The Multicore(R) line of solder pastes is designed to meet the rigorous demands of a variety of electronic manufacturing soldering processes. Whether your process requires long abandon times, wide process windows, or high-speed printing, Henkel Loctite offers a Multicore(R) paste to suit your needs. Henkel Loctite is also breaking new ground in the development of lead-free products. As the industry works toward eliminating lead from its products and processes, Henkel Loctite has developed not only the solder technology to meet that need, but will also provide the technical and engineering support crucial to process engineers as they face the unique processing requirements of lead-free operations. 20 www.loctite.com/electronics Multicore(R) Solder Pastes MP200 Solder Paste Wide Process Window DESCRIPTION/APPLICATION ALLOY % METAL LOAD TACK (G./MM2) PRINT SPEED mm/sec. IPC/J-STD CLASSIFICATION A high activity, soft, colorless, low residue, no-clean solder paste that exhibits excellent print definition with long open and abandon time capabilities. High activity of the MP200 flux offers excellent wetting to a wide range of surface finishes, and an exceptional reflow process window. Is suitable for fine pitch, high speed printing applications. Pin testable. SN62/SN63 63S4 (Anti-Tombstoning) 90 90.5 1.1 25 - 200 ROL0 Item number Product Description Package size Item number Product Description Package size M00439 M00440 M00441 M00447 M00505 Sn63 MP200 AGS 90 Sn63 MP200 AGS 90 Sn63 MP200 AGS 90 Sn63 MP200 AGS 90 Sn63 MP200 AGS 90.5 500 Gram Jar 700 Gram Semco 1300 Gram Semco 20CC EFD Cartridge 750 Gram Proflow M00443 M00444 M00445 M00448 M00506 Sn62 MP200 AGS 90 Sn62 MP200 AGS 90 Sn62 MP200 AGS 90 Sn62 MP200 AGS 90 Sn62 MP200 AGS 90.5 500 Gram Jar 700 Gram Semco 1300 Gram Semco 30CC EFD Cartridge 750 Gram Proflow M00449 Multi-Tak MP 200 (Rework Flux) 30CC Cartridge M00479 M00480 M00481 63S4 MP200 ACP 90 63S4 MP200 ACP 90 63S4 MP200 ACP 90 500 Gram Jar 700 Gram Semco 1300 Gram Semco CR36 No-Clean Solder Paste Highest Activity Offering DESCRIPTION/APPLICATION ALLOY % METAL LOAD TACK (G./MM2) PRINT SPEED mm/sec . IPC/J-STD CLASSIFICATION 89.5 1.3 - 1.6 20 - 200 ROLO A high activity, colorless residue, no-clean solder paste. CR36 exhibits good abandon time, long stencil life, and minimal hot slump. It has excellent wetting to a wide range of surface finishes. The activity of CR36 gives it an SN62/SN63 exceptional reflow process window, making it suitable for both volume and high mix manufacturing. Item number Product Description Package size M00086 M00219 Sn63 CR36 AGS 89.5 Sn63 CR36 AGS 89.5 500 Gram Jar 500 Gram Semco LF320 Lead Free Paste Wide Process Window DESCRIPTION/APPLICATION ALLOY % METAL LOAD TACK (G./MM2) PRINT SPEED mm/sec . IPC/J-STD CLASSIFICATION A no-clean flux system specially formulated for Pb-free alloys. High temperature tolerance and wide printing capability. 96SC alloy (Sn 95.5, Ag 3.5, Cu 0.7%) reflows at 217C. 96SC 88 1.2 20-150 ROMO DESCRIPTION/APPLICATION ALLOY % METAL LOAD TACK (G./MM2) PRINT SPEED mm/sec . IPC/J-STD CLASSIFICATION High performance water washable solder paste. Residues are readily removed with DI water, without the need for a saponifier. WS200 has good open time with excellent print definition and soldering activity. SN62/SN63 90.5 0.8 25-100 ORH1 Item number Product Description Package size M00501 M00502 96SC LF320 AGS88 96SC LF320 AGS88 500 Gram Jar 600 Gram Semco WS200 Water Wash Paste Item number Product Description Package size Item number Product Description Package size M00486 M00487 M00508 Sn63 WS200 AGS 90.5 Sn63 WS200 AGS 90.5 Sn63 WS200 AGS 90.5 500 Gram Jar 700 Gram Semco 1300 Gram Semco M00488 M00489 M00509 Sn62 WS200 AGS 90.5 Sn62 WS200 AGS 90.5 Sn62 WS200 AGS 90.5 500 Gram Jar 700 Gram Semco 1300 Gram Semco 21 Multicore(R) No-Clean Fluxes X32-10 No-Clean Flux Clear Residue-Wide Process Window DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION A general purpose halide-free low solids flux which leaves clean, dry boards after wave soldering. Suitable for foam and spray flux application systems. 2.2 Zero 15.3 REMO Spray/Foam Item number Package size M00322 M00320 M00323 1 Gallon 5 Gallon 55 Gallon MF200 Liquid Flux General Purpose - Lead-Free Compatible DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION A general purpose halide-free flux with sustained activity to extend flux life in dual wave and Pb-free wave soldering aplications. Suitable for spray flux application systems. 6.4 Zero 37 ORMO Spray/Foam Item number Package size M00490 M00491 M00492 1 Gallon 5 Gallon 55 Gallon MF300 VOC-free Clear Residue Resin Free DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION General purpose VOC-free (water based), no-clean, halide-free and resin-free flux with special formulation to minimize solder balling. Compatible with Pbfree processes. 4.6 Zero 48.5 ORMO Spray/Foam DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION Higher solids flux for better wetting on reduced solderability surfaces and to minimize bridging on complex geometries. Fully Pb-free and dual wave compatible. 6.5 Zero 41 ROMO Spray/Foam Item number Package size M00469 M00470 M00471 1 Gallon 5 Gallon 55 Gallon MFR301 IPA Based Rosin Flux Item number Package size M00472 M00473 M00474 1 Gallon 5 Gallon 55 Gallon 22 Multicore(R) No-Clean VOC-Free Fluxes MF101 Liquid Flux No Clean - VOC Free - Rosin Based Emulsion DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE IPC CLASS APPLICATION A unique rosin emulsion technology flux which combines the benefits of a VOC-free flux with the sustained activity of rosin. This can be used in dual wave applications for soldering bottom side SMD components. Excellent activity produces a wide process window reducing defects and improving hole-fill. Can be used in lead-free wave applications. 6.5 - 7.0 Zero 40 ROMO Spray Item number Package size M00372 M00373 1 Gallon 5 Gallon Multicore(R) Water Wash Fluxes - IPA Based Hydro-X/20 High Activity Flux DESCRIPTION/APPLICATION % SOLIDS % HALIDES ACID VALUE APPLICATION A high activity water washable flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables a wider process window and the soldering of all common electronic surfaces with ease. Residues are readily and completely removed by water wash after soldering. Suitable for lead-free wave soldering. 20 1.0 24 Spray/Foam Item number Package size M00274 M00272 M00273 1 Gallon 5 Gallon 55 Gallon Multicore(R) Cored Wire The Multicore(R) line of cored wire features the renowned multiple flux cores technology to ensure even and consistent distribution of flux throughout the solder wire. This reliability makes multicore solder wire the first choice for automated wire soldering processes. ITEM DESCRIPTION HALIDE CONTENT IPC CLASS ALLOY OPTIONS (SN/PB) ALLOY OPTIONS (PB-FREE) CONTENT (BY WEIGHT)* X39 Halide free, no-clean, clear residues Zero ROLO 60/40, 63/37, SN62 96SC, 99C 1% 400 Halide free, no-clean, clear residue, increased flux content for improved wetting. Zero ROLO 60/40, 63/37, SN62 96SC, 99C 2.2% 502 No-clean, clear residue, minimal activation for increased wetting speed. 0.2% ROM1 60/40, 63/37, SN62 96SC, 99C 3% 309 General purpose high activity for fast wetting. <1% ROM1 60/40, 63/37, SN62 96SC, 99C 3% Hydro-X High activity water washable. 3% ORH1 60/40, 63/37, SN62 96SC, 99C 2% *Flux content is nominal and may vary regionally due to market requirements. Please check with your regional supplier. 23 Multicore(R) Cleaners Prozone SC01 DESCRIPTION/APPLICATION Prozone SC01 is designed for the stencil cleaning and hand cleaning of process soldering residues. A highly effective cleaner that dries rapidly (fast evaporation). Item number Package size M00290 M00297 M00296 1 Gallon 5 Gallon 55 Gallon Other Multicore(R) Product Offerings Solder Mask No-Clean Desoldering Wicks Temporary solder resists used with circuit boards prior to soldering. Will withstand flux and wave soldering operations. Suitable for use with copper, hand, robotic, pneumatic or template screening applications and brush. Item number M293366 M290996 M00390 M290998 M291001 M291005 M291008 M00393 M291013 M291017 Item number M292961 M292967 Description Spot-On Solder Mask Spot-On Solder Mask Mini Fluxers and Cleaners Package size 250 ml 5 liters Perfect for SMT re-work Controlled release flux and cleaner pen applicators. Range of compatible flux types available. Ideal for controlled application of flux when carrying out SMT re-work. Cleaner pen easily removes residues. Item number M00385 M293319 M00387 M293321 Description MF-X33-04 No-Clean MF-X33S-07i No-Clean MF-638125 RMA Type MF-Prozone Cleaner Tip Tinner Description NCAA NCAA NCAA NCAB NCAB NCBB NCBB NCBB NCOO NCOO Length 5 ft. (1.524m) 10 ft.(3.048m) 100 ft.(30.48 m) 5 ft.(1.524m) 100 ft.(3.048m) 5 ft.(1.524m) 10 ft.(30.48m) 100 ft.(30.48 m) 5 ft.(1.524m) 10 ft.(3.048m) Width 1.5 mm (0.06in.) 1.5 mm (0.06 in) 1.5 mm (0.06 in.) 2.2 mm (0.08 in.) 2.2 mm (0.08 in.) 2.7 mm (0.10 in.) 2.7 mm (0.10 in.) 2.7 mm (0.10 in.) 0.8 mm (0.03 in.) 0.8 mm (0.03 in.) Extends solder iron tip life Handy, non-abrasive solder iron tip-tinner. Easily wets hot solder irons leaving a brightly tinned tip. Improves hand soldering efficiency and extends tip life. Adhesive pad allows easy mounting on or near the solder iron holder. Item number M293011 24 Description Tip-Tinner