ALPHA & OMEGA Document No. PO00003 SEMICONDUCTOR, LTD. Version rev G TSSOP8 PACKAGE OUTLINE iy Ee 0 u 124X) <= _ Z\ f jt a tu r] { [010mm] a RECOMMENDED LAND PATTERN SYMBOLS DIMENSIONS IN MILLIMETERS DIMENSIONS IN INCHES MIN NOM MAX MIN NOM MAX A 1.20 0.047 , Al 0.05 - 0.15 0.002 - 0.006 A2 0.80 1.00 1.05 0.031 0.039 0.041 re) b 0.19 - 0.30 0.007 0.012 418s C 0.09 0.20 || 0.004 [ - | 0.008 0 D 2.90 3.00 3.10 0.114 0.118 0.122 El 6.40 BSC 0.252 BSC i 325 E 430 | 440 | 4.50 0.169 | 0.173. | 0.177 e 0.65 BSC 0.026 BSC L 0.45 0.60 0.75 0.018 0.024 0.030 6 0 8 0 8 eae UNIT: mm NOTE 1. ALL DIMENSIONS ARE IN MILLMETERS. 2. DIMENSIONS ARE INCLUSIVE OF PLATING. 3. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND GATE BURRS. MOLD FLASH AT THE NON-LEAD SIDES SHOULD BE LESS THAN 6 MILS EACH. 4, DIMENSION L IS MEASURED IN GAUGE PLANE. 5. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED INCH DIMENSIONS ARE NOT NECESSARILY EXACT. 6. REFER TO JEDEC MO-153(AA)