1
Data sheet acquired from Harris Semiconductor
SCHS207A
Features
Onboard Oscillator
Common Reset
Negative Edge Clocking
Typical fMAX = 50MHz at VCC = 5V, CL = 15pF,
TA = 25oC
Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating T emperature Range . . . -55oC to 125oC
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il1µA at VOL, VOH
Description
The ’HC4060 and ’HCT4060 each consist of an oscillator
section and 14 ripple-carry binary counter stages. The
oscillator configuration allows design of either RC or crystal
oscillator circuits. A Master Reset input is provided which
resets the counter to the all-0’s state and disables the
oscillator. A high level on the MR line accomplishes the reset
function. All counter stages are master-slave flip-flops. The
state of the counter is advanced one step in binary order on
the negative transition of φI (and φO). All inputs and outputs
are buffered. Schmitt trigger action on the input-pulse-line
permits unlimited rise and fall times.
In order to achieve a symmetrical waveform in the oscillator
section the HCT4060 input pulse switch points are the same
as in the HC4060; only the MR input in the HCT4060 has
TTL switching levels.
Pinout
CD54HC4060, CD54HCT4060
(CERDIP)
CD74HC4060, CD74HCT4060
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER TEMP. RANGE
(oC) PACKAGE
CD54HC4060F3A -55 to 125 16 Ld CERDIP
CD74HC4060E -55 to 125 16 Ld PDIP
CD74HC4060M -55 to 125 16 Ld SOIC
CD54HCT4060F3A -55 to 125 16 Ld CERDIP
CD74HCT4060E -55 to 125 16 Ld PDIP
CD74HCT4060M -55 to 125 16 Ld SOIC
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all
electrical specifications. Please contact your local TI sales office
or customer service for ordering information.
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
Q12
Q13
Q14
Q6
Q5
Q7
GND
Q4
VCC
Q8
Q9
MR
φI
φO
φO
Q10
February 1998 - Revised May 2000
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2000, Texas Instruments Incorporated
CD54/74HC4060,
CD54/74HCT4060
High Speed CMOS Logic
14-Stage Binary Counter with Oscillator
[ /Title
(CD74
HC406
0,
CD74
HCT40
60)
/
Sub-
j
ect
(High
Speed
CMOS
2
Functional Diagram
φI
Q4
Q5
Q6
Q7
Q9
Q12
Q14
φO
φO
MR
Q13
Q10
Q8
14-STAGE
RIPPLE
COUNTER
AND
OSCILLATOR
GND = 8
VCC = 16
7
5
4
6
13
1
3
2
15
14
12
11
9
10
FIGURE 1. LOGIC BLOCK DIAGRAM
TRUTH TABLE
øI MR OUTPUT STATE
L No Change
L Advance to Next State
X H All Outputs are Low
ø1Q1
FF1
ø1 Q1
R
ø4Q4
FF4
ø4 Q4
R
ø14 Q14
FF14
ø14 Q14
R
ø5 Q13
FF5 - FF13
ø5 Q13
R
723
5, 4, 6, 14, 13, 15, 1
Q5 - Q10, Q12
MR 12
11
10
9
Q14
Q13
Q4
øO
øO
ø1
CD54/74HC4060, CD54/74HCT4060
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 3) θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage Q Outputs
CMOS Loads
VOH VIH or VIL -0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage Q Outputs
TTL Loads
- - ---- - - -V
-4 4.5 3.98 - - 3.84 - 3.7 - V
-5.2 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage Q Outputs
CMOS Loads
VOL VIH or VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage Q Outputs
TTL Loads
- - ---- - - -V
4 4.5 - - 0.26 - 0.33 - 0.4 V
5.2 6 - - 0.26 - 0.33 - 0.4 V
High-Level Output
Voltage φO Output
(Pin 10)
CMOS Loads
VOH VCC or
GND -0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
CD54/74HC4060, CD54/74HCT4060
4
High-Level Output
Voltage φO Output
(Pin 10)
TTL Loads
Note 6
VOH VCC or
GND -2.6 4.5 3.98 - - 3.84 - 3.7 - V
-3.3 6 5.48 - - 5.34 - 5.2 - V
Low-Level Output
Voltage φO Output
(Pin 10)
CMOS Loads
VOL VCC or
GND 0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low-Level Output
Voltage φO Output
(Pin 10)
TTL Loads
VOL VCC or
GND 2.6 4.5 - - 0.26 - 0.33 - 0.4 V
3.3 6 - - 0.26 - 0.33 - 0.4 V
High-Level Output
Voltage φO Output
(Pin 9)
TTL Loads
VOH VIL or VIH -3.2 4.5 3.98 - - 3.84 - 3.7 - V
-4.2 6 5.48 - - 5.34 - 5.2 - V
Low-Level Output
Voltage φO Output
(Pin 9)
TTL Loads
VOL VIL or VIH -2.6 4.5 - - 0.26 - 0.33 - 0.4 V
-3.3 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC or
GND -6--±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 6 - - 8 - 80 - 160 µA
HCT TYPES
High Level Input
Voltage VIH - - 4.5 to
5.5 2--2 - 2 - V
Low Level Input
Voltage VIL - - 4.5 to
5.5 - - 0.8 - 0.8 - 0.8 V
High Level Output
Voltage Q Outputs
CMOS Loads
VOH VIH or VIL
Note 5 -0.02 4.5 4.4 - - 4.4 - 4.4 - V
High Level Output
Voltage Q Outputs
TTL Loads
-4 4.5 3.98 - - 3.84 - 3.7 - V
Low Level Output
Voltage Q Outputs
CMOS Loads
VOL VIH or VIL
Note 5 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage Q Outputs
TTL Loads
4 4.5 - - 0.26 - 0.33 - 0.4 V
High-Level Output
Voltage φO Output
(Pin 10)
CMOS Loads
VOH VCC or
GND -0.02 4.5 4.4 - - 4.4 - 4.4 - V
High-Level Output
Voltage φO Output
(Pin 10)
TTL Loads Note 6
VOH VCC or
GND -2.6 4.5 3.98 - - 3.84 - 3.7 - V
Low-Level Output
Voltage φO Output
(Pin 10)
CMOS Loads
VOL VCC or
GND 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
CD54/74HC4060, CD54/74HCT4060
5
Low-Level Output
Voltage φO Output
(Pin 10)
TTL Loads
VOL VCC or
GND 2.6 4.5 - - 0.26 - 0.33 - 0.4 V
High-Level Output
Voltage φO Output
(Pin 9)
TTL Loads
VOH VIL or VIH -3.2 4.5 3.98 - - 3.84 - 3.7 - V
Low-Level Output
Voltage φO Output
(Pin 9)
TTL Loads
VOL VIH or VIL
Note 5 3.2 4.5 - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIAny
Voltage
Between
VCC and
GND
0 5.5 - ±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 5.5 - - 8 - 80 - 160 µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
ICC
(Note 4) VCC
-2.1 - 4.5 to
5.5 - 100 360 - 450 - 490 µA
NOTES:
4. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
5. For pin 11 VIH = 3.15V, VIL = 0.9V.
6. Limits not valid when pin 12 (instead of pin 11) is used as control input.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
MR 0.35
NOTE: Unit Load is ICC limit specified in DC Electrical Specifica-
tions Table, e.g. 360µA max at 25oC.
Prerequisite for Switching Specifications
PARAMETER SYMBOL VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
HC TYPES
Maximum Input Pulse
Frequency tMAX 2 6 - - 5 - - 4 - - MHz
4.5 30 - - 25 - - 20 - - MHz
6 35 - - 29 - - 23 - - MHz
Input Pulse Width tW2 80 - - 100 - - 120 - - ns
4.5 16 - - 20 - - 24 - - ns
614--17- -20--ns
Reset Removal Time tREM 2 100 - - 125 - - 150 - - ns
4.5 20 - - 25 - - 30 - - ns
617--21- -26--ns
CD54/74HC4060, CD54/74HCT4060
6
Reset Pulse Width tW2 80 - - 100 - - 120 - - ns
4.5 16 - - 20 - - 24 - - ns
614--17- -20--ns
HCT TYPES
Maximum Input,
Pulse Frequency tMAX 4.5 30 - - 25 - - 20 - - MHz
Input Pulse Width tW4.5 16 - - 20 - - 24 - - ns
Reset Removal Time tREM 4.5 26 - - 33 - - 39 - - ns
Reset Pulse Width tW4.5 25 - - 31 - - 38 - - ns
Prerequisite for Switching Specifications (Continued)
PARAMETER SYMBOL VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
Switching Specifications Input tr, tf= 6ns
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC-55oC TO
125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Propagation Delay tPLH, tPHL CL = 50pF 2 - - 300 - 375 - 450 ns
φI to Q4 4.5 - - 60 - 75 - 90 ns
CL = 15pF 5 - 25 - - - - - ns
CL = 50pF 6 - - 51 - 64 - 78 ns
Qn to Qn+1 tPLH, tPHL CL = 50pF 2 - - 80 - 100 - 120 ns
4.5 - - 16 - 20 - 24 ns
CL = 15pF 5 - 6 - - - - - ns
CL = 50pF 6 - - 14 - 17 - 20 ns
MR to QntPHL CL = 50pF 2 - - 175 - 220 - 265 ns
4.5 - - 35 - 44 - 53 ns
CL = 15pF 5 - 14 - - - - - ns
CL = 50pF 6 - - 30 - 37 - 45 ns
Output Transition Time tTHL, tTLH CL = 50pF 2 - - 75 - 95 - 110 ns
4.5 - - 15 - 19 - 22 ns
6 - - 13 - 16 - 19 ns
Input Capacitance CI
(TBD)
Propagation Dissipation
Capacitance CPD ---40-----pF
HCT TYPES
Propagation Delay tPLH, tPHL CL = 50pF 2- - - - - - - -ns
φI to Q4 4.5 - - 66 - 83 - 100 ns
CL = 15pF 5 - 25 - - - - - -ns
CL = 50pF 6 - - - - - - - -ns
CD54/74HC4060, CD54/74HCT4060
7
Qn to Qn+1 tPLH, tPHL CL = 50pF 2 - - - - - - - ns
4.5 - - 16 - 20 - 24 ns
CL = 15pF 5 - 6 - - - - - ns
CL = 50pF 6 - - - - - - - ns
MR to QntPHL CL = 50pF 2 - - - - - - - ns
4.5 - - 44 - 55 - 66 ns
CL = 15pF 5 - 17 - - - - - ns
CL = 50pF 6 - - - - - - - ns
Output Transition Time tTHL, tTLH CL = 50pF 2 - - - - - - - ns
4.5 - - 15 - 19 - 22 ns
6-------ns
Input Capacitance CI
(TBD)
Propagation Dissipation
Capacitance CPD ---40-----pF
NOTES:
7. CPD is used to determine the dynamic power consumption, per package.
8. PD = CPD VCC2 fi(CL VCC2 fi/M) where M = 21, 22, 23, ...214, fi = input frequency, CL = output load capacitance.
Switching Specifications Input tr, tf= 6ns (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC-55oC TO
125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
TYPICAL LIMIT VALUES FOR RX AND CX
PARAMETER TEST
CONDITIONS VOLTAGE
TYPICAL
MAXIMUM
LIMITS
RX Minimum CX > 1000pF 2 1K
CX > 10pF 4.5
CX > 10pF 6
RX Maximum CX > 10pF 2 20M
CX > 10pF 4.5
CX > 10pF 6
CX Minimum RX > 10K2 10pF
RX > 10K4.5
RX > 10K6
RX = 1K2 1000pF
RX = 1K4.5 10pF
RX = 1K6 10pF
Maximum
Astable Oscillator
Frequency
CX = 1000pF,
RX = 1K2 0.5MHz
(Note 9)
CX = 100pF,
RX = 1K4.5 3MHz
(Note 9)
CX = 100pF,
RX = 1K6 3MHz
(Note 9)
NOTE:
9. At very high frequencies f = 1/2.2 RXCXno longer gives an
accurate approximation.
NOTE: OSC Frequency 1/2.2 RXCX
For 1M > RX > 1K, CX > 10pF, f < 1MHz
FIGURE 2. FREQUENCY OF ON-BOARD OSCILLATOR AS A
FUNCTION OF CX AND RX
102
10
1
10-1
10-2
10-3
10-4
10-5 10-1 10010 102103104105106
OSCILLATOR FREQUENCY (Hz)
CX (µF)
TA = 25oC
RX = 1K
10K
100K
1M
10M
CD54/74HC4060, CD54/74HCT4060
8
Typical Performance Curves
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 3. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 4. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 5. HC AND HCT TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC FIGURE 6. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
CLOCK 90% 50%
10% GND
VCC
trCLtfCL
50% 50%
tWL tWH
10%
tWL + tWH =fCL
I
CLOCK 2.7V 1.3V
0.3V GND
3V
trCL= 6ns tfCL= 6ns
1.3V 1.3V
tWL tWH
0.3V
tWL + tWH =fCL
I
tPHL tPLH
tTHL tTLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
VCC
tr = 6ns tf = 6ns
90%
tPHL tPLH
tTHL tTLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
tr = 6ns tf = 6ns
90%
CD54/74HC4060, CD54/74HCT4060
IMPORTANT NOTICE
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any product or service without notice, and advise customers to obtain the latest version of relevant information
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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Copyright 2000, Texas Instruments Incorporated