Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
&
1
Product Code Type Circuit Nominal
CapacitanceValue
Form
9
2
$
3
$
4
&
5
5
6
7
8
9
6
10
Noise Filter Chip type T-circuit
EMI filter
The first two digits are
significant figures of
capacitance value and the
third one denotes the number
of zeros following.
Code
U
Packing
Embossed Carrier Taping
Ferrite core
Chip capacitor
Adhesive
Electrode
1.8±0.2
2.7±0.3
0.5±0.2
4.5±0.4
0.5±0.2
1.0±0.2
Size : 1807 inch
Mass (Weight) : 92.5 mg/pc.
■ Construction ■ Dimensions in mm (not to scale)
Chip EMI Filters
Type:
EXCCET
■ Features
● Rated current (2 A max.)
● Eight capacitance values in a wide range, related to
the noise frequency
● Suitable for narrow pitch insertion
● Suitable for applications requiring thin design
● RoHS compliant
■ Explanation of Part Numbers
■ Recommended Applications
● Digital equipment such as PCs, word processors,
printers, HDD, PPC and communication equipment.
● Digital audio and video equipment.
● AC adapters and switching power supplies.
● Electronic musical instruments and other digital
equipment.
Nov. 201202
Discontinued
Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Measurement Circuit
~
50 ?
50 ?
Sample
1M 10M 100M 1G
Frequency (Hz)
Attenuation(dB)
60
50
40
30
20
10
0
471 220
470
101
103
222 102
271
t2
Chip component
P1P2P0
Compartment
Sprocket hole
fD0
Tape running direction
F
W
B
A
T
fC
E
f D
f B
W
f A
0A0B0C0D
Dimensions
(mm) 180.0 0 60.0±1.0 13.0±0.5
21.0±0.8
Part Number
Rated
Voltage
(V DC)
(1)
Capacitance
(pF)
Toler-
ance
(%)
(2)
Characteristics
Rated
Current
(A DC)
DC
Resistance
(mΩ)
25 dB Attenuate
Frequency
(MHz)
15 dB Attenuate
Frequency
(MHz)
EXCCET220U 50 22 ±20 YB 2 50 max. 800 to 1000 600 to 1000
EXCCET470U 50 47 ±20 YB 2 50 max. 450 to 550 350 to 1000
EXCCET101U 50 100 ±20 YB 2 50 max. 300 to 450 200 to 900
EXCCET271U 50 270 ±20 YB 2 50 max. 200 to 300 80 to 700
EXCCET471U 50 470 ±20 YB 2 50 max. 100 to 220 50 to 700
EXCCET102U 50 1000 ±20 YB 2 50 max. 65 to 200 30 to 700
EXCCET222U 50 2200 ±20 YB 2 50 max. 35 to 180 15 to 700
EXCCET103U 50 10000 ±20 YB 2 50 max. 15 to 120 15 to 700
Part Number Kind of Taping Pitch (P1)Quantity
EXCCET□□□UEmbossed Carrier Taping 4 mm 1000 pcs./reel
■ Packaging Methods (Taping)
● Standard Quantity
● Taping Reel
● Embossed Carrier Taping
ABWFP
1
Dimensions
(mm) 2.2±0.2 4.9±0.2 12.0±0.2
5.50±0.05
4.0±0.1
P2P00D0t2
Dimensions
(mm) 2.0±0.1 4.0±0.1 1.5±0.1 3.5 max.
–3.0
EWT
Dimensions
(mm) 2.0±0.5 13.0±1.0 16.5 max.
(1) Please inquire to us about the particular capacitance value, on a range of 22 to 10000 pF.
(2) Characteristics YB: Maximum capacitance is ±10 % over the temperature range of –25 °C to +85 °C in reference to +20 °C.
■ Attenuation Characteristics (Reference Data)
■ Ratings
● Category Temperature Range –40 °C to +85 °C
Nov. 201202
Discontinued
Chip EMI Filters
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
5.4
1.3 1.3
1.15
1.0
0.2
Copper foil
Resist
1.4
1.15
1.0
0.2
Copper foil
Resist
1.4
5.4
1.3 1.3
1.4
Resist
2.54
Preheating
Peak
Heating
Temperature
Time
■ Recommended Land Pattern Design(mm)
● For Single Mounting ● For High Density Mounting
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 10 °C max. 10 s
Temperature Time
Preheating 150 °C to 170 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
● Recommended soldering conditions for refl ow
For soldering (Example : Sn-37Pb)
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression
Device shown on this catalog.
1. Use rosin-based fl ux or halogen-free fl ux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, con sult with our sales person
in advance.
3. Do not apply shock to Chip EMI Filters (hereafter called the fi lters) or pinch them with a hard tool (e.g. pliers and
tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress
may damage the filters. Handle with care.
4. Avoid applying static electricity to the fi lters.
5. The performance of the fi lters deteriorates in a circuit that is susceptible to surges or other abnormal voltages.
Carefully check the circuit operations before use.
6. Store the fi lters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
7. Use the fi lters within a year after the date of the outgoing inspection indicated on the packages.
Using the land pattern which we do not recommend,
or mounting by the solder under 180μm, verify the
performance, reliability, etc. thoroughly.
● Flow soldering
· Chip EMI Filters cannot be mounted on a printed circuit board by fl ow soldering.
Mount them by refl ow soldering.
Nov. 201202
Discontinued
