TBD62089APG TOSHIBA BiCD Integrated Circuit Silicon Monolithic TBD62089APG 8-ch Sink Type DMOS Transistor Array with D-type Flip-Flop The TBD62089APG is an 8-ch DMOS transistor array with D-type flip-flop. Please be careful about thermal conditions during use. Features * * * Built-in 8 circuits High output voltage High output current * Package : VOUT = 50 V (max) : IOUT = 500 mA/ch (max) DIP20-P-300-2.54A : DIP20-P-300-2.54A Weight: 1.4 g (typ.) Pin assignment (top view) VDD /Y1 /Y2 /Y3 /Y4 /Y5 /Y6 /Y7 /Y8 GND /CLR D1 D2 D3 D4 D5 D6 D7 D8 CLK (c)2016 Toshiba Corporation 1 2016-12-21 TBD62089APG Pin description Pin No. Pin name Function 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 /CLR D1 D2 D3 D4 D5 D6 D7 D8 CLK GND /Y8 /Y7 /Y6 /Y5 /Y4 /Y3 /Y2 /Y1 VDD Clear signal input pin Data signal input pin Data signal input pin Data signal input pin Data signal input pin Data signal input pin Data signal input pin Data signal input pin Data signal input pin Clock signal input pin Ground pin Output pin Output pin Output pin Output pin Output pin Output pin Output pin Output pin Power supply pin Block diagram /Y1 /Y2 /Y3 /Y4 /Y5 /Y6 /Y7 /Y8 VDD CLK /CLR D 100k (typ.) 100k (typ.) CK R Q 100k (typ.) D CK R Q 100k (typ.) D CK R Q 100k (typ.) D CK R Q 100k (typ.) D1 D2 D3 D4 D5 Equivalent circuit may be omitted or simplified for explanatory purpose. D CK R D Q CK R 100k (typ.) D Q CK R 100k (typ.) D6 D Q CK R 100k (typ.) D7 Q 100k (typ.) D8 GND Function table INPUT CLK X L OUTPUT: /Y /CLR D L X H H L H H H L H X Y0 H X Y0 : "L" to "H" : "H" to "L" H: High level L: Low level X: Don't care Y0: /Y level just before inputting conditions in the table are fixed *: Operating conditions in the table: OUTPUT is connected to the power supply through resistors. 2 2016-12-21 TBD62089APG Absolute maximum ratings (Ta = 25C) Characteristics Symbol Rating Unit Output voltage VOUT 50 V Power supply voltage VDD -0.5 to 6 V Output current IOUT 500 mA/ch Input voltage VIN -0.5 to 6 V Power dissipation PD (Note1) 1.76 (Note2) W Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note1: In mounting on a board, based on JEDEC 2s2p standards Note2: When Ta exceeds 25 C, derating with 14.1 mW/C is necessary. Operating range (Ta = - 40 to 85C, unless otherwise specified) Characteristics Symbol Test conditions Min Typ. Output voltage VOUT Power supply voltage Unit Max 50 5.5 V 0 400 Duty = 10 % 0 400 Duty = 50 % 0 195 VDD 3 1 channel ON, Ta = 25 C Output current (per channel) (Note) tpw = 25 ms 8 channels ON Ta = 85C Tj = 120C IOUT V mA Input voltage (Output on) VIN (ON) 0.7xVDD VDD V Input voltage (Output off) VIN (OFF) 0 0.3xVDD V Voltage rising time of CLK input tr VDD = 3 V to 5.5 V 0 500 ns Voltage falling time of CLK input tf VDD = 3 V to 5.5 V 0 500 ns Setup time tsu VDD = 3 V to 5.5 V Setup time of D input for CLK input 10 ns Hold time th VDD = 3 V to 5.5 V Hold time of D input for CLK input 10 ns Pulse width (CLK, /CLR) tw VDD = 3 V to 5.5 V 30 ns Logic clock frequency fCLK VDD = 3 V to 5.5 V 20 MHz Note: In mounting on a board, based on JEDEC 2s2p standards Timing chart CLK 50% 10% 90% 90% 50% tr tw D 50% tsu th 10% tf 50% Timing charts may be omitted or simplified for explanatory purposes. 3 2016-12-21 TBD62089APG Electrical characteristics (Ta = 25C and VDD = 5 V, unless otherwise specified) Characteristics Symbol Test Circuit Output leakage current Ileak 1 Output voltage VDS (Output ON-resistance) (RON) 2 Test conditions Min Typ. Max Unit VOUT = 50 V, Ta = 85 C VIN = 0 V 1.0 A IOUT = 350 mA 0.56 (1.6) 1.14 (3.25) IOUT = 200 mA 0.32 (1.6) 0.65 (3.25) IOUT = 100 mA 0.16 (1.6) 0.325 (3.25) V () Input current (Output on) IIN (ON) 3 VIN = 5.5 V, VDD = 5.5 V 80 A Input current (Output off) IIN (OFF) 4 VIN = 0 V, VDD = 5.5 V 1.0 A Power supply current (per channel) ICC (ON) 3 VIN = 5.5 V, VDD = 5.5 V 75 A ICC (OFF) 4 VIN = 0 V, VDD = 5.5 V 1.0 A CLK (50 %) to /Y (50 %) /Y: H to L CL = 30 pF RL = 240 , pull-up to 24 V VDD = 4.5 to 5.5 V 270 430 5 tpHL (CLK) VDD = 3.0 to 3.6 V 470 670 CLK (50 %) to /Y (50 %) /Y: L to H CL = 30 pF RL = 240 , pull-up to 24 V VDD = 4.5 to 5.5 V 350 510 VDD = 3.0 to 3.6 V 350 510 /CLR (50 %) to /Y (50 %) /Y: L to H CL = 30 pF RL = 240 , pull-up to 24 V VDD = 4.5 to 5.5 V 350 510 VDD = 3.0 to 3.6 V 350 510 Propagation delay time tpLH (CLK) tpLH (/CLR) 5 5 ns ns ns 5 VDD = 4.5 to 5.5 V 400 tor /Y waveform: 10 % to 90 % CL = 30 pF RL = 240 , pull-up to 24 V 280 Turn-on delay time VDD = 3.0 to 3.6 V 280 400 480 5 VDD = 4.5 to 5.5 V 330 tof /Y waveform: 90 % to 10 % CL = 30 pF RL = 240 , pull-up to 24 V Turn-off delay time VDD = 3.0 to 3.6 V 620 860 Timing chart CLK 50% 50% /Y 50% tpHL(CLK) /CLR 50% tpLH(CLK) 90% 10% tof 90% 10% tor 50% /Y 50% tpLH(/CLR) Timing charts may be omitted or simplified for explanatory purposes. 4 2016-12-21 ns ns TBD62089APG Test circuit 1. Ileak 2. VDS (RON) D CLK /CLR PG (/Y = H) VDD D CLK /CLR PG (/Y = L) /Y Ileak VOUT GND VDD VDD /Y IOUT VDS GND VDD RON = VDS / IOUT 3. IIN (ON) and ICC (ON) IIN(ON) IIN(ON) IIN(ON) VIN VIN 4. IIN (OFF) and ICC (OFF) D IIN(OFF) IIN(OFF) IIN(OFF) VDD CLK /Y /CLR VIN VDD GND VIN VIN D VDD CLK /Y /CLR GND VDD VIN 5. tpHL (CLK), tpLH (CLK), tpLH (/CLR), tor, and tof PG D CLK /CLR VDD /Y GND CL RL VOUT VDD Test circuits may be omitted or simplified for explanatory purposes. 5 2016-12-21 TBD62089APG Package dimensions DIP20-P-300-2.54A Unit: mm Weight: 1.4 g (typ.) 6 2016-12-21 TBD62089APG Notes on Contents 1. Block diagram Block diagram may be simplified for explanatory purpose. 2. Test circuit Test circuit may be simplified for explanatory purpose. 3. Timing chart Timing charts may be simplified for explanatory purposes. IC Usage Considerations Notes on handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. (2) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by explosion or combustion. In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is applied even just once. (3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly. Points to remember on handling of ICs Heat Radiation Design When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the effect of IC heat radiation with peripheral components. Back-EMF When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor's power supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 7 2016-12-21 TBD62089APG RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. 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