Memory Module Specifications KVR13R9S4/4I 4GB 1Rx4 512M x 72-Bit PC3-10600 CL9 Registered w/Parity 240-Pin DIMM DESCRIPTION SPECIFICATIONS This document describes ValueRAM's 512M x 72-bit (4GB) CL(IDD) 9 cycles DDR3-1333 CL9 SDRAM (Synchronous DRAM), Intel (R) compat- Row Cycle Time (tRCmin) 49.5ns (min.) ibility tested, registered w/parity, 1Rx4 ECC memory module, Refresh to Active/Refresh Command Time (tRFCmin) 160ns (min.) based on eighteen 512M x 4-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR3-1333 timing of Row Active Time (tRASmin) 36ns (min.) 9-9-9 at 1.5V. This 240-pin DIMM uses gold contact fingers. Maximum Operating Power 6.006 W* The electrical and mechanical specifications are as follows: UL Rating 94 V - 0 Operating Temperature 0o C to 85o C FEATURES Storage Temperature -55o C to +100o C * JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply *Power will vary depending on the SDRAM and Register/PLL used. * VDDQ = 1.5V (1.425V ~ 1.575V) * 667MHz fCK for 1333Mb/sec/pin * 8 independent internal bank * Programmable CAS Latency: 9, 8, 7, 6 * Programmable Additive Latency: 0, CL - 2, or CL - 1 clock * Programmable CAS Write Latency(CWL) = 7 (DDR3-1333) * 8-bit pre-fetch * Burst Length: 8 (Interleave without any limit, sequential with starting address "000" only), 4 with tCCD = 4 which does not allow seamless read or write [either on the fly using A12 or MRS] * Bi-directional Differential Data Strobe * Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%) * On Die Termination using ODT pin * On-DIMM thermal sensor (Grade B) * Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at 85C < TCASE < 95C * Asynchronous Reset * PCB : Height 1.180" (30.00mm), double sided component Continued >> Document No. VALUERAM1192-001.A00 05/09/12 Page 1 MODULE DIMENSIONS: (units = millimeters) Document No. VALUERAM1192-001.A00 Page 2