SFH 4045
IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung
High Power Infrared Emitter (940 nm)
Lead (Pb) Free Product - RoHS Compliant
Vorläufige Daten / Preliminary D ata
2010-01-27 1
Wesentliche Merkmale
• Infrarot LED mit hoher Ausgangsleistung
• Kurze Schaltzeiten
Anwendungen
• Lichtschranken, Lichtvorhänge
• Sensorik
• Näherungssensor
• berührungsempfindliche Bildschirme
Sicherheitshinweise
Je nach Betriebsart emittieren diese Bauteile
hochkonzentrierte, nicht sichtbare Infrarot-
Strahlung, die gefährlich für das menschliche
Auge sein kann. Produkte, die diese Bauteile
enthalten, müssen gemäß den Sicherheits-
richtlinien der IEC-Normen 60825-1 und 62471
behandelt werden.
Typ
Type Bestellnummer
Ordering Code Strahlstärkegruppierung1) (IF = 70 mA, tp = 20 ms)
Radiant Intensity Grouping1)
Ie (mW/sr)
SFH 4045 Q65110A9731 ≥ 40 (typ. 90)
1) gemessen bei einem Raumwin ke l Ω = 0.01 / measured at a solid angle of Ω = 0.01 sr
Features
• High Power Infrared LED
• Short switching ti mes
Applications
• Interrupters, Lightcurtains
•Sensors
• proximity sensor
• Touchscreen
Safety Advices
Depending on the mode of operation, these
devices emit highly concentrated non visible
infrared light which can be hazardous to the
human eye. Products which incorporate these
devices have to follow the safety precautions
given in IEC 60825-1 and IEC 62471.
2010-01-27 2
SFH 4045
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Betriebstemperatur
Operating temperature range Top – 25 … + 85 °C
Lagertemperatur
Storage temperature range Tstg – 40 … + 85 °C
Sperrspannung
Reverse voltage VR5 V
Vorwärtsgleichstrom
Forward current IF70 mA
Stoßstrom, tp = 100 μs, D = 0
Surge current IFSM 700 mA
Verlustleistung
Power dissipation Ptot 140 mW
Wärmewiderstand Sperrschicht - Umgebung bei
Montage auf FR4 Platine, Padgröße je 16 mm2
Thermal resistance junction - ambient mounted
on PC-board (FR4), padsize 16 mm2 each
Wärmewiderstand Sperrschicht - Lötstelle bei
Montage auf Metall-Block
Thermal resistance junction - soldering point,
mounted on metal block
RthJA
RthJS
540
360
K/W
K/W
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
Wellenlänge der Strahlung
Wavelength at peak emission
IF = 70 mA
λpeak 950 nm
Centroid-Wellenlänge der Strahlung
Centroid wavelength
IF = 70 mA
λcentroid 940 nm
Spektrale Bandbreite bei 50% von Imax
Spectral bandwidth at 50% of Imax
IF = 70 mA
Δλ 42 nm
Abstrahlwinkel
Half angle ϕ± 9Grad
deg.
SFH 4045
2010-01-27 3
Aktive Chipfläche
Active chip area A0.04 mm2
Abmessungen der aktiven Chipfläche
Dimension of the active chip area L × B
L × W0.2 × 0.2 mm²
Schaltzeiten, Ie von 10% auf 90% und von 90%
auf 10%, bei IF = 70 mA, RL = 50 Ω
Switching times, Ιe from 10% to 90% and from
90% to 10%, IF = 70 mA, RL = 50 Ω
tr, tf12 ns
Durchlassspannung
Forward voltage
IF = 70 mA, tp = 20 ms
VF
1.6 (< 2.0)
V
Sperrstrom
Reverse current IRnot designed for
reverse
operation
μA
Gesamtstrahlungsfluss
Total radiant flux
IF = 70 mA, tp = 20 ms
Φe typ 40 mW
Temperaturkoeffizient von Ie bzw. Φe, IF = 70 mA
Temperature coefficient of Ie or Φe, IF = 70 mA TCI– 0.5 %/K
Temperaturkoeffizient von VF, IF = 70 mA
Temperature coefficient of VF, IF = 70 mA TCV– 3.5 mV/K
Temperaturkoeffizient von λ, IF = 70 mA
Temperature coefficient of λ, IF = 70 mA TCλ+ 0.3 nm/K
Kennwerte (TA = 25 °C)
Characteristics (cont’d)
Bezeichnung
Parameter Symbol
Symbol Wert
Value Einheit
Unit
2010-01-27 4
SFH 4045
Abstrahlcharakteristik
Radiation Characteristics Irel = f (ϕ)
Strahlstärke Ie in Achsrichtung1)
gemessen bei einem Raumwinkel Ω = 0.01 sr
Radiant Intensity Ie in Axial Direction
at a solid angle of Ω = 0.01 sr
Bezeichnung
Parameter Symbol Werte
Values Einheit
Unit
SFH 4045
- U SFH 4045
- V SFH 4045
- AW
Strahlstärke
Radiant intensity
IF = 70 mA, tp = 20 ms
Ie min
Ie max
40
80 63
125 100
200 mW/sr
mW/sr
Strahlstärke
Radiant intensity
IF = 500 mA, tp = 25 µs
Ie typ 225 360 550 mW/sr
1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) /
Only one bin in one packing unit (variation lower 2:1)
OHF04388
0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚0.40.60.81.0
100˚
90˚
80˚
70˚
60˚
50˚
0˚10˚20˚30˚40˚
0
0.2
0.4
0.6
0.8
1.0
ϕ
SFH 4045
2010-01-27 5
Relative Spectral Emission
Irel = f (λ)
Forward Current IF = f (VF)
Single pulse, tp = 100 μs
800
0nm
%
OHF04134
20
40
60
80
100
I
rel
λ
850 900 950 1025
OHF03828
F
I
10
-4
0.5 1 1.5 2 2.5 V3
10
0
A
0
F
V
-1
10
5
5
10
-2
-3
5
10
Radiant Intensity
Single pulse, tp = 25 μs
Permissible Pulse Handling
Capability IF = f (τ), TA = 25 °C,
duty cycle D = parameter
Ie
Ie 70 mA = f (IF)
OHF03827
10
-2
mA
I
F
0
10
1
10
2
10
3
1055
1
10
5
-1
10
5
0
10
I
(70 mA)
e
I
e
1010
0
-2-3-4-5
1010 10
F
I
AP
t
=
DT
210-1
10
t
p
10 s10
OHF04265
T
t
P
I
F
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
0.03
0.2
0.1
0.05
0.02
0.01
0.005
=
D
1
0.5
Max. Permissible Forward Current
IF = f (TA), RthJA = 540 K/W
Permissible Pulse Handling
Capability IF = f (τ), TA = 85 °C,
duty cycl e D = parameter
0
0˚C
T
I
F
mA
OHF04264
A
20 40 60 80 100
10
20
30
40
50
60
70
80
1010
0
-2-3-4-5
1010 10
F
I
AP
t
=
DT
210-1
10
t
p
10 s10
OHF04266
T
t
P
I
F
0.1
0.2
0.3
0.4
0.5
0.6
0.8
0.7
0.03
0.2
0.1
0.05
0.02
0.01
0.005
=
D
1
0.5
2010-01-27 6
SFH 4045
Maßzeichnung
Package Outlines
Maße in mm / Dimensions in mm.
Gehäuse / Package Sidelooker mit Linse / Sidelooker with Lens
Anschlussbelegung
pin configuration 1 = Kathode / cathode
2 = Anode / anode
Farbe
Color farblos klar
colorless clear
SFH 4045
2010-01-27 7
Gurtung / Polarität und Lage Verpackungseinheit 1500/Rolle, ø180 mm
Method of Taping / Polarity and Orientation Packing unit 1500/reel, ø180 mm
Maße in mm (inch) / Dimensions in mm (inch).
Empfohlenes Lötpaddesign Reflow Löten
Recommended Solder Pad Reflow Soldering
Maße in mm / Dimensions in mm.
2010-01-27 8
SFH 4045
Lötbedingungen Vorbehandlung nach JEDEC Level 3
Soldering Conditions Preconditioning acc. to JEDEC Level 3
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Leibnizstrasse 4, D-93055 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as as sured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be use d in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected
to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.
2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain
and sustain human life. If they fail, it is reas onable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C +0 ˚C
-5 ˚C
245 ˚C ±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C -0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
