The Multicore® line of solder pastes is
designed to meet the rigorous demands
of a variety of electronic manufacturing
soldering processes. Whether your process
requires long abandon times, wide process
windows, or high-speed printing, Henkel
Loctite offers a Multicore®paste to suit
your needs.
Henkel Loctite is also breaking new ground in the
development of lead-free products. As the industry works
toward eliminating lead from its products and processes, Henkel
Loctite has developed not only the solder technology to meet that need, but will
also provide the technical and engineering support crucial to process engineers as they face the
unique processing requirements of lead-free operations.
www.loctite.com/electronics
20
Multicore®Solder Pastes
MP200 Solder Paste Wide Process Window
Item number Product Description Package size
M00439 Sn63 MP200 AGS 90 500 Gram Jar
M00440 Sn63 MP200 AGS 90 700 Gram Semco
M00441 Sn63 MP200 AGS 90 1300 Gram Semco
M00447 Sn63 MP200 AGS 90 20CC EFD Cartridge
M00505 Sn63 MP200 AGS 90.5 750 Gram Proflow
M00449 Multi-Tak MP 200 30CC Cartridge
(Rework Flux)
Item number Product Description Package size
M00443 Sn62 MP200 AGS 90 500 Gram Jar
M00444 Sn62 MP200 AGS 90 700 Gram Semco
M00445 Sn62 MP200 AGS 90 1300 Gram Semco
M00448 Sn62 MP200 AGS 90 30CC EFD Cartridge
M00506 Sn62 MP200 AGS 90.5 750 Gram Proflow
M00479 63S4 MP200 ACP 90 500 Gram Jar
M00480 63S4 MP200 ACP 90 700 Gram Semco
M00481 63S4 MP200 ACP 90 1300 Gram Semco
CR36 No-Clean Solder Paste Highest Activity Offering
Item number Product Description Package size
M00086 Sn63 CR36 AGS 89.5 500 Gram Jar
M00219 Sn63 CR36 AGS 89.5 500 Gram Semco
LF320 Lead Free Paste Wide Process Window
Item number Product Description Package size
M00501 96SC LF320 AGS88 500 Gram Jar
M00502 96SC LF320 AGS88 600 Gram Semco
WS200 Water Wash Paste
Item number Product Description Package size
M00486 Sn63 WS200 AGS 90.5 500 Gram Jar
M00487 Sn63 WS200 AGS 90.5 700 Gram Semco
M00508 Sn63 WS200 AGS 90.5 1300 Gram Semco
DESCRIPTION/APPLICATION ALLOY
% METAL LOAD
TACK
(G./MM2)PRINT SPEED
mm/sec.
IPC/J-STD
CLASSIFICATION
A high activity, soft, colorless, low residue, no-clean solder paste that
exhibits excellent print definition with long open and abandon time
capabilities. High activity of the MP200 flux offers excellent wetting to a
wide range of surface finishes, and an exceptional reflow process window.
Is suitable for fine pitch, high speed printing applications. Pin testable.
SN62/SN63
63S4
(Anti-Tombstoning)
90
90.5 1.1 25 - 200 ROL0
DESCRIPTION/APPLICATION ALLOY
% METAL LOAD
TACK
(G./MM2)PRINT SPEED
mm/sec .
IPC/J-STD
CLASSIFICATION
A high activity, colorless residue, no-clean solder paste. CR36 exhibits
good abandon time, long stencil life, and minimal hot slump. It has excellent
wetting to a wide range of surface finishes. The activity of CR36 gives it an
exceptional reflow process window, making it suitable for both volume and
high mix manufacturing.
SN62/SN63
89.5
1.3 - 1.6
20 - 200 ROLO
DESCRIPTION/APPLICATION ALLOY
% METAL LOAD
TACK
(G./MM2)PRINT SPEED
mm/sec .
IPC/J-STD
CLASSIFICATION
A no-clean flux system specially formulated for Pb-free
alloys. High temperature tolerance and wide printing capability. 96SC alloy
(Sn 95.5, Ag 3.5, Cu 0.7%) reflows at 217°C.
96SC
88 1.2 20-150 ROMO
DESCRIPTION/APPLICATION ALLOY
% METAL LOAD
TACK
(G./MM2)PRINT SPEED
mm/sec .
IPC/J-STD
CLASSIFICATION
High performance water washable solder paste. Residues are readily
removed with DI water, without the need for a saponifier. WS200 has good
open time with excellent print definition and soldering activity.
SN62/SN63
90.5 0.8 25-100 ORH1
21
Item number Product Description Package size
M00488 Sn62 WS200 AGS 90.5 500 Gram Jar
M00489 Sn62 WS200 AGS 90.5 700 Gram Semco
M00509 Sn62 WS200 AGS 90.5 1300 Gram Semco
Multicore®No-Clean Fluxes
X32-10 No-Clean Flux Clear Residue-Wide Process Window
DESCRIPTION/APPLICATION % SOLIDS
% HALIDES
ACID VALUE IPC CLASS
APPLICATION
A general purpose halide-free low solids flux which leaves clean, dry boards
after wave soldering. Suitable for foam and spray flux application systems.
2.2
Zero
15.3
REMO Spray/Foam
MF200 Liquid Flux General Purpose - Lead-Free Compatible
DESCRIPTION/APPLICATION % SOLIDS
% HALIDES
ACID VALUE IPC CLASS
APPLICATION
A general purpose halide-free flux with sustained activity to extend flux life in
dual wave and Pb-free wave soldering aplications. Suitable for spray flux
application systems.
6.4
Zero
37
ORMO Spray/Foam
MFR301
DESCRIPTION/APPLICATION % SOLIDS
% HALIDES
ACID VALUE IPC CLASS
APPLICATION
Higher solids flux for better wetting on reduced solderability surfaces and to
minimize bridging on complex geometries. Fully Pb-free and dual
wave compatible.
6.5
Zero
41
ROMO Spray/Foam
Item number Package size
M00322 1 Gallon
M00320 5 Gallon
M00323 55 Gallon
Item number Package size
M00490 1 Gallon
M00491 5 Gallon
M00492 55 Gallon
Item number Package size
M00472 1 Gallon
M00473 5 Gallon
M00474 55 Gallon
MF300 VOC-free
DESCRIPTION/APPLICATION % SOLIDS
% HALIDES
ACID VALUE IPC CLASS
APPLICATION
General purpose VOC-free (water based), no-clean, halide-free and resin-free
flux with special formulation to minimize solder balling. Compatible with Pb-
free processes.
4.6
Zero
48.5
ORMO Spray/Foam
Item number Package size
M00469 1 Gallon
M00470 5 Gallon
M00471 55 Gallon
22
Clear Residue Resin Free
IPA Based Rosin Flux
Multicore®Water Wash Fluxes - IPA Based
Hydro-X/20
DESCRIPTION/APPLICATION % SOLIDS
% HALIDES
ACID VALUE
APPLICATION
A high activity water washable flux designed for the soldering of the most
difficult electronic assemblies. Unique activator package enables a wider
process window and the soldering of all common electronic surfaces with
ease. Residues are readily and completely removed by water wash after
soldering. Suitable for lead-free wave soldering.
20
1.0
24
Spray/Foam
High Activity Flux
Item number Package size
M00274 1 Gallon
M00272 5 Gallon
M00273 55 Gallon
Multicore®No-Clean VOC-Free Fluxes
MF101 Liquid Flux No Clean - VOC Free - Rosin Based Emulsion
DESCRIPTION/APPLICATION % SOLIDS
% HALIDES
ACID VALUE IPC CLASS
APPLICATION
A unique rosin emulsion technology flux which combines the benefits of a
VOC-free flux with the sustained activity of rosin. This can be used in dual
wave applications for soldering bottom side SMD components. Excellent
activity produces a wide process window reducing defects and improving
hole-fill. Can be used in lead-free wave applications.
6.5 - 7.0
Zero
40
ROMO Spray
Item number Package size
M00372 1 Gallon
M00373 5 Gallon
23
Multicore®Cored Wire
The Multicore®line of cored wire features the renowned multiple flux
cores technology to ensure even and consistent distribution of flux
throughout the solder wire. This reliability makes multicore solder
wire the first choice for automated wire soldering processes.
ITEM
DESCRIPTION HALIDE CONTENT
IPC CLASS ALLOY OPTIONS
(SN/PB)ALLOY OPTIONS
(PB-FREE)CONTENT
(BY WEIGHT)*
X39
Halide free, no-clean, clear residues
Zero
ROLO
60/40, 63/37, SN62 96SC, 99C 1%
400
Halide free, no-clean, clear residue, increased
flux content for improved wetting.
Zero
ROLO
60/40, 63/37, SN62 96SC, 99C 2.2%
502
No-clean, clear residue, minimal activation for
increased wetting speed.
0.2%
ROM1
60/40, 63/37, SN62 96SC, 99C 3%
309
General purpose high activity for fast wetting.
<1%
ROM1
60/40, 63/37, SN62 96SC, 99C 3%
Hydro-X
High activity water washable.
3%
ORH1
60/40, 63/37, SN62 96SC, 99C 2%
*Flux content is nominal and may vary regionally due to market requirements. Please check with your regional supplier.
Other Multicore®Product Offerings
Solder Mask
Temporary solder resists used with circuit boards prior to soldering. Will withstand
flux and wave soldering operations. Suitable for use with copper, hand, robotic,
pneumatic or template screening applications and brush.
Item number Description Package size
M292961 Spot-On Solder Mask 250 ml
M292967 Spot-On Solder Mask 5 liters
No-Clean Desoldering Wicks
Item number Description Length Width
M293366 NCAA 5 ft. (1.524m) 1.5 mm (0.06in.)
M290996 NCAA 10 ft.(3.048m) 1.5 mm (0.06 in)
M00390 NCAA 100 ft.(30.48 m) 1.5 mm (0.06 in.)
M290998 NCAB 5 ft.(1.524m) 2.2 mm (0.08 in.)
M291001 NCAB 100 ft.(3.048m) 2.2 mm (0.08 in.)
M291005 NCBB 5 ft.(1.524m) 2.7 mm (0.10 in.)
M291008 NCBB 10 ft.(30.48m) 2.7 mm (0.10 in.)
M00393 NCBB 100 ft.(30.48 m) 2.7 mm (0.10 in.)
M291013 NCOO 5 ft.(1.524m) 0.8 mm (0.03 in.)
M291017 NCOO 10 ft.(3.048m) 0.8 mm (0.03 in.)
Tip Tinner
Handy, non-abrasive solder iron tip-tinner. Easily wets hot solder irons leaving a
brightly tinned tip. Improves hand soldering efficiency and extends tip life.
Adhesive pad allows easy mounting on or near the solder iron holder.
Item number Description
M293011 Tip-Tinner
Mini Fluxers and Cleaners
Controlled release flux and cleaner pen applicators. Range of compatible flux types
available. Ideal for controlled application of flux when carrying out SMT re-work.
Cleaner pen easily removes residues.
Item number Description
M00385 MF-X33-04 No-Clean
M293319 MF-X33S-07i No-Clean
M00387 MF-638125 RMA Type
M293321 MF-Prozone Cleaner
Perfect for SMT re-work
Extends solder iron tip life
Multicore®Cleaners
Prozone SC01
DESCRIPTION/APPLICATION
Prozone SC01 is designed for the stencil cleaning and hand cleaning of process
soldering residues. A highly effective cleaner that dries rapidly (fast evaporation).
Item number Package size
M00290 1 Gallon
M00297 5 Gallon
M00296 55 Gallon
24
