Data Sheet Preliminary Information 101537P6
© 2001, 2002 Skyworks Solutions, Inc., All Rights Reserved. March 27, 2002
Preliminary Information
This document contains information on a new product. The parametric information, although not
fully characterized, is the result of testing initial devices.
CX77133
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
The CX77133 Power Amplifier Module (PAM) is a fully matched, 6-pin surface mount
module developed for Personal Communications Service (PCS) and wireless local
loop applications. This small and efficient Power Amplifier packs a full 1850–1910
MHz bandwidth coverage into a single compact package.
The CX77133 meets the stringent spectral linearity requirements of Code Division
Multiple Access (CDMA) PCS transmission with high power added efficiency for
power output of up to 28 dBm. A single Gallium Arsenide (GaAs) Microwave
Monolithic Integrated Circuit (MMIC) contains all the active circuitry in the module.
The MMIC contains on-board bias circuitry, as well as input and interstage matching
circuits. Output match is realized off-chip within the module package to optimize
efficiency and power performance into a 50 Ω load.
This device is manufactured with Skyworks’ GaAs Heterojunction Bipolar Transistor
(HBT) process, which provides for all positive voltage DC supply operation while
maintaining high efficiency and good linearity. Primary bias to the CX77133 is
supplied directly from a three-cell nickel cadmium, a single-cell lithium ion, or other
suitable battery with an output in the 3–4 volt range. Power down is accomplished by
setting the voltage on the low current reference pin to zero volts. No external supply
side switch is needed as typical “off” leakage is a few microamperes with full primary
voltage supplied from the battery.
Functional Block Diagram
MMIC
MODULE
RF
Output
(5)
RF
Input
(2)
VCC1
(1)
(6, 7)
GND
VCC2
(4)
VREF
(3)
Driver
Stage Bias
Power
Stage Bias
Input
Match DA
Inter
Stage
Match
PA Output
Match
(6, 7)
GND
Distinguishing Features
• Low voltage positive bias supply
(3 to 4 Volts)
• Good linearity
• High efficiency
• Large dynamic range
• 6-pin package (6 x 6 x 1.5 mm)
• Power down control
Applications
• Personal communications
services (PCS)
• Wireless local loop (WLL)
Electrical Specifications CX77133
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
2Skyworks 101537P6
Preliminary Information March 27, 2002
Electrical Specifications
The following tables list the electrical characteristics of the CX77133 Power Amplifier. Table 1
lists the absolute maximum rating for continuous operation.
Table 2 lists the recommended operating conditions and Table 3 lists the electrical performance of
the CX77133 Power Amplifier for nominal operating conditions.
Table 1. Absolute Maximum Ratings(1)
Parameter Symbol Minimum Nominal Maximum Unit
RF Input Power PIN —4.07.0dBm
Supply Voltage VCC — 3.4 6.0 Volts
Reference Voltage VREF — 3.0 3.3 Volts
Case Operating Temperature TC–30 +25 +110 oC
Storage Temperature TSTG –55 — +125 oC
NOTE(S):
(1) No damage assuming only one parameter is set at limit at a time with all other parameters set at or below
nominal value.
Table 2. Recommended Operating Conditions
Parameter Symbol Min Nominal Max Unit
Supply Voltage VCC 3.2 3.4 4.2 Volts
Reference Voltage VREF 2.95 3.0 3.2 Volts
Operating Frequency FO1850.0 1880.0 1910.0 MHz
Case Operating Temperature TC–30 +25 +85 °C
CX77133 Electrical Specifications
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
101537P6 Skyworks 3
March 27, 2002 Preliminary Information
Table 3. Electrical Specification for Nominal Operating Conditions (1)
Characteristics Condition Symbol Minimum Typical Maximum Unit
Quiescent Current Nominal Iq70.0 120.0 130.0 mA
Leakage Current VREF = 0 V
VCC = 3.4 V
Ilk ——7.0µA
Gain PO = 0 dBm
PO = 28 dBm
G
Gp
25.5
27.0
26.5
28.5
28.0
30.0
dB
dB
Power Added Efficiency PO = 28 dBm PAEd 28 32.0 36.0 — %
Adjacent Channel Power PO ≤ 28 dBm (2) ACP — –50.0 –48.5 dBc
Harmonic Suppression
Second
Third
PO ≤ 28 dBm
PO ≤ 28 dBm
DFO2
DFO3
—
—
–38.0
–44.0
–32.0
–37.5
dBc
dBc
Noise Power in RX Band
1930-1990 MHz
PO ≤ 28 dBm RXBN — –135.0 –133.0 dBm/Hz
Noise Figure — NF — 4.0 5.5 dB
Input Voltage Standing Wave Ratio — VSWR — 1.2 1.4 —
Stability (spurious output) 5:1 VSWR
All Phases
S — — –60.0 dBc
Ruggedness – No damage PO ≤ 28 dBm Ru 10:1 — — VSWR
NOTE(S):
(1) VCC = +3.4 V, VREF = +3.0 V, Freq. = 1880 MHz, TC = 25 oC, unless otherwise specified.
(2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW
Electrical Specifications CX77133
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
4Skyworks 101537P6
Preliminary Information March 27, 2002
Table 4. Electrical Specification Limits for Recommended Operating Conditions (1)
Characteristics Condition Symbol Minimum Maximum Unit
Quiescent Current Nominal Iq—180.0mA
Gain PO = 0 dBm
PO = 28 dBm
G
Gp
24.0
23.0
29.5
32.5
dB
dB
Power Added Efficiency VCC = 3.4 V
PO = 28 dBm
PAEd 28 31.5 — %
Adjacent Channel Power(2) PO ≤ 28 dBm ACP — –44.0 dBc
Harmonic Suppression
Second
Third
PO ≤ 28 dBm
PO ≤ 28 dBm
DFO2
DFO3
—–30.0
–35.0
dBc
dBc
Noise Power in RX Band
1930-1990 MHz
PO ≤ 28 dBm RXBN — –131.0 dBm/Hz
Noise Figure — NF — 8.0 dB
Input Voltage Standing Wave Ratio — VSWR — 2.0 —
Stability (spurious output) 5:1 VSWR
All Phases
S — –60.0 dBc
Ruggedness–No damage PO ≤ 28 dBm Ru 10:1 — VSWR
NOTE(S):
(1) Per Table 2, unless otherwise specified.
(2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
Worst case ACPR is –43dBc at +85 °C, Vcc = 3.2 V.
CX77133 Evaluation Board Description
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
101537P6 Skyworks 5
March 27, 2002 Preliminary Information
Evaluation Board Description
The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the
interface testing of the CX77133, the evaluation board schematic and diagrams are included for
preliminary analysis and design. Figure 1 shows the basic schematic of the board for the
1850 MHz to 1910 MHz range. Figure 2 illustrates the board layout.
Figure 1. Evaluation Board Schematic
Figure 2. Evaluation Board Assembly Diagram
101537_003
1
2
3
6
5
4
VCC1
RFIN
RFIN
VREF
VREF
GND
RFOUT RFOUT
VCC2
VCC
C3
330 pF
C4
1000 pF
C1
220 pF
C2
4.7 µF
101537_002
Vref
GND
GND
Vcc
C2
C4
C3
C1
RF OUTRF IN
SKYWORKS
6x6_ENG_EVAL_BD
Package Dimensions and Pin Descriptions CX77133
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
6Skyworks 101537P6
Preliminary Information March 27, 2002
Package Dimensions and Pin Descriptions
The CX77133 is a multi-layer laminate base, overmold encapsulated modular package designed for
surface-mounted solder attachment to a printed circuit board.
Figure 3 is a mechanical drawing of the pad layout for this package and Figure 4 illustrates typical
case markings. The pin numbering convention starts with pin 1 in the upper left, as indicated in
Figure 3, and increments counter-clockwise around the package. Table 5 describes each pin
function.
Figure 3. CX77133 Package Dimensions
Table 5. Pin Description
Pin #123456GND PAD
Function VCC1(1) RF Input VREF VCC2(1) RF Output GND GND(2)
NOTE(S):
(1) All supply pins may be connected together at the supply.
(2) Package underside is GND.
101537_007
TOP VIEWS
FRONT VIEW
Notes: Solder mask pattern pad layout as viewed
from top looking through package.
All dimensions are in millimeters.
1.258
2.88
5.50
0.759 ±0.05 (6x)
0.50
0.09 ±0.05 (6x)
0.14
2.62
2.50
2.50
6.04
±0.05
6.04 ±0.05
1
2
34
5
6
0.14 (6x)
1.50 ±0.10
0.48 ±0.07
Ground Pad
PIN 1 INDICATOR
CX77133 Package and Handling Information
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
101537P6 Skyworks 7
March 27, 2002 Preliminary Information
Package and Handling Information
Because of its sensitivity to moisture absorption, this device package is baked and vacuum packed
prior to shipment. Instructions on the shipping container label must be followed regarding exposure
to moisture after the container seal is broken, otherwise, problems related to moisture absorption
may occur when the part is subjected to high temperature during solder assembly.
The CX77133 is capable of withstanding an MSL 3/225 °C solder reflow. Care must be taken when
attaching this product, whether it is done manually or in a production solder reflow environment. If
the part is attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 225 °C. If the part is manually attached, precaution
should be taken to insure that the part is not subjected to temperatures exceeding 225 °C for more
than 10 seconds. For details on both attachment techniques, precautions, and handling procedures
recommended by Conexant, please refer to Application Note: PCB Design and SMT
Assembly/Rework, Document Number 101752. Additional information on standard SMT reflow profiles
can also be found in the JEDEC Standard J–STD–020A.
Production quantities of this product are shipped in the standard tape-and-reel format. For
packaging details, refer to Application Note: Tape and Reel, Document Number 101568.
Figure 4. Typical Case Markings
101537_006
SKYWORKS
CX77133-NN
NXXXXX.XX
YYWW MEX
Manufacturing Part Number-Revision Number
Mark Pin 1
Identifier Lot Number
YY = Manufacture Year
WW = Week Package
Sealed
MEX = Country Code
Package and Handling Information CX77133
Power Amplifier Module for CDMA PCS (1850–1910 MHz)
8Skyworks 101537P6
Preliminary Information March 27, 2002
© 2002, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products. These materials are
provided by Skyworks as a service to its customers and may be used for informational purposes only. Skyworks assumes no
responsibility for errors or omissions in these materials. Skyworks may make changes to its products, specifications and product
descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility
whatsoever for conflicts, incompatibilities, or other difficulties arising from future changes to its products and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as
may be provided in Skyworks' Terms and Conditions of Sale for such products, Skyworks assumes no liability whatsoever.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING
TO SALE AND/OR USE OF SKYWORKS™ PRODUCTS INCLUDING WARRANTIES RELATING TO FITNESS FOR A
PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT,
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OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS.
SKYWORKS SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES,
INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE
MATERIALS.
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damages resulting from such improper use or sale.
The following are trademarks of Skyworks Solutions, Inc.: Skyworks™, the Skyworks symbol, and "Breakthrough Simplicity"™.
Product names or services listed in this publication are for identification purposes only, and may be trademarks of third parties. Third-
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Additional information, posted at www.skyworksinc.com, is incorporated by reference.
Ordering Information
Revision History
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752
Application Note: Tape and Reel, Document Number 101568
JEDEC Standard J–STD–020A
Model Number Manufacturing
Part Number Product Revision Package Operating Temperature
CX77133 CX77133–12 12 6x6LM-6 –30 °C to +85 °C
Revision Level Date Description
P1 March 2001 Preliminary Information
P2 July 2001 Revise: Table 1, Figures 1, 2, 4.
Add: Table 4
Remove: Table 5, Figure 5
P3 August 2001 Revise: Table 3
P4 October 2001 Revise: Figure 3
P5 March 8, 2002 Revise: Tables 3, 4, and 5; Figure 3.
P6 March 27, 2002 Revise: Table 4 footnotes; Figure 3.
