Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 MAC08BT1, MAC08MT1 Pb Description Designed for high volume, low cost, industrial and consumer applications such as motor control; process control; temperature, light and speed control. Features * Sensitive Gate Trigger Current in Four Trigger Modes * Blocking Voltage to 600 Volts * Glass Passivated Surface for Reliability and Uniformity * Surface Mount Package * Pb-Free Packages are Available Functional Diagram Pin Out 4 MT 1 MT 2 G 1 2 3 Additional Information Datasheet Resources Samples (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19 Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 Maximum Ratings (TJ = 25C unless otherwise noted) Rating Peak Repetitive Off-State Voltage (Note 1) (Gate Open, Sine Wave 50 to 60 Hz, TJ = -40 to 110C) Symbol Value Unit VDRM, VRRM 200 600 V IT 0.8 A 8.0 A Asec MAC08BT1 MAC08MT1 On-State RMS Current (Full Cycle Sine Wave, 60 Hz, TC = 80C) (RMS) Peak Non-Repetitive Surge Current (One Full Cycle Sine Wave, 60 Hz, TC= 25C) ITSM Circuit Fusing Consideration (t = 8.3 msec) I2t 0.4 Peak Gate Power (Pulse Width 10 sec, TC= 80C) PGM 5.0 W Average Gate Power (t = 8.3 msec, TC= 80C) PG(AV) 0.1 W Operating Junction Temperature Range TJ -40 to +110 C Storage Temperature Range Tstg -40 to +150 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1.VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. Thermal Characteristics Rating Symbol Value Unit Thermal Resistance, Junction-to-Ambient PCB Mounted per Figure 1 R8JA 156 C/W 2. These ratings are applicable when surface mounted on the minimum pad sizes recommended. 3. 1/8" from case for 10 seconds. Electrical Characteristics - OFF (TC = 25C unless otherwise noted) Characteristic TJ = 25C TJ = 110C Peak Repetitive Blocking Current (VAK = VDRM = VRRM; Gate Open) Symbol Min Typ Max IDRM, IRRM - - 10 Unit A - - 200 mA Electrical Characteristics - ON (TC = 25C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Peak On-State Voltage (Note 2) (ITM = 1.1 A) VTM - - 1.9 V Gate Trigger Current (Continuous dc) IGT - - 10 mA IH - - 5.0 mA VGT - - 2.0 V (VD = 12 V, RL = 100 ) Holding Current (VD = 12 V, Gate Open, Initiating Current = 20 mA)) Gate Trigger Voltage (Continuous dc) (VD = 12 V, RL = 100 ) Unit 2. Pulse Test: Pulse Width 2.0 ms, Duty Cycle 2%. Dynamic Characteristics Characteristic Critical Rate of Rise of Commutation Voltage (f = 250 Hz, ITM = 1.0 A, Commutating di/dt = 1.5 A/mS On-State Current Duration = 2.0 mS, VDRM = 200 V, Gate Unenergized, TC = 110C, Gate Source Resistance = 150 , See Figure 10) Critical Rate of Rise of Off-State Voltage (VD = 0.67 x VDRM, Exponential Waveform, Gate Open, TJ = 110C) Symbol Min Typ Max Unit (dI/dt)c 1.5 - - A/ms dV/dt 10 - - V/s (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19 Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 Voltage Current Characteristic of SCR Symbol Parameter VDRM Peak Repetitive Forward Off State Voltage IDRM Peak Forward Blocking Current VRRM Peak Repetitive Reverse Off State Voltage IRRM Peak Reverse Blocking Current VTM Maximum On State Voltage IH +Current Quadrant 1 Main Terminal 2+ VTM On State IH IRRM at VRRM Holding Current Quadrant 3 Main Terminal 2- +Voltage Off State IH IDRM at VDRM VTM Figure 1. PCB for Thermal Impedance and Power Testing of SOT-223 Quadrant Definitions for a Triac 0.15 3.8 MT2 Positive 0.079 2.0 (Positive Half Cycle) + (+) MT 2 0.091 2.3 (+) MT 2 0.091 2.3 0.244 6.2 0.079 2.0 Quadrant II (-) IGT Gate (-) IGT Gate MT 1 Quadrant I MT 1 REF REF (-) MT 2 (-) MT 2 IGT Quadrant III + (-) IGT Gate (-) IGT Gate MT 1 REF 0.059 1.5 0.984 25.0 0.059 1.5 0.059 1.5 inches mm IGT 0.096 2.44 Quadrant IV MT 1 REF MT2 Negative (Negative Half Cycle) 0.096 2.44 0.096 2.44 0.059 1.5 0.059 1.5 0.472 12.0 BOARD MOUNTED VERTICALLY IN CINCH 8840 EDGE CONNECTOR. BOARD THICKNESS = 65 MIL., FOIL THICKNESS = 2.5 MIL. MATERIAL: G10 FIBERGLASS BASE EPOXY All Polarities are referenced to MT1. With in-phase signals (using standard AC lines) quadrants I and III are used (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19 Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 Figure 3. Junction to Ambient Thermal Resistance vs. Copper Tab Area IT, INSTANTANEOUS ON-STATE CURRENT (AMPS) Figure 2. On-State Characteristics 10 1.0 0.1 TYPICAL AT TJ = 110C MAX AT TJ = 110C MAX AT TJ = 25C 0.01 0 1.0 2.0 3.0 4.0 vT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) 5.0 T A, MAXIMUM ALLOWABLEAMBIENT TEMPERATURE ( C) Figure 4. Current Derating, Minimum Pad Size Reference: Ambient Temperature Figure 5. Current Derating, 1.0 cm Square Pad Reference: Ambient Temperature 110 100 30 90 60 90 80 = CONDUCTION ANGLE dc 70 = 180 60 120 50 MINIMUM FOOTPRINT 50 OR 60 Hz 40 30 20 0 0.4 0.1 0.2 0.3 IT(RMS), RMS ON-STATE CURRENT (AMPS) 0.5 Figure 6. Current Derating, 2.0 cm Square Pad Reference: Ambient Temperature Figure 7. Current Derating Reference: MT2 Tab (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19 Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 Figure 9. Thermal Response, Device Mounted on Figure 1 Printed Circuit Board Figure 8. Power Dissipation Figure 10. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt) Figure 11. Typical Commutating dv/dt versus Current Crossing Rate and Junction Temperature Figure 12. Typical Commutating dv/dt versus Junction Temperature at 0.8 Amps RMS 10 10 60 Hz 60 80 180 Hz COMMUTATING dv/dt dv/dtc , (V/ S) COMMUTATING dv/dt dv/dtc , (V/ S) 400 Hz 110 ITM 100 tw f= 1.0 1.01 VDRM 1 2 tw (di dt)c TM 1000 di/dtc, RATE OF CHANGE OF COMMUTATING CURRENT (A/mS) 0 1.0 60 300 Hz VDRM = 200V 70 80 90 100 TJ, JUNCTION TEMPERATURE (C) 110 (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19 Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 60 600 V pk TJ = 110C STATIC dv/dt (V/ s) 50 MAIN TERMINAL #2 POSITIVE 40 Figure 14. Typical Gate Trigger Current Variation 10 I GT , GATE TRIGGER CURRENT (mA) Figure 13. Exponential Static dv/dt versus Gate - Main Terminal 1 Resistance MAIN TERMINAL #1 POSITIVE 20 10 100 10,000 1000 0.1 RG Figure 15. Typical Holding Current Variation IGT4 IGT1 40 60 80 0 TJ, JUNCTION TEMPER ATURE (C) Figure 16. Gate Trigger Voltage Variation 6.0 1.1 VGT , GATE TRIGGER VOLTAGE (VOLTS) IH, HOLDING CURRENT (mA) IGT2 1.0 30 5.0 4.0 MAIN TERMINAL #2 POSITIVE 3.0 2.0 MAIN TERMINAL #1 POSITIVE 1.0 0 IGT3 02 01 40 60 TJ, JUNCTION TEMPERATURE (C) 80 00 0.3 VGT3 VGT4 VGT2 VGT1 02 01 40 60 80 00 TJ, JUNCTION TEMPERATURE (C) (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19 Thyristors Surface Mount - 200V - 600V > MAC08BT1, MAC08MT1 Dimensions Part Marking System D b1 4 SOT-223 Case 318E Style 11 4 HE 12 E 3 AC08X x Y M A XX G e C A Dim A1 L1 Inches Millimeters =Device Code =D, M, or N =Year =Month =Assembly Site =Lot Serial Code =Pb-Free Package Soldering Footprint Min Nom Max Min Nom Max --- --- 0.071 --- --- 1.80 A1 0.001 0.003 0.005 0.02 0.07 0.13 b 0.026 0.030 0.033 0.66 0.75 0.84 b1 0.114 0.118 0.122 2.90 3.00 3.10 A 3 2 1 b e1 0.08 (0003) AC08x YMAXX c 0.009 0.011 0.014 0.23 0.29 0.35 D 0.260 0.260 0.264 6.60 6.60 6.71 E 0.130 0.138 0.146 3.30 3.50 3.70 e --- 0.091 --- --- 2.30 --- e1 0.030 0.037 0.045 0.75 0.95 1.15 L1 0.059 0.069 0.079 1.50 1.75 2.00 HE 0.268 0.276 0.283 6.80 7.00 7.20 o 0 --- 10 0 --- 10 3. 8 0.15 2. 0 0.079 2. 3 0.091 6. 3 0.24 8 2. 3 0.091 2. 0 0.079 1. 5 0.059 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2.CONTROLLING DIMENSION: INCH. SCALE 6: 1 mm in ch es Ordering Information Device Pin Assignment 1 Main Terminal 1 Package Type Shipping MAC08BT1 SOT-223 1000 / Tape & Reel SOT-223 (Pb-Free) 1000 / Tape & Reel 2 Main Terminal 2 MAC08BT1G 3 Gate MAC08MT1 SOT-223 1000 / Tape & Reel 4 Main Terminal 2 MAC08MT1G SOT-223 (Pb-Free) 1000 / Tape & Reel Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 07/25/19