inches)
Figure 37. 5-Lead Small Outline Transistor Package [SOT-23]
(RJ-5)
Dimensions shown in millimeters
042208-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS TO-226-AA
0.020 (0.51)
0.017 (0.43)
0.014 (0.36)
0.1150 (2.92)
0.0975 (2.48)
0.0800 (2.03)
0.165 (4.19)
0.145 (3.68)
0.125 (3.18)
1
2
3
BOTTOM VIEW
FRONT VIEW
0.0220 (0.56)
0.0185 (0.47)
0.0150 (0.38)
0.105 (2.68)
0.100 (2.54)
0.095 (2.42)
0.055 (1.40)
0.050 (1.27)
0.045 (1.15)
SEATING
PLANE
0.500 (12.70) MIN
0.205 (5.21)
0.190 (4.83)
0.175 (4.45)
0.210 (5.33)
0.190 (4.83)
0.170 (4.32)
Figure 38. 3-Pin Plastic Header-Style Package [TO-92]
(T-3)
Dimensions shown in inches and (millimeters)
TMP35/TMP36/TMP37
Rev. E | Page 19 of 20
ORDERING GUIDE
Model
Accuracy at
25°C (°C max)
Linear Operating
Temperature Range Package Description
Package
Option Branding
TMP35FS ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35FS-REEL ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35FSZ1 ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35FSZ-REEL1 ±2.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GRT-REEL7 ±3.0 10°C to 125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T5G
TMP35GRTZ-REEL71 ±3.0 10°C to 125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T5G
TMP35GS ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GS-REEL ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GSZ1 ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GSZ-REEL1 ±3.0 10°C to 125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP35GT9 ±3.0 10°C to 125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP35GT9Z1 ±3.0 10°C to 125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP36FS ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36FS-REEL ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36FSZ1±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36FSZ-REEL1 ±2.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GRT-REEL7 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T6G
TMP36GRTZ-REEL71 ±3.0 −40°C to +125°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T6G
TMP36GS ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GS-REEL ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GS-REEL7 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GSZ1 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GSZ-REEL1 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GSZ-REEL71 ±3.0 −40°C to +125°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP36GT9 ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP36GT9Z1 ±3.0 −40°C to +125°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP36CSURF DIE
TMP37FS ±2.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37FS-REEL ±2.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37FSZ1 ±2.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37FT9 ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37FT9-REEL ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37FT9Z1 ±2.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37GRT-REEL7 ±3.0 5°C to 100°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T7G
TMP37GRTZ-REEL71 ±3.0 5°C to 100°C 5-Lead Small Outline Transistor Package (SOT-23) RJ-5 T12
TMP37GS ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37GS-REEL ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37GSZ1 ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37GSZ-REEL1 ±3.0 5°C to 100°C 8-Lead Standard Small Outline Package (SOIC_N) R-8
TMP37GT9 ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37GT9-REEL ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
TMP37GT9Z1 ±3.0 5°C to 100°C 3-Pin Plastic Header-Style Package (TO-92) T-3
1 Z = RoHS Compliant Part.
TMP35/TMP36/TMP37
Rev. E | Page 20 of 20
NOTES
©1996–2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00337-0-8/08(E)
