Octal, 14-Bit, 65 MSPS, Serial LVDS,
1.8 V Analog-to-Digital Converter
Data Sheet AD9257-EP
Rev. A Document Feedback
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FEATURES
Low power: 55 mW per channel at 65 MSPS with scalable
power options
SNR = 75.5 dB (to Nyquist)
SFDR = 91 dBc (to Nyquist)
DNL = ±0.6 LSB (typical), INL = ±1.1 LSB (typical)
Serial LVDS (ANSI-644, default)
Low power, reduced signal option (similar to IEEE 1596.3)
Data and frame clock outputs
650 MHz full power analog bandwidth
2 V p-p input voltage range
1.8 V supply operation
Serial port control
Full chip and individual channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Programmable clock and data alignment
Programmable output resolution
Standby mode
ENHANCED PRODUCT FEATURES
Supports defense and aerospace applications (AQEC standard)
Military temperature range (−55°C to +125°C)
Controlled manufacturing baseline
Qualification data available on request
APPLICATIONS
Medical imaging and nondestructive ultrasound
Portable ultrasound and digital beam forming systems
Quadrature radio receivers
Diversity radio receivers
Optical networking
Test equipment
GENERAL DESCRIPTION
The AD9257-EP is an octal, 14-bit, 65 MSPS analog-to-digital
converter (ADC) with an on-chip sample-and-hold circuit
designed for low cost, low power, small size, and ease of use.
The product operates at a conversion rate of up to 65 MSPS and
is optimized for outstanding dynamic performance and low
power in applications where a small package size is critical.
The ADC requires a single 1.8 V power supply and LVPECL-/
CMOS-/LVDS-compatible sample rate clock for full performance
operation. No external reference or driver components are
required for many applications.
The ADC automatically multiplies the sample rate clock for the
appropriate LVDS serial data rate. A data clock output (DCO) for
capturing data on the output and a frame clock output (FCO) for
signaling a new output byte are provided. Individual channel
FUNCTIONAL BLOCK DIAGRAM
Figure 1.
power-down is supported and typically consumes 1 mW when
all channels are disabled. The ADC contains several features
designed to maximize flexibility and minimize system cost, such as
programmable clock and data alignment and programmable digital
test pattern generation. The available digital test patterns include
built-in deterministic and pseudorandom patterns, along with
custom user defined test patterns entered via the serial port
interface (SPI).
The AD9257-EP is available in an RoHS-compliant, 64-lead
LFCSP. It is specified over the −55°C to +125°C temperature. This
product is protected by a U.S. patent. Additional application and
technical information can be found in the AD9257 data sheet.
PRODUCT HIGHLIGHTS
1. Small Footprint. Eight ADCs are contained in a small,
space-saving package.
2. Low Power of 55 mW/Channel at 65 MSPS with Scalable
Power Options.
3. Ease of Use. A DCO is provided that operates at frequen-
cies of up to 455 MHz and supports double data rate
(DDR) operation.
4. User Flexibility. The SPI control offers a wide range of
flexible features to meet specific system requirements.
5. Pin Compatible with the AD9637 (12-Bit Octal ADC).
ADC 14 SERIAL
LVDS
D+ A
D– A
VIN+ A
A
V
DD
AD9257-EP
VIN– A
D+ B
D– B
VIN+ B
VIN– B ADC 14 SERIAL
LVDS
ADC 14 SERIAL
LVDS
ADC 14 SERIAL
LVDS
ADC 14 SERIAL
LVDS
ADC 14 SERIAL
LVDS
ADC 14 SERIAL
LVDS
ADC 14 SERIAL
LVDS
D+ C
D– C
VIN+ C
VIN– C
D+ D
D– D
VIN+ D
VIN– D
D+ E
D– E
VIN+ E
VIN– E
D+ F
D– F
VIN+ F
VIN– F D+ G
D– G
VIN+ G
VIN– G
DATA RATE
MULTIPLIER
SERIAL PORT
INTERFACE
REF
SELECT
D+ H
FCO+
FCO–
DCO+
DCO–
D– H
VIN+ H
VIN– H
VREF
VCM
1.0V
SYNC
SENSE
PDWN DR
V
DD
RBIAS AGND CSB CLK+ CLK–SDIO/
DFS SCLK/
DTP
12740-001
AD9257-EP Data Sheet
Rev. A | Page 2 of 13
TABLE OF CONTENTS
Features .............................................................................................. 1
Enhanced Product Features ............................................................ 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 1
Specifications ..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications .......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications ...............................................................6
Timing Specifications ...................................................................6
Absolute Maximum Ratings ............................................................9
Thermal Characteristics ...............................................................9
ESD Caution...................................................................................9
Pin Configuration and Function Descriptions ........................... 10
Typical Performance Characteristics ........................................... 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 13
REVISION HISTORY
6/15Rev. 0 to Rev. A
Changes to Table 2 ............................................................................ 4
Changes to Table 3 ............................................................................ 5
Changes to Table 6 ............................................................................ 9
Changes to Figure 6 ........................................................................ 10
2/15—Revision 0: Initial Version
Data Sheet AD9257-EP
Rev. A | Page 3 of 13
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 1.
Parameter1 Temp Min Typ Max Unit
RESOLUTION 14 Bits
ACCURACY
No Missing Codes Full Guaranteed
Offset Error Full 0.7 0.3 +0.1 % FSR
Offset Matching Full 0 0.23 0.6 % FSR
Gain Error Full 7.0 2.9 +1.0 % FSR
Gain Matching Full 1.0 +1.6 +5.0 % FSR
Differential Nonlinearity (DNL) Full 0.95 ±0.6 +1.6 LSB
Integral Nonlinearity (INL) Full 4.5 ±1.1 +4.5 LSB
TEMPERATURE DRIFT
Offset Error Full ±2 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage (1 V Mode) Full 0.98 0.99 1.01 V
Load Regulation at 1.0 mA (VREF = 1 V) Full 2 mV
Input Resistance Full 7.5
INPUT REFERRED NOISE
VREF = 1.0 V 25°C 0.94 LSB rms
ANALOG INPUTS
Differential Input Voltage (VREF = 1 V) Full 2 V p-p
Common-Mode Voltage Full 0.9 V
Common-Mode Range Full 0.5 1.3 V
Differential Input Resistance 5.2
Differential Input Capacitance
Full
3.5
pF
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 V
IAVDD Full 198 211 mA
IDRVDD (ANSI-644 Mode) Full 60 93 mA
IDRVDD (Reduced Range Mode) 25°C 45 mA
TOTAL POWER CONSUMPTION
Total Power Dissipation (Eight Channels, ANSI-644 Mode) Full 464 547 mW
Total Power Dissipation (Eight Channels, Reduced Range Mode) 25°C 437 mW
Power-Down Dissipation 25°C 1 mW
Standby Dissipation
2
25°C
92
mW
1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2 Can be controlled via the SPI.
AD9257-EP Data Sheet
Rev. A | Page 4 of 13
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted. CLK
divider = 8 used for typical characteristics at input frequency 19.7 MHz.
Table 2.
Parameter1 Temp Min Typ Max Unit
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz 25°C 75.7 dBFS
fIN = 19.7 MHz Full 72.8 75.6 dBFS
fIN = 30.5 MHz 25°C 75.5 dBFS
fIN = 63.5 MHz 25°C 74.9 dBFS
fIN = 123.4 MHz 25°C 73.2 dBFS
SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD)
IN
25°C
75.6
dBFS
fIN = 19.7 MHz Full 70.9 75.6 dBFS
fIN = 30.5 MHz 25°C 75.4 dBFS
fIN = 63.5 MHz 25°C 74.8 dBFS
fIN = 123.4 MHz 25°C 72.8 dBFS
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz 25°C 12.3 Bits
fIN = 19.7 MHz Full 11.5 12.3 Bits
fIN = 30.5 MHz 25°C 12.2 Bits
fIN = 63.5 MHz 25°C 12.1 Bits
fIN = 123.4 MHz 25°C 11.8 Bits
fIN = 9.7 MHz 25°C 96 dBc
fIN = 19.7 MHz Full 78 96 dBc
fIN = 30.5 MHz 25°C 91 dBc
fIN = 63.5 MHz 25°C 95 dBc
fIN = 123.4 MHz 25°C 83 dBc
WORST HARMONIC (SECOND OR THIRD)
fIN = 9.7 MHz 25°C 99 dBc
fIN = 19.7 MHz Full −98 78 dBc
fIN = 30.5 MHz 25°C 91 dBc
fIN = 63.5 MHz 25°C 98 dBc
fIN = 123.4 MHz 25°C −83 dBc
WORST OTHER (EXCLUDING SECOND OR THIRD)
fIN = 9.7 MHz 25°C 96 dBc
fIN = 19.7 MHz Full −96 86 dBc
fIN = 30.5 MHz 25°C 98 dBc
fIN = 63.5 MHz 25°C 95 dBc
IN
25°C
−94
dBc
TWO-TONE INTERMODULATION DISTORTION (IMD)AIN1 AND AIN2 = −7.0 dBFS
fIN1 = 30 MHz, fIN2 = 32 MHz 25°C 92 dBc
CROSSTALK2 25°C 98 dB
Crosstalk (Overrange Condition)3 25°C 94 dB
POWER SUPPLY REJECTION RATIO (PSRR)4 25°C
AVDD 52 dB
DRVDD 71 dB
ANALOG INPUT BANDWIDTH, FULL POWER 25°C 650 MHz
1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2 Crosstalk is measured at 10 MHz with −1.0 dBFS analog input on one channel and no input on the adjacent channel.
3 Overrange condition is 3 dB above the full-scale input range.
4 PSRR is measured by injecting a sinusoidal signal at 10 MHz to the power supply pin and measuring the output spur on the FFT. PSRR is calculated as the ratio of the
amplitudes of the spur voltage over the pin voltage, expressed in decibels.
Data Sheet AD9257-EP
Rev. A | Page 5 of 13
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 3.
Parameter1, 2 Temp Min Typ Max Unit
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance CMOS/LVDS/LVPECL
Differential Input Voltage3 Full 0.2 3.6 V p-p
Input Voltage Range Full AGND − 0.2 AVDD + 0.2 V
Input Common-Mode Voltage Full 0.9 V
Input Resistance (Differential) 25°C 15
Input Capacitance 25°C 4 pF
LOGIC INPUTS (PDWN, SYNC, SCLK)
Logic 1 Voltage
Full
1.2
AVDD + 0.2
V
Logic 0 Voltage Full 0 0.8 V
Input Resistance 25°C 30
Input Capacitance 25°C 2 pF
LOGIC INPUT (CSB)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V
Logic 0 Voltage Full 0 0.8 V
Input Resistance 25°C 26
Input Capacitance 25°C 2 pF
LOGIC INPUT (SDIO)
Logic 1 Voltage Full 1.2 AVDD + 0.2 V
Logic 0 Voltage
Full
0
0.8
V
Input Resistance 25°C 26
Input Capacitance 25°C 5 pF
LOGIC OUTPUT (SDIO)4
Logic 1 Voltage (IOH = 800 μA) Full 1.79 V
Logic 0 Voltage (IOL = 50 μA) Full 0.05 V
DIGITAL OUTPUTS (D± x), ANSI-644
Logic Compliance LVDS
Differential Output Voltage (VOD) Full ±247 ±350 ±454 mV
Output Offset Voltage (VOS) Full 1.13 1.21 1.38 V
Output Coding (Default) Twos complement
DIGITAL OUTPUTS (D± x), LOW POWER, REDUCED SIGNAL OPTION
Logic Compliance LVDS
Differential Output Voltage (V
OD
)
Full
±150
±200
±250
mV
Output Offset Voltage (V
OS
)
Full
1.13
1.21
1.38
V
Output Coding (Default) Twos complement
1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2 When referencing a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin
names of multifunction pins, refer to the Pin Configuration and Function Descriptions section.
3 This is specified for LVDS and LVPECL only.
4 This is specified for 13 SDIO/DFS pins sharing the same connection.
AD9257-EP Data Sheet
Rev. A | Page 6 of 13
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −1.0 dBFS, unless otherwise noted.
Table 4.
Parameter1, 2 Temp Min Typ Max Unit
CLOCK3
Input Clock Rate Full 10 520 MHz
Conversion Rate Full 10 65 MSPS
Clock Pulse Width High (tEH) Full 7.69 ns
Clock Pulse Width Low (tEL) Full 7.69 ns
OUTPUT PARAMETERS3
Propagation Delay (tPD) Full 1.5 2.3 3.1 ns
Rise Time (tR) (20% to 80%) Full 300 ps
Fall Time (t
F
) (20% to 80%)
Full
300
ps
FCO Propagation Delay (tFCO) Full 1.5 2.3 3.1 ns
DCO Propagation Delay (tCPD)4 Full tFCO + (tSAMPLE/28) ns
DCO to Data Delay (tDATA )4 Full (tSAMPLE/28) − 300 (tSAMPLE/28) (tSAMPLE/28) + 300 ps
DCO to FCO Delay (tFRAME)4 Full (tSAMPLE/28) − 300 (tSAMPLE/28) (tSAMPLE/28) + 300 ps
Data to Data Skew
(tDATA-MAX − tDATA-MIN)
Full ±50 ±200 ps
Wake-Up Time (Standby) 25°C 35 μs
Wake-Up Time (Power-Down)5 25°C 375 μs
Pipeline Latency Full 16 Clock cycles
APERTURE
Aperture Delay (tA) 25°C 1 ns
Aperture Uncertainty (Jitter) 25°C 0.1 ps rms
Out-of-Range Recovery Time 25°C 1 Clock cycles
1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2 Measured on standard FR-4 material.
3 Can be adjusted via the SPI.
4 tSAMPLE/28 is based on the number of bits divided by 2 because the delays are based on half duty cycles. tSAMPLE = 1/fS.
5 Wake-up time is defined as the time required to return to normal operation from power-down mode.
TIMING SPECIFICATIONS
Table 5.
Parameter Description Limit Unit
SYNC TIMING REQUIREMENTS
tSSYNC SYNC to rising edge of CLK+ setup time 0.24 ns typ
tHSYNC SYNC to rising edge of CLK+ hold time 0.40 ns typ
SPI TIMING REQUIREMENTS1 See Figure 4
t
DS
Setup time between the data and the rising edge of SCLK
2
ns min
tDH Hold time between the data and the rising edge of SCLK 2 ns min
tCLK Period of the SCLK 40 ns min
tS Setup time between CSB and SCLK 2 ns min
tH Hold time between CSB and SCLK 2 ns min
t
HIGH
SCLK pulse width high
10
ns min
tLOW SCLK pulse width low 10 ns min
tEN_SDIO Time required for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge (not shown in Figure 4)
10 ns min
tDIS_SDIO Time required for the SDIO pin to switch from an output to an input relative to the SCLK
rising edge (not shown in Figure 4)
10 ns min
1 When referring to a single function of a multifunction pin, only the portion of the pin name that is relevant to the specification is listed. For full pin names of
multifunction pins, refer to the Pin Configuration and Function Descriptions section.
Data Sheet AD9257-EP
Rev. A | Page 7 of 13
Timing Diagrams
Figure 2. Word Wise DDR,1× Frame, 14-Bit Output Mode (Default)
Figure 3. Word Wise DDR, 1× Frame, 12-Bit Output Mode
DCO–
DCO+
D– x
D+ x
FCO–
FCO+
VIN± x
CLK–
CLK+
MSB
N – 17 D12
N – 17 D11
N – 17 D10
N – 17 D9
N – 17 D8
N – 17 D7
N – 17 D6
N – 17 D5
N – 17 D4
N – 17 D3
N – 17 D2
N – 17 D0
N – 17
D1
N – 17 D12
N – 16
MSB
N – 16
N – 1
t
A
t
EH
t
CPD
t
FCO
t
PD
t
DATA
t
FRAME
t
EL
N
12740-002
DCO–
DCO+
D– x
D+ x
FCO–
FCO+
V
IN± x
CLK–
CLK+
MSB
N – 17 D10
N – 17 D9
N – 17 D8
N – 17 D7
N – 17 D6
N – 17 D5
N – 17 D4
N – 17 D3
N – 17 D2
N – 17 D1
N – 17 D0
N – 17 D10
N – 16
MSB
N – 16
N – 1
N
t
DATA
t
FRAME
t
FCO
t
PD
t
CPD
t
EH
t
A
t
EL
12740-003
AD9257-EP Data Sheet
Rev. A | Page 8 of 13
Figure 4. Serial Port Interface Timing Diagram
Figure 5. SYNC Input Timing Requirements
DON’T C ARE
DON’ T CAREDON’T C ARE
DON’T CARE
SDIO
SCLK
CSB
t
S
t
DH
t
CLK
t
DS
t
H
R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0
t
LOW
t
HIGH
12740-021
SYNC
CLK+
t
HSYNC
t
SSYNC
12740-004
Data Sheet AD9257-EP
Rev. A | Page 9 of 13
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to AGND −0.3 V to +2.0 V
Digital Outputs (D± x, DCO+, DCO−, FCO+,
FCO−) to AGND
−0.3 V to +2.0 V
CLK+, CLK− to AGND −0.3 V to +2.0 V
VIN+ x, VIN− x to AGND −0.3 V to +2.0 V
SCLK/DTP, SDIO/DFS, CSB to AGND −0.3 V to +2.0 V
SYNC, PDWN to AGND −0.3 V to +2.0 V
RBIAS, VCM to AGND −0.3 V to +2.0 V
VREF, SENSE to AGND −0.3 V to +2.0 V
Environmental
Operating Temperature Range (Ambient) −55°C to +125°C
Maximum Junction Temperature 150°C
Lead Temperature (Soldering, 10 sec) 300°C
Storage Temperature Range (Ambient) −65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL CHARACTERISTICS
The exposed pad must be soldered to the ground plane for the
LFCSP package. Soldering the exposed pad to the PCB increases
the reliability of the solder joints and maximizes the thermal
capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec) θJA1, 2 θ
JC1, 3 θ
JB1, 4 JT1, 2 Unit
64-Lead LFCSP
9 mm × 9 mm
(CP-64-4)
0 22.3 1.4 N/A 0.1 °C/W
1.0 19.5 N/A 11.8 0.2 °C/W
2.5 17.5 N/A N/A 0.2 °C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θJA.
ESD CAUTION
AD9257-EP Data Sheet
Rev. A | Page 10 of 13
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 6. Pin Configuration, Top View
Table 8. Pin Function Descriptions
Pin No. Mnemonic Description
0 AGND, EP
Analog Ground, Exposed Pad. The exposed thermal pad on the bottom of the package provides
the analog ground for the device. This exposed pad must be connected to ground for proper
operation.
1, 4, 7, 8, 11, 12, 37,
42, 45, 48, 51, 59, 62
AVDD 1.8 V Analog Supply.
13, 36 NIC Not Internally Connected. These pins can be connected to ground.
14, 35 DRVDD 1.8 V Digital Output Driver Supply.
2, 3 VIN+ G, VIN− G ADC G Analog Input True, ADC G Analog Input Complement.
5, 6 VIN− H, VIN+ H ADC H Analog Input Complement, ADC H Analog Input True.
9, 10 CLK−, CLK+ Input Clock Complement, Input Clock True.
15, 16 D− H, D+ H ADC H Digital Output Complement, ADC H Digital Output True.
17, 18 D− G, D+ G ADC G Digital Output Complement, ADC G Digital Output True.
19, 20 D− F, D+ F ADC F Digital Output Complement, ADC F Digital Output True.
21, 22 D− E, D+ E ADC E Digital Output Complement, ADC E Digital Output True.
23, 24 DCO−, DCO+ Data Clock Digital Output Complement, Data Clock Digital Output True.
25, 26 FCO−, FCO+ Frame Clock Digital Output Complement, Frame Clock Digital Output True.
27, 28 D− D, D+ D ADC D Digital Output Complement, ADC D Digital Output True.
29, 30 D− C, D+ C ADC C Digital Output Complement, ADC C Digital Output True.
31, 32 D− B, D + B ADC B Digital Output Complement, ADC B Digital Output True.
33, 34 D− A, D+ A ADC A Digital Output Complement, ADC A Digital Output True.
38 SCLK/DTP Serial Clock (SCLK)/Digital Test Pattern (DTP).
39 SDIO/DFS Serial Data Input/Output (SDIO)/Data Format Select (DFS).
40 CSB Chip Select Bar.
41 PDWN Power-Down.
43, 44 VIN+ A, VIN− A ADC A Analog Input True, ADC A Analog Input Complement.
46, 47 VIN− B, VIN+ B ADC B Analog Input Complement, ADC B Analog Input True.
49, 50 VIN+ C, VIN− C ADC C Analog Input True, ADC C Analog Input Complement.
D– G
D+ G
D– F
D+ F
D– E
D+ E
DCO–
DCO+
FCO–
FCO+
D– D
D+ D
D– C
D+ C
D– B
D+ B
VIN+ F
VIN– F
AVDD
VIN– E
VIN+ E
AVDD
SYNC
VCM
VREF
SENSE
RBIAS
VIN+ D
VIN– D
AVDD
VIN– C
VIN+ C
AVDD
VIN+ G
VIN– G
AVDD
VIN– H
VIN+ H
AVDD
AVDD
CLK–
CLK+
AVDD
AVDD
NIC
DRVDD
D– H
D+ H
AVDD
VIN+ B
VIN– B
AVDD
VIN– A
VIN+ A
AVDD
PDWN
CSB
SDIO/DFS
SCLK/DTP
AVDD
NIC
DRVDD
D+ A
D– A
NOTES
1. NIC = NOT INT ERNALLY CONNECT ED. THESE PINS CAN BE CO NNECTED TO G ROUND.
2. THE E X P OSE D THERM AL PAD ON THE BO TTOM OF THE PACKAGE P ROVIDES THE
ANALOG GROUND FO R THE DE V ICE. T HIS EXPOSED PAD MUST BE CONNECTED TO
GROUND F OR PROPER OPERATION.
12740-005
AD9257-EP
TOP VIEW
(Not to Scale)
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Data Sheet AD9257-EP
Rev. A | Page 11 of 13
Pin No. Mnemonic Description
52, 53 VIN− D, VIN+ D ADC D Analog Input Complement, ADC D Analog Input True.
54 RBIAS Analog Current Bias Setting. Connect to 10 kΩ (1% tolerance) resistor to ground.
55 SENSE Reference Mode Selection.
56 VREF Voltage Reference Input/Output.
57
VCM
Analog Output Voltage at Midsupply. This pin sets the common mode of the analog inputs.
58 SYNC Digital Input. SYNC input to clock divider. 30internal pull-down resistor.
60, 61 VIN+ E, VIN− E ADC E Analog Input True, ADC E Analog Input Complement.
63, 64 VIN− F, VIN+ F ADC F Analog Input Complement, ADC F Analog Input True.
AD9257-EP Data Sheet
Rev. A | Page 12 of 13
TYPICAL PERFORMANCE CHARACTERISTICS
See the AD9257 data sheet for a full set of Typical Performance Characteristics plots.
Figure 7. SNR/SFDR vs. Temperature, fIN = 9.7 MHz, fSAMPLE = 65 MSPS
12740-015
SNR/S FDR (dBF S /dBc)
TEMPERATURE (°C)
70
75
80
85
90
95
100
105
–55 –35 –15 525 45 65 85 105 125
SF DR ( dBc)
SNR (dBFS )
Data Sheet AD9257-EP
Rev. A | Page 13 of 13
OUTLINE DIMENSIONS
Figure 8. 64-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
9 mm × 9 mm Body, Very Very Thin Quad
(CP-64-17)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option
AD9257TCPZ-65-EP −55°C to +125°C 64-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-64-17
1 Z = RoHS Compliant Part.
0.45
0.40
0.35
0.50
BSC
BOT TOM VI E W
TO P V IEW
PIN 1
INDICATOR
PIN 1
INDICATOR
6.30
6.20 SQ
6.10
SEATING
PLANE
0.05 MAX
0.02 NOM
COPLANARITY
0.08
06-06-2014-A
9.10
9.00 SQ
8.90
0.20 MI N
7.50 REF
1
64
16
17
49
48
32
33
PKG-004559
EXPOSED
PAD
0.20 3 RE F
0.30
0.25
0.18
COMPLIAN T T O JEDEC S TANDARDS MO-220 - WMM D
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PI N CONFIGURATI ON AND
FUNC TI ON DE S CRIP TI ONS
SECTION O F THIS DATA SHEET.
0.80
0.75
0.70
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registered trademarks are the property of their respective owners.
D12740-0-6/15(A)