10 9 | 8 | 7 6 | 5 4 3 | 2 | 1 9.70 +0.05 5.20 +0.05 I TU 1.00 #0.05 (8X) | 7 _ I __ 0.60 2.54 +0.05| 3.81 | ! 5,08 0.05 . | | | 4 __ | | | | __- _ | | bee eee 40.00 0.10 DETAIL? RECOMMENDED PCB LAYOUT \Soz5 <0 TW NOTES: = 7,30 7930 - AN af oF LC 1MATERIAL:HOUSING---LCP 30% GLASS FILL / ! 1 9,30 +0.5 UL94 V-0,COLOR BLACK | } SECTION Z-Z TEMINAL---PHOSPHOR BRONZE 0.12MM REF THICKNESS \ 7 2.PLATING:TERMINAL:SIM SIDE---0.8 MICROMETER MIN GOLD NY | SOLDER TAIL---GOLD FLASH 0.05 MICROMETER MIN 0.05 MIN UNDERPLATING---2 MICROMETER NICKEL OVERALL SCALE 20:1 3.NO SHARP EDGES INTERFACING WITH THE PCB OR SIM CARD RO.8020.15 4 CONTACT MUST NOT EXTENDED BEYOND HOUSING EDGE DURING ee Kx > DEFLECTION AND MUST LOWER THAN HOUSING LEVEL AFTER 3TIMES C0.10 DETAIL2 REFLOW (ALL AROUND)\ \ _ CARD INSERTION DIRECTION 5 MAINTAIN IN CONTACT AREA \ (3 AXES CAPABLE) 6 THIS IS LEAD FREE PRODUCT 41.50 0.05 | on QUALITY GENERAL TOLERANCES DIMENSION STYLE SCALE DESIGN UNITS THIRD ANGLE s SYMBOLS} (UNLESS SPECIFIED) MM ONLY 5:1 METRIC | Cleroyection Ss mm INCH DRAWN BY DATE TITLE _ = [giNW-0 PLACES iE=--[z=-= [CYZHU 2006/08/31 8 CKT 0.05 +0.05 | U ir 3 PLACES|t--- |4+--- [CHECKED BY DATE MEGA SIM CONNECTOR 5 ina (8X) 2 &|\/=2 [2 PLACES |+ 0.15 _|[+--- oO wi + +- APPROVED BY DATE W zz / I PLACE [#02 - fol& MOLEX INCORPORATED SCALE 20:1 ao sz ANGULAR + 2 VS 63g e MATERIAL NO. DOCUMENT NO. SHEET NO, i S exo DRAFT WHERE APPLICABLE 474940001 SD-47494-001 1 0F 1 21 = _ WITCH? DIRE ONS SIZE] THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX A ip A SJINCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION b_frame_A3_P_AM_T 9 , 7 6 5 | 4 | 3 | 2 1 Rev. D 2004/06/28