SPEC NO: KDA0533 REV NO: V.1 DATE: SEP/17/2001 PAGE: 1 OF 3
APPROVED:J.LU CHECKED: DRAWN:X.Q.ZHENG
PHOTOTRANSISTOR
Description
Made with NPN silicon phototransistor chips.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
KP-2012P3C WATER CLEAR LENS
Features
!MECHANICALLY AND SPECTRALLY MATCHED TO
THE KP-2012 SERIES INFRARED EMITTING LED LAMP.
!WATER CLEAR LENS.
!PACKAGE :2000PCS/REEL.
SPEC NO: KDA0533 REV NO: V.1 DATE: SEP/17/2001 PAGE: 2 OF 3
APPROVED:J.LU CHECKED: DRAWN:X.Q.ZHENG
Electrical And Radiant Characteristics at T)=25°°
°°
°C
Absolute Maximum Rating at T)=25°°
°°
°C
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egnaRerutarepmeTegarotS 04- °58+~C °C
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V
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C
Au001=
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mc/Wm0=
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Au001=
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e
mc/Wm0=
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mc/Wm02=
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V01=
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mc/Wm0=
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V5=
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C
Am1=
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0001= Ω
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SPEC NO: KDA0533 REV NO: V.1 DATE: SEP/17/2001 PAGE: 3 OF 3
APPROVED:J.LU CHECKED: DRAWN:X.Q.ZHENG
KP-2012P3C
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
