TBD62381AFWG,EHZ - TOSHIBA - Product.Network

TBD62381A series

2017-03-24

TOSHIBA BiCD Integrated Circuit Silicon Monolithic

TBD62381APG, TBD62381AFNG, TBD62381AFWG

8-ch low ON resistance DMOS transistor array

TBD62381A series are DMOS transistor arrays with 8 circuits. Please be

careful about thermal conditions during use.

Features

• Built-in 8 circuits

• High voltage : VOUT = 50 V (max)

• High current : IOUT = 500 mA/ch (max)

• Input voltage (output on) : 2.0 V to 25 V

• Input voltage (output off) : 0 V to 0.6 V

• Package : PG type P-DIP18-300-2.54-001

FNG type SSOP18-P-225-0.65

FWG type P-SOP18-0812-1.27-001

Pin Assignment (top view)

Pin connection may be omitted partially or simplified for explanatory purpose.

TBD62381APG

P-DIP18-300-2.54-001

TBD

62381AFNG

SSOP18-P-225-0.65

TBD62381AFWG

P-SOP18-0812-1.27-001

Weight

-DIP18-300-2.54-001 :1.3 g (typ.)

SSOP1

8-P-225-0.65 :0.09 g (typ.)

P-SOP18-0812-1.27-001 :0.5 g (typ.)

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2017-03-24

Pin Descriptions

Pin No. Pin name Function

Input pin

GND

Ground pin

VCC

Power supply pin

Output pin

Basic Circuit

Basic circuit may be omitted partially or simplified for explanatory purpose.

INPUT

OUTPUT

VCC

Clamp

circuit

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Absolute Maximum Ratings (Ta = 25°C)

Characteristics Symbol Rating Unit

Power supply voltage VCC −0.5 to 6.0 V

Output voltage VOUT 50 V

Output current (per ch) IOUT 500 mA

Input voltage VIN −0.5 to 30 V

Power

dissipation

PG (Note1)

1.47

FNG (Note2) 0.96

FWG (Note3) 1.31

Operating temperature Topr −40 to 85 °C

Storage temperature Tstg −55 to 150 °C

Note1: Stand alone When Ta exceeds 25 °C, it is necessary to do the derating with 11.8 mW/°C.

Note2: On PCB (size: 50 mm × 50 mm × 1.6 mm, Cu area: 40 %. single-side glass epoxy) When Ta exceeds 25 °C, it is

necessary to do the derating with 7.7 mW/°C.

Note3: On PCB (size: 75 mm × 114 mm × 1.6 mm, Cu area: 20 %, single-side glass epoxy) When Ta exceeds 25 °C, it

is necessary to do the derating with 10.48 mW/°C.

Operating Ranges (Ta = −40 to 85°C, unless otherwise specified.)

Characteristics Symbol Test conditions Min Typ. Max Unit

Power supply voltage VCC ― 4.5 5.0

5.5

Output voltage VOUT ― ― ―

Output current

(per ch)

PG (Note1)

IOUT

1 circuit ON, Ta = 25 °C 0 ― 400

tpw = 25 ms

8 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 % 0 ―

400

Duty = 50 % 0 ― 203

FNG (Note2)

1 circuit ON, Ta = 25 °C 0 ― 400

tpw = 25 ms

8 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 % 0 ― 367

Duty = 50 % 0 ― 164

FWG (Note3)

1 circuit ON, Ta = 25 °C 0 ― 400

tpw = 25 ms

8 circuits ON

Ta = 85 °C

Tj = 120 °C

Duty = 10 % 0 ― 400

Duty = 50 % 0 ― 192

Input voltage (Output on) VIN (ON) IOUT = 100 mA or more, VOUT = 2 V 2.0 ― 25 V

Input voltage (Output off) VIN (OFF) IOUT = 100 μA or less, VOUT = 2 V 0 ― 0.6 V

Note1: Stand alone

Note2: On PCB (size: 50 mm × 50 mm × 1.6 mm, Cu area: 40 %, single-side glass epoxy)

Note3: On PCB (size: 75 mm × 114 mm × 1.6 mm, Cu area: 20 %, single-side glass epoxy)

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Electrical Characteristics (Ta = 25°C, unless otherwise specified.)

Characteristics Symbol Te st

Circuit

Test conditions Min Typ. Max Unit

Output leakage current Ileak 1 VOUT = 50 V, Ta = 85 °C

VIN = 0V, VCC = 5.5 V ― ― 1.0 μA

Output voltage

(Output ON-resistance)

VDS

(RON) 2

IOUT = 350 mA

VCC = 5.0 V, VIN = 5.0 V ― 0.35

(1.0)

0.875

(2.5)

(Ω)

IOUT = 200 mA,

VCC = 5.0 V, VIN = 5.0 V ― 0.2

(1.0)

0.5

(2.5)

IOUT = 100 mA

VCC = 5.0 V, VIN = 5.0 V ― 0.1

(1.0)

0.25

(2.5)

Input current

IIN(ON) 3 VCC = 5.5 V, VIN = 2.0 V ― 3 10 μA

IIN(OFF) 4 VCC = 5.5 V, VIN = 0 V

Ta = 85 °C ― ― 1.0 μA

Consumption current (per ch) ICC(ON) 3 VCC = VIN =5.5 V ― 60 200 μA

ICC(OFF) 4 VCC = 5.5 V, VIN = 0 V ― ― 1.0 μA

Turn-on delay tON

VCC = 5.0 V, VOUT = 50 V

RL = 125 Ω

CL = 15 pF

― 1.0 ―

μs

Turn-off delay tOFF ― 1.0 ―

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Test Circuit

1. Ileak 2. VDS (RON)

3. IIN (ON), ICC (ON) 4. IIN (OFF), ICC (OFF)

Test circuits may be omitted partially or simplified for explanatory purpose.

OUTPUT

INPUT

GND

VCC

VIN

VCC

ICC(ON)

IIN(ON)

OUTPUT

INPUT

GND

VCC

VIN

VCC

ICC(OFF)

IIN(OFF)

OUTPUT

INPUT

GND

VOUT

IOUT

VDS

RON = VDS / IOUT

Ileak

VCC

VIN

VCC

OUTPUT

INPUT

GND

VCC

VIN

VCC

TBD62381A series

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5. tON, tOFF

Note1: Pulse width 50 μs, Duty cycle 10 %

Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns, VIH = 5.0 V

Note2: CL includes capacitance of the probe and the test board.

Test circuits and timing charts may be omitted partially or simplified for explanatory purpose.

Precautions for Using

This IC does not incorporate built-in protection circuits for excess current or over voltage.

Therefore, if the short-circuit between adjacent pins or between outputs, the short-to-power or ground fault has occurred,

the current or voltage beyond the absolute maximum rating is impressed, and IC may be destroyed. When designing,

please consider enough in power supply line, output line, and GND line.

In addition, so as not to continue to flow a current that exceeds the absolute maximum rating of the IC, please insert the

appropriate fuse in the power supply line.

(Note2)

(Note1)

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Package Dimensions

P-DIP18-300-2.54-001 Unit: mm

Weight: 1.3 g (typ.)

SSOP18-P-225-0.65 Unit: mm

Weight: 0.09 g (typ.)

TBD62381A series

2017-03-24

P-SOP18-0812-1.27-001 Unit: mm

Weight: 0.5 g (typ.)

TBD62381A series

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Notes on Contents

1. Pin Connection

Pin connection may be simplified for explanatory purpose.

2. Equivalent Circuit

Equivalent circuit may be simplified for explanatory purpose.

3. Test Circuit

Test circuit may be simplified for explanatory purpose.

4. Timing Chart

Timing charts may be simplified for explanatory purposes.

IC Usage Considerations

Notes on handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a

moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or

deterioration, and may result in injury by explosion or combustion.

(2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of

power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute

maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result

in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly

to which current is applied even just once.

(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of

overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or

load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the

effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time

and insertion circuit location, are required.

(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the

negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or

ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the

protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such

as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input

or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a

speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may

cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)

connection-type IC that inputs output DC voltage to a speaker directly.

Points to remember on handling of ICs

Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is

appropriately radiated, in order not to exceed the specified junction temperature (Tj) at any time or under any condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,

deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the

effect of IC heat radiation with peripheral components.

Back-EMF

When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power supply

owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power

supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take

the effect of back-EMF into consideration in system design.

TBD62381A series

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RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in

this document, and related hardware, software and systems (collectively "Product") without notice.

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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury

or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or

incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant

TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product

and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the

application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or

applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)

evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,

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