TOTX177L(F,T)
2004-02-02
1
FIBER OPTIC TRANSMITTING MODULE
TOTX177L(F,T)
FIBER OPTIC TRANSMITTING
MODULE FOR DIGITAL AUDIO
EQUIPMENT
l Conforms to JEITA Standard CP-1212
(Digital Audio Optical Interface
for Consumer Equipment).
l TTL interface.
l LED is driven by differential circuit.
l A Self-tapping hole for easy attachment to
Audio Equipment panels.
l Shutter System
1. Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Storage Temperature Tstg -40 to 70 °C
Operating Temperature Topr -20 to 70 °C
Supply Voltage VCC -0.5 to 7 V
Input Voltage VIN -0.5 to VCC + 0.5 V
Soldering Temperature Tsol 260 (Note 1) °C
Note 1: Soldering time = 10 seconds (At a distance of 1 mm from the package).
2. Recommended Operating Conditions
Characteristics Symbol Min Typ.
Max
Unit
Supply Voltage VCC 4.75
5.0 5.25
V
High-Level Input Voltage VIH 2.0 --- VCC V
Low-Level Input Voltage VIL 0 --- 0.8 V
Handling precaution: The LED’s used in this product contain GaAs (Gallium Arsenide).
Care must be taken to protect the safety of people and the environment when scrapping or
terminal processing.
Unit: mm
TENTATIVE
Shutter Color：Gray
Pin Connection
1. GND
2. Vcc
3. Input
TOTX177L(F,T)
2004-02-02
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3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 5 V)
Characteristics Symbol Test Condition Min
Typ.
Max
Unit
Data Rate NRZ Code (Note 2) DC --- 15 Mb / s
Transmission Distance Using
APF
(Note
3)
and
TORX177L(F,T)
0.2 --- 5 m
Pulse Width Distortion (Note 4) ⊿tw Pulse Width = 67 ns
Pulse Cycle = 134 ns
Using TORX177L(F,T)
CL = 10 pF
-15
--- 15 ns
Fiber Output Power (Note 5) Pf -21
--- -15
dBm
Peak Emission Wavelength --- 650
--- nm
Current Consumption ICC --- 8 15 mA
High Level Input Voltage VIH 2.0 --- --- V
Low Level Input Voltage VIL --- --- 0.8 V
Note 2: LED is on when input signal is high, and off when it is low.
7.5Mb/s (max.) Biphase Signal.
Note 3: All Plastic Fiber (970 / 1000 µm).
Note 4: Between input of TOTX177L(F,T) and output of TORX177L(F,T).
Note 5: Measure with a standard optical fiber, peak value.
4. Mechanical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min
Typ.
Max
Unit
Insertion Force (Note 6) Initial value --- --- 39.2
N
Withdrawal Force (Note 6) Initial value 5.9 --- 39.2
N
Torque for Self-Tap Using self-tapping screw
(M3 × 8) 58.8
--- 98 N·cm
Note 6: Square type connector : EIAJ RC-5720B
5. Application Circuit
6. Required Optical Fiber with Fiber Optic Connectors
All Plastic Fiber with Square Type Connector ( EIAJ RC-5720B )
TOTX177L(F,T)
2004-02-02
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7. Board layout hole pattern (Recommendation)
Unit: mm
Tolerance: ±0.05 mm
Recommended PCB thickness: 1.6 mm
8. Precautions during use
(1) Maximum rating
The maximum ratings are the limit values which must not be exceeded during operation of device.
None of these rating value must not be exceeded. If the maximum rating value is exceeded, the
characteristics of devices may never be restored properly. In extreme cases, the device may be
permanently damages.
(2) Lifetime of light emitters
If an optical module is used for a long period of time, degeneration in the characteristics will mostly
be due to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical
output of the LEDs used as the light source. The cause of degradation of the optical output of the
LEDs may be defects in wafer crystallization or mold resin stress. The detailed causes are, however,
not clear.
The lifetime of light emitters is greatly influenced by the operating conditions and the environment in
which it is used as well as by the lifetime characteristics unique to the device type. Thus, when a light
emitting device and its operating conditions determined, Toshiba recommend that lifetime
characteristics be checked.
Depending on the environment conditions, Toshiba recommend that maintenance such as regular
checks of the amount of optical output in accordance with the condition of operating environment.
(3) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical
modules are optical components. During soldering, ensure that flux does not contact with the emitting
surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with shutter system. The shutter system is used to avoid malfunction
when the optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where
there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend
that soldering be performed without the optical module mounted on the board. Then, after the board
has been cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and make
sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the
effects of flux. In such a cases, be sure to check the devices’reliability.
(4) Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to
vibration and shock. In actual equipment, there are sometimes cases in which vibration, shock, or
stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in
the design of equipment which will be subject to high levels of vibration.
(5) Support pins
The optical transmission module TOTX177L(F,T) has support pins in order to fix itself to the PCB
temporary. Please make the hole for these pins in the PCB under the condition described in board
layout hole pattern.
TOTX177L(F,T)
2004-02-02
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(6) Panel attachment
TOTX177L(F,T) has hole for panel attachment. Please be sure to attach it to panel with self-tapping
screw.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to
pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off
using cotton tips.
(8) Supply voltage
Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure
that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.
(9) Input voltage
If a voltage exceeding the maximum rating value (VCC + 0.5 V) is applied to the transmitters' input,
the internal IC may suffer damage. If there is a possibility that excessive voltage due to surges may
be added to the input terminal, insert a protective circuit.
(10) Soldering condition
Solder at 260°C or less for no more than ten seconds.
(11) The hole for chassis
Please make a hole for inserting optical connector
the slash part in the following figure.
(12) Case(receptacle) material
The case is made of polycarbonate. Polycarbonate is usually stable with acid, alcohol, and
aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone),
alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen,
or melted. Please take care when choosing a packaging material by referencing the table below.
〈Chemicals to avoid with polycarbonate〉
PHENOMENON CHEMICALS
A
Little deterioration
But staining ・nitric acid(low concentration) , hydrogen peroxide, chlorine
B
Cracked crazed,
or Swollen ・acetic acid(70% or more)
・gasoline
・methyl ethyl ketone, ehtyl aetate, butyl acetate
・ethyl methacrylate, ethyl ether, MEK
・acetone, m-amino alcohol, carbon tetrachloride
・carbon disulfide, trichloroethylene, cresol
・thinners, oil of turpentine
・triethanolamine
C
Melted
｛ ｝： used as solvent ・concentrated sulfuric acid
・benzene
・styrene, acrylonitrile, vinyl acetate
・ethylenediamine, diethylenediamine
・{chloroform, methyl chloride, tetrachloromethane, dioxane}
{1,2-dichloroethane}
D
Decomposed ・ammonia water
・other alkali
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(13) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations
in order to protect the environment against contamination.
Compound semiconductors such, as GaAs are used as LED materials in this module. When devices
are disposed of, worker safety and protection of the environment must be taken into account.
(14) Precautions during use
Toshiba is continually working to improve the quality and reliability of their products. Nevertheless,
semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity
and their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba
products, to observe standards of safety, and to avoid situations in which the malfunction or failure of
a Toshiba product could cause loss of human life, bodily injury or damage to property.
When developing equipment, please ensure that Toshiba products are used within the specified
operating ranges set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
TOTX177L(F,T)
2004-02-02
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• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system , and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes
are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the
products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with
domestic garbage.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
000707EAC
RESTRICTIONS ON PRODUCT USE
