HLMP-DB25, HLMP-KB45
T-1¾ (5 mm), T-1 (3 mm)
Blue LED Lamps
Data Sheet
CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions dur-
ing handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
Features
x Popular T-1¾ and T-1 diameter packages
x General purpose leads
x Reliable and rugged
x Available on tape and reel
x Binned for color and intensity
Applications
x Status indicators
x Small message panel
x Running and decorative lights for commercial use
Description
These blue LEDs are designed in industry standard T-1 and
T-1¾ package with clear and non diffused optics. They are
also available in tape and reel, and ammo-pack option for
ease of handling and use.
These blue lamps are ideal for use as indicators and for
general purpose lighting. Blue lamps offer color differen-
tiation as blue is attractive and not widely available.
6.10 (0.240)
5.59 (0.220)
23.0
(0.90) MIN.
0.45 (0.018)
SQUARE NOMINAL
2.54 (0.100)
NOM.
CATHODE
1.27 (0.050)
NOM.
0.89 (0.035)
0.64 (0.025)
9.19 (0.352)
8.43 (0.332)
5.08 (0.200)
4.57 (0.180)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.
HLMP-DB25
1.02 (0.040)
NOM.
3.43 (0.135)
2.92 (0.115)
23.0
(0.90) MIN.
4.70 (0.185)
4.19 (0.165)
3.18 (0.125)
2.67 (0.105)
2.54 (0.100) NOM.
1.27 (0.050)
NOM.
6.35 (0.250)
5.58 (0.220)
0.45 (0.018)
SQUARE NOM.
CATHODE
HLMP-KB45
2
Selection Guide
Luminous Intensity Iv (mcd)
Part Number Package Viewing Angle Min. Max.
HLMP-KB45-A00xx T-1 40 30 –
HLMP-DB25-B00xx T-1¾ 25 40 –
Absolute Maximum Ratings at TA = 25°C
Parameter Blue Units
Peak Forward Current 70 mA
DC Current[1] 30 mA
Reverse Voltage Not recommended for reverse bias
Transient Forward Current[2] (10 Psec Pulse) 350 mA
LED Junction Temperature 115 °C
Operating Temperature –20 to +80 °C
Storage Temperature –30 to +100 °C
Wave Soldering Temperature [1.59 mm (0.063 in.) from Body]P 250°C for 3 seconds
Solder Dipping Temperature [1.59 mm (0.063 in.) from Body] 260°C for 5 seconds
Notes:
1. Derate linearly from 50°C as shown in Figure 6.
2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current.
Part Numbering System
Mechanical Option
00: Bulk
02: Tape & Reel, Straight Leads
DD: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Viewing Angle
25: 25 degrees
45: 40 degrees
Color Options
B: Blue
Package Options
D: T-1¾ (5 mm)
K: T-1 (3 mm)
HLMP - x x xx - x x x xx
3
Optical Characteristics at TA = 25°C
Color, Dominant
Luminous Intensity Wavelength Peak Wavelength Viewing Angle
I
V (mcd) @ IF = 20 mA Od[1] (nm) OPEAK (nm) 2T1/2[2] Degrees
Part Number Min. Typ. Typ. Typ.
HLMP-DB25-B00xx 40 470 464 25
HLMP-KB45-A00xx 30 470 464 40
Notes:
1. The dominant wavelength, Od, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
2. T1/2 is the off-axis angle at which the luminous intensity is half of the axial luminous intensity.
Electrical Characteristics at TA = 25°C
Thermal Resistance
Forward Voltage Speed Capacitance RTJ-PIN (°C/W)
V
F (Volts) Response C (pF), VF = 0, Junction to
@ IF = 20 mA Ws (ns) f = 1 MHz Cathode Lead
Part Number Typ. Max. Typ. Typ. Typ.
HLMP-DB25-B00xx 3.2 3.8 500 97 260
HLMP-KB45-A00xx 3.2 3.8 500 97 290
Figure 1. Relative intensity vs. wavelength Figure 2. Forward current vs. forward voltage
Figure 3. Relative intensity vs. peak forward current (300 Ps pulse width,
10 ms period)
Figure 4. Maximum Tolerable Peak Current vs Pulse Width
IF – FORWARD CURRENT – mA
VF – FORWARD VOLTAGE – V
1.0
1.6
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IP – PEAK FORWARD CURRENT – mA
20 40 60 80
1.4
30 50 70
RATIO OF PEAK CURRENT TO
TEMPERATURE DERATED DC CURRENT
1.00E-06 1.00E-02
10
1
PULSE WIDTH (SECONDS)
1.00E-031.00E-041.00E-05
10 KHz
3 KHz
1 KHz
300 Hz
100 Hz REFRESH RATE
0
5
10
15
20
25
30
01234
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
380 430 480 530 580 630 680
WAVELENGTH - nm
RELATIVE INTENSITY
4
Figure 8. Relative luminous intensity vs. angular displacement for HLMP-KB45
Figure 7. Relative luminous intensity vs. angular displacement for HLMP-DB25
Figure 6. Maximum DC forward current vs. ambient temperature. Derating
based on TJ max. = 115°C
Figure 5. Relative luminous intensity vs. forward current
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – DC FORWARD CURRENT – mA
IF – FORWARD CURRENT – mA DC
0
0
TA – AMBIENT TEMPERATURE – °C
30 70
35
20
10
10 50
30
80
5
15
25
20 40 60 90
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 5 10 15 20 25 30
10° 100°40° 70°20° 60° 80°30° 50° 90°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
.6
.8
.2
.4
1.0
10° 100°40° 70°20° 60° 80°30° 50° 90°
0°
10°
20°
30°
40°
50°
60°
70°
80°
90°
.6
.8
.2
.4
1.0
5
Mechanical Option Matrix
Mechanical
Option Code Definition
00 Bulk Packaging, minimum increment 500 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1300 pcs/reel
DD Ammo Pack, straight leads with minimum increment 2000pcs/pack
Note:
All categories are established for classification of products. Products may not be available in all
categories. Please contact your local Avago representative for further clarification/information.
Intensity Bin Limits
Intensity Range (mcd)
Bin Min. Max.
A 30.0 40.0
B 40.0 50.0
C 50.0 65.0
D 65.0 85.0
E 85.0 110.0
F 110.0 140.0
G 140.0 180.0
H 180.0 240.0
J 240.0 310.0
K 310.0 400.0
L 400.0 520.0
M 520.0 680.0
N 680.0 880.0
Tolerance for each bin limit is ± 15%.
Color Bin Limits (nm at 20 mA)
Blue nm @ 20 mA
Bin ID Min. Max.
1 460.0 464.0
2 464.0 468.0
3 468.0 472.0
4 472.0 476.0
5 476.0 480.0
Tolerance for each bin limit is ±0.5 nm.
Soldering/Cleaning
Cleaning agents from the ketone family (acetone, methyl
ethyl ketone, etc.) and from the chlorinated hydrocarbon
family (methylene chloride, trichloro-ethylene, carbon
tetrachloride, etc.) are not recommended for cleaning LED
parts. All of these various solvents attack or dissolve the
encapsulating epoxies used to form the package of plastic
LED parts.
6
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max. –
Pre-heat Time 60 sec Max. –
Peak Temperature 250°C Max. 260°C Max.
Dwell Time 3 sec Max. 5 sec Max.
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
x Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
1.59 mm
7
Example of Wave Soldering Temperature Profile for TH LED
0 10 20 30 40 50 60 70 80 90 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR
HOT AIR KNIFE
TEMPERATURE (°C)
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-3263EN
AV02-2213EN - October 26, 2009
(ii) Avago Baby Label (Only available on bulk packaging)
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Color Bin
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
