Walsin Technology Corporation
Page 6 of 9 WA04, WA06 Ver.12 Jan.-2010
MOUNTING
Due to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by
automatic placement systems.
Chip placement can be on ceramic substrates and printed-circuit boards (PCBs).
Electrical connection to the circuit is by individual soldering condition.
The end terminations guarantee a reliable contact.
SOLDERING CONDITION
The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10
seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete
components on the reverse (mixed PCBs).
Surface Mount Resistors are tested for solderability at 245°C during 3 seconds. The test condition for no
leaching is 260°C for 30 seconds. Typical examples of soldering processes that provide reliable joints without
any damage are given in Fig 4.
Fig 4. Infrared soldering profile for Chip Resistors array
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.