1Sheet: DG-085021
July 30, 2008
©SHARP Corporation
GM1BW78140A
GM1BW78140A High Brightness Chip LED (White)
Notice The content of this data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
■Features
1. High brightness (39 lm @ 150 mA)
2. White Color (achieved via InGaN Blue LED chips in
combination with Yellow Phosphor)
3. Four-chip light source
4. Compact Package
5. Size: 2.64 × 1.64 × 0.7 mm
■Agency Approvals/Compliance
1. RoHS compliant
■Applications
1. General Indoor Illumination
2. Lighting
a. Commercial
b. Industrial
c. Architectural
d. Portable and Personal
3. Backlighting
4. Reading Lamps
Sheet No. DG-085021
July 30, 2008
2
GM1BW78140A
■External Dimensions
Equivalent Circuit
1
1
1
1
2
Anode
White
Cathode
No. Name
Pin Arrangement
NOTES:
1. Units: mm
2. Unspecified tolerence: ±0.2 mm
3. ( ): Reference dimensions
2
2
2
1.64
(1.44)
2.64
(0.64)(0.90)
(0.90)
(2.44)
0.70
GM1BW78140A-1
Sheet No. DG-085021
July 30, 2008
3
GM1BW78140A
■Absolute Maximum Ratings
*1 Operating Current values follow the Derating Curves.
*2 Cathode temperature is measured on the back of the chip pad.
*3 Do not exceed specified temperature range under any packing condition.
*4 This device uses the solder pads for heat sinking, therefore the
Operating Temperature range is prescribed by Tc.
■Electro-optical Characteristics
*1 Measured by EG&G Model 550 (Radiometer/Photometer) after 20 ms drive (Tolerance: ±15%) Also see Luminous Intensity Ranking.
*2 Monitored by 6-inch integrating sphere of Sharp Standard. Product mounted on special substrate for monitoring.
*3 Measured by Otsuka Electronics Model MCPD-LE3400 (Tolerance: x, y: ±0.02) Also see Chromaticity Ranking.
*4 Parenthesis indicates reference values.
■Derating Curve
Parameter Symbol Rating Unit
Power dissipation *1 P 840 mW
Forward current *1 IF200 mA
Reverse voltage VR-5 V
Operating temperature *2 Tc -30 to +85 °C
Storage temperature*3 Tstg -40 to +100 °C
Soldering temperature *4 Tsol 250 °C
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage VF
IF = 150 mA
3.5 4.2 V
Luminous intensity *1 Iv 4.8 9.5 cd
Luminous flux *2 φv(20)(39)lm
Chromaticity coordinates *3 x0.35
y0.36
Reverse current IRVR = 4 V 100 µA
Fig. 1 Forward Current vs.
Cathode Temperature
250
200
150
100
50
0
-30 -5 20 45
Cathode Temperature Tc (°C)
Forward Current IF (mA)
70 95
75
GM1BW78140A-3
Fig. 2 Thermal Resistance
Tj Tc Ta
Junction
NOTES:
Junction to Cathode: 25°C/W (Reference)
Cathode to Ambient: Thermal resistance
will vary depending on substrate structure
Cathode Terminal
Ambient
GM1BW78140A-4
1
1
2
2
Tc = 25°C
Tc = 25°C
Sheet No. DG-085021
July 30, 2008
4
GM1BW78140A
■Characteristic Diagrams (TYP.*)
Characteristics data are typical data and are not guaranteed data.
Fig. 3 Luminous Intensity
vs. Forward Current
Fig. 4 Forward Current vs. Forward Voltage
14.0 Tc = 25°C
12.0
10.0
8.0
6.0
4.0
2.0
0.0 04080
Forward Current IF (mA)
Luminous Intensity (cd)
120 160 200
GM1BW78140A-5
Tc = 25°C
200
160
120
80
40
0
0.0 1.0 2.0 3.0 4.0 5.0
Forward Voltage V
F
(V)
Forward Current I
F
(mA)
GM1BW78140A-6
Fig. 5 Relative Luminous Intensity vs.
Cathode Temperature
Fig. 6 Forward Voltage vs.
Cathode Temperature
1000
100
10
-40 -20 0 20 40 60 80 100
Cathode Temperature Tc (°C)
Relative Luminous Intensity (%)
GM1BW78140A-7
5.0
4.0
3.0
2.0
Forward Voltage V
F
(V)
-40 -20 0 20 40 60 80 100
Cathode Temperature Tc (°C)
GM1BW78140A-8
Sheet No. DG-085021
July 30, 2008
5
GM1BW78140A
●Luminous Intensity Ranking
NOTE: Quantities in each ranking are decided by Sharp.
●Chromaticity Ranking
NOTE: Quantities in each ranking are decided by Sharp. Tolerance: ±0.02
Fig. 7 Chromaticity vs.
Cathode Temperature
0.320 0.330 0.340 0.350 0.360 0.370
x
y
0.370
0.365
0.360
0.355
0.350
0.345
0.340
GM1BW78140A-9
25°C
0°C
40°C
60°C
85°C
-30°C
Fig. 8 Relative Illuminance vs.
Viewing Angle
90°
-100 -50 50 1000
60°
30°
0°
30°
60°
90°
Radiant Pattern
Relative Illuminance
X-Axis
Y-Axis
Top View
GM1BW78140A-10
Rank Luminous Intensity Unit Condition
A 4.8 to 11 cd IF = 150 mA
B 8.2 and up
Rank Point 1 Point 2 Point 3 Point 4
xyxyxyxy
a 0.333 0.395 0.333 0.361 0.321 0.351 0.319 0.381
b 0.350 0.411 0.347 0.374 0.333 0.361 0.333 0.395
c 0.372 0.429 0.365 0.388 0.347 0.374 0.350 0.411
d 0.400 0.449 0.388 0.404 0.365 0.388 0.372 0.429
e 0.333 0.361 0.332 0.331 0.323 0.323 0.321 0.351
f 0.347 0.374 0.344 0.341 0.332 0.331 0.333 0.361
g 0.365 0.388 0.359 0.352 0.344 0.341 0.347 0.374
h 0.388 0.404 0.377 0.364 0.359 0.352 0.365 0.388
Sheet No. DG-085021
July 30, 2008
6
GM1BW78140A
■Tape Specifications
Fig. 9 Chromaticity Diagram
Fig. 10 Tape Shape and Dimensions
t1
W1
W0
P2D0P0
P1
A
Cathode
E
F
B
t2
t3
GM1BW78140A-13
Sheet No. DG-085021
July 30, 2008
7
GM1BW78140A
■Tape Dimension Specifications
Parameter Symbol Dimension
(mm) Remarks
Concave rectangular
pocket for parts insertion
Vertical A 1.85 Dimension excludes corner R at the bottom inside
Horizontal B 2.85
Pitch P14.0
Round sprocket hole
Diameter D01.5
Pitch P04.0 Accumulated error ±0.5 mm/10 pitch
Position E 1.75 Distance between the edge of the tape and center of the hole
Center to center distance Vertical P22.0 Distance between center line of the concave square hole and
round sprocket hole
Horizontal F 3.5
Cover tape Width W15.5
Thickness t30.1
Carrier tape Width W08.0
Thickness t10.25
Overall thickness t21.3 Combines cover tape and carrier tape
Sheet No. DG-085021
July 30, 2008
8
GM1BW78140A
■Reel Specifications
■Reel Dimension Specifications
*1 Label on side of flange: part name, quantity, lot number.
*2 Material: described on flange.
Fig. 11 Reel Shape and Dimensions
Parameter Symbol Dimension (mm) Remarks
Flange
Diameter A 180
Thickness t 1.3
Flange spacing W 9.5 Dimension of shaft core
Hub
External diameter B 60
Spindle hole diameter C 13
Key slit width E 2.0
Key slit depth U 4.0
0.8
0.6
0.4
0.2
EU
Label
t
W
B
.160Q/+#4#0-ޓ
ޓޓޓޛ'+#,%ޜ/#&'+02*+.+22+0'5
SHARP CORPORATION
PART No. GM1BW78140A
QUANTITY 4000
A
C
GM1BW78140A-14
Sheet No. DG-085021
July 30, 2008
9
GM1BW78140A
■Taping Specifications
1. Leader tape standard: JIS C0806
2. Cover tape peel resistance: F = 0.1 to 1.0 N (θ = 10° or less). See Fig. 10.
3. Tape bending resistance: Cover tape will remain in place on radii of 30 mm or more. Under 30 mm radii,
the cover may separate.
4. Joints are not allowed in the cover tape.
5. Parts are packed with an average quantity of 4000 pieces per reel.
6. Product mass: 8 mg (approximately)
7. Sharp guarantees the following:
a. No contiguous empty spaces in the tape
b. Missing parts will not make up more than 0.1% of the total quantity.
c. Parts will be easily removed from the packing.
8. Parts will not stick to the cover tape as it is peeled.
Fig. 12 Leader Tape
Fig. 13 Tape Separation
Empty Stuffed
40 mm MIN.
Leading (Empty)
400 mm MIN.
Pull out
GM1BW78140A-15
Cover tape
Forward Carrier tape
F
Tape speed: 5 mm/s
θ = 0 ~ 10°
GM1BW78140A-16
Sheet No. DG-085021
July 30, 2008
10
GM1BW78140A
■Label and Marking Information
Fig. 14 Label Contents
SHARP CORPORATION
PART No. GM1BW78140A φPart number
Quantity
EIAJ C-3 Bar code
EIAJ C-3 Bar code
Lot number and rank
Production country (Japan or Philipines)
QUANTITY 4000 φ
φ
φ
LOT No. MI08A01 RANK φ
φ
ޓޓޓޛEIAJ C-3ޜMADE INޓPHILIPPINES
Production plant code (alphabetically)
Production year (the last two digits of the year)
Production date (01 ~ 31)
Rank : : Luminous intensity rank
: Chromaticity coordinates rank
Production month
(alphabetically with January corresponding to A)
1
2
3
4
LOT Number
MI A0 10 8
4321
GM1BW78140A-17
Sheet No. DG-085021
July 30, 2008
11
GM1BW78140A
■Design Notes
1. This product is not designed to resist electromagnetic and ionized-particle radiation. Moreover, it is not designed
to directly resist excessive moisture, such as dew or condensation; or corrosive (salt) air or corrosive gases,
such as Cl, H2S, NH3, SO2, NOX.
2. Do not allow the circuit design to apply any reverse voltage to the LEDs at any time, operating or not. Do not
bias this part in any manner when it is not operating.
3. Sharp recommends using a constant-current supply to drive this part, as a constant-voltage supply may over-
drive the part due to the lowering of VF as the part’s temperature rises. If current beyond this part’s maximum
rating is allowed to flow through it, it may short-circuit; causing excess heat, smoke, or even fire. An overcurrent
circuit is recommended to avoid this, as well as overvoltage protection. Always follow safety standards and reg-
ulations where this device will be applied.
4. This part can be easily damaged by external stress. Make sure it is not mechanically stressed during or after
assembly. The emitting area is sealed with a silicone resin, which is particularly vulnerable to pressure from pick-
and-place equipment. Excessive pressure applied to the sealing resin can cause the underlying structure of the
part to debond or break entirely. Sharp recommends the use of a plastic collet (Teflon preferred) to protect parts
from excess stress.
5. This product uses a blue LED chip in combination with yellow phosphor to achieve its color. There may be some
color change caused by afterglow of the phosphor when driving this part with pulsed power. Heating and level
of current when in operation may also change the color slightly. Verify this part’s performance before use.
6. This part has exposed metal in bands along the side. See Fig. 15. Avoid touching this area when mounting it to
the substrate, and do not allow other conductive elements from the design to contact it.
7. This part has a very high light output. Looking directly at it during full power output can cause injury.
8. Sharp recommends taking proper personal and environmental static control precautions when handling this part.
9. Materials of high thermal conductivity are incorporated in this device to allow generated heat to be effectively
transferred from it to the circuit board. For best reliability, Sharp recommends against locating other sources of
heat near the LED, and to incorporate good thermal design practices and verification to maximize the part’s life.
10. Sharp recommends handling these parts in a clean, non-dusty environment since surface dust may be difficult
to remove and can affect the optical performance of the part.
11. Sharp recommends confirming the part’s performance, reliability, and resistance to any of these conditions, if it
is to be used in any of these environments:
• Direct sunlight, outdoor exposure, dusty conditions
• In water, oil, medical fluids, and organic solvents
• Excessive moisture, such as dew or condensation
• Corrosive (salt) air or corrosive gases, such as Cl, H2S, NH3, SO2, NOX
Fig. 15 Non-contact Areas
Resin
Metal Plate
GM1BW78140A-19
Sheet No. DG-085021
July 30, 2008
12
GM1BW78140A
■Manufacturing Guidelines
●Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use.
See Fig. 16.
2. Store these parts between 5°C and 30°C, at a relative humidity of less than 70%; for no longer than 1 year after
the manufacture date.
3. After breaking the package seal, maintain the environment within 5°C to 30°C, at a relative humidity of less than
60%. Solder the parts within 3 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
Parts may be stored up to one year under these conditions.
5. If the parts are exposed to air for more than 2 days, or if the silica gel telltale indicates moisture contamination,
bake the parts:
• When in the tape carrier, bake them at a temperature of 60°C to 65°C, for 36 to 48 hours.
• When loose or on a PCB, bake them at a temperature of 100°C to 120°C, for at least 12 hours.
• Note that the reels may become distorted if they are in a stack when baking. Confirm that the parts have cooled
to room temperature after baking.
Fig. 16 Factory Moisture-proof Packaging
Aluminum
package
Silica gel
Reel
Label (EIAJ C-3 compliant label)
Label
GM1BW78140W-18
Sheet No. DG-085021
July 30, 2008
13
GM1BW78140A
●Cleaning Instructions
1. Sharp does not recommend cleaning printed circuit boards containing this device. Process chemicals will affect
the structural and optical characteristics of this device.
2. Use solder paste that does not require cleaning.
●Soldering Instructions
1. When soldering with reflow methods, Sharp recommends following the soldering profile in Fig. 17.
2. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
3. When using a second reflow, the second process should be carried out as soon as possible after the first, and
within three days.
4. Electrodes on this part are silver-plated. If the part is exposed to a corrosive environment, the plating may be
damaged, thereby affecting solderability.
5. The Reflow Profile shown in Fig. 17 should be considered as a set of maximum parameters. Since this part uses
the leads for heatsinking, the peak temperature should be kept as cool as possible and the cooldown period
lengthened as much as possible. Thermal conduction into the LED will be affected by the performance of the
reflow process, so verification of the reflow process is recommended.
6. These parts may be used in a nitrogen reflow process, but may not be dip-soldered.
7. When repairing boards containing this part, preheat it from room temperature at such a rate that it reaches
100°C after 90 s ±30 s; then solder at a temperature between 250°C and 260°C; and within 10 seconds.
Fig. 17 Temperature Profile
250 MAX.
25
Time (second)
220
5 s MAX.
55 s MAX.
90 ~ 120s
1 ~ 4°C/s 1 ~ 4°C/s
Temperature (°C)
180 to 200
GM1BW78140W-20
1 ~ 4°C/s
Sheet No. DG-085021
July 30, 2008
14
GM1BW78140A
●Recommended Solder Pad Design
1. Solderability depends on reflow conditions, solder paste, and circuit board materials. Check the entire process
before production commences.
2. Fig. 18 shows the recommended solder pattern for this part.
3. When using a second reflow, Sharp recommends checking the process carefully: board warping from heat can
cause mechanical failure in these parts, in addition to the high heat conducted into the part through the connec-
tions.
●Presence of ODCs
This product shall not contain the following materials, and they are not used in the production process for this
product:
• Regulated substances: CFCs, Halon, Carbon tetrachloride, and 1,1,1-Trichloroethane (Methylchloroform).
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
• Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl
ethers (PBDE).
Fig. 18 Recommended Solder Pad Design
0.90
NOTE: Units: mm
0.64
1.44
GM1BW78140A-21
■Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP’s devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data materials, struc-
ture, and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment (terminal)
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliabilty such as:
--- Transportation control and safety equipment
(i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high
level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment (trunk lines)
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.
scuba)
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or
in part, without the express written permission of
SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
Sheet No. DG-085021
July 30, 2008
15
GM1BW78140A