MF3MOD4101DA4/04 - NXP Semiconductors

1. General description

MIFARE DESFire EV1 is ideal for service providers wanting to use multi-application smart

cards in transport schemes, e-government or identity applications. It fully complies with

the requirements for fast and highly secure data transmission, flexible memory

organization and interoperability with existing infrastructure.

MIFARE DESFire EV1 is based on open global standards for both air interface and

cryptographic methods. It is compliant to all 4 levels of ISO/IEC 14443A and uses optional

ISO/IEC 7816-4 commands.

Featuring an on-chip backup management system and the mutual three pass

authentication, a MIFARE DESFire EV1 card can hold up to 28 different applications and

32 files per application. The size of each file is defined at the moment of its creation,

making MIFARE DESFire EV1 a truly flexible and convenient product.

Additionally, an automatic anti-tear mechanism is available for all file types, which

guarantees transaction oriented data integrity. With MIFARE DESFire EV1, data transfer

rates up to 848 Kbit/s can be achieved, making fast data processing possible.

The chip's main characteristics are denoted by its name DESFire EV1 - DES indicates the

high level of security MIFARE DESFire EV1 achieves using a 3DES hardware

cryptographic engine for enciphering transmission data. Fire reflects its outstanding

position as a fast, innovative, reliable and secure IC in the contactless proximity

transaction market. Hence, MIFARE DESFire EV1 brings many benefits to endusers.

Cardholders can experience convenient contactless ticketing while also having the

possibility to use the same device for related applications such as payment at vending

machines, access control or event ticketing. In other words, the MIFARE DESFire EV1

silicon solution offers enhanced consumer-friendly system design, in combination with

security and reliability.

MIFARE DESFire EV1 delivers the perfect balance of speed, performance and cost

efficiency. Its open concept allows future seamless integration of other ticketing media

such as smart paper tickets, key fobs, and mobile ticketing based on Near Field

Communication (NFC) technology. It is also fully compatible with the existing MIFARE

reader hardware platform. MIFARE DESFire EV1 is your ticket to contactless systems

worldwide.

MF3ICD81, MF3ICD41,

MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

Rev. 3 — 17 February 2009 Product short data sheet

Product short data sheet Rev. 3 — 17 February 2009 2 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

2. Features

2.1 Key features

Fully ISO/IEC 14443 type A 1 to 4 compliant

8 KB EEPROM with fast programming

(also 2 KB and 4 KB versions are available)

Secure, high speed command set

Flexible file structure

Anti-collision

Unique 7-byte serial number (ISO cascade level 2)

Data integrity: CRC and bit counting on physical layer

Open DES/3DES crypto algorithm in hardware

Open AES128 crypto algorithm in hardware

Based on NXP advanced 0.14 μm NV-technology

Fast data transfer: 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s

Functional backward compatibility to MF3ICD40

Composite CC EAL 4+ certification

3. Applications

Advanced public transportation

High secure access control

Event ticketing

eGovernment

Identity

Product short data sheet Rev. 3 — 17 February 2009 3 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

4. Quick reference data

[1] Stresses above one or more of the values may cause permanent damage to the device

[2] Exposure to limiting values for extended periods may affect device reliability.

[3] Measured with LCR meter

5. Ordering information

[1] This package is also known as MOA4.

Table 1. Quick reference data [1][2]

Symbol Parameter Conditions Min Typ Max Unit

fiinput frequency - 13.56 - MHz

Ciinput capacitance Tamb = 22 °C, fi = 13.56 MHz;

2,8 V RMS

[3] 14.96 17.0 19.04 pF

EEPROM characteristics:

tret retention time Tamb = 22 °C 10 - - year

Nendu(W) write endurance Tamb = 22 °C 200000 500000 - cycle

tcy(W) write cycle time Tamb = 22 °C-2.9-ms

Table 2. Ordering information

Type number Package

Name Description Version

MF3ICD8101DUD/04 FFC 8 inch wafer (sawn; 120 µm thickness, on film

frame carrier; electronic fail die marking

according to SECSII format) (see also Ref. 4), 8K EEPROM

MF3ICD4101DUD/04 FFC 8 inch wafer (sawn; 120 µm thickness, on film

frame carrier; electronic fail die marking

according to SECSII format) (see also Ref. 4), 4K EEPROM

MF3ICD2101DUD/04 FFC 8 inch wafer (sawn; 120 µm thickness, on film

frame carrier; electronic fail die marking

according to SECSII format) (see also Ref. 4), 2K EEPROM

MF3MOD8101DA4/04 PLLMC[1] plastic leadless module carrier package; 35 mm

wide tape (see Ref. 5), 8K EEPROM

SOT500-2

MF3MOD4101DA4/04 PLLMC[1] plastic leadless module carrier package; 35 mm

wide tape (see Ref. 5), 4K EEPROM

SOT500-2

MF3MOD2101DA4/04 PLLMC[1] plastic leadless module carrier package; 35 mm

wide tape (see Ref. 5), 2K EEPROM

SOT500-2

Product short data sheet Rev. 3 — 17 February 2009 4 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

6. Block diagram

7. Limiting values

[1] Stresses above one or more of the limiting values may cause permanent damage to the device

[2] Exposure to limiting values for extended periods may affect device reliability

[3] MIL Standard 883-C method 3015; human body model: C = 100 pF, R = 1.5 kΩ

Fig 1. Block diagram of MF3ICD81, MF3ICD41, MF3ICD21

001aah878

INTERFACE UART

ISO/IEC

14443A

CRYPTO

CO-PROCESSOR

CPU CRC

EEPROMRAMROM

TRUE RANDOM

NUMBER

GENERATOR

SECURITY

SENSORS

POWER ON

RESET

VOLTAGE

REGULATOR

CLOCK

INPUT FILTER

RESET

GENERATOR

Table 3. Limiting values [1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

IIinput current - 30 mA

Ptot (pack) total power dissipation per

package

-200mW

Tstg storage temperature −55 125 °C

Tamb ambient temperature −25 70 °C

VESD electrostatic discharge voltage [3] 2-kV

Ilu latch-up current ±100 - mA

Product short data sheet Rev. 3 — 17 February 2009 5 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

8. Functional description

8.1 Contactless energy and data transfer

In the MIFARE system, the MF3ICD81 is connected to a coil consisting of a few turns

embedded in a standard ISO/IEC smart card (see Ref. 7). No battery is needed. When the

card is positioned in the proximity of the PCD antenna, the high speed RF communication

interface allows to transmit data with up to 848 kbit/s.

8.2 Anticollision

An intelligent anticollision mechanism allows handling more than one MF3ICD81 in the

field simultaneously. The anticollision algorithm selects each MF3ICD81 individually and

ensures that the execution of a transaction with a selected MF3ICD81 is performed

correctly without data corruption resulting from other MF3ICD81s in the field.

8.3 UID/serial number

The unique 7 byte (UID) is programmed into a locked part of the NV-memory which is

reserved for the manufacturer. Due to security and system requirements these bytes are

write-protected after being programmed by the IC manufacturer at production time.

According to ISO/IEC 14443-3 (see Ref. 11) during the first anticollision loop the cascade

tag will be returned 88h and the first 3 bytes of the UID, UID0 to UID2 and BCC. The

second anticollision loop will return bytes UID3 to UID6 and BCC.

SN0 holds the Manufacturer ID for NXP (04h) according to ISO/IEC 14443-3 and

ISO/IEC 7816-6 AMD 1.

MF3ICD81 gives also the possibility to use Random ID. In this case MF3ICD81 only uses

a single anti-collision loop. The 3 byte random number is generated after RF-reset of the

MF3ICD81.

8.4 Memory organization

The 2/4/8 kB NV-memory is organized using a flexible file system. This file system allows

a maximum of 28 different applications on one single MF3ICD81. Each application

provides up to 32 files. Every application is represented by it's 3 bytes Application

IDentifier, AID.

Five different file types are supported, see Section 8.5.

A guideline to assign DESFire AIDs can be found in the application note “MIFARE

Application Directory, MAD” (see Ref. 8).

Each file can be created either at MF3ICD81 initialization (card production/card printing),

at MF3ICD81 personalization (vending machine) or in the field.

If a file or application becomes obsolete in operation, it can be permanently invalidated.

Commands which have impact on the file structure itself (e.g. creation or deletion of

applications, change of keys) activate an automatic rollback mechanism, which protects

the file structure from getting corrupted.

Product short data sheet Rev. 3 — 17 February 2009 6 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

If this rollback is necessary, it is done without user interaction before carrying out further

commands.To ensure data integrity on application level, a transaction oriented backup is

implemented for all file types with backup. It is possible to mix file types with and without

backup within one application.

As the command are the same for all MF3ICD81, MF3ICD41, MF3ICD21, the details on

the commands can be retrieved from Ref. 1. Only the memory size is different between

the three products.

8.5 Available file types

The files within an application can be of different types as:

•Standard data files

•Backup data files

•Value files with backup

•Linear record files with backup

•Cyclic record files with backup

8.6 Security

The 7 byte UID is fixed programmed into each device during production. It cannot be

altered and ensures the uniqueness of each device.

The UID may be used to derive diversified keys for each ticket. Diversified MF3ICD81

keys contribute to gain an effective anti-cloning mechanism and increase the security of

the original key, see Ref. 6.

Prior to data transmission a mutual three pass authentication can be done between

MF3ICD81 and PCD depending on the configuration employing either 56-bit DES (single

DES, DES), 112-bit DES (triple DES, 3DES), 168-bit DES (3 key triple DES, 3K3DES) or

AES. During the authentication the level of security of all further commands during the

session is set. In addition the communication settings of the file/application result in the

following option of secure communication between MF3ICD81 and PCD:

•Plain data transfer (only possible within the backwards compatible mode to

MF3ICD40)

•Plain data transfer with cryptographic checksum (MAC):

Authentication with Backwards compatible mode to MF3ICD40: 4 byte MAC

All other Authentications based on DES/3DES/AES: 8 byte CMAC

•Encrypted data transfer (secured by CRC before encryption):

Authentication with Backwards compatible mode to MF3ICD40: A 16 bit CRC is

calculated over the stream and attached. The resulting stream is encrypted using the

chosen cryptographic method.

All other Authentications based DES/3DES/AES: A 32 bit CRC is calculated over the

stream and attached. The resulting stream is encrypted using the chosen

cryptographic method.

Find more information on the security concept of the product in Ref. 1. Be aware not all

levels of security are recommended. The recommendation on the secure handling of the

product can be seen in Ref. 2 as well as in Ref. 10.

Product short data sheet Rev. 3 — 17 February 2009 7 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

9. DESFire command set

A detailed description of all commands can be found in Ref. 1.

9.1 ISO/IEC 14443-3

9.2 ISO/IEC 14443-4

Table 4. ISO/IEC 14443-3

Command Description

REQA REQA and ATQA are implemented fully

according to ISO/IEC 14443-3.

WUPA WAKE-UP is implemented fully according to

ISO/IEC 14443-3.

ANTICOLLISION / SELECT Cascade Level 1 The ANTICOLLISION and SELECT commands

are implemented fully according to ISO/IEC

14443-3. The response is part 1 of the UID.

ANTICOLLISION / SELECT Cascade Level 2 The ANTICOLLISION and SELECT commands

are implemented fully according to ISO/IEC

14443-3. The response is part 2 of the UID.

HALT The HALT command brings MF3ICD81 to the

HALT-state.

Table 5. ISO/IEC 14443-4

Command Description

RATS The response to the RATS command identifies the MF3ICD81 type to the

PCD.

PPS The PPS command allows an individual selection of the communication baud

rate between PCD and MF3ICD81. For DESFire it is possible to individually

set the communication baud rate independently for both directions i.e.

DESFire allows a non-symmetrical information interchange speed.

WTX If the MF3ICD81 needs more time than the defined FWT to respond to a PCD

command it will send a request for a waiting time extension.

DESELECT Using DESELECT command MF3ICD81 can be brought to the HALT-state.

Product short data sheet Rev. 3 — 17 February 2009 8 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

9.3 MF3ICD81 command set overview – security related commands

Remark: All command and data frames are exchanged between MF3ICD81 and PCD by

using block format as defined in ISO/IEC 14443-4.

9.4 MF3ICD81 command set overview – MF3ICD81 level commands

Remark: All command and data frames are exchanged between MF3ICD81 and PCD by

using block format as defined in ISO/IEC 14443-4.

Table 6. Security related commands

Command Description

Authenticate In this procedure both, the MF3ICD81 as well as the reader device, show

in an encrypted way that they possess the same secret which especially

means the same key. This procedure not only confirms that both entities

are permitted to do operations on each other but also creates a session

key which can be used to keep the further communication path secure.

As the name “session key” implicitly indicates, each time a new

authentication procedure is successfully completed a new key for further

cryptographic operations is generated.

Change KeySettings Changes the master key settings on MF3ICD81 and application level.

Set Configuration Configures the card and pre personalizes the card with a key, defines if

the UID or the random ID is sent back during communication setup and

configures the ATS string.

Change Key Changes any key stored on the MF3ICD81.

Get Key Version Reads out the current key version of any key stored on the MF3ICD81.

Table 7. MF3ICD81 level commands

Command Description

Create Application Creates new applications on the MF3ICD81.

Delete Application Permanently deactivates applications on the MF3ICD81.

Get Applications IDs Returns the Application IDentifiers of all applications on a MF3ICD81.

Free Memory Returns the free memory available on the card

GetDFNames Returns the DF names

Get KeySettings Gets information on the MF3ICD81 and application master key settings.

In addition it returns the maximum number of keys which are configured

for the selected application.

Select Application Selects one specific application for further access.

FormatMF3ICD81 Releases the MF3ICD81 user memory.

Get Version Returns manufacturing related data of the MF3ICD81.

GetCardUID Returns the UID.

Product short data sheet Rev. 3 — 17 February 2009 9 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

9.5 MF3ICD81 command set overview – application level commands

Remark: All command and data frames are exchanged between MF3ICD81 and PCD by

using block format as defined in ISO/IEC 14443-4.

9.6 MF3ICD81 command set overview – data manipulation commands

Table 8. Application level commands

Command Description

Get FileIDs Returns the File IDentifiers of all active files within the currently selected

application.

Get FileSettings Get information on the properties of a specific file.

Change FileSettings Changes the access parameters of an existing file.

Create StdDataFile Creates files for the storage of plain unformatted user data within an

existing application on the MF3ICD81.

Create

BackupDataFile

Creates files for the storage of plain unformatted user data within an

existing application on the MF3ICD81, additionally supporting the feature of

an integrated backup mechanism.

Create ValueFile Creates files for the storage and manipulation of 32-bit signed integer

values within an existing application on the MF3ICD81.

Create

LinearRecordFile

Creates files for multiple storage of structural similar data, for example for

loyalty programs, within an existing application on the MF3ICD81. Once the

file is filled completely with data records, further writing to the file is not

possible unless it is cleared.

Create

CyclicRecordFile

Creates files for multiple storage of structural similar data, for example for

logging transactions, within an existing application on the MF3ICD81. Once

the file is filled completely with data records, the MF3ICD81 automatically

overwrites the oldest record with the latest written one. This wrap is fully

transparent for the PCD.

DeleteFile Permanently deactivates a file within the file directory of the currently

selected application.

Table 9. Data manipulation commands

Command Description

Read Data Reads data from Standard Data Files or Backup Data Files.

Write Data Writes data to Standard Data Files or Backup Data Files.

Get Value Reads the currently stored value from Value Files.

Credit Increases a value stored in a Value File.

Debit Decreases a value stored in a Value File.

Limited Credit Allows a limited increase of a value stored in a Value File without

having full Credit permissions to the file.

Write Record Writes data to a record in a Cyclic or Linear Record File.

Read Records Reads out a set of complete records from a Cyclic or Linear Record

File.

Clear RecordFile Resets a Cyclic or Linear Record File to empty state.

Commit Transaction Validates all previous write access’ on Backup Data Files, Value

Files and Record Files within one application.

Abort Transaction Invalidates all previous write access’ on Backup Data Files, Value

Files and Record Files within one application.

Product short data sheet Rev. 3 — 17 February 2009 10 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

Remark: All command and data frames are exchanged between MF3ICD81 and PCD by

using block format as defined in ISO/IEC 14443-4.

9.7 MF3ICD81 command set - ISO/IEC 7816 APDU commands

The MF3ICD81 provides the following commands according to ISO/IEC 7816-4:

–INS code ‘A4’ SELECT

–INS code ‘B0’ READ BINARY

–INS code ‘D6’ UPDATE BINARY

–INS code ‘B2’ READ RECORDS

–INS code ‘E2’ APPEND RECORD

–INS code ‘84’ GET CHALLENGE

–INS code ‘88’ INTERNAL AUTHENTICATE

–INS code ‘82’ EXTERNAL AUTHENTICATE

9.7.1 ISO/IEC 7816-4 APDU message structure

DESFire supports the APDU message structure according to ISO/IEC 7816-4 for

–an optional wrapping of the native DESFire APDU format

–for the additionally implemented ISO/IEC 7816-4 commands

Find more information on the ISO/IEC 7816-4 commands in Ref. 1.

Product short data sheet Rev. 3 — 17 February 2009 11 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

10. Abbreviations

Table 10. Abbreviations

Acronym Description

AES Advanced Encryption Standard

AID Application IDentifier

APDU Application Protocol Data Unit

ATS Answer to Select

CMAC Cryptic Message Authentication Code

CRC Cyclic Redundancy Check

DES Digital Encryption Standard

DF Dedicated File

EEPROM Electrically Erasable Programmable Read-Only Memory

FWT Frame Waiting Time

INS Instructions

MAC Message Authentication Code

MAD MIFARE Application Directory

NV Non Volatile Memory

PCD Proximity Coupling Device

MF3ICD81 Proximity Integrated Circuit Card

PPS Protocol Parameter Selection

RATS Request Answer To Select

REQA Request Answer

RF Radio Frequency

UID Unique Identifier

WTX Waiting Time Extension

WUPA Wake Up Protocol A

Product short data sheet Rev. 3 — 17 February 2009 12 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

11. References

[1] Data sheet — MF3ICD81 MIFARE DESFire Functional Specification,

BL-ID Doc. No. 1340345

[2] Data sheet — MF3ICD81 Guidance, Delivery and Operation Manual,

BL-ID Doc No. 146934

[3] Data sheet — Specification addendum MF3ICD81, BL-ID Doc. No. 167310

[4] Data sheet — MF3ICD8101 Sawn bumped 120µm wafer addendum, BL-ID Doc.

No. 131831

[5] Data sheet — MF3MOD81 Contactless chip card module,

BL-ID Doc. No. 143931

[6] Application note — MIFARE DESFire - Implementation hints and examples,

BL-ID Doc. No. 094532

[7] Application note — MIFARE (Card) Coil Design Guide Product Specification,

BL-ID Doc. No. 011732

[8] Application note — MIFARE Application Directory,

BL-ID Doc. No. 001830

[9] Application note — MIFARE ISO/IEC 14443 MF3ICD81 Selection,

BL-ID Doc. No. 130810

[10] Application note — End to end system security risk considerations for

implementing contactless cards, BL-ID Doc. No. 155010

[11] ISO/IEC Standard — ISO/IEC 14443 Identification cards - Contactless integrated

circuit cards - Proximity cards

Product short data sheet Rev. 3 — 17 February 2009 13 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

12. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

MF3ICD81_MF3ICD41_

MF3ICD21_SDS_N_3

20090128 Product short data sheet - MF3ICD8101_SDS_N_1

Modifications: •Specification status changed into “product”

•Basic type number of MF3ICD81 changed

•Type numbers MF3ICD41 and MF3ICD21 added

•Section 1 “General description”, Section 2 “Features” and Section 3 “Applications”: updated

•Section 11 “References”: added section

MF3ICD8101_SDS_N_1 20071211 Objective short data sheet - -

Product short data sheet Rev. 3 — 17 February 2009 14 of 15

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

13.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between information in this document and such

terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

MIFARE — is a trademark of NXP B.V.

DESFire — is a trademark of NXP B.V.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors MF3ICD81, MF3ICD41, MF3ICD21

MIFARE DESFire EV1 contactless multi-application IC

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 17 February 2009

Document identifier: MF3ICD81_MF3ICD41_MF3ICD21_SDS_N_3

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Tables

Table 1. Quick reference data [1][2] . . . . . . . . . . . . . . . . . .3

Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3

Table 3. Limiting values [1][2] . . . . . . . . . . . . . . . . . . . . . . .4

Table 4. ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . .7

Table 5. ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . . .7

Table 6. Security related commands . . . . . . . . . . . . . . . .8

Table 7. MF3ICD81 level commands. . . . . . . . . . . . . . . . 8

Table 8. Application level commands . . . . . . . . . . . . . . . 9

Table 9. Data manipulation commands . . . . . . . . . . . . . . 9

Table 10. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Table 11. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13

16. Figures

Fig 1. Block diagram of MF3ICD81, MF3ICD41, MF3ICD21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

17. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3

5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Functional description . . . . . . . . . . . . . . . . . . . 5

8.1 Contactless energy and data transfer. . . . . . . . 5

8.2 Anticollision. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

8.3 UID/serial number. . . . . . . . . . . . . . . . . . . . . . . 5

8.4 Memory organization . . . . . . . . . . . . . . . . . . . . 5

8.5 Available file types . . . . . . . . . . . . . . . . . . . . . . 6

8.6 Security. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 DESFire command set. . . . . . . . . . . . . . . . . . . . 7

9.1 ISO/IEC 14443-3 . . . . . . . . . . . . . . . . . . . . . . . 7

9.2 ISO/IEC 14443-4 . . . . . . . . . . . . . . . . . . . . . . . 7

9.3 MF3ICD81 command set overview – security

related commands . . . . . . . . . . . . . . . . . . . . . . 8

9.4 MF3ICD81 command set overview – MF3ICD81

level commands . . . . . . . . . . . . . . . . . . . . . . . . 8

9.5 MF3ICD81 command set overview – application

level commands . . . . . . . . . . . . . . . . . . . . . . . . 9

9.6 MF3ICD81 command set overview – data

manipulation commands. . . . . . . . . . . . . . . . . . 9

9.7 MF3ICD81 command set- ISO/IEC 7816 APDU

commands . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

9.7.1 ISO/IEC 7816-4 APDU message structure. . . 10

10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11

11 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

12 Revision history . . . . . . . . . . . . . . . . . . . . . . . 13

13 Legal information . . . . . . . . . . . . . . . . . . . . . . 14

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

13.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

13.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 14

13.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 14

14 Contact information . . . . . . . . . . . . . . . . . . . . 14

15 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

17 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15