KX164CS32F40FBBAXT - INFINEON TECHNOLOGIES AG

Data Sheet, V1.1, Aug. 2006

Microcontrollers

XC164CS-32F/32R

16-Bit Single-Chip Microcontroller

with C166SV2 Core

Edition 2006-08

Published by

Infineon Technologies AG

81726 München, Germany

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characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values

stated herein and/or any information regarding the application of the device, Infineon Technologies hereby

disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-

infringement of intellectual property rights of any third party.

Information

For further information on technology, delivery terms and conditions and prices please contact your nearest

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question please contact your nearest Infineon Technologies Office.

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Data Sheet, V1.1, Aug. 2006

Microcontrollers

XC164CS-32F/32R

16-Bit Single-Chip Microcontroller

with C166SV2 Core

XC164-32

Derivatives

Data Sheet V1.1, 2006-08

XC164CS

Revision History: V1.1, 2006-08

Previous Version(s):

V1.0, 2005-06 (XC164-32F)

Page Subjects (major changes since last revision)

6New derivatives added.

51 Footnote at XTAL1 input pin.

55 Footnote on leakage of P3.15 added.

76 Green Package added.

75 Thermal Resistance: RTHA replaced by RΘJC and RΘJL because RTHA

strongly depends on the external system (PCB, environment).

PDISS removed, because no static parameter, but derived from thermal

resistance.

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Your feedback will help us to continuously improve the quality of this document.

Please send your proposal (including a reference to this document) to:

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XC164-32
Derivatives
Table of Contents 
Data Sheet 3 V1.1, 2006-08
 
Summary of Features   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  4
General Device Information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
1 Introduction   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
2 Pin Configuration and Definition   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
Functional Description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
1 Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .  18
2 External Bus Controller  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
3 Central Processing Unit (CPU)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  21
4 Interrupt System   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  23
5 On-Chip Debug Support (OCDS)   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  28
6 Capture/Compare Units (CAPCOM1/2) . . . . . . . . . . . . . . . . . . . . . . . . . . .  29
7 The Capture/Compare Unit CAPCOM6 . . . . . . . . . . . . . . . . . . . . . . . . . . .  32
8 General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .  33
9 Real Time Clock   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  37
10 A/D Converter   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  39
11 Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1)  . . . . . . . . . .  40
12 High Speed Synchronous Serial Channels (SSC0/SSC1)   . . . . . . . . . . . .  41
13 TwinCAN Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  42
14 Watchdog Timer   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  44
15 Clock Generation  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  45
16 Parallel Ports  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  45
17 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  47
18 Instruction Set Summary  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  48
Electrical Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  51
1 General Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  51
2 DC Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  54
3 Analog/Digital Converter Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . .  60
4 AC Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  63
4.1 Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  63
4.2 On-chip Flash Operation  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  67
4.3 External Clock Drive XTAL1   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  68
4.4 Testing Waveforms  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  69
4.5 External Bus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  70
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  75
1 Packaging   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  75
2 Flash Memory Parameters   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  78
Table of Contents

XC164CS16-Bit Single-Chip Microcontroller with C166SV2 Core

XC166 Family

Data Sheet 4 V1.1, 2006-08

1 Summary of Features

• High Performance 16-bit CPU with 5-Stage Pipeline

– 25 ns Instruction Cycle Time at 40 MHz CPU Clock (Single-Cycle Execution)

– 1-Cycle Multiplication (16 × 16 bit), Background Division (32 / 16 bit) in 21 Cycles

– 1-Cycle Multiply-and-Accumulate (MAC) Instructions

– Enhanced Boolean Bit Manipulation Facilities

– Zero-Cycle Jump Execution

– Additional Instructions to Support HLL and Operating Systems

– Register-Based Design with Multiple Variable Register Banks

– Fast Context Switching Support with Two Additional Local Register Banks

– 16 Mbytes Total Linear Address Space for Code and Data

– 1024 Bytes On-Chip Special Function Register Area (C166 Family Compatible)

• 16-Priority-Level Interrupt System with 75 Sources, Sample-Rate down to 50 ns

• 8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via

Peripheral Event Controller (PEC), 24-Bit Pointers Cover Total Address Space

• Clock Generation via on-chip PLL (factors 1:0.15 … 1:10), or

via Prescaler (factors 1:1 … 60:1)

• On-Chip Memory Modules

– 2 Kbytes On-Chip Dual-Port RAM (DPRAM)

– 4 Kbytes On-Chip Data SRAM (DSRAM)

– 6 Kbytes On-Chip Program/Data SRAM (PSRAM)

– 256 Kbytes On-Chip Program Memory (Flash Memory or Mask ROM)

• On-Chip Peripheral Modules

– 14-Channel A/D Converter with Programmable Resolution (10-bit or 8-bit) and

Conversion Time (down to 2.55 µs or 2.15 µs)

– Two 16-Channel General Purpose Capture/Compare Units (12 Input/Output Pins)

– Capture/Compare Unit for flexible PWM Signal Generation (CAPCOM6)

(3/6 Capture/Compare Channels and 1 Compare Channel)

– Multi-Functional General Purpose Timer Unit with 5 Timers

– Two Synchronous/Asynchronous Serial Channels (USARTs)

– Two High-Speed-Synchronous Serial Channels

– On-Chip TwinCAN Interface (Rev. 2.0B active) with 32 Message Objects

(Full CAN/Basic CAN) on Two CAN Nodes, and Gateway Functionality

– On-Chip Real Time Clock

• Idle, Sleep, and Power Down Modes with Flexible Power Management

• Programmable Watchdog Timer and Oscillator Watchdog

XC164-32

Derivatives

Summary of Features

Data Sheet 5 V1.1, 2006-08

• Up to 12 Mbytes External Address Space for Code and Data

– Programmable External Bus Characteristics for Different Address Ranges

– Multiplexed or Demultiplexed External Address/Data Buses

– Selectable Address Bus Width

– 16-Bit or 8-Bit Data Bus Width

– Four Programmable Chip-Select Signals

• Up to 79 General Purpose I/O Lines,

partly with Selectable Input Thresholds and Hysteresis

• On-Chip Bootstrap Loader

• Supported by a Large Range of Development Tools like C-Compilers, Macro-

Assembler Packages, Emulators, Evaluation Boards, HLL-Debuggers, Simulators,

Logic Analyzer Disassemblers, Programming Boards

• On-Chip Debug Support via JTAG Interface

• 100-Pin Green TQFP Package, 0.5 mm (19.7 mil) pitch (RoHS compliant)

Ordering Information

The ordering code for Infineon microcontrollers provides an exact reference to the

required product. This ordering code identifies:

• the derivative itself, i.e. its function set, the temperature range, and the supply voltage

• the package and the type of delivery.

For the available ordering codes for the XC164CS please refer to your responsible sales

representative or your local distributor.

Note: The ordering codes for Mask-ROM versions are defined for each product after

verification of the respective ROM code.

This document describes several derivatives of the XC164CS group. Table 1

enumerates these derivatives and summarizes the differences. As this document refers

to all of these derivatives, some descriptions may not apply to a specific product.

For simplicity all versions are referred to by the term XC164CS throughout this

document.

XC164-32

Derivatives

Summary of Features

Data Sheet 6 V1.1, 2006-08

Table 1 XC164CS Derivative Synopsis

Derivative1)

1) This Data Sheet is valid for devices starting with and including design step BA.

Temp.

Range

Program

Memory

On-Chip RAM Interfaces

Standard Devices2)

2) The Flash speed grading indicates the access time to the on-chip Flash module. According to this access time

Flash waitstates must be selected (bitfield WSFLASH in register IMBCTRL) according to the intended

operating frequency. For more details, please refer to Section 4.4.2.

Grade A devices are identified by “Grade A” in the fourth line of the chip marking.

SAK-XC164CS-32F40F

SAK-XC164CS-32F20F

-40 °C to

125 °C

256 Kbytes

Flash

2 Kbytes DPRAM,

4 Kbytes DSRAM,

6 Kbytes PSRAM

ASC0, ASC1,

SSC0, SSC1,

CAN0, CAN1,

CC6

SAF-XC164CS-32F40F

SAF-XC164CS-32F20F

-40 °C to

85 °C

Grade A Devices2)

SAK-XC164CS-32F40F

SAK-XC164CS-32F20F

-40 °C to

125 °C

256 Kbytes

Flash

2 Kbytes DPRAM,

4 Kbytes DSRAM,

6 Kbytes PSRAM

ASC0, ASC1,

SSC0, SSC1,

CAN0, CAN1,

CC6

SAF-XC164CS-32F40F

SAF-XC164CS-32F20F

-40 °C to

85 °C

ROM Devices

SAK-XC164CS-32R40F

SAK-XC164CS-32R20F

-40 °C to

125 °C

256 Kbytes

ROM

2 Kbytes DPRAM,

4 Kbytes DSRAM,

6 Kbytes PSRAM

ASC0, ASC1,

SSC0, SSC1,

CAN0, CAN1,

CC6

SAF-XC164CS-32R40F

SAF-XC164CS-32R20F

-40 °C to

85 °C

XC164-32

Derivatives

General Device Information

Data Sheet 7 V1.1, 2006-08

2 General Device Information

2.1 Introduction

The XC164CS derivatives are high-performance members of the Infineon XC166 Family

of full featured single-chip CMOS microcontrollers. These devices extend the

functionality and performance of the C166 Family in terms of instructions (MAC unit),

peripherals, and speed. They combine high CPU performance (up to 40 million

instructions per second) with high peripheral functionality and enhanced IO-capabilities.

They also provide clock generation via PLL and various on-chip memory modules such

as program Flash, program RAM, and data RAM.

Figure 1 Logic Symbol

MCA05554_XC164

XC164

XTAL1

XTAL2

NMI

RSTIN

RSTOUT

ALE

WR/WRL

Port 5

14 bit

Port 20

5 bit

PORT0

16 bit

PORT1

16 bit

Port 3

14 bit

Port 4

8 bit

Port 9

6 bit

AGND

AREF

DDI/P

SSI/P

JTAGTRST Debug via Port 3

XC164-32

Derivatives

General Device Information

Data Sheet 8 V1.1, 2006-08

2.2 Pin Configuration and Definition

The pins of the XC164CS are described in detail in Table 2, including all their alternate

functions. Figure 2 summarizes all pins in a condensed way, showing their location on

the 4 sides of the package. E*) and C*) mark pins to be used as alternate external

interrupt inputs, C*) marks pins that can have CAN interface lines assigned to them.

Figure 2 Pin Configuration (top view)

MCP06457

P5.11/AN11/T5EUD 25

P5.10/AN10/T6EUD 24

P5.5/AN5 23

P5.4/AN4 22

P5.3/AN3 21

P5.0/AN0 18

VDDP 17

VSSP 16

P9.5/CC21IO 15

P9.4/CC20IO 14

P9.3/CC19IO/C*) 13

P9.2/CC18IO/C*) 12

P9.1/CC17IO/C*) 11

P9.0/CC16IO/C*) 10

VDDP 9

VSSP 8

P0H.3/AD11 7

P0H.0/AD8 4

NMI 3

P20.12/RSTOUT 2

RSTIN 1

P0H.2/AD10

P0H.1/AD9

P5.2/AN2

P5.1/AN1

100

XTAL1

XTAL2

VSSI

VDDI

P1H.7/A15/CC27IO/EX7IN

P1H.6/A14/CC26IO/EX6IN

P1H.5/A13/CC25IO/EX5IN

P1H.4/A12/CC24IO/EX4IN

P1H.3/A11/T7IN/SCLK1/EX3IN/E*)

P1H.2/A10/C6P2/MTSR1/EX2IN

P1H.1/A9/C6P1/MRST1/EX1IN

P1H.0/A8/C6P0/CC23IO/EX0IN

VSSP

VDDP

P1L.7/A7/CTRAP/CC22IO

P1L.6/A6/COUT63

P1L.5/A5/COUT62

P1L.4/A4/CC62

P1L.3/A3/COUT61

P1L.2/A2/CC61

P1L.1/A1/COUT60

P1L.0/A0/CC60

P0H.7/AD15

P0H.6/AD14

P0H.5/AD13

45P3.7/T2IN/BRKIN

P5.6/AN6

P5.7/AN7

VAREF

VAGND

P5.12/AN12/T6IN

P5.13/AN13/T5IN

P5.14/AN14/T4EUD

P5.15/AN15/T2EUD

VSSI

VDDI

TRST

VSSP

VDDP

P3.1/T6OUT/RxD1/TCK/E*)

P3.2/CAPIN/TDI

P3.3/T3OUT/TDO

P3.4/T3EUD/TMS

P3.5/T4IN/TxD1/BRKOUT

P3.6/T3IN

P3.8/MRST0

P3.9/MTSR0

P3.10/TxD0/E*)

P3.11/RxD0/E*)

P3.12/BHE/WRH/E*)

51 P3.13/SCLK0/E*)

P3.15/CLKOUT/FOUT

P4.0/A16/CS3

P4.1/A17/CS2

P4.2/A18/CS1

P4.3/A19/CS0

P4.4/A20/C*)

P4.5/A21/C*)

P4.6/A22/C*)

P4.7/A23/C*)

VDDP

VSSP

P20.0/RD

P20.1/WR/WRL

P20.4/ALE

P20.5/EA

P0L.0/AD0

P0L.1/AD1

P0L.2/AD2

P0L.3/AD3

P0L.4/AD4

P0L.5/AD5

P0L.6/AD6

P0L.7/AD7

P0H.4/AD12

XC164

XC164-32

Derivatives

General Device Information

Data Sheet 9 V1.1, 2006-08

Table 2 Pin Definitions and Functions

Sym-

bol

Num.

Input

Outp.

Function

RSTIN 1 I Reset Input with Schmitt-Trigger characteristics. A low level

at this pin while the oscillator is running resets the XC164CS.

A spike filter suppresses input pulses < 10 ns. Input pulses

> 100 ns safely pass the filter. The minimum duration for a

safe recognition should be 100 ns + 2 CPU clock cycles.

Note: The reset duration must be sufficient to let the

hardware configuration signals settle.

External circuitry must guarantee low level at the

RSTIN pin at least until both power supply voltages

have reached the operating range.

P20.12 2 IO For details, please refer to the description of P20.

NMI 3 I Non-Maskable Interrupt Input. A high to low transition at this

pin causes the CPU to vector to the NMI trap routine. When

the PWRDN (power down) instruction is executed, the NMI

pin must be low in order to force the XC164CS into power

down mode. If NMI is high, when PWRDN is executed, the

part will continue to run in normal mode.

If not used, pin NMI should be pulled high externally.

P0H.0 -

P0H.3

4 … 7 IO For details, please refer to the description of PORT0.

XC164-32

Derivatives

General Device Information

Data Sheet 10 V1.1, 2006-08

P9.0

P9.1

P9.2

P9.3

P9.4

P9.5

I/O

Port 9 is a 6-bit bidirectional I/O port. Each pin can be

programmed for input (output driver in high-impedance

state) or output (configurable as push/pull or open drain

driver). The input threshold of Port 9 is selectable (standard

or special).

The following Port 9 pins also serve for alternate functions:1)

CC16IO CAPCOM2: CC16 Capture Inp./Compare Outp.,

CAN1_RxD CAN Node B Receive Data Input,

EX7IN Fast External Interrupt 7 Input (alternate pin B)

CC17IO CAPCOM2: CC17 Capture Inp./Compare Outp.,

CAN1_TxD CAN Node B Transmit Data Output,

EX6IN Fast External Interrupt 6 Input (alternate pin B)

CC18IO CAPCOM2: CC18 Capture Inp./Compare Outp.,

CAN0_RxD CAN Node A Receive Data Input,

EX7IN Fast External Interrupt 7 Input (alternate pin A)

CC19IO CAPCOM2: CC19 Capture Inp./Compare Outp.,

CAN0_TxD CAN Node A Transmit Data Output,

EX6IN Fast External Interrupt 6 Input (alternate pin A)

CC20IO CAPCOM2: CC20 Capture Inp./Compare Outp.

CC21IO CAPCOM2: CC21 Capture Inp./Compare Outp.

P5.0

P5.1

P5.2

P5.3

P5.4

P5.5

P5.10

P5.11

P5.6

P5.7

P5.12

P5.13

P5.14

P5.15

Port 5 is a 14-bit input-only port.

The pins of Port 5 also serve as analog input channels for the

A/D converter, or they serve as timer inputs:

AN0

AN1

AN2

AN3

AN4

AN5

AN10, T6EUD GPT2 Timer T6 Ext. Up/Down Ctrl. Inp.

AN11, T5EUD GPT2 Timer T5 Ext. Up/Down Ctrl. Inp.

AN6

AN7

AN12, T6IN GPT2 Timer T6 Count/Gate Input

AN13, T5IN GPT2 Timer T5 Count/Gate Input

AN14, T4EUD GPT1 Timer T4 Ext. Up/Down Ctrl. Inp.

AN15, T2EUD GPT1 Timer T2 Ext. Up/Down Ctrl. Inp.

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

General Device Information

Data Sheet 11 V1.1, 2006-08

TRST 36 I Test-System Reset Input. A high level at this pin activates

the XC164CS’s debug system. For normal system operation,

pin TRST should be held low.

P3.1

P3.2

P3.3

P3.4

P3.5

P3.6

P3.7

P3.8

P3.9

P3.10

P3.11

P3.12

P3.13

P3.15

I/O

Port 3 is a 14-bit bidirectional I/O port. Each pin can be

programmed for input (output driver in high-impedance

state) or output (configurable as push/pull or open drain

driver). The input threshold of Port 3 is selectable (standard

or special).

The following Port 3 pins also serve for alternate functions:

T6OUT GPT2 Timer T6 Toggle Latch Output,

RxD1 ASC1 Data Input (Async.) or Inp./Outp. (Sync.),

EX1IN Fast External Interrupt 1 Input (alternate pin A),

TCK Debug System: JTAG Clock Input

CAPIN GPT2 Register CAPREL Capture Input,

TDI Debug System: JTAG Data In

T3OUT GPT1 Timer T3 Toggle Latch Output,

TDO Debug System: JTAG Data Out

T3EUD GPT1 Timer T3 External Up/Down Control Input,

TMS Debug System: JTAG Test Mode Selection

T4IN GPT1 Timer T4 Count/Gate/Reload/Capture In.,

TxD1 ASC0 Clock/Data Output (Async./Sync.),

BRKOUT Debug System: Break Out

T3IN GPT1 Timer T3 Count/Gate Input

T2IN GPT1 Timer T2 Count/Gate/Reload/Capture In.,

BRKIN Debug System: Break In

MRST0 SSC0 Master-Receive/Slave-Transmit In/Out.

MTSR0 SSC0 Master-Transmit/Slave-Receive Out/In.

TxD0 ASC0 Clock/Data Output (Async./Sync.),

EX2IN Fast External Interrupt 2 Input (alternate pin B)

RxD0 ASC0 Data Input (Async.) or Inp./Outp. (Sync.),

EX2IN Fast External Interrupt 2 Input (alternate pin A)

BHE External Memory High Byte Enable Signal,

WRH External Memory High Byte Write Strobe,

EX3IN Fast External Interrupt 3 Input (alternate pin B)

SCLK0 SSC0 Master Clock Output / Slave Clock Input,

EX3IN Fast External Interrupt 3 Input (alternate pin A)

CLKOUT System Clock Output (= CPU Clock),

FOUT Programmable Frequency Output

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

General Device Information

Data Sheet 12 V1.1, 2006-08

P4.0

P4.1

P4.2

P4.3

P4.4

P4.5

P4.6

P4.7

Port 4 is an 8-bit bidirectional I/O port. Each pin can be

programmed for input (output driver in high-impedance

state) or output (configurable as push/pull or open drain

driver). The input threshold of Port 4 is selectable (standard

or special).

Port 4 can be used to output the segment address lines, the

optional chip select lines, and for serial interface lines:1)

A16 Least Significant Segment Address Line,

CS3 Chip Select 3 Output

A17 Segment Address Line,

CS2 Chip Select 2 Output

A18 Segment Address Line,

CS1 Chip Select 1 Output

A19 Segment Address Line,

CS0 Chip Select 0 Output

A20 Segment Address Line,

CAN1_RxD CAN Node B Receive Data Input,

EX5IN Fast External Interrupt 5 Input (alternate pin B)

A21 Segment Address Line,

CAN0_RxD CAN Node A Receive Data Input,

EX4IN Fast External Interrupt 4 Input (alternate pin B)

A22 Segment Address Line,

CAN0_TxD CAN Node A Transmit Data Output,

EX5IN Fast External Interrupt 5 Input (alternate pin A)

A23 Most Significant Segment Address Line,

CAN0_RxD CAN Node A Receive Data Input,

CAN1_TxD CAN Node B Transmit Data Output,

EX4IN Fast External Interrupt 4 Input (alternate pin A)

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

General Device Information

Data Sheet 13 V1.1, 2006-08

P20

P20.0

P20.1

P20.4

P20.5

P20.12

Port 20 is a 5-bit bidirectional I/O port. Each pin can be

programmed for input (output driver in high-impedance

state) or output. The input threshold of Port 20 is selectable

(standard or special).

The following Port 20 pins also serve for alternate functions:

RD External Memory Read Strobe, activated for

every external instruction or data read access.

WR/WRL External Memory Write Strobe.

In WR-mode this pin is activated for every

external data write access.

In WRL-mode this pin is activated for low byte

data write accesses on a 16-bit bus, and for

every data write access on an 8-bit bus.

ALE Address Latch Enable Output.

Can be used for latching the address into

external memory or an address latch in the

multiplexed bus modes.

EA External Access Enable pin.

A low level at this pin during and after Reset

forces the XC164CS to latch the configuration

from PORT0 and pin RD, and to begin

instruction execution out of external memory.

A high level forces the XC164CS to latch the

configuration from pins RD, ALE, and WR, and

to begin instruction execution out of the internal

program memory. “ROMless” versions must

have this pin tied to ‘0’.

RSTOUT Internal Reset Indication Output.

Is activated asynchronously with an external

hardware reset. It may also be activated

(selectable) synchronously with an internal

software or watchdog reset.

Is deactivated upon the execution of the EINIT

instruction, optionally at the end of reset, or at

any time (before EINIT) via user software.

Note: Port 20 pins may input configuration values (see EA).

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

General Device Information

Data Sheet 14 V1.1, 2006-08

PORT0

P0L.0 -

P0L.7

P0H.0 -

P0H.3

P0H.4 -

P0H.7

67 - 74

4 - 7

75 - 78

IO PORT0 consists of the two 8-bit bidirectional I/O ports P0L

and P0H. Each pin can be programmed for input (output

driver in high-impedance state) or output.

In case of an external bus configuration, PORT0 serves as

the address (A) and address/data (AD) bus in multiplexed

bus modes and as the data (D) bus in demultiplexed bus

modes.

Demultiplexed bus modes:

8-bit data bus: P0H = I/O, P0L = D7 - D0

16-bit data bus: P0H = D15 - D8, P0L = D7 - D0

Multiplexed bus modes:

8-bit data bus: P0H = A15 - A8, P0L = AD7 - AD0

16-bit data bus: P0H = AD15 - AD8, P0L = AD7 - AD0

Note: At the end of an external reset (EA = 0) PORT0 also

may input configuration values

PORT1

P1L.0

P1L.1

P1L.2

P1L.3

P1L.4

P1L.5

P1L.6

P1L.7

P1H

…

I/O

PORT1 consists of the two 8-bit bidirectional I/O ports P1L

and P1H. Each pin can be programmed for input (output

driver in high-impedance state) or output.

PORT1 is used as the 16-bit address bus (A) in

demultiplexed bus modes (also after switching from a

demultiplexed to a multiplexed bus mode).

The following PORT1 pins also serve for alt. functions:

CC60 CAPCOM6: Input / Output of Channel 0

COUT60 CAPCOM6: Output of Channel 0

CC61 CAPCOM6: Input / Output of Channel 1

COUT61 CAPCOM6: Output of Channel 1

CC62 CAPCOM6: Input / Output of Channel 2

COUT62 CAPCOM6: Output of Channel 2

COUT63 Output of 10-bit Compare Channel

CTRAP CAPCOM6: Trap Input

CTRAP is an input pin with an internal pull-up resistor. A low

level on this pin switches the CAPCOM6 compare outputs to

the logic level defined by software (if enabled).

CC22IO CAPCOM2: CC22 Capture Inp./Compare Outp.

…continued…

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

General Device Information

Data Sheet 15 V1.1, 2006-08

PORT1

(cont’d)

P1H.0

P1H.1

P1H.2

P1H.3

P1H.4

P1H.5

P1H.6

P1H.7

I/O

…continued…

CC6POS0 CAPCOM6: Position 0 Input,

EX0IN Fast External Interrupt 0 Input (default pin),

CC23IO CAPCOM2: CC23 Capture Inp./Compare Outp.

CC6POS1 CAPCOM6: Position 1 Input,

EX1IN Fast External Interrupt 1 Input (default pin),

MRST1 SSC1 Master-Receive/Slave-Transmit In/Out.

CC6POS2 CAPCOM6: Position 2 Input,

EX2IN Fast External Interrupt 2 Input (default pin),

MTSR1 SSC1 Master-Transmit/Slave-Receive Out/Inp.

T7IN CAPCOM2: Timer T7 Count Input,

SCLK1 SSC1 Master Clock Output / Slave Clock Input,

EX3IN Fast External Interrupt 3 Input (default pin),

EX0IN Fast External Interrupt 0 Input (alternate pin A)

CC24IO CAPCOM2: CC24 Capture Inp./Compare Outp.,

EX4IN Fast External Interrupt 4 Input (default pin)

CC25IO CAPCOM2: CC25 Capture Inp./Compare Outp.,

EX5IN Fast External Interrupt 5 Input (default pin)

CC26IO CAPCOM2: CC26 Capture Inp./Compare Outp.,

EX6IN Fast External Interrupt 6 Input (default pin)

CC27IO CAPCOM2: CC27 Capture Inp./Compare Outp.,

EX7IN Fast External Interrupt 7 Input (default pin)

XTAL2

XTAL1

100

XTAL2: Output of the oscillator amplifier circuit

XTAL1: Input to the oscillator amplifier and input to the

internal clock generator

To clock the device from an external source, drive XTAL1,

while leaving XTAL2 unconnected. Minimum and maximum

high/low and rise/fall times specified in the AC.

Characteristics must be observed.

Note: Input pin XTAL1 belongs to the core voltage domain.

Therefore, input voltages must be within the range

defined for VDDI.

VAREF 28 – Reference voltage for the A/D converter.

VAGND 29 – Reference ground for the A/D converter.

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

General Device Information

Data Sheet 16 V1.1, 2006-08

VDDI 35, 97 – Digital Core Supply Voltage (On-Chip Modules):

+2.5 V during normal operation and idle mode.

Please refer to the Operating Condition Parameters.

VDDP 9, 17,

38, 61,

– Digital Pad Supply Voltage (Pin Output Drivers):

+5 V during normal operation and idle mode.

Please refer to the Operating Condition Parameters.

VSSI 34, 98 – Digital Ground

Connect decoupling capacitors to adjacent VDD/VSS pin pairs

as close as possible to the pins.

All VSS pins must be connected to the ground-line or ground-

plane.

VSSP 8, 16,

37, 62,

–

1) The CAN interface lines are assigned to ports P4 and P9 under software control.

Table 2 Pin Definitions and Functions (cont’d)

Sym-

bol

Num.

Input

Outp.

Function

XC164-32

Derivatives

Functional Description

Data Sheet 17 V1.1, 2006-08

3 Functional Description

The architecture of the XC164CS combines advantages of RISC, CISC, and DSP

processors with an advanced peripheral subsystem in a very well-balanced way. In

addition, the on-chip memory blocks allow the design of compact systems-on-silicon with

maximum performance (computing, control, communication).

The on-chip memory blocks (program code-memory and SRAM, dual-port RAM, data

SRAM) and the set of generic peripherals are connected to the CPU via separate buses.

Another bus, the LXBus, connects additional on-chip resources as well as external

resources (see Figure 3).

This bus structure enhances the overall system performance by enabling the concurrent

operation of several subsystems of the XC164CS.

The following block diagram gives an overview of the different on-chip components and

of the advanced, high bandwidth internal bus structure of the XC164CS.

Figure 3 Block Diagram

GPT

C166SV2 - Core

DPRAM

CPU

PMU

DMU

BRGen BRGen BRGen BRGen

ASC0

USART

ASC1

USART

SSC0

SPI

SSC1

SPI

ADC

8-Bit/

10-Bit

14 Ch

CC1

Twin

CAN

A B

RTC WDT Interrupt & PEC

EBC

LXBus Control

External Bus

Control

DSRAM

ProgMem

Flash/ROM

256 Kbytes

PSRAM

Osc / PLL

Clock Generator

OCDS

Debug Support

XTAL

Interrupt Bus

Peripheral Data Bus

CC2

P 20 P 9 Port 5 Port 4 Port 3 PORT1 PORT0

16148

5 6

MCB04323_X432R

LXB us

CC6

T13

T12

XC164-32

Derivatives

Functional Description

Data Sheet 18 V1.1, 2006-08

3.1 Memory Subsystem and Organization

The memory space of the XC164CS is configured in a Von Neumann architecture, which

means that all internal and external resources, such as code memory, data memory,

registers and I/O ports, are organized within the same linear address space. This

common memory space includes 16 Mbytes and is arranged as 256 segments of

64 Kbytes each, where each segment consists of four data pages of 16 Kbytes each.

The entire memory space can be accessed bytewise or wordwise. Portions of the

on-chip DPRAM and the register spaces (E/SFR) have additionally been made directly

bitaddressable.

The internal data memory areas and the Special Function Register areas (SFR and

ESFR) are mapped into segment 0, the system segment.

The Program Management Unit (PMU) handles all code fetches and, therefore, controls

accesses to the program memories, such as Flash memory and PSRAM.

The Data Management Unit (DMU) handles all data transfers and, therefore, controls

accesses to the DSRAM and the on-chip peripherals.

Both units (PMU and DMU) are connected via the high-speed system bus to exchange

data. This is required if operands are read from program memory, code or data is written

to the PSRAM, code is fetched from external memory, or data is read from or written to

external resources, including peripherals on the LXBus (such as TwinCAN). The system

bus allows concurrent two-way communication for maximum transfer performance.

256 Kbytes of on-chip Flash memory store code or constant data. The on-chip Flash

memory is organized as four 8-Kbyte sectors, one 32-Kbyte sector, and three 64-Kbyte

sectors. Each sector can be separately write protected1), erased and programmed (in

blocks of 128 bytes). The complete Flash area can be read-protected. A password

sequence temporarily unlocks protected areas. The Flash module combines very fast

64-bit one-cycle read accesses with protected and efficient writing algorithms for

programming and erasing. Thus, program execution out of the internal Flash results in

maximum performance. Dynamic error correction provides extremely high read data

security for all read accesses.

For timing characteristics, please refer to Section 4.4.2.

6 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data.

The PSRAM is accessed via the PMU and is therefore optimized for code fetches.

4 Kbytes of on-chip Data SRAM (DSRAM) are provided as a storage for general user

data. The DSRAM is accessed via the DMU and is therefore optimized for data

accesses.

2 Kbytes of on-chip Dual-Port RAM (DPRAM) are provided as a storage for user

defined variables, for the system stack, and general purpose register banks. A register

bank can consist of up to 16 wordwide (R0 to R15) and/or bytewide (RL0, RH0, …, RL7,

1) Each two 8-Kbyte sectors are combined for write-protection purposes.

XC164-32

Derivatives

Functional Description

Data Sheet 19 V1.1, 2006-08

RH7) so-called General Purpose Registers (GPRs).

The upper 256 bytes of the DPRAM are directly bitaddressable. When used by a GPR,

any location in the DPRAM is bitaddressable.

1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function

used for controlling and monitoring functions of the different on-chip units. Unused SFR

addresses are reserved for future members of the XC166 Family. Therefore, they should

either not be accessed, or written with zeros, to ensure upward compatibility.

In order to meet the needs of designs where more memory is required than is provided

on chip, up to 12 Mbytes (approximately, see Table 3) of external RAM and/or ROM can

be connected to the microcontroller. The External Bus Interface also provides access to

external peripherals.

Table 3 XC164CS Memory Map1)

1) Accesses to the shaded areas generate external bus accesses.

Address Area Start Loc. End Loc. Area Size2)

2) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.

Notes

Flash register space FF’F000HFF’FFFFH4 Kbytes 3)

3) Not defined register locations return a trap code.

Reserved (Acc. trap) FE’0000HFF’EFFFH60 Kbytes –

Reserved for EPSRAM F8’1800HFD’FFFFH378 Kbytes –

Emul. Program

SRAM4)

4) The Emulation PSRAM (EPSRAM) realizes a 2nd access path to the PSRAM with a different timing.

F8’0000HF8’17FFH6 Kbytes 2nd way to PSRAM

Reserved for PSRAM E0’1800HF7’FFFFH< 1.5 Mbytes Minus PSRAM

Program SRAM E0’0000HE0’17FFH6 Kbytes Maximum

Reserved for program

memory

C4’0000HDF’FFFFH< 2 Mbytes Minus Flash

Program Flash/ROM C0’0000HC3’FFFFH256 Kbytes –

Reserved BF’0000HBF’FFFFH64 Kbytes –

External memory area 40’0000HBE’FFFFH< 8 Mbytes Minus reserved

segment

External IO area5) 20’0800H3F’FFFFH< 2 Mbytes Minus TwinCAN

TwinCAN registers 20’0000H20’07FFH2 Kbytes –

External memory area 01’0000H1F’FFFFH< 2 Mbytes Minus segment 0

Data RAMs and SFRs 00’8000H00’FFFFH32 Kbytes Partly used

External memory area 00’0000H00’7FFFH32 Kbytes –

XC164-32

Derivatives

Functional Description

Data Sheet 20 V1.1, 2006-08

3.2 External Bus Controller

All of the external memory accesses are performed by a particular on-chip External Bus

Controller (EBC). It can be programmed either to Single Chip Mode when no external

memory is required, or to one of four different external memory access modes1), which

are as follows:

• 16 … 24-bit Addresses, 16-bit Data, Demultiplexed

• 16 … 24-bit Addresses, 16-bit Data, Multiplexed

• 16 … 24-bit Addresses, 8-bit Data, Multiplexed

• 16 … 24-bit Addresses, 8-bit Data, Demultiplexed

In the demultiplexed bus modes, addresses are output on PORT1 and data is

input/output on PORT0 or P0L, respectively. In the multiplexed bus modes both

addresses and data use PORT0 for input/output. The high order address (segment) lines

use Port 4. The number of active segment address lines is selectable, restricting the

external address space to 8 Mbytes … 64 Kbytes. This is required when interface lines

are assigned to Port 4.

Up to 4 external CS signals (3 windows plus default) can be generated in order to save

external glue logic. External modules can directly be connected to the common

address/data bus and their individual select lines.

Important timing characteristics of the external bus interface have been made

programmable (via registers TCONCSx/FCONCSx) to allow the user the adaption of a

wide range of different types of memories and external peripherals.

In addition, up to 4 independent address windows may be defined (via registers

ADDRSELx) which control the access to different resources with different bus

characteristics. These address windows are arranged hierarchically where window 4

overrides window 3, and window 2 overrides window 1. All accesses to locations not

covered by these 4 address windows are controlled by TCONCS0/FCONCS0. The

currently active window can generate a chip select signal.

Note: The chip select signal of address window 4 is not available on a pin.

The external bus timing is related to the rising edge of the reference clock output

CLKOUT. The external bus protocol is compatible with that of the standard C166 Family.

The EBC also controls accesses to resources connected to the on-chip LXBus. The

LXBus is an internal representation of the external bus and allows accessing integrated

peripherals and modules in the same way as external components.

The TwinCAN module is connected and accessed via the LXBus.

5) Several pipeline optimizations are not active within the external IO area. This is necessary to control external

peripherals properly.

1) Bus modes are switched dynamically if several address windows with different mode settings are used.

XC164-32

Derivatives

Functional Description

Data Sheet 21 V1.1, 2006-08

3.3 Central Processing Unit (CPU)

The main core of the CPU consists of a 5-stage execution pipeline with a 2-stage

instruction-fetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply

and accumulate unit (MAC), a register-file providing three register banks, and dedicated

SFRs. The ALU features a multiply and divide unit, a bit-mask generator, and a barrel

shifter.

Figure 4 CPU Block Diagram

Based on these hardware provisions, most of the XC164CS’s instructions can be

executed in just one machine cycle which requires 25 ns at 40 MHz CPU clock. For

DPRAM

CPU

IPIP

GPRs

R14

R15

GPRs

R14

R15

IFU

Injection/

Exception

Handler

ADU

MAC

mca04917_x.vsd

CPUCON1

CPUCON2

CSP IP

Return

Stack

FIFO

Branch

Unit

Prefetch

Unit VECSEG

TFR

+/-

IDX0

IDX1

QX0

QX1

QR0

QR1

DPP0

DPP1

DPP2

DPP3

SPSEG

STKOV

STKUN

+/-

MRW

MCW

MSW

MAL

+/-

MAH

Multiply

Unit

ALU

Division Unit

M ultiply Unit

Bit-Mask-Gen.

Barrel-Shifter

+/-

MDC

PSW

MDH

ZEROS

MDL

ONES

GPRs

R14

R15

Buffer

2-Stage

Prefetch

Pipeline

5-Stage

Pipeline

GPRs

R14

R15

PMU

DMU

DSRAM

EBC

Peripherals

PSRAM

Flash/ROM

XC164-32

Derivatives

Functional Description

Data Sheet 22 V1.1, 2006-08

example, shift and rotate instructions are always processed during one machine cycle

independent of the number of bits to be shifted. Also multiplication and most MAC

instructions execute in one single cycle. All multiple-cycle instructions have been

optimized so that they can be executed very fast as well: for example, a division

algorithm is performed in 18 to 21 CPU cycles, depending on the data and division type.

Four cycles are always visible, the rest runs in the background. Another pipeline

optimization, the branch target prediction, allows eliminating the execution time of

branch instructions if the prediction was correct.

The CPU has a register context consisting of up to three register banks with 16 wordwide

GPRs each at its disposal. The global register bank is physically allocated within the

on-chip DPRAM area. A Context Pointer (CP) register determines the base address of

the active global register bank to be accessed by the CPU at any time. The number of

passing, a register bank may overlap others.

A system stack of up to 32 Kwords is provided as a storage for temporary data. The

system stack can be allocated to any location within the address space (preferably in the

on-chip RAM area), and it is accessed by the CPU via the stack pointer (SP) register.

Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack

pointer value upon each stack access for the detection of a stack overflow or underflow.

The high performance offered by the hardware implementation of the CPU can efficiently

be utilized by a programmer via the highly efficient XC164CS instruction set which

includes the following instruction classes:

• Standard Arithmetic Instructions

• DSP-Oriented Arithmetic Instructions

• Logical Instructions

• Boolean Bit Manipulation Instructions

• Compare and Loop Control Instructions

• Shift and Rotate Instructions

• Prioritize Instruction

• Data Movement Instructions

• System Stack Instructions

• Jump and Call Instructions

• Return Instructions

• System Control Instructions

• Miscellaneous Instructions

The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes

and words. A variety of direct, indirect or immediate addressing modes are provided to

specify the required operands.

XC164-32

Derivatives

Functional Description

Data Sheet 23 V1.1, 2006-08

3.4 Interrupt System

With an interrupt response time of typically 8 CPU clocks (in case of internal program

execution), the XC164CS is capable of reacting very fast to the occurrence of non-

deterministic events.

The architecture of the XC164CS supports several mechanisms for fast and flexible

response to service requests that can be generated from various sources internal or

external to the microcontroller. Any of these interrupt requests can be programmed to

being serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).

In contrast to a standard interrupt service where the current program execution is

suspended and a branch to the interrupt vector table is performed, just one cycle is

‘stolen’ from the current CPU activity to perform a PEC service. A PEC service implies a

single byte or word data transfer between any two memory locations with an additional

increment of either the PEC source, or the destination pointer, or both. An individual PEC

transfer counter is implicitly decremented for each PEC service except when performing

in the continuous transfer mode. When this counter reaches zero, a standard interrupt is

performed to the corresponding source related vector location. PEC services are very

well suited, for example, for supporting the transmission or reception of blocks of data.

The XC164CS has 8 PEC channels each of which offers such fast interrupt-driven data

transfer capabilities.

A separate control register which contains an interrupt request flag, an interrupt enable

flag and an interrupt priority bitfield exists for each of the possible interrupt nodes. Via its

related register, each node can be programmed to one of sixteen interrupt priority levels.

Once having been accepted by the CPU, an interrupt service can only be interrupted by

a higher prioritized service request. For the standard interrupt processing, each of the

possible interrupt nodes has a dedicated vector location.

Fast external interrupt inputs are provided to service external interrupts with high

precision requirements. These fast interrupt inputs feature programmable edge

detection (rising edge, falling edge, or both edges).

Software interrupts are supported by means of the ‘TRAP’ instruction in combination with

an individual trap (interrupt) number.

Table 4 shows all of the possible XC164CS interrupt sources and the corresponding

hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers.

Note: Interrupt nodes which are not assigned to peripherals (unassigned nodes), may

be used to generate software controlled interrupt requests by setting the

respective interrupt request bit (xIR).

XC164-32

Derivatives

Functional Description

Data Sheet 24 V1.1, 2006-08

Table 4 XC164CS Interrupt Nodes

Source of Interrupt or PEC

Service Request

Control

Vector

Location1)

Trap

Number

CAPCOM Register 0 CC1_CC0IC xx’0040H10H / 16D

CAPCOM Register 1 CC1_CC1IC xx’0044H11H / 17D

CAPCOM Register 2 CC1_CC2IC xx’0048H12H / 18D

CAPCOM Register 3 CC1_CC3IC xx’004CH13H / 19D

CAPCOM Register 4 CC1_CC4IC xx’0050H14H / 20D

CAPCOM Register 5 CC1_CC5IC xx’0054H15H / 21D

CAPCOM Register 6 CC1_CC6IC xx’0058H16H / 22D

CAPCOM Register 7 CC1_CC7IC xx’005CH17H / 23D

CAPCOM Register 8 CC1_CC8IC xx’0060H18H / 24D

CAPCOM Register 9 CC1_CC9IC xx’0064H19H / 25D

CAPCOM Register 10 CC1_CC10IC xx’0068H1AH / 26D

CAPCOM Register 11 CC1_CC11IC xx’006CH1BH / 27D

CAPCOM Register 12 CC1_CC12IC xx’0070H1CH / 28D

CAPCOM Register 13 CC1_CC13IC xx’0074H1DH / 29D

CAPCOM Register 14 CC1_CC14IC xx’0078H1EH / 30D

CAPCOM Register 15 CC1_CC15IC xx’007CH1FH / 31D

CAPCOM Register 16 CC2_CC16IC xx’00C0H30H / 48D

CAPCOM Register 17 CC2_CC17IC xx’00C4H31H / 49D

CAPCOM Register 18 CC2_CC18IC xx’00C8H32H / 50D

CAPCOM Register 19 CC2_CC19IC xx’00CCH33H / 51D

CAPCOM Register 20 CC2_CC20IC xx’00D0H34H / 52D

CAPCOM Register 21 CC2_CC21IC xx’00D4H35H / 53D

CAPCOM Register 22 CC2_CC22IC xx’00D8H36H / 54D

CAPCOM Register 23 CC2_CC23IC xx’00DCH37H / 55D

CAPCOM Register 24 CC2_CC24IC xx’00E0H38H / 56D

CAPCOM Register 25 CC2_CC25IC xx’00E4H39H / 57D

CAPCOM Register 26 CC2_CC26IC xx’00E8H3AH / 58D

CAPCOM Register 27 CC2_CC27IC xx’00ECH3BH / 59D

CAPCOM Register 28 CC2_CC28IC xx’00F0H3CH / 60D

XC164-32

Derivatives

Functional Description

Data Sheet 25 V1.1, 2006-08

CAPCOM Register 29 CC2_CC29IC xx’0110H44H / 68D

CAPCOM Register 30 CC2_CC30IC xx’0114H45H / 69D

CAPCOM Register 31 CC2_CC31IC xx’0118H46H / 70D

CAPCOM Timer 0 CC1_T0IC xx’0080H20H / 32D

CAPCOM Timer 1 CC1_T1IC xx’0084H21H / 33D

CAPCOM Timer 7 CC2_T7IC xx’00F4H3DH / 61D

CAPCOM Timer 8 CC2_T8IC xx’00F8H3EH / 62D

GPT1 Timer 2 GPT12E_T2IC xx’0088H22H / 34D

GPT1 Timer 3 GPT12E_T3IC xx’008CH23H / 35D

GPT1 Timer 4 GPT12E_T4IC xx’0090H24H / 36D

GPT2 Timer 5 GPT12E_T5IC xx’0094H25H / 37D

GPT2 Timer 6 GPT12E_T6IC xx’0098H26H / 38D

GPT2 CAPREL Register GPT12E_CRIC xx’009CH27H / 39D

A/D Conversion Complete ADC_CIC xx’00A0H28H / 40D

A/D Overrun Error ADC_EIC xx’00A4H29H / 41D

ASC0 Transmit ASC0_TIC xx’00A8H2AH / 42D

ASC0 Transmit Buffer ASC0_TBIC xx’011CH47H / 71D

ASC0 Receive ASC0_RIC xx’00ACH2BH / 43D

ASC0 Error ASC0_EIC xx’00B0H2CH / 44D

ASC0 Autobaud ASC0_ABIC xx’017CH5FH / 95D

SSC0 Transmit SSC0_TIC xx’00B4H2DH / 45D

SSC0 Receive SSC0_RIC xx’00B8H2EH / 46D

SSC0 Error SSC0_EIC xx’00BCH2FH / 47D

PLL/OWD PLLIC xx’010CH43H / 67D

ASC1 Transmit ASC1_TIC xx’0120H48H / 72D

ASC1 Transmit Buffer ASC1_TBIC xx’0178H5EH / 94D

ASC1 Receive ASC1_RIC xx’0124H49H / 73D

ASC1 Error ASC1_EIC xx’0128H4AH / 74D

ASC1 Autobaud ASC1_ABIC xx’0108H42H / 66D

End of PEC Subchannel EOPIC xx’0130H4CH / 76D

Table 4 XC164CS Interrupt Nodes (cont’d)

Source of Interrupt or PEC

Service Request

Control

Vector

Location1)

Trap

Number

XC164-32

Derivatives

Functional Description

Data Sheet 26 V1.1, 2006-08

CAPCOM6 Timer T12 CCU6_T12IC xx’0134H4DH / 77D

CAPCOM6 Timer T13 CCU6_T13IC xx’0138H4EH / 78D

CAPCOM6 Emergency CCU6_EIC xx’013CH4FH / 79D

CAPCOM6 CCU6_IC xx’0140H50H / 80D

SSC1 Transmit SSC1_TIC xx’0144H51H / 81D

SSC1 Receive SSC1_RIC xx’0148H52H / 82D

SSC1 Error SSC1_EIC xx’014CH53H / 83D

CAN0 CAN_0IC xx’0150H54H / 84D

CAN1 CAN_1IC xx’0154H55H / 85D

CAN2 CAN_2IC xx’0158H56H / 86D

CAN3 CAN_3IC xx’015CH57H / 87D

CAN4 CAN_4IC xx’0164H59H / 89D

CAN5 CAN_5IC xx’0168H5AH / 90D

CAN6 CAN_6IC xx’016CH5BH / 91D

CAN7 CAN_7IC xx’0170H5CH / 92D

RTC RTC_IC xx’0174H5DH / 93D

Unassigned node – xx’0100H40H / 64D

Unassigned node – xx’0104H41H / 65D

Unassigned node – xx’012CH4BH / 75D

Unassigned node – xx’00FCH3FH / 63D

Unassigned node – xx’0160H58H / 88D

1) Register VECSEG defines the segment where the vector table is located to.

Bitfield VECSC in register CPUCON1 defines the distance between two adjacent vectors. This table

represents the default setting, with a distance of 4 (two words) between two vectors.

Table 4 XC164CS Interrupt Nodes (cont’d)

Source of Interrupt or PEC

Service Request

Control

Vector

Location1)

Trap

Number

XC164-32

Derivatives

Functional Description

Data Sheet 27 V1.1, 2006-08

The XC164CS also provides an excellent mechanism to identify and to process

exceptions or error conditions that arise during run-time, so-called ‘Hardware Traps’.

Hardware traps cause immediate non-maskable system reaction which is similar to a

standard interrupt service (branching to a dedicated vector table location). The

occurrence of a hardware trap is additionally signified by an individual bit in the trap flag

hardware trap will interrupt any actual program execution. In turn, hardware trap services

can normally not be interrupted by standard or PEC interrupts.

Table 5 shows all of the possible exceptions or error conditions that can arise during run-

time:

Table 5 Hardware Trap Summary

Exception Condition Trap

Flag

Trap

Vector

Location1)

1) Register VECSEG defines the segment where the vector table is located to.

Trap

Number

Trap

Priority

Reset Functions:

• Hardware Reset

• Software Reset

• Watchdog Timer

Overflow

–

RESET

xx’0000H

00H

III

Class A Hardware Traps:

• Non-Maskable Interrupt

• Stack Overflow

• Stack Underflow

• Software Break

NMI

STKOF

STKUF

SOFTBRK

NMITRAP

STOTRAP

STUTRAP

SBRKTRAP

xx’0008H

xx’0010H

xx’0018H

xx’0020H

02H

04H

06H

08H

Class B Hardware Traps:

• Undefined Opcode

• PMI Access Error

• Protected Instruction

Fault

• Illegal Word Operand

Access

UNDOPC

PACER

PRTFLT

ILLOPA

BTRAP

xx’0028H

0AH

Reserved – – [2CH - 3CH][0B

H -

0FH]

–

Software Traps

• TRAP Instruction

–– Any

[xx’0000H -

xx’01FCH]

in steps of

Any

[00H -

7FH]

Current

CPU

Priority

XC164-32

Derivatives

Functional Description

Data Sheet 28 V1.1, 2006-08

3.5 On-Chip Debug Support (OCDS)

The On-Chip Debug Support system provides a broad range of debug and emulation

features built into the XC164CS. The user software running on the XC164CS can thus

be debugged within the target system environment.

The OCDS is controlled by an external debugging device via the debug interface,

consisting of the IEEE-1149-conforming JTAG port and a break interface. The debugger

controls the OCDS via a set of dedicated registers accessible via the JTAG interface.

Additionally, the OCDS system can be controlled by the CPU, e.g. by a monitor program.

An injection interface allows the execution of OCDS-generated instructions by the CPU.

Multiple breakpoints can be triggered by on-chip hardware, by software, or by an

external trigger input. Single stepping is supported as well as the injection of arbitrary

instructions and read/write access to the complete internal address space. A breakpoint

trigger can be answered with a CPU-halt, a monitor call, a data transfer, or/and the

activation of an external signal.

Tracing data can be obtained via the JTAG interface or via the external bus interface for

increased performance.

The debug interface uses a set of 6 interface signals (4 JTAG lines, 2 break lines) to

communicate with external circuitry. These interface signals are realized as alternate

functions on Port 3 pins.

Complete system emulation is supported by the New Emulation Technology (NET)

interface.

XC164-32

Derivatives

Functional Description

Data Sheet 29 V1.1, 2006-08

3.6 Capture/Compare Units (CAPCOM1/2)

The CAPCOM units support generation and control of timing sequences on up to

32 channels with a maximum resolution of 1 system clock cycle (8 cycles in staggered

mode). The CAPCOM units are typically used to handle high speed I/O tasks such as

pulse and waveform generation, pulse width modulation (PMW), Digital to Analog (D/A)

conversion, software timing, or time recording relative to external events.

Four 16-bit timers (T0/T1, T7/T8) with reload registers provide two independent time

bases for each capture/compare register array.

The input clock for the timers is programmable to several prescaled values of the internal

system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.

This provides a wide range of variation for the timer period and resolution and allows

precise adjustments to the application specific requirements. In addition, external count

inputs for CAPCOM timers T0 and T7 allow event scheduling for the capture/compare

registers relative to external events.

Both of the two capture/compare register arrays contain 16 dual purpose

capture/compare registers, each of which may be individually allocated to either

CAPCOM timer T0 or T1 (T7 or T8, respectively), and programmed for capture or

compare function.

12 registers of the CAPCOM2 module have each one port pin associated with it which

serves as an input pin for triggering the capture function, or as an output pin to indicate

the occurrence of a compare event.

Table 6 Compare Modes (CAPCOM1/2)

Compare Modes Function

Mode 0 Interrupt-only compare mode;

several compare interrupts per timer period are possible

Mode 1 Pin toggles on each compare match;

several compare events per timer period are possible

Mode 2 Interrupt-only compare mode;

only one compare interrupt per timer period is generated

Mode 3 Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;

only one compare event per timer period is generated

Double Register

Mode

Two registers operate on one pin;

pin toggles on each compare match;

several compare events per timer period are possible

Single Event Mode Generates single edges or pulses;

can be used with any compare mode

XC164-32

Derivatives

Functional Description

Data Sheet 30 V1.1, 2006-08

When a capture/compare register has been selected for capture mode, the current

contents of the allocated timer will be latched (‘captured’) into the capture/compare

generated. Either a positive, a negative, or both a positive and a negative external signal

transition at the pin can be selected as the triggering event.

The contents of all registers which have been selected for one of the five compare modes

are continuously compared with the contents of the allocated timers.

When a match occurs between the timer value and the value in a capture/compare

XC164-32

Derivatives

Functional Description

Data Sheet 31 V1.1, 2006-08

Figure 5 CAPCOM1/2 Unit Block Diagram

Sixteen

16-bit

Capture/

Compare

Registers

Mode

Control

(Capture

Compare)

T0/T7

Input

Control

T1/T8

Input

Control

MCB05569

CCxIRQ

CAPCOM1 provides channels x = 0 … 15,

CAPCOM2 provides channels x = 16 … 31.

(see signals CCxIO and CCxIRQ)

T0IRQ,

T7IRQ

T1IRQ,

T8IRQ

CCxIO

T0IN/T7IN

T6OUF

Reload Reg.

T0REL/T7REL

Timer T0/T7

Timer T1/T8

Reload Reg.

T1REL/T8REL

XC164-32

Derivatives

Functional Description

Data Sheet 32 V1.1, 2006-08

3.7 The Capture/Compare Unit CAPCOM6

The CAPCOM6 unit supports generation and control of timing sequences on up to three

16-bit capture/compare channels plus one independent 10-bit compare channel.

In compare mode the CAPCOM6 unit provides two output signals per channel which

have inverted polarity and non-overlapping pulse transitions (deadtime control). The

compare channel can generate a single PWM output signal and is further used to

modulate the capture/compare output signals.

In capture mode the contents of compare timer T12 is stored in the capture registers

upon a signal transition at pins CCx.

Compare timers T12 (16-bit) and T13 (10-bit) are free running timers which are clocked

by the prescaled system clock.

Figure 6 CAPCOM6 Block Diagram

For motor control applications both subunits may generate versatile multichannel PWM

signals which are basically either controlled by compare timer T12 or by a typical hall

sensor pattern at the interrupt inputs (block commutation).

Control

CC Channel 0

CC60

CC Channel 1

CC61

CC Channel 2

CC62

MCB04109

Prescaler

Offset Register

T12OF

Compare

Timer T12

16-bit

Period Register

T12P

Mode

Select Register

CC6MSEL Trap Register

Port

Control

Logic

Control Register

CTCON

Compare Register

CMP13

Prescaler

Compare

Timer T13

10-bit

Period Register

T13P

Block

Commutation

Control

CC6MCON.H

CC60

COUT60

CC61

COUT61

CC62

COUT62

CTRAP

CC6POS0

CC6POS1

CC6POS2

fCPU

fCPU COUT63

The timer registers (T12, T13) are not directly accessible.

The period and offset registers are loading a value into the timer registers.

XC164-32

Derivatives

Functional Description

Data Sheet 33 V1.1, 2006-08

3.8 General Purpose Timer (GPT12E) Unit

The GPT12E unit represents a very flexible multifunctional timer/counter structure which

may be used for many different time related tasks such as event timing and counting,

pulse width and duty cycle measurements, pulse generation, or pulse multiplication.

The GPT12E unit incorporates five 16-bit timers which are organized in two separate

modules, GPT1 and GPT2. Each timer in each module may operate independently in a

number of different modes, or may be concatenated with another timer of the same

module.

Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for

one of four basic modes of operation, which are Timer, Gated Timer, Counter, and

Incremental Interface Mode. In Timer Mode, the input clock for a timer is derived from

the system clock, divided by a programmable prescaler, while Counter Mode allows a

timer to be clocked in reference to external events.

Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the

operation of a timer is controlled by the ‘gate’ level on an external input pin. For these

purposes, each timer has one associated port pin (TxIN) which serves as gate or clock

input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.

The count direction (up/down) for each timer is programmable by software or may

additionally be altered dynamically by an external signal on a port pin (TxEUD) to

facilitate e.g. position tracking.

In Incremental Interface Mode the GPT1 timers (T2, T3, T4) can be directly connected

to the incremental position sensor signals A and B via their respective inputs TxIN and

TxEUD. Direction and count signals are internally derived from these two input signals,

so the contents of the respective timer Tx corresponds to the sensor position. The third

position sensor signal TOP0 can be connected to an interrupt input.

Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer

overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out

monitoring of external hardware components. It may also be used internally to clock

timers T2 and T4 for measuring long time periods with high resolution.

In addition to their basic operating modes, timers T2 and T4 may be configured as reload

or capture registers for timer T3. When used as capture or reload registers, timers T2

and T4 are stopped. The contents of timer T3 is captured into T2 or T4 in response to a

signal at their associated input pins (TxIN). Timer T3 is reloaded with the contents of T2

or T4 triggered either by an external signal or by a selectable state transition of its toggle

latch T3OTL. When both T2 and T4 are configured to alternately reload T3 on opposite

state transitions of T3OTL with the low and high times of a PWM signal, this signal can

be constantly generated without software intervention.

XC164-32

Derivatives

Functional Description

Data Sheet 34 V1.1, 2006-08

Figure 7 Block Diagram of GPT1

With its maximum resolution of 2 system clock cycles, the GPT2 module provides

precise event control and time measurement. It includes two timers (T5, T6) and a

capture/reload register (CAPREL). Both timers can be clocked with an input clock which

is derived from the CPU clock via a programmable prescaler or with external signals. The

MCA05563

Aux. Timer T2

Mode

Control

Capture

U/D

Basic Clock

GPT

T3CON.BPS1

T3OTL T3OUT

Toggle

Latch

T2IN

T2EUD Reload

Core Timer T3

Mode

Control

T3IN

T3EUD U/D

Interrupt

Request

(T3IRQ)

Mode

Control

U/D

Aux. Timer T4

T4EUD

T4IN Reload

Capture

Interrupt

Request

(T4IRQ)

Interrupt

Request

(T2IRQ)

XC164-32

Derivatives

Functional Description

Data Sheet 35 V1.1, 2006-08

count direction (up/down) for each timer is programmable by software or may

additionally be altered dynamically by an external signal on a port pin (TxEUD).

Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6,

which changes its state on each timer overflow/underflow.

The state of this latch may be used to clock timer T5, and/or it may be output on pin

T6OUT. The overflows/underflows of timer T6 can additionally be used to clock the

CAPCOM1/2 timers, and to cause a reload from the CAPREL register.

The CAPREL register may capture the contents of timer T5 based on an external signal

transition on the corresponding port pin (CAPIN), and timer T5 may optionally be cleared

after the capture procedure. This allows the XC164CS to measure absolute time

differences or to perform pulse multiplication without software overhead.

The capture trigger (timer T5 to CAPREL) may also be generated upon transitions of

GPT1 timer T3’s inputs T3IN and/or T3EUD. This is especially advantageous when T3

operates in Incremental Interface Mode.

XC164-32

Derivatives

Functional Description

Data Sheet 36 V1.1, 2006-08

Figure 8 Block Diagram of GPT2

MCA05564

GPT2 Timer T5

Mode

Control

GPT2 CAPREL

T3IN/

T3EUD

CAPREL

Mode

Control

Mode

Control

Reload

Clear

U/D

Capture

Clear

U/D

T5IN

CAPIN

Interrupt

Request

(T5IR)

Interrupt

Request

(T6IR)

Interrupt

Request

(CRIR)

Basic Clock

GPT

T6CON.BPS2

T6IN

GPT2 Timer T6 T6OTL T6OUT

T6OUF

Toggle

XC164-32

Derivatives

Functional Description

Data Sheet 37 V1.1, 2006-08

3.9 Real Time Clock

The Real Time Clock (RTC) module of the XC164CS is directly clocked via a separate

clock driver with the prescaled on-chip main oscillator frequency (fRTC = fOSCm/32). It is

therefore independent from the selected clock generation mode of the XC164CS.

The RTC basically consists of a chain of divider blocks:

• a selectable 8:1 divider (on - off)

• the reloadable 16-bit timer T14

• the 32-bit RTC timer block (accessible via registers RTCH and RTCL), made of:

– a reloadable 10-bit timer

– a reloadable 6-bit timer

– a reloadable 10-bit timer

All timers count up. Each timer can generate an interrupt request. All requests are

combined to a common node request.

Figure 9 RTC Block Diagram

Note: The registers associated with the RTC are not affected by a reset in order to

maintain the correct system time even when intermediate resets are executed.

CNT-Register

REL-Register

10 Bits6 Bits6 Bits10 BitsT14

MCB05568

T14-Register

Interrupt Sub Node RTCINT

MUX

PRE

RUN CNT

INT3

CNT

INT2

CNT

INT1

CNT

INT0

CNT

RTC

T14REL 10 Bits6 Bits6 Bits10 Bits

XC164-32

Derivatives

Functional Description

Data Sheet 38 V1.1, 2006-08

The RTC module can be used for different purposes:

• System clock to determine the current time and date,

optionally during idle mode, sleep mode, and power down mode

• Cyclic time based interrupt, to provide a system time tick independent of CPU

frequency and other resources, e.g. to wake up regularly from idle mode

• 48-bit timer for long term measurements (maximum timespan is > 100 years)

• Alarm interrupt for wake-up on a defined time

XC164-32

Derivatives

Functional Description

Data Sheet 39 V1.1, 2006-08

3.10 A/D Converter

For analog signal measurement, a 10-bit A/D converter with 14 multiplexed input

channels and a sample and hold circuit has been integrated on-chip. It uses the method

of successive approximation. The sample time (for loading the capacitors) and the

conversion time is programmable (in two modes) and can thus be adjusted to the

external circuitry. The A/D converter can also operate in 8-bit conversion mode, where

the conversion time is further reduced.

Overrun error detection/protection is provided for the conversion result register

(ADDAT): either an interrupt request will be generated when the result of a previous

conversion has not been read from the result register at the time the next conversion is

complete, or the next conversion is suspended in such a case until the previous result

has been read.

For applications which require less analog input channels, the remaining channel inputs

can be used as digital input port pins.

The A/D converter of the XC164CS supports four different conversion modes. In the

standard Single Channel conversion mode, the analog level on a specified channel is

sampled once and converted to a digital result. In the Single Channel Continuous mode,

the analog level on a specified channel is repeatedly sampled and converted without

software intervention. In the Auto Scan mode, the analog levels on a prespecified

number of channels are sequentially sampled and converted. In the Auto Scan

Continuous mode, the prespecified channels are repeatedly sampled and converted. In

addition, the conversion of a specific channel can be inserted (injected) into a running

sequence without disturbing this sequence. This is called Channel Injection Mode.

The Peripheral Event Controller (PEC) may be used to automatically store the

conversion results into a table in memory for later evaluation, without requiring the

overhead of entering and exiting interrupt routines for each data transfer.

After each reset and also during normal operation the ADC automatically performs

calibration cycles. This automatic self-calibration constantly adjusts the converter to

changing operating conditions (e.g. temperature) and compensates process variations.

These calibration cycles are part of the conversion cycle, so they do not affect the normal

operation of the A/D converter.

In order to decouple analog inputs from digital noise and to avoid input trigger noise

those pins used for analog input can be disconnected from the digital IO or input stages

under software control. This can be selected for each pin separately via register P5DIDIS

(Port 5 Digital Input Disable).

The Auto-Power-Down feature of the A/D converter minimizes the power consumption

when no conversion is in progress.

XC164-32

Derivatives

Functional Description

Data Sheet 40 V1.1, 2006-08

3.11 Asynchronous/Synchronous Serial Interfaces (ASC0/ASC1)

The Asynchronous/Synchronous Serial Interfaces ASC0/ASC1 (USARTs) provide serial

communication with other microcontrollers, processors, terminals or external peripheral

components. They are upward compatible with the serial ports of the Infineon 8-bit

microcontroller families and support full-duplex asynchronous communication and half-

duplex synchronous communication. A dedicated baud rate generator with a fractional

divider precisely generates all standard baud rates without oscillator tuning. For

transmission, reception, error handling, and baudrate detection 5 separate interrupt

vectors are provided.

In asynchronous mode, 8- or 9-bit data frames (with optional parity bit) are transmitted

or received, preceded by a start bit and terminated by one or two stop bits. For

multiprocessor communication, a mechanism to distinguish address from data bytes has

been included (8-bit data plus wake-up bit mode). IrDA data transmissions up to

115.2 kbit/s with fixed or programmable IrDA pulse width are supported.

In synchronous mode, bytes (8 bits) are transmitted or received synchronously to a shift

clock which is generated by the ASC0/1. The LSB is always shifted first.

In both modes, transmission and reception of data is FIFO-buffered. An autobaud

detection unit allows to detect asynchronous data frames with its baudrate and mode

with automatic initialization of the baudrate generator and the mode control bits.

A number of optional hardware error detection capabilities has been included to increase

the reliability of data transfers. A parity bit can automatically be generated on

transmission or be checked on reception. Framing error detection allows to recognize

data frames with missing stop bits. An overrun error will be generated, if the last

character received has not been read out of the receive buffer register at the time the

reception of a new character is complete.

Summary of Features

• Full-duplex asynchronous operating modes

– 8- or 9-bit data frames, LSB first, one or two stop bits, parity generation/checking

– Baudrate from 2.5 Mbit/s to 0.6 bit/s (@ 40 MHz)

– Multiprocessor mode for automatic address/data byte detection

– Support for IrDA data transmission/reception up to max. 115.2 kbit/s (@ 40 MHz)

– Loop-back capability

– Auto baudrate detection

• Half-duplex 8-bit synchronous operating mode at 5 Mbit/s to 406.9 bit/s (@ 40 MHz)

• Buffered transmitter/receiver with FIFO support (8 entries per direction)

• Loop-back option available for testing purposes

• Interrupt generation on transmitter buffer empty condition, last bit transmitted

condition, receive buffer full condition, error condition (frame, parity, overrun error),

start and end of an autobaud detection

XC164-32

Derivatives

Functional Description

Data Sheet 41 V1.1, 2006-08

3.12 High Speed Synchronous Serial Channels (SSC0/SSC1)

The High Speed Synchronous Serial Channels SSC0/SSC1 support full-duplex and half-

duplex synchronous communication. It may be configured so it interfaces with serially

linked peripheral components, full SPI functionality is supported.

A dedicated baud rate generator allows to set up all standard baud rates without

oscillator tuning. For transmission, reception and error handling three separate interrupt

vectors are provided.

The SSC transmits or receives characters of 2 … 16 bits length synchronously to a shift

clock which can be generated by the SSC (master mode) or by an external master (slave

mode). The SSC can start shifting with the LSB or with the MSB and allows the selection

of shifting and latching clock edges as well as the clock polarity.

A number of optional hardware error detection capabilities has been included to increase

the reliability of data transfers. Transmit error and receive error supervise the correct

handling of the data buffer. Phase error and baudrate error detect incorrect serial data.

Summary of Features

• Master or Slave mode operation

• Full-duplex or Half-duplex transfers

• Baudrate generation from 20 Mbit/s to 305.18 bit/s (@ 40 MHz)

• Flexible data format

– Programmable number of data bits: 2 to 16 bits

– Programmable shift direction: LSB-first or MSB-first

– Programmable clock polarity: idle low or idle high

– Programmable clock/data phase: data shift with leading or trailing clock edge

• Loop back option available for testing purposes

• Interrupt generation on transmitter buffer empty condition, receive buffer full

condition, error condition (receive, phase, baudrate, transmit error)

• Three pin interface with flexible SSC pin configuration

XC164-32

Derivatives

Functional Description

Data Sheet 42 V1.1, 2006-08

3.13 TwinCAN Module

The integrated TwinCAN module handles the completely autonomous transmission and

reception of CAN frames in accordance with the CAN specification V2.0 part B (active),

i.e. the on-chip TwinCAN module can receive and transmit standard frames with 11-bit

identifiers as well as extended frames with 29-bit identifiers.

Two Full-CAN nodes share the TwinCAN module’s resources to optimize the CAN bus

traffic handling and to minimize the CPU load. The module provides up to 32 message

objects, which can be assigned to one of the CAN nodes and can be combined to FIFO-

structures. Each object provides separate masks for acceptance filtering.

The flexible combination of Full-CAN functionality and FIFO architecture reduces the

efforts to fulfill the real-time requirements of complex embedded control applications.

Improved CAN bus monitoring functionality as well as the number of message objects

permit precise and comfortable CAN bus traffic handling.

Gateway functionality allows automatic data exchange between two separate CAN bus

systems, which reduces CPU load and improves the real time behavior of the entire

system.

The bit timing for both CAN nodes is derived from the master clock and is programmable

up to a data rate of 1 Mbit/s. Each CAN node uses two pins of Port 4, Port 7, or Port 9 to

interface to an external bus transceiver. The interface pins are assigned via software.

Figure 10 TwinCAN Module Block Diagram

TwinCAN Module Kernel

MCB05567

TxDCA

RxDCA

TxDCB

RxDCB

CAN

Node A

CAN

Node B

Message

Object

Buffer

Clock

Control

fCAN

Interrupt

Control

Address

Decoder

TwinCAN Control

Port

Control

XC164-32

Derivatives

Functional Description

Data Sheet 43 V1.1, 2006-08

Summary of Features

• CAN functionality according to CAN specification V2.0 B active

• Data transfer rate up to 1 Mbit/s

• Flexible and powerful message transfer control and error handling capabilities

• Full-CAN functionality and Basic CAN functionality for each message object

• 32 flexible message objects

– Assignment to one of the two CAN nodes

– Configuration as transmit object or receive object

– Concatenation to a 2-, 4-, 8-, 16-, or 32-message buffer with FIFO algorithm

– Handling of frames with 11-bit or 29-bit identifiers

– Individual programmable acceptance mask register for filtering for each object

– Monitoring via a frame counter

– Configuration for Remote Monitoring Mode

• Up to eight individually programmable interrupt nodes can be used

• CAN Analyzer Mode for bus monitoring is implemented

Note: When a CAN node has the interface lines assigned to Port 4, the segment address

output on Port 4 must be limited. CS lines can be used to increase the total amount

of addressable external memory.

XC164-32

Derivatives

Functional Description

Data Sheet 44 V1.1, 2006-08

3.14 Watchdog Timer

The Watchdog Timer represents one of the fail-safe mechanisms which have been

implemented to prevent the controller from malfunctioning for longer periods of time.

The Watchdog Timer is always enabled after a reset of the chip, and can be disabled

until the EINIT instruction has been executed (compatible mode), or it can be disabled

and enabled at any time by executing instructions DISWDT and ENWDT (enhanced

mode). Thus, the chip’s start-up procedure is always monitored. The software has to be

designed to restart the Watchdog Timer before it overflows. If, due to hardware or

software related failures, the software fails to do so, the Watchdog Timer overflows and

generates an internal hardware reset and pulls the RSTOUT pin low in order to allow

external hardware components to be reset.

The Watchdog Timer is a 16-bit timer, clocked with the system clock divided by

2/4/128/256. The high byte of the Watchdog Timer register can be set to a prespecified

reload value (stored in WDTREL) in order to allow further variation of the monitored time

interval. Each time it is serviced by the application software, the high byte of the

Watchdog Timer is reloaded and the low byte is cleared. Thus, time intervals between

13 µs and 419 ms can be monitored (@ 40 MHz).

The default Watchdog Timer interval after reset is 3.28 ms (@ 40 MHz).

XC164-32

Derivatives

Functional Description

Data Sheet 45 V1.1, 2006-08

3.15 Clock Generation

The Clock Generation Unit uses a programmable on-chip PLL with multiple prescalers

to generate the clock signals for the XC164CS with high flexibility. The master clock fMC

is the reference clock signal, and is used for TwinCAN and is output to the external

system. The CPU clock fCPU and the system clock fSYS are derived from the master clock

either directly (1:1) or via a 2:1 prescaler (fSYS = fCPU = fMC / 2). See also Section 4.4.1.

The on-chip oscillator can drive an external crystal or accepts an external clock signal.

The oscillator clock frequency can be multiplied by the on-chip PLL (by a programmable

factor) or can be divided by a programmable prescaler factor.

If the bypass mode is used (direct drive or prescaler) the PLL can deliver an independent

clock to monitor the clock signal generated by the on-chip oscillator. This PLL clock is

independent from the XTAL1 clock. When the expected oscillator clock transitions are

missing the Oscillator Watchdog (OWD) activates the PLL Unlock/OWD interrupt node

and supplies the CPU with an emergency clock, the PLL clock signal. Under these

circumstances the PLL will oscillate with its basic frequency.

The oscillator watchdog can be disabled by switching the PLL off. This reduces power

consumption, but also no interrupt request will be generated in case of a missing

oscillator clock.

Note: At the end of an external reset (EA = ‘0’) the oscillator watchdog may be disabled

via hardware by (externally) pulling the RD line low upon a reset, similar to the

standard reset configuration.

3.16 Parallel Ports

The XC164CS provides up to 79 I/O lines which are organized into six input/output ports

and one input port. All port lines are bit-addressable, and all input/output lines are

individually (bit-wise) programmable as inputs or outputs via direction registers. The I/O

ports are true bidirectional ports which are switched to high impedance state when

configured as inputs. The output drivers of some I/O ports can be configured (pin by pin)

for push/pull operation or open-drain operation via control registers. During the internal

reset, all port pins are configured as inputs (except for pin RSTOUT).

The edge characteristics (shape) and driver characteristics (output current) of the port

drivers can be selected via registers POCONx.

The input threshold of some ports is selectable (TTL or CMOS like), where the special

CMOS like input threshold reduces noise sensitivity due to the input hysteresis. The

input threshold may be selected individually for each byte of the respective ports.

All port lines have programmable alternate input or output functions associated with

them. All port lines that are not used for these alternate functions may be used as general

purpose IO lines.

XC164-32

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Functional Description

Data Sheet 46 V1.1, 2006-08

Table 7 Summary of the XC164CS’s Parallel Ports

Port Control Alternate Functions

PORT0 Pad drivers Address/Data lines or data lines1)

1) For multiplexed bus cycles.

PORT1 Pad drivers Address lines2)

2) For demultiplexed bus cycles.

Capture inputs or compare outputs,

Serial interface lines

Port 3 Pad drivers,

Open drain,

Input threshold

Timer control signals, serial interface lines,

Optional bus control signal BHE/WRH,

System clock output CLKOUT (or FOUT)

Port 4 Pad drivers,

Open drain,

Input threshold

Segment address lines3), CS signal lines

3) For more than 64 Kbytes of external resources.

CAN interface lines4)

4) Can be assigned by software.

Port 5 – Analog input channels to the A/D converter,

Timer control signals

Port 9 Pad drivers,

Open drain,

Input threshold

Capture inputs or compare outputs

CAN interface lines4)

Port 20 Pad drivers,

Open drain

Bus control signals RD, WR/WRL, ALE,

External access enable pin EA,

Reset indication output RSTOUT

XC164-32

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Functional Description

Data Sheet 47 V1.1, 2006-08

3.17 Power Management

The XC164CS provides several means to control the power it consumes either at a given

time or averaged over a certain timespan. Three mechanisms can be used (partly in

parallel):

•Power Saving Modes switch the XC164CS into a special operating mode (control

via instructions).

Idle Mode stops the CPU while the peripherals can continue to operate.

Sleep Mode and Power Down Mode stop all clock signals and all operation (RTC may

optionally continue running). Sleep Mode can be terminated by external interrupt

signals.

•Clock Generation Management controls the distribution and the frequency of

internal and external clock signals. While the clock signals for currently inactive parts

of logic are disabled automatically, the user can reduce the XC164CS’s CPU clock

frequency which drastically reduces the consumed power.

External circuitry can be controlled via the programmable frequency output FOUT.

•Peripheral Management permits temporary disabling of peripheral modules (control

via register SYSCON3). Each peripheral can separately be disabled/enabled.

The on-chip RTC supports intermittent operation of the XC164CS by generating cyclic

wake-up signals. This offers full performance to quickly react on action requests while

the intermittent sleep phases greatly reduce the average power consumption of the

system.

XC164-32

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Functional Description

Data Sheet 48 V1.1, 2006-08

3.18 Instruction Set Summary

Table 8 lists the instructions of the XC164CS in a condensed way.

The various addressing modes that can be used with a specific instruction, the operation

of the instructions, parameters for conditional execution of instructions, and the opcodes

for each instruction can be found in the “Instruction Set Manual”.

This document also provides a detailed description of each instruction.

Table 8 Instruction Set Summary

Mnemonic Description Bytes

ADD(B) Add word (byte) operands 2 / 4

ADDC(B) Add word (byte) operands with Carry 2 / 4

SUB(B) Subtract word (byte) operands 2 / 4

SUBC(B) Subtract word (byte) operands with Carry 2 / 4

MUL(U) (Un)Signed multiply direct GPR by direct GPR

(16- × 16-bit)

DIV(U) (Un)Signed divide register MDL by direct GPR (16-/16-bit) 2

DIVL(U) (Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2

CPL(B) Complement direct word (byte) GPR 2

NEG(B) Negate direct word (byte) GPR 2

AND(B) Bitwise AND, (word/byte operands) 2 / 4

OR(B) Bitwise OR, (word/byte operands) 2 / 4

XOR(B) Bitwise exclusive OR, (word/byte operands) 2 / 4

BCLR/BSET Clear/Set direct bit 2

BMOV(N) Move (negated) direct bit to direct bit 4

BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit 4

BCMP Compare direct bit to direct bit 4

BFLDH/BFLDL Bitwise modify masked high/low byte of bit-addressable

direct word memory with immediate data

CMP(B) Compare word (byte) operands 2 / 4

CMPD1/2 Compare word data to GPR and decrement GPR by 1/2 2 / 4

CMPI1/2 Compare word data to GPR and increment GPR by 1/2 2 / 4

PRIOR Determine number of shift cycles to normalize direct

word GPR and store result in direct word GPR

SHL/SHR Shift left/right direct word GPR 2

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Functional Description

Data Sheet 49 V1.1, 2006-08

ROL/ROR Rotate left/right direct word GPR 2

ASHR Arithmetic (sign bit) shift right direct word GPR 2

MOV(B) Move word (byte) data 2 / 4

MOVBS/Z Move byte operand to word op. with sign/zero extension 2 / 4

JMPA/I/R Jump absolute/indirect/relative if condition is met 4

JMPS Jump absolute to a code segment 4

JB(C) Jump relative if direct bit is set (and clear bit) 4

JNB(S) Jump relative if direct bit is not set (and set bit) 4

CALLA/I/R Call absolute/indirect/relative subroutine if condition is met 4

CALLS Call absolute subroutine in any code segment 4

PCALL Push direct word register onto system stack and call

absolute subroutine

TRAP Call interrupt service routine via immediate trap number 2

PUSH/POP Push/pop direct word register onto/from system stack 2

SCXT Push direct word register onto system stack and update

RET(P) Return from intra-segment subroutine

(and pop direct word register from system stack)

RETS Return from inter-segment subroutine 2

RETI Return from interrupt service subroutine 2

SBRK Software Break 2

SRST Software Reset 4

IDLE Enter Idle Mode 4

PWRDN Enter Power Down Mode (supposes NMI-pin being low) 4

SRVWDT Service Watchdog Timer 4

DISWDT/ENWDT Disable/Enable Watchdog Timer 4

EINIT End-of-Initialization Register Lock 4

ATOMIC Begin ATOMIC sequence 2

EXTR Begin EXTended Register sequence 2

EXTP(R) Begin EXTended Page (and Register) sequence 2 / 4

EXTS(R) Begin EXTended Segment (and Register) sequence 2 / 4

Table 8 Instruction Set Summary (cont’d)

Mnemonic Description Bytes

XC164-32

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Functional Description

Data Sheet 50 V1.1, 2006-08

NOP Null operation 2

CoMUL/CoMAC Multiply (and accumulate) 4

CoADD/CoSUB Add/Subtract 4

Co(A)SHR (Arithmetic) Shift right 4

CoSHL Shift left 4

CoLOAD/STORE Load accumulator/Store MAC register 4

CoCMP Compare 4

CoMAX/MIN Maximum/Minimum 4

CoABS/CoRND Absolute value/Round accumulator 4

CoMOV Data move 4

CoNEG/NOP Negate accumulator/Null operation 4

Table 8 Instruction Set Summary (cont’d)

Mnemonic Description Bytes

XC164-32

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Electrical Parameters

Data Sheet 51 V1.1, 2006-08

4 Electrical Parameters

4.1 General Parameters

Note: Stresses above those listed under “Absolute Maximum Ratings” may cause

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in

the operational sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the

voltage on VDDP pins with respect to ground (VSS) must not exceed the values

defined by the absolute maximum ratings.

Table 9 Absolute Maximum Ratings

Parameter Symbol Limit Values Unit Notes

Min. Max.

Storage temperature TST -65 150 °C1)

1) Moisture Sensitivity Level (MSL) 3, conforming to Jedec J-STD-020C for 260 °C for PG-TQFP-100-5, and

240 °C for P-TQFP-100-16.

Junction temperature TJ-40 150 °C under bias

Voltage on VDDI pins with

respect to ground (VSS)

VDDI -0.5 3.25 V –

Voltage on VDDP pins with

respect to ground (VSS)

VDDP -0.5 6.2 V –

Voltage on any pin with

respect to ground (VSS)

VIN -0.5 VDDP +

0.5

V2)

2) Input pin XTAL1 belongs to the core voltage domain. Therefore, input voltages must be within the range

defined for VDDI.

Input current on any pin

during overload condition

–-1010mA–

Absolute sum of all input

currents during overload

condition

– – |100| mA –

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Electrical Parameters

Data Sheet 52 V1.1, 2006-08

Operating Conditions

The following operating conditions must not be exceeded to ensure correct operation of

the XC164CS. All parameters specified in the following sections refer to these operating

conditions, unless otherwise noticed.

Table 10 Operating Condition Parameters

Parameter Symbol Limit Values Unit Notes

Min. Max.

Digital supply voltage for

the core

VDDI 2.35 2.7 V Active mode,

fCPU = fCPUmax

1)2)

1) fCPUmax = 40 MHz for devices marked … 40F, fCPUmax = 20 MHz for devices marked … 20F.

2) External circuitry must guarantee low-level at the RSTIN pin at least until both power supply voltages have

reached the operating range.

Digital supply voltage for

IO pads

VDDP 4.4 5.5 V Active mode2)3)

3) The specified voltage range is allowed for operation. The range limits may be reached under extreme

operating conditions. However, specified parameters, such as leakage currents, refer to the standard

operating voltage range of VDDP = 4.75 V to 5.25 V.

Supply Voltage Difference ∆VDD -0.5 – V VDDP - VDDI

4) This limitation must be fulfilled under all operating conditions including power-ramp-up, power-ramp-down,

and power-save modes.

Digital ground voltage VSS 0 V Reference voltage

Overload current IOV -5 5 mA Per IO pin5)6)

-2 5 mA Per analog input

pin5)6)

Overload current coupling

factor for analog inputs7)

KOVA –1.0 × 10-4 –IOV > 0

–1.5 × 10-3 –IOV < 0

Overload current coupling

factor for digital I/O pins7)

KOVD –5.0 × 10-3 –IOV > 0

–1.0 × 10-2 –IOV < 0

Absolute sum of overload

currents

Σ|IOV|– 50 mA

External Load

Capacitance

CL– 50 pF Pin drivers in

default mode8)

Ambient temperature TA070°C SAB-XC164…

-40 85 °C SAF-XC164…

-40 125 °C SAK-XC164…

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Data Sheet 53 V1.1, 2006-08

Parameter Interpretation

The parameters listed in the following partly represent the characteristics of the

XC164CS and partly its demands on the system. To aid in interpreting the parameters

right, when evaluating them for a design, they are marked in column “Symbol”:

CC (Controller Characteristics):

The logic of the XC164CS will provide signals with the respective characteristics.

SR (System Requirement):

The external system must provide signals with the respective characteristics to the

XC164CS.

5) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin

exceeds the specified range: VOV > VDDP + 0.5 V (IOV > 0) or VOV < VSS - 0.5 V (IOV < 0). The absolute sum of

input overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the

specified limits.

Proper operation is not guaranteed if overload conditions occur on functional pins such as XTAL1, RD, WR,

etc.

6) Not subject to production test - verified by design/characterization.

7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error

current adds to the respective pin’s leakage current (IOZ). The amount of error current depends on the overload

current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse

compared to the polarity of the overload current that produces it.

The total current through a pin is |ITOT| = |IOZ| + (|IOV| × KOV). The additional error current may distort the input

voltage on analog inputs.

8) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output

current may lead to increased delays or reduced driving capability (CL).

XC164-32
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Electrical Parameters 
Data Sheet 54 V1.1, 2006-08
 
4.2 DC Parameters
Table 11 DC Characteristics (Operating Conditions apply)1)
Parameter Symbol Limit Values Unit Test Condition
Min. Max.
Input low voltage TTL 
(all except XTAL1)
VIL SR -0.5 0.2 × VDDP 
- 0.1
V–
Input low voltage 
XTAL12)
VILC SR -0.5 0.3 × VDDI V–
Input low voltage
(Special Threshold)
VILS SR -0.5 0.45 × 
VDDP
V3)
Input high voltage TTL 
(all except XTAL1)
VIH SR 0.2 × VDDP 
+ 0.9
VDDP + 0.5 V –
Input high voltage 
XTAL12)
VIHC SR 0.7 × VDDI VDDI + 0.5 V –
Input high voltage
(Special Threshold)
VIHS SR 0.8 × VDDP 
- 0.2
VDDP + 0.5 V 3)
Input Hysteresis
(Special Threshold)
HYS 0.04 × 
VDDP
–VVDDP in [V], 
Series resis-
tance = 0 Ω3)
Output low voltage VOL CC – 1.0 V IOL ≤ IOLmax
4)
–0.45VIOL ≤ IOLnom
4)5)
Output high voltage6) VOH CC VDDP - 1.0 – V IOH ≥ IOHmax
4)
VDDP - 
0.45
–VIOH ≥ IOHnom
4)5)
Input leakage current
(Port 5)7)
IOZ1 CC – ±300 nA 0 V < VIN < VDDP, 
TA ≤ 125 °C
±200 nA 0 V < VIN < VDDP, 
TA ≤ 85 °C14)
Input leakage current
(all other8))7)
IOZ2 CC – ±500 nA 0.45 V < VIN < 
VDDP
Configuration pull-up 
current9)
ICPUH
10) –-10µAVIN = VIHmin
ICPUL
11) -100 – µAVIN = VILmax
Configuration pull-
down current12)
ICPDL
10) –10µAVIN = VILmax
ICPDH
11) 120 – µAVIN = VIHmin

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Electrical Parameters

Data Sheet 55 V1.1, 2006-08

Level inactive hold

current13)

ILHI

10) –-10µAVOUT = 0.5 ×

VDDP

Level active hold

current13)

ILHA

11) -100 – µAVOUT = 0.45 V

XTAL1 input current IIL CC – ±20 µA0 V < VIN < VDDI

Pin capacitance14)

(digital inputs/outputs)

CIO CC – 10 pF –

1) Keeping signal levels within the limits specified in this table, ensures operation without overload conditions.

For signal levels outside these specifications, also refer to the specification of the overload current IOV.

2) If XTAL1 is driven by a crystal, reaching an amplitude (peak to peak) of 0.4 × VDDI is sufficient.

3) This parameter is tested for P3, P4, P9.

4) The maximum deliverable output current of a port driver depends on the selected output driver mode, see

Table 12, Current Limits for Port Output Drivers. The limit for pin groups must be respected.

5) As a rule, with decreasing output current the output levels approach the respective supply level (VOL → VSS,

VOH → VDDP). However, only the levels for nominal output currents are guaranteed.

6) This specification is not valid for outputs which are switched to open drain mode. In this case the respective

output will float and the voltage results from the external circuitry.

7) An additional error current (IINJ) will flow if an overload current flows through an adjacent pin. Please refer to

the definition of the overload coupling factor KOV.

8) The driver of P3.15 is designed for faster switching, because this pin can deliver the reference clock for the

bus interface (CLKOUT). The maximum leakage current for P3.15 is, therefore, increased to 1 µA.

9) This specification is valid during Reset for configuration on RD, WR, EA, PORT0

10) The maximum current may be drawn while the respective signal line remains inactive.

11) The minimum current must be drawn to drive the respective signal line active.

12) This specification is valid during Reset for configuration on ALE.

13) This specification is valid during Reset for pins P4.3-0, which can act as CS outputs, and for P3.12.

14) Not subject to production test - verified by design/characterization.

Table 11 DC Characteristics (Operating Conditions apply)1) (cont’d)

Parameter Symbol Limit Values Unit Test Condition

Min. Max.

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Electrical Parameters

Data Sheet 56 V1.1, 2006-08

Table 12 Current Limits for Port Output Drivers

Port Output Driver

Mode

Maximum Output Current

(IOLmax, -IOHmax)1)

1) An output current above |IOXnom| may be drawn from up to three pins at the same time.

For any group of 16 neighboring port output pins the total output current in each direction (ΣIOL and Σ-IOH) must

remain below 50 mA.

Nominal Output Current

(IOLnom, -IOHnom)

Strong driver 10 mA 2.5 mA

Medium driver 4.0 mA 1.0 mA

Weak driver 0.5 mA 0.1 mA

Table 13 Power Consumption XC164CS (Operating Conditions apply)

Parameter Sym-

bol

Limit Values Unit Test Condition

Min. Max.

Power supply current (active)

with all peripherals active

IDDI – 10 +

3.0 × fCPU

mA fCPU in [MHz]1)2)

1) During Flash programming or erase operations the supply current is increased by max. 5 mA.

2) The supply current is a function of the operating frequency. This dependency is illustrated in Figure 11.

These parameters are tested at VDDImax and maximum CPU clock frequency with all outputs disconnected and

all inputs at VIL or VIH.

Pad supply current IDDP –5 mA

3) The pad supply voltage pins (VDDP) mainly provides the current consumed by the pin output drivers. A small

amount of current is consumed even though no outputs are driven, because the drivers’ input stages are

switched and also the Flash module draws some power from the VDDP supply.

Idle mode supply current

with all peripherals active

IIDX – 10 +

1.3 × fCPU

mA fCPU in [MHz]2)

Sleep and Power down mode

supply current caused by

leakage4)

4) The total supply current in Sleep and Power down mode is the sum of the temperature dependent leakage

current and the frequency dependent current for RTC and main oscillator (if active).

IPDL

5) This parameter is determined mainly by the transistor leakage currents. This current heavily depends on the

junction temperature (see Figure 13). The junction temperature TJ is the same as the ambient temperature TA

if no current flows through the port output drivers. Otherwise, the resulting temperature difference must be

taken into account.

– 128,000

× e-α

mA VDDI = VDDImax

TJ in [°C]

α =

4670 / (273 + TJ)

Sleep and Power down mode

supply current caused by

leakage and the RTC running,

clocked by the main oscillator4)

IPDM

7) – 0.6 +

0.02 × fOSC

+ IPDL

mA VDDI = VDDImax

fOSC in [MHz]

XC164-32

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Electrical Parameters

Data Sheet 57 V1.1, 2006-08

6) All inputs (including pins configured as inputs) at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP, all outputs (including

pins configured as outputs) disconnected. This parameter is tested at 25 °C and is valid for TJ ≥ 25 °C.

7) This parameter is determined mainly by the current consumed by the oscillator switched to low gain mode (see

Figure 12). This current, however, is influenced by the external oscillator circuitry (crystal, capacitors). The

given values refer to a typical circuitry and may change in case of a not optimized external oscillator circuitry.

XC164-32

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Electrical Parameters

Data Sheet 58 V1.1, 2006-08

Figure 11 Supply/Idle Current as a Function of Operating Frequency

I [mA]

fCPU [MHz]

10 20 30 40

IDDImax

IDDItyp

IIDXmax

IIDXtyp

100

120

140

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Electrical Parameters

Data Sheet 59 V1.1, 2006-08

Figure 12 Sleep and Power Down Supply Current due to RTC and Oscillator

Running, as a Function of Oscillator Frequency

Figure 13 Sleep and Power Down Leakage Supply Current as a Function of

Temperature

I [mA]

fOSC [MHz]

4 8 12 16

IPDMmax

IPDMtyp

1.0

2.0

3.0

0.1

[mA]

TJ [°C]

050 100 150

IPDL

0.5

1.0

1.5

-50

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Electrical Parameters

Data Sheet 60 V1.1, 2006-08

4.3 Analog/Digital Converter Parameters

Table 14 A/D Converter Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit Test

Condition

Min. Max.

Analog reference supply VAREF SR 4.5 VDDP

+ 0.1

V1)

1) TUE is tested at VAREF = VDDP + 0.1 V, VAGND = 0 V. It is verified by design for all other voltages within the

defined voltage range.

If the analog reference supply voltage drops below 4.5 V (i.e. VAREF ≥ 4.0 V) or exceeds the power supply

voltage by up to 0.2 V (i.e. VAREF = VDDP + 0.2 V) the maximum TUE is increased to ±3 LSB. This range is not

subject to production test.

The specified TUE is guaranteed only, if the absolute sum of input overload currents on Port 5 pins (see IOV

specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the respective period of

time. During the reset calibration sequence the maximum TUE may be ±4 LSB.

Analog reference ground VAGND SR VSS - 0.1 VSS + 0.1 V –

Analog input voltage range VAIN SR VAGND VAREF V2)

2) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these

cases will be X000H or X3FFH, respectively.

Basic clock frequency fBC 0.5 20 MHz 3)

Conversion time for 10-bit

result4)

tC10P CC 52 × tBC + tS + 6 × tSYS – Post-calibr. on

tC10 CC 40 × tBC + tS + 6 × tSYS – Post-calibr. off

Conversion time for 8-bit

result4)

tC8P CC 44 × tBC + tS + 6 × tSYS – Post-calibr. on

tC8 CC 32 × tBC + tS + 6 × tSYS – Post-calibr. off

Calibration time after reset tCAL CC 484 11,696 tBC

Total unadjusted error TUE CC – ±2LSB

Total capacitance

of an analog input

CAINT CC – 15 pF 6)

Switched capacitance

of an analog input

CAINS CC – 10 pF 6)

Resistance of

the analog input path

RAIN CC – 2 kΩ6)

Total capacitance

of the reference input

CAREFT CC – 20 pF 6)

Switched capacitance

of the reference input

CAREFS CC – 15 pF 6)

Resistance of

the reference input path

RAREF CC – 1 kΩ6)

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Electrical Parameters

Data Sheet 61 V1.1, 2006-08

Figure 14 Equivalent Circuitry for Analog Inputs

3) The limit values for fBC must not be exceeded when selecting the peripheral frequency and the ADCTC setting.

4) This parameter includes the sample time tS, the time for determining the digital result and the time to load the

result register with the conversion result (tSYS = 1/fSYS).

Values for the basic clock tBC depend on programming and can be taken from Table 15.

When the post-calibration is switched off, the conversion time is reduced by 12 x tBC.

5) The actual duration of the reset calibration depends on the noise on the reference signal. Conversions

executed during the reset calibration increase the calibration time. The TUE for those conversions may be

increased.

6) Not subject to production test - verified by design/characterization.

The given parameter values cover the complete operating range. Under relaxed operating conditions

(temperature, supply voltage) reduced values can be used for calculations. At room temperature and nominal

supply voltage the following typical values can be used:

CAINTtyp = 12 pF, CAINStyp = 7 pF, RAINtyp = 1.5 kΩ, CAREFTtyp = 15 pF, CAREFStyp = 13 pF, RAREFtyp = 0.7 kΩ.

A/D Converter

MCS05570

Source

AIN

Ext

AINT

AINS

AIN, On

AINS

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Electrical Parameters

Data Sheet 62 V1.1, 2006-08

Sample time and conversion time of the XC164CS’s A/D Converter are programmable.

In compatibility mode, the above timing can be calculated using Table 15.

The limit values for fBC must not be exceeded when selecting ADCTC.

Converter Timing Example:

Table 15 A/D Converter Computation Table1)

1) These selections are available in compatibility mode. An improved mechanism to control the ADC input clock

can be selected.

ADCON.15|14

(ADCTC)

A/D Converter

Basic Clock fBC

ADCON.13|12

(ADSTC)

Sample Time

00 fSYS / 4 00 tBC × 8

01 fSYS / 2 01 tBC × 16

10 fSYS / 16 10 tBC × 32

11 fSYS / 8 11 tBC × 64

Assumptions: fSYS = 40 MHz (i.e. tSYS = 25 ns), ADCTC = ‘01’, ADSTC = ‘00’

Basic clock fBC = fSYS / 2 = 20 MHz, i.e. tBC = 50 ns

Sample time tS= tBC × 8 = 400 ns

Conversion 10-bit:

With post-calibr. tC10P = 52 × tBC + tS + 6 × tSYS = (2600 + 400 + 150) ns = 3.15 µs

Post-calibr. off tC10 = 40 × tBC + tS + 6 × tSYS = (2000 + 400 + 150) ns = 2.55 µs

Conversion 8-bit:

With post-calibr. tC8P = 44 × tBC + tS + 6 × tSYS = (2200 + 400 + 150) ns = 2.75 µs

Post-calibr. off tC8 = 32 × tBC + tS + 6 × tSYS = (1600 + 400 + 150) ns = 2.15 µs

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Electrical Parameters

Data Sheet 63 V1.1, 2006-08

4.4 AC Parameters

4.4.1 Definition of Internal Timing

The internal operation of the XC164CS is controlled by the internal master clock fMC.

The master clock signal fMC can be generated from the oscillator clock signal fOSC via

different mechanisms. The duration of master clock periods (TCMs) and their variation

(and also the derived external timing) depend on the used mechanism to generate fMC.

This influence must be regarded when calculating the timings for the XC164CS.

Figure 15 Generation Mechanisms for the Master Clock

Note: The example for PLL operation shown in Figure 15 refers to a PLL factor of 1:4,

the example for prescaler operation refers to a divider factor of 2:1.

The used mechanism to generate the master clock is selected by register PLLCON.

MCT05555

Phase Locked Loop Operation (1:N)

OSC

Direct Clock Drive (1:1)

Prescaler Operation (N:1)

OSC

TCM

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Electrical Parameters

Data Sheet 64 V1.1, 2006-08

CPU and EBC are clocked with the CPU clock signal fCPU. The CPU clock can have the

same frequency as the master clock (fCPU = fMC) or can be the master clock divided by

two: fCPU = fMC / 2. This factor is selected by bit CPSYS in register SYSCON1.

The specification of the external timing (AC Characteristics) depends on the period of the

CPU clock, called “TCP”.

The other peripherals are supplied with the system clock signal fSYS which has the same

frequency as the CPU clock signal fCPU.

Bypass Operation

When bypass operation is configured (PLLCTRL = 0xB) the master clock is derived from

the internal oscillator (input clock signal XTAL1) through the input- and output-

prescalers:

fMC = fOSC / ((PLLIDIV+1) × (PLLODIV+1)).

If both divider factors are selected as ‘1’ (PLLIDIV = PLLODIV = ‘0’) the frequency of fMC

directly follows the frequency of fOSC so the high and low time of fMC is defined by the duty

cycle of the input clock fOSC.

The lowest master clock frequency is achieved by selecting the maximum values for both

divider factors:

fMC = fOSC / ((3 + 1) × (14 + 1)) = fOSC / 60.

Phase Locked Loop (PLL)

When PLL operation is configured (PLLCTRL = 11B) the on-chip phase locked loop is

enabled and provides the master clock. The PLL multiplies the input frequency by the

factor F (fMC = fOSC × F) which results from the input divider, the multiplication factor, and

the output divider (F = PLLMUL+1 / (PLLIDIV+1 × PLLODIV+1)). The PLL circuit

synchronizes the master clock to the input clock. This synchronization is done smoothly,

i.e. the master clock frequency does not change abruptly.

Due to this adaptation to the input clock the frequency of fMC is constantly adjusted so it

is locked to fOSC. The slight variation causes a jitter of fMC which also affects the duration

of individual TCMs.

The timing listed in the AC Characteristics refers to TCPs. Because fCPU is derived from

fMC, the timing must be calculated using the minimum TCP possible under the respective

circumstances.

The actual minimum value for TCP depends on the jitter of the PLL. As the PLL is

constantly adjusting its output frequency so it corresponds to the applied input frequency

(crystal or oscillator) the relative deviation for periods of more than one TCP is lower than

for one single TCP (see formula and Figure 16).

This is especially important for bus cycles using waitstates and e.g. for the operation of

timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train

XC164-32

Derivatives

Electrical Parameters

Data Sheet 65 V1.1, 2006-08

generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter

is negligible.

The value of the accumulated PLL jitter depends on the number of consecutive VCO

output cycles within the respective timeframe. The VCO output clock is divided by the

output prescaler (K = PLLODIV+1) to generate the master clock signal fMC. Therefore,

the number of VCO cycles can be represented as K ×N, where N is the number of

consecutive fMC cycles (TCM).

For a period of N × TCM the accumulated PLL jitter is defined by the deviation DN:

DN [ns] = ±(1.5 + 6.32 × N / fMC); fMC in [MHz], N = number of consecutive TCMs.

So, for a period of 3 TCMs @ 20 MHz and K = 12: D3 = ±(1.5 + 6.32 × 3 / 20) = 2.448 ns.

This formula is applicable for K × N < 95. For longer periods the K × N = 95 value can be

used. This steady value can be approximated by: DNmax [ns] = ±(1.5 + 600 / (K × fMC)).

Figure 16 Approximated Accumulated PLL Jitter

Note: The bold lines indicate the minimum accumulated jitter which can be achieved by

selecting the maximum possible output prescaler factor K.

Different frequency bands can be selected for the VCO, so the operation of the PLL can

be adjusted to a wide range of input and output frequencies:

MCD05566

±1

±2

±3

±4

±5

±6

±7

±8

Acc. jitter DN

051015 20 25

ns K = 15

K = 12

K = 10

K = 8

K = 6 K = 5

10 MHz

20 MHz

40 MHz

XC164-32

Derivatives

Electrical Parameters

Data Sheet 66 V1.1, 2006-08

Table 16 VCO Bands for PLL Operation1)

1) Not subject to production test - verified by design/characterization.

PLLCON.PLLVB VCO Frequency Range Base Frequency Range

00 100 … 150 MHz 20 … 80 MHz

01 150 … 200 MHz 40 … 130 MHz

10 200 … 250 MHz 60 … 180 MHz

11 Reserved

XC164-32

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Electrical Parameters

Data Sheet 67 V1.1, 2006-08

4.4.2 On-chip Flash Operation

The XC164CS’s Flash module delivers data within a fixed access time (see Table 17).

Accesses to the Flash module are controlled by the PMI and take 1 + WS clock cycles,

where WS is the number of Flash access waitstates selected via bitfield WSFLASH in

time tACC of the Flash array. Therefore, the required Flash waitstates depend on the

available speed grade as well as on the actual system frequency.

Note: The Flash access waitstates only affect non-sequential accesses. Due to

prefetching mechanisms, the performance for sequential accesses (depending on

the software structure) is only partially influenced by waitstates.

In typical applications, eliminating one waitstate increases the average

performance by 5% … 15%.

Example: For an operating frequency of 40 MHz (clock cycle = 25 ns), Standard devices

must be operated with 2 waitstates: ((2 + 1) × 25 ns) ≥ 70 ns.

Grade A devices can be operated with 1 waitstate: ((1 + 1) × 25 ns) ≥ 50 ns.

Table 18 indicates the interrelation of waitstates, system frequency, and speed grade.

Note: The maximum achievable system frequency is limited by the properties of the

respective derivative, i.e. 40 MHz (or 20 MHz for xxx-32F20F devices).

Table 17 Flash Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit

Min. Typ. Max.

Flash module access time (Standard) tACC CC – – 701)

1) The actual access time is also influenced by the system frequency, so the frequency ranges are not fully linear.

See Table 18.

Flash module access time (Grade A) tACC CC – – 501) ns

Programming time per 128-byte block tPR CC – 22)

2) Programming and erase time depends on the system frequency. Typical values are valid for 40 MHz.

5ms

Erase time per sector tER CC – 2002) 500 ms

Table 18 Flash Access Waitstates

Required Waitstates Frequency Range for

Standard Flash Speed

Frequency Range for

Flash Speed Grade A

0 WS (WSFLASH = 00B)fCPU ≤ 16 MHz fCPU ≤ 20 MHz

1 WS (WSFLASH = 01B)fCPU ≤ 28 MHz fCPU ≤ 40 MHz

2 WS (WSFLASH = 10B)fCPU ≤ 40 MHz fCPU ≤ 40 MHz

XC164-32

Derivatives

Electrical Parameters

Data Sheet 68 V1.1, 2006-08

4.4.3 External Clock Drive XTAL1

Figure 17 External Clock Drive XTAL1

Note: If the on-chip oscillator is used together with a crystal or a ceramic resonator, the

oscillator frequency is limited to a range of 4 MHz to 16 MHz.

It is strongly recommended to measure the oscillation allowance (negative

resistance) in the final target system (layout) to determine the optimum

parameters for the oscillator operation. Please refer to the limits specified by the

crystal supplier.

When driven by an external clock signal it will accept the specified frequency

range. Operation at lower input frequencies is possible but is verified by design

only (not subject to production test).

Table 19 External Clock Drive Characteristics (Operating Conditions apply)

Parameter Symbol Limit Values Unit

Min. Max.

Oscillator period tOSC SR 25 2501)

1) The maximum limit is only relevant for PLL operation to ensure the minimum input frequency for the PLL.

High time2)

2) The clock input signal must reach the defined levels VILC and VIHC.

t1SR6–ns

Low time2) t2SR6–ns

Rise time2) t3SR–8ns

Fall time2) t4SR–8ns

MCT05572

OSC

0.5

DDI

ILC

IHC

XC164-32

Derivatives

Electrical Parameters

Data Sheet 69 V1.1, 2006-08

4.4.4 Testing Waveforms

Figure 18 Input Output Waveforms

Figure 19 Float Waveforms

MCD05556

0.45 V

0.8 V

2.0 V Input Signal

(driven by tester)

Output Signal

(measured)

Hold time

Output delay Output delay

Hold time

Output timings refer to the rising edge of CLKOUT.

Input timings are calculated from the time, when the input signal reaches

VIH or VIL, respectively.

MCA05565

Timing

Reference

Points

VLoad

+ 0.1 V

VLoad

- 0.1 V

VOH

- 0.1 V

VOL

+ 0.1 V

For timing purposes a port pin is no longer floating when a 100 mV

change from load voltage occurs, but begins to float when a 100 mV

change from the loaded

VOH

VOL

level occurs (

IOH

IOL

= 20 mA).

XC164-32

Derivatives

Electrical Parameters

Data Sheet 70 V1.1, 2006-08

4.4.5 External Bus Timing

Figure 20 CLKOUT Signal Timing

Table 20 CLKOUT Reference Signal

Parameter Symbol Limit Values Unit

Min. Max.

CLKOUT cycle time tc5CC 40/30/251)

1) The CLKOUT cycle time is influenced by the PLL jitter (given values apply to fCPU = 25/33/40 MHz).

For longer periods the relative deviation decreases (see PLL deviation formula).

CLKOUT high time tc6CC8–ns

CLKOUT low time tc7CC6–ns

CLKOUT rise time tc8CC–4ns

CLKOUT fall time tc9CC–4ns

MCT05571

CLKOUT

XC164-32

Derivatives

Electrical Parameters

Data Sheet 71 V1.1, 2006-08

Variable Memory Cycles

External bus cycles of the XC164CS are executed in five subsequent cycle phases (AB,

C, D, E, F). The duration of each cycle phase is programmable (via the TCONCSx

registers) to adapt the external bus cycles to the respective external module (memory,

peripheral, etc.).

This table provides a summary of the phases and the respective choices for their

duration.

Note: The bandwidth of a parameter (minimum and maximum value) covers the whole

operating range (temperature, voltage) as well as process variations. Within a

given device, however, this bandwidth is smaller than the specified range. This is

also due to interdependencies between certain parameters. Some of these

interdependencies are described in additional notes (see standard timing).

Table 21 Programmable Bus Cycle Phases (see timing diagrams)

Bus Cycle Phase Parameter Valid Values Unit

Address setup phase, the standard duration of this

phase (1 … 2 TCP) can be extended by 0 … 3 TCP

if the address window is changed

tpAB 1 … 2 (5) TCP

Command delay phase tpC0 … 3 TCP

Write Data setup/MUX Tristate phase tpD0 … 1 TCP

Access phase tpE1 … 32 TCP

Address/Write Data hold phase tpF0 … 3 TCP

XC164-32

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Electrical Parameters

Data Sheet 72 V1.1, 2006-08

Note: The shaded parameters have been verified by characterization.

They are not subject to production test.

Table 22 External Bus Cycle Timing (Operating Conditions apply)

Parameter Symbol Limit Values Unit

Min. Max.

Output valid delay for:

RD, WR(L/H)

tc10 CC 115ns

Output valid delay for:

BHE, ALE

tc11 CC -1 8 ns

Output valid delay for:

A23 … A16, A15 … A0 (on PORT1)

tc12 CC 318ns

Output valid delay for:

A15 … A0 (on PORT0)

tc13 CC 318ns

Output valid delay for:

tc14 CC 316ns

Output valid delay for:

D15 … D0 (write data, MUX-mode)

tc15 CC 319ns

Output valid delay for:

D15 … D0 (write data, DEMUX-mode)

tc16 CC 216ns

Output hold time for:

RD, WR(L/H)

tc20 CC -3 4ns

Output hold time for:

BHE, ALE

tc21 CC 0 11 ns

Output hold time for:

A23 … A16, A15 … A0 (on PORT0)

tc23 CC 1 13 ns

Output hold time for:

tc24 CC -2 4ns

Output hold time for:

D15 … D0 (write data)

tc25 CC 1 13 ns

Input setup time for:

D15 … D0 (read data)

tc30 SR 29 – ns

Input hold time

D15 … D0 (read data)1)

1) Read data are latched with the same (internal) clock edge that triggers the address change and the rising edge

of RD. Therefore address changes before the end of RD have no impact on (demultiplexed) read cycles. Read

data can be removed after the rising edge of RD.

tc31 SR -5 – ns

XC164-32

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Electrical Parameters

Data Sheet 73 V1.1, 2006-08

Figure 21 Multiplexed Bus Cycle

CLKOUT

tpAB tpCtp Dtp EtpF

ALE

tc21

tc11

A23-A16,

BHE, CSx

tc11

tc14

WR(L/H)

tc20

tc10

Data In

AD15-AD0

(read)

tc30

tc31

MCT05557

AD15-AD0

(write)

tc13 tc15 tc25

tc13 tc23

Data OutLow Address

High Address

Low Address

XC164-32

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Electrical Parameters

Data Sheet 74 V1.1, 2006-08

Figure 22 Demultiplexed Bus Cycle

Address

tpAB tp CtpDtp EtpF

tc21

tc11

tc14

tc20

tc10

Data In

tc30

tc31

MCT05558

tc16 tc25

CLKOUT

ALE

A23-A0,

BHE, CSx

WR(L/H)

D15-D0

(read)

D15-D0

(write) Data Out

XC164-32

Derivatives

Package and Reliability

Data Sheet 75 V1.1, 2006-08

5 Package and Reliability

5.1 Packaging

Table 23 Package Parameters

Parameter Symbol Limit Values Unit Notes

Min. Max.

Green Package PG-TQFP-100-5

Thermal resistance

junction to case

RΘJC –8K/W–

Thermal resistance

junction to leads

RΘJL –31K/W–

Standard Package P-TQFP-100-16

Thermal resistance

junction to case

RΘJC –7K/W–

Thermal resistance

junction to leads

RΘJL –23K/W–

XC164-32

Derivatives

Package and Reliability

Data Sheet 76 V1.1, 2006-08

Package Outlines

Figure 23 PG-TQFP-100-5 (Plastic Green Thin Quad Flat Package)

GPP05614

Index Marking

100 1

1) Does not include plastic or metal protrusion of 0.25 max. per side

0.5

24 x 0.5 = 12

0.22±0.05 100x0.08 DA-B C

Seating Plane

STAND OFF

±0.05

0.1

±0.05

1.4

1.6 MAX

0.08 C100x

Coplanarity

14 H

0.2 A-B D 4x

16 100x0.2 A-B D

12˚

0.2 MIN.

±0.15

0.6

(1)

0˚...7˚

0.15

+0.05

-0.06

XC164-32

Derivatives

Package and Reliability

Data Sheet 77 V1.1, 2006-08

Figure 24 P-TQFP-100-16 (Plastic - Thin Quad Flat Package)

Index Marking

100 1

0.22

±0.05

0.5

±0.05

14 0.1

100x

0.08 A-B

A-B

0.2

4xH

100x

1.4

1.6 MAX.

0.08

±0.05

0.6

±0.15

0.15

7˚

+0.05

-0.06

MAX.

Does not include plastic or metal protrusion of 0.25 max. per side

Does not include dambar protrusion of 0.08 max. per side at max. material condition

GPP09189

You can find all of our packages, sorts of packing and others in our

Infineon Internet Page “Products”: http://www.infineon.com/products.Dimensions in mm

XC164-32

Derivatives

Package and Reliability

Data Sheet 78 V1.1, 2006-08

5.2 Flash Memory Parameters

The data retention time of the XC164CS’s Flash memory (i.e. the time after which stored

data can still be retrieved) depends on the number of times the Flash memory has been

erased and programmed.

Table 24 Flash Parameters (XC164CS, 256 Kbytes)

Parameter Symbol Limit Values Unit Notes

Min. Max.

Data retention time tRET 15 – years Max. 103

erase/program

cycles

Flash Erase Endurance NER 20 ×103––Max. data

retention time

5years

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